Temperature effect on bonding structures of amorphous carbon containing more than 30at.% silicon

Bonding evolution of amorphous carbon incorporated with Si or a-C(Si) in a thermal process has not been studied. Unhydrogenated a-C(Si) films were deposited by magnetron sputtering to undergo two different thermal processes: i) sputter deposition at substrate temperatures from 100 to 500 °C; ii) room temperature deposition followed by annealing at 200 to 1000 °C. The hardness of the films deposited at high temperature exhibits a monotonic decrease whereas the films deposited at room temperature maintained their hardness until 600 °C. X-ray photoelectron spectroscopy and Raman spectroscopy were used to analyze the composition and bonding structures. It was established that the change in the mechanical property is closely related to the atomic bonding structures, their relative fractions and the evolution (conversion from C–C sp³ → CC sp² or CC sp² → C–Si sp³) as well as clustering of sp² structures.     

Changes in chemical bonding of diamond-like carbon films by atomic-hydrogen exposure

We have deposited unhydrogenated diamond-like carbon (DLC) films on Si substrate by pulsed laser deposition using KrF excimer laser, and investigated the effects of atomic-hydrogen exposure on the structure and chemical bonding of the DLC films by photoelectron spectroscopy (PES) using synchrotron radiation and Raman spectroscopy. The fraction of sp³ bonds at the film surface, as evaluated from C1s spectra, increased at a substrate temperature of 400 °C by atomic-hydrogen exposure, whereas the sp³ fraction decreased at 700 °C with increasing exposure time. It was found that the sp³ fraction was higher at the surfaces than the subsurfaces of the films exposed to atomic hydrogen at both the temperatures. The Raman spectrum of the film exposed to atomic hydrogen at 400 °C showed that the clustering of sp² carbon atoms progressed inside the film near the surface even at such a low temperature as 400 °C.     

Preparation of diamond like carbon thin films above room temperature and their properties

Diamond like carbon (DLC) thin films were deposited on p-type silicon (p-Si), quartz and ITO substrates by microwave (MW) surface-wave plasma (SWP) chemical vapor deposition (CVD) at different substrate temperatures (RT ∼ 300 °C). Argon (Ar: 200 sccm) was used as carrier gas while acetylene (C₂H₂: 20 sccm) and nitrogen (N: 5 sccm) were used as plasma source. Analytical methods such as X-ray photoelectron spectroscopy (XPS), FT-IR and UV–visible spectroscopy were employed to investigate the structural and optical properties of the DLC thin films respectively. FT-IR spectra show the structural modification of the DLC thin films with substrate temperatures showing the distinct peak around 3350 cm^− 1 wave number; which may corresponds to the sp² C–H bond. Tauc optical gap and film thickness both decreased with increasing substrate temperature. The peaks of XPS core level C 1 s spectra of the DLC thin films shifted towards lower binding energy with substrate temperature. We also got the small photoconductivity action of the film deposited at 300 °C on ITO substrate.     

Dependence of the composition and bonding structure of carbon nitride films deposited by direct current plasma assisted pulsed laser ablation on the deposition temperature

Carbon nitride films were deposited by direct current plasma assisted pulsed laser ablation of a graphite target under nitrogen atmosphere. Atomic force microscopy (AFM), Fourier transform infrared (FTIR), Raman, and X-ray photoelectron spectroscopy (XPS) were used to characterize the surface morphology, bonding structure, and composition of the deposited films. The influence of deposition temperature in the range 25–400 °C on the composition and bonding structure of carbon nitride films was systematically studied. AFM images show that surface roughness and cluster size increase monotonically with deposition temperature. XPS, FTIR, and Raman spectra indicate directly the existence of CN, CN, and CN bonds in the deposited films. The increase of deposition temperature results in a drastic decrease in the N/C ratio, the content of CN bond and N atoms bonded to sp³ C atoms, in addition to the increase in the content of disorder sp² C atoms and N atoms bonded to sp² C atoms in the deposited films. Raman spectra show that the intensity ratio of D peak over G peak increases with increasing deposition temperature to 200 °C, then decreases with the further increase of deposition temperature, which results from the continuous growth of sp² cluster in the films.     

