实用电子仿真工作平台简介

文章介绍了一个实用的电子仿真工作平台ＥｌｅｃｔｒｏｎｉｃＷｏｒｋｂｅａｃｈ，它能设计调试电子仿真实验，还可将成功的电子实验线路生成自动布线的印刷电路板。     

薄膜开关在自动BLU叠片机生产调试中的应用

自动BLU叠片机主要用于背光单元制作过程中各种导光膜的叠放，在叠合过程中，各种导光膜的特性不同，叠放工艺也各不相同，设备运作繁琐，生产调试技术难度高，耗时费力。为此我们设计了薄膜开关组，结合软件开发，成功优化了自动BLU叠片机设备生产调试过程，提高了生产效率。     

基于Proteus的自动拨号报警器仿真设计

利用嵌入式系统仿真软件Proteus实现了基于AT89C51单片机的自动拨号报警器仿真设计。详细分析自动拨号报警器的硬件设计原理,并在Keil开发环境下设计了对应的驱动程序,在Proteus中完成了软、硬件的联合仿真调试,最后给出了仿真运行结果。通过Proteus软件的前期仿真,大大缩短了实际开发周期,降低开发成本,对于单片机应用系统、电子电路的开发和教学等都有较大的实用价值,且设计的电路及驱动程序对相应的实际应用系统具有一定的借鉴作用。     

现代电子电路设计制作方法

<正> 随着集成电路技术的飞速发展和微机的普及应用,电子电路的设计制作进入了一个新阶段,出现了新的设计制作方法。为与以往传统的电子电路制作方法区别开来,我们称之为现代电子电路设计制作方法。运用现代电子电路设计制作方法,可将以往由许多标准的数字电路和模拟电路组成的系统制作成一二片在家中即可设计的大规模集成电路,可将复杂的印刷电路板设计,变成从电原理图中提取电路联接关系(这种联接关系称为网表),快速地自动生成印刷电路板图,可将以往使用信号源和仪器对电路板进行的复杂调试工作,变成用微机软件仿真调试,还可将使用普通仪器进行的多次调试变成使用智能仪器的高效调试。总之,在现代电子电路的开发与设计中,以往许多在实验室中进行的手工焊接、调试工作,变成了使用微机软件的仿真工作。     

可视化增强技术优化芯片后期验证和调试

在芯片验证、仿真和全芯片模拟的过程中,为了调试复杂问题,可视化增强技术能够方便地获得所需要的足够信号信息。它能够通过对设计的自动分析来确定哪些是重要信号,扩展没有被捕获的信号,并将低级别描述中的信号与RTL级描述中的信号相关联,这些都有助于对设计的全面理解,从而大大减少调试时间。     

基于Petri网的耳机部件自动装配设备PLC控制系统研究

为解决在具有并发、竞争控制的PLC控制系统中传统的PLC程序设计方法存在不适用,而且易导致程序出错并且难以检查错误等问题,利用Petri网具有图形描述、模拟特点以及分析具有并发和冲突环节等复杂事件的能力,结合Petri网的建模方法与ExSpect模型仿真技术对耳机部件自动装配设备控制系统进行建模与仿真分析,然后利用仿真结果再结合工艺流程,直观地指导构建PLC 控制系统的程序。仿真与调试结果表明：该方法可避免设备运行时相关部件的冲撞等实际问题,缩短调试时间,保证了PLC控制系统可行、可靠性。     

基于FPGA"乒乓球比赛游戏机"的设计

FPGA的低成本正推动其在消费电子产品中的应用，为进一步挖掘其在娱乐产品应用中的巨大商机，基于Altera公司FPGA，在QuartusⅡ8．1环境下，运用VHDL语言、采用有限状态机等设计方法设计了一款乒乓球比赛游戏机。介绍了该游戏机系统功能模块划分及关键模块具体设计方案，给出设计和调试中遇到的问题及解决途径，并进行了仿真测试。仿真结果表明，该乒乓球游戏机工作正常，具有发球权控制、自动计分、犯规提示等多种功能，能有效模拟实际乒乓球比赛。     

具有测试功能机载雷达软件仿真系统

描述供机载雷达应用软件调试，测试用的软件仿真系统，它不但能仿真雷达应用软件的运行环境，可用于设计，调试应用软件，还实现了对雷达软件的功能及性能测试，提高了机载雷达软件的质量。     

“虚实结合”的EDA课程设计实验教学案例

为提高学生的工程实践能力,我校EDA课程设计结合自研在线教学平台,采用案例式教学方式,锻炼和培养学生对EDA开发工具综合运用的能力和动手实践能力。EDA课程案例包括Matlab设计仿真、Modelsim仿真及D/A电路设计调试等EDA完整工程设计流程,线上实验平台提供远程硬件调试功能,学生可以随时随地通过线上实验平台对设计进行验证并与教师进行在线交流。该案例的成功实施有助于虚实结合的实践教学方法探索。     

一种嵌入式微处理器片上调试系统的硬件部分设计

本文介绍了嵌入式微处理器的片上调试方法，引入了其中基于MIPS微处理器的EJTAG片上调试规范。设计了EJTAG的片上硬件部分，将其分为核外TAP相关部分和核内调试相关寄存器部分，分别由EDA软件自动生成和人工设计完成。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first