DY—5型亚微米电子束曝光机

本文介绍了ＤＹ－５型微米电子束曝光机的主要技术性能；最细特征线宽０．４μｍ，图形位置精度及拼接精度优于±０．１５μｍ；扫描场尺寸１×１ｍｍ＾２和２×２ｍｍ＾２；最高扫描速度１ＭＨｚ，可加工１００×１００ｍｍ＾２掩模版或Х７５硅圆片，给出了部分曝光试验结果。     

非晶硅X－射线探测阵列的研究

研制出ａ－Ｓｉ：Ｈｐｉｎ型Ｘ－射线间接探测线阵，它探测的是Ｘ－射线在闪光体（Ｃｓｌ）所激发的荧光，制备出单元面积分别为２．５×２．５ｍｍ２、１．６×１．６ｍｍ２和１００×１００μｍ２的１６、２５、３２０单元的线阵．器件的暗电流达到１e－１２Ａ／ｍｍ２（－１０ｍＶ），光灵敏度～０．３５μＡ／μＷ（６００ｎｍ）．本文报道了Ｘ－射线探测阵列的制备及测试结果．     

单片机在激光工件台中的应用

本文介绍单片机在双频激光干涉工件台位置显示和微动控制中的应用，由于采用单片机使激光工件台位置显示精度高，微动控制简单、可靠。显示分辨率０．０１μｍ，位置测量精度０．０２μｍ，测量最大距离３３０ｍｍ，（实际距离１００ｍｍ），微动距离５μｍ、１０μｍ、５０μｍ、１００μｍ四档。     

LB技术制备大面积超薄PMMA抗蚀层的研究

采用自行研制的ＬＢ自动提膜装置，制备出大面积（１０×８ｃｍ２）、高质量的ＰＭＭＡ超薄抗蚀剂膜，并将其用于高分辨率铬掩模版的研制。通过电子束曝光，湿法蚀刻，制作了分辨率优于０．５μｍ，特征线宽０．３８μｍ的４（１００ｍｍ）铬掩模版。     

高可靠大功率1.3μm发光二极管

把１．３μｍ波长分段吸收式脊形波导结构发光二极管进行不同温度的加速老化寿命试验，共测试２４８５００器件小时。该器件在２５℃、１５０ｍＡＣＷ的平均寿命为１．２×１０６ｈ，其退化激活能Ｅａ＝０．４８ｅＶ；与标准单模光纤耦合后，在２５℃、１００ｍＡ下的光功率大于３０μＷ，最大可大于５０μＷ。     

Si1-XGeX/Si红外光电探测器

本文报导了用两种缓冲层生长技术研制的Ｓｉ１－ｘＧｅｘ／Ｓｉ异质结ｐｉｎ型红外探测器。其波长范围为０．７０～１．５５μｍ,峰值波长为０．９６～１．０６μｍ,暗电流密度低达０．０３μＡ／ｍｍ＾２（－２Ｖ）,在１．３μｍ处的响应度高达０．１５Ａ／Ｗ（－５Ｖ）;讨论了Ｇｅ组分、外延层厚度、偏置电压等对探测器参数的影响。     

Si基Ge0.85Si0.15异质光电二极管

采用低温生长缓冲层,高温生长ＧｅＳｉ外延层的方法在ｎ型Ｓｉ衬底上外延生长（ｉ）Ｇｅ０．８５Ｓｉ０．１５－（ｐ）Ｓｉ层,以此材料作为吸收区制备成ＧｅＳｉ／Ｓｉ异质结ｐｉｎ台面光电二极管。其波长范围为０．７－１．５５μｍ,峰值波长位于１．０６μｍ,暗电流密度低达０．０３３μＡ／ｍｍ＾２（－２Ｖ）,在１．０６μｍ和１．３μｍ处的响应度分别为１．８Ａ／Ｗ（－２Ｖ）和０．０６６Ａ／Ｗ（－Ｖ）。     

HgCdTe分子束外延薄膜的研制

本文概要报导我们ＨｇＣｄＴｅＭＢＥ上作的最近进展。一批面积２．０－１６．６ｃｍ２，组份ｘ０．１８８－０．３０，载流子浓度７．８１×１０１４～１．０×１０１６ｃｍ－３，迁移率１．０×１０４～１．４５×１０５ｃｍ２ｖ－１．ｓ－１和ｘ射线双晶衍射半峰宽（ＦＷＨＭ）６４～１００ａｒｃｓｅｃ的Ｎ型原生ＨｇＣｄＴｅ外延膜已经得到，某些参数已接近或达到国外报导的典型值，并在国内首先研制了直径为５０ｍｍ的ＨｇＣｄＴｅ外延膜。为了评价材料的特性，用一块Ｘ＝０．２４３的外延膜经适当热处理后研制了光伏探测器试验阵列，其最好的一元探测率Ｄλ＊＝２．４４×１０１０ｃｍＨｚ１／２Ｗ－１（λｃ＝７．９μｍ）。     

1～20GHzGaAs单片功率放大器

南京电子器件研究所在７６ｍｍ圆片上研制成功超宽带单片功率放大器,芯片尺寸为３．２ｍｍ×１．６ｍｍ×０．１ｍｍ,采用栅长０．５μｍ的ＰＨＥＭＴ为有源器件,在１～２０ＧＨｚ频带范围内测得放大器的线性增益为８±０．５ｄＢ,带内输出功率大于１００ｍＷ,最大输出功率超过２５０ｍＷ,输入输出驻波比小于２．０。ＧａＡｓ单片超宽带功率放大器在宽带范围内具有较高的增益和输出功率,增益平坦,驻波特性好,容易级联,可广泛应用于电子工程、微波多路通讯、宽带仪器仪表等领域,可使相应的电子设备进一步小型化、固体化,具有很…     

多元多色HgCdTe红外探测器

简要介绍利用不同波段的微型滤光片和不同响应波段的多元ＨｇＣｄＴｅ红外探测器,叙述了通过精密镶嵌技术组合而成的四波段２１５～２２５μｍ、８４～８９μｍ、１０３～１１３μｍ和１１５～１２５μｍ８８元多元多色探测器的设计原理和特性,以及多元多色探测器的组合工艺,并给出了各个通道的响应光谱特性和探测器的工作性能。研制成功的８８元多色红外探测器每个通道的平均探测率和响应率分别为：Ｄ２．１５～２．２５＝１．２×１０１２ｃｍＨｚ１／２／Ｗ和Ｒ２．１５～２．２５＝５．０×１０６Ｖ／Ｗ,Ｄ８．４～８．９＝７．０×１０１０ｃｍＨｚ１／２／Ｗ和Ｒ８．４～８．９＝１．６×１０４Ｖ／Ｗ,Ｄ１０．３～１１．３＝４．０×１０１０ｃｍＨｚ１／２／Ｗ和Ｒ１０．３～１１．３＝４．３×１０３Ｖ／Ｗ,Ｄ１１．５～１２．５＝３．０×１０１０ｃｍＨｚ１／２／Ｗ和Ｒ１１．５～１２．５＝３．３×１０３Ｖ／Ｗ,文中对这些结果进行了分析和讨论。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.