35#钢激光宽带淬火研究

利用扫描激光束对35#钢材料进行了宽带激光淬火,在3.0～3.3kW激光功率下,获得单道淬硬带宽15mm,淬硬层深0.53mm.给出了不同激光功率条件下淬火区硬度沿淬硬层深的变化曲线,淬硬层硬度分布基本均匀,平均硬度约为554～675Hv,与基体硬度比较提高了2.3～2.5倍.显微组织结构分析显示淬硬层沿层深方向可分为完全淬硬层、过渡层和高温回火区三个区域.     

45~#钢宽带激光淬火研究

:本文利用宽带CO2 激光束 ,对 45 #钢表面进行宽带淬火 ,获得单道淬火宽度 10mm以上。淬硬层硬度达 5 0 0～ 6 30Hv0 3是非淬硬层的 2～ 2 5倍 ,深度达 1 9～ 2 .0mm。激光淬硬层分为表面过热区、均匀相变区和过渡区三个区域 ,所对应的金相组织分别为高碳马氏体、隐晶马氏体和混和马氏体。宽带激光淬火造成的组织细化和大量高碳马氏体的形成是硬度提高的主要原因。在扫描速度v =4mm/s和离焦量 18mm条件下 ,45 #钢宽带激光淬火的最佳功率约为 3 0～ 3 3kW。     

激光淬火工艺参数对40Cr钢淬硬层深的影响

用5kWCWCO2激光器对40Cr钢进行了激光淬火试验,探讨激光工艺参数对淬硬层深的影响。结果表明,激光功率增大、扫描速度降低、激光束重叠尺寸增大,则淬硬层深增大,且扫描速度比激光功率的影响更大。40Cr钢在功率1000～1200W,扫描速度15～30mm/s,激光束重叠尺寸1.0～1.5mm的工艺条件下淬火,可获得不小于0.35mm的平均淬硬层深。     

45^#钢宽带激光淬火研究

本文利用宽带CO2激光束,对45^#钢表面进行宽带淬火,获得单道淬火宽度10mm以上。淬硬层硬度达500－630Hv0.3是非淬硬层的2－2．5倍,深度达1．9－2．0mm。激光淬硬层分为表面过热区、均匀相变区和过渡区三个区域,所对应的金相组织分别为高碳马氏体、隐晶马氏体和混和马氏体。宽带激光淬火造成的组织细化和大量高碳马氏体的形成是硬度提高的主要原因。在扫描速度v=4mm/s离焦量18mm条件下,45^#钢宽带激光淬火的最佳功率约为3.0-3.3kW。     

U74钢轨表面激光淬火工艺及其对耐磨性的影响

本文研究了U74钢轨表面激光淬火工艺及其对表面耐磨性能的影响。激光淬硬层分为表面过热区、均匀相变区和过渡区。淬硬层深度约为0.5-0.8mm，单道淬火宽度约4mm，表面硬度可达Hv850-Hv1000，淬硬层组织为高碳马氏体，细晶混合马氏体和少量奥氏体。激光淬火造成的组织细化和大量高碳马氏体的形成是硬度提高的主要原因。在扫描速度为6mm/秒，离焦量60mm的条件下，U74钢轨表面激光淬火的最佳功率约为1.8kW。在该功率下，可以获得最高硬度、最大硬化层深度和最佳能量利用系数。摩擦学试验表明，经过激光淬火，钢轨表面的耐磨性能有了明显提高。     

40CrNiMoA齿轮激光表面强化及抗疲劳性分析

对40CrNiMo齿轮进行了激光表面强化处理,用SEM和TEM对处理试样显微组织进行了分析,测试并分析了其显微硬度,并进行了抗疲劳性现场试验,结果表明:40CrNiMo激光淬火后其组织由淬硬层、过渡区和基体组成,淬硬层组织为细小的板条马氏体和针状马氏体,层深约1.5mm,过渡区为马氏体和索氏体混合组织,基体为回火索氏体。淬硬层表面硬度比常规淬火硬度有所提高。40CrNiMo激光淬火齿轮比20Cr2Ni4渗碳淬火齿轮疲劳强度提高约10%。     

一种大功率激光加工用新型宽带光斑成形抛物面镜

介绍了一种大功率激光加工用新型宽带光斑成形抛物面镜的设计原理和实验结果.根据几何光学原理,采用光线追迹的方法对该抛物面镜的光斑进行分析,证明通过抛物面镜反射聚焦后,能够将原始圆形激光束整形为光强分布均匀的窄条形光斑.并利用该新型抛物面镜及横流CO2激光器,对45#钢进行了激光相变硬化研究,测量了淬火带尺寸和淬硬层深度,并对硬化层形貌及其金相组织进行了观察和分析.结果表明,当激光器输出功率为3 kW,窄条光斑长度12 mm,扫描速度15 mm/s时,该45#钢淬硬层硬度值可达540～580 HV0.3,是非淬硬层的3.5～4倍.淬硬层深度约为1 mm,单道淬火宽度10 mm以上,硬化层分布均匀.     

T10钢激光相变硬化的组织与性能研究

采用激光相变硬化工艺对T10钢表面进行了改性处理,并对改性后的组织与性能进行了研究,结果表明:硬化区组织为针状马氏体+少量残余奥氏体,热影响区组织为少量针状马氏体+网状渗碳体.基材组织为回火马氏体.淬硬层表面的洛氏硬度最高值为940Hv0.1,淬硬层内的显微硬度分布均匀,从硬化区→热影响区→过渡区→基材显微硬度呈梯度变化.激光相变硬化后淬硬层耐磨性分析,要比常规淬火后耐磨性提高10%左右.     

高碳高铬轧辊用钢激光相变强化研究

为了研究高碳高铬轧辊用钢的激光相变强化行为,采用5kW连续横流CO2激光器对高碳高铬轧辊进行激光相变强化试验,并进行了显微组织分析和硬度测试,得到了适应生产的激光相变强化工艺参数.结果表明,激光相变强化处理后的硬度可由550HV提高到750-800HV,峰值可达900HV.当扫描速度为8mm/s,激光功率为2200W,光斑直径为8mm时,可得到0.5mm深的淬硬层,且不出现软化带.     

ZnO纳米粉吸光特性及其应用实例

用热物理法制备ZnO纳米晶须和纳米粒子 ,该晶须从中心向空间三维拓展出四根针 ,针的直径由根部向顶部逐渐变小 ,使ZnO纳米晶须在很宽波段对光吸收。利用此特殊结构制备出纳米黑化吸收剂 ,并应用于激光表面强化。与传统黑化剂的效果相比 ,其 5Cr5MoSiV钢淬硬层的显微硬度达到 792Hv,增幅为 6 % ;淬硬层的最大深度为0 6 0mm ,上升的幅度为 2 0 % ;激光淬火功率下降了 30 0W ,节能高达 30 %。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first