Structure and properties of hard carbon films depending on heat treatment temperatures via polymer precursor

Phenylcarbyne polymer films were coated on silicon substrates and heat treated in 1 atm pressure of argon at various temperatures. The structural changes occurring during the heat treatment process of the polymer were investigated by Raman spectroscopy and Fourier transform infrared (FTIR) spectroscopy. The Raman and FTIR spectra features of the polymer showed a dependence on the heat treatment temperatures. At low temperatures (below 400°C), the Raman and IR spectra of the polymer were similar to those of the original polymer. The hardness and Young's modulus of the polymer films were below 1 and 50 GPa, respectively. With increasing temperature (above 400°C), thermal decomposition of the polymer occurred, resulting in structural changes of the polymer from soft amorphous hydrocarbon (400–600°C) phases to hard carbon phases (above 600°C). The hardness and Young's modulus increased from 1.5 and 65 GPa at 600°C to 9 and 120 GPa at 1000°C, respectively. It is assumed that the hard carbon film converted from the polymer might contain sp² and sp³ carbon phases; high temperature of heat treatment resulted in increasing sp² (glassy) carbon phase in the films.     

XPS studies of amorphous SiCN thin films prepared by nitrogen ion-assisted pulsed-laser deposition of SiC target

Amorphous SiCN films were prepared on Si (100) substrates by nitrogen ion-assisted pulsed-laser ablation of an SiC target. The dependence of the formed chemical bonds in the films on nitrogen ion energy and the substrate temperature was investigated by an X-ray photoelectron spectroscopy (XPS). The fractions of sp² CC, sp³ CC, and sp² CN bonds decreased, and that of NSi bonds increased when the nitrogen ion energy was increased without heating during the film preparation. The fraction of sp³ CN bonds was not changed by the nitrogen ion irradiation below 200 eV. Si atoms displaced carbon atoms in the films and the sp³ bonding network was made between carbon and silicon through nitrogen. This tendency was remarkable in the films prepared under substrate heating, and the fraction of sp³ CN bonds also decreased when the nitrogen ion energy was increased. Under the impact of high-energy ions or substrate heating, the films consisted of sp² CC bonds and SiN bonds, and the formation of sp³ CN bonds was difficult.     

Effect of deposition voltage on the microstructure of electrochemically deposited hydrogenated amorphous carbon films

Hydrogenated amorphous carbon (a-C:H) films were deposited on Si substrates by electrolysis in a methanol solution at ambient pressure and a low temperature (50 °C), using various deposition voltages. The influence of deposition voltage on the microstructure of the resulting films was analyzed by visible Raman spectroscopy at 514.5 nm and X-ray photoelectron spectroscopy (XPS). The contents of sp³ bonded carbon in the various films were obtained by the curve fitting technique to the C1s peak in the XPS spectra. The hardness and Young’s modulus of the a-C:H films were determined using a nanoindenter. The Raman characteristics suggest an increase of the ratio of sp³/sp² bonded carbon with increasing deposition voltage. The percentage of sp³-bonded carbon is determined as 33–55% obtained from XPS. Corresponding to the increase of sp³/sp², the hardness and Young’s modulus of the films both increase as the deposition voltage increases from 800 V to 1600 V.     

Enhanced electrical properties of In-Ga-Sn-O thin films at low-temperature annealing

Electrical and optical properties of In-Ga-Sn-O (IGTO) thin films deposited by radio-frequency magnetron sputtering were investigated according to annealing temperatures. While IGTO films remained an amorphous phase even after a heat treatment at temperature up to 500 °C, Hall measurements showed that annealing temperature had a significant impact on electrical properties of IGTO thin films. After investigating a wide range of annealing temperatures for samples from as-deposited state to 500 °C, IGTO film annealed at 200 °C exhibited the best electrical performance with a conductivity of 229.31 Ω^?1cm^?1, a Hall mobility of 36.89 cm²V^?1s^?1, and a carrier concentration of 3.85 × 10¹⁹ cm^?3. Changes in proportions of oxygen-related defects and percentages of Sn²⁺ and Sn⁴⁺ ions within IGTO films according to annealing temperatures were analyzed with X-ray photoelectron spectroscopy to determine the cause of the superb performance of IGTO at a low temperature. In IGTO films annealed at 200 °C, Sn⁴⁺ ions acting as donor defects accounted for a high percentage, whereas hydroxyl groups working as electron traps showed a significantly reduced percentage compared to the as-deposited film. Optical band gaps of IGTO films obtained from UV–visible spectrum were 3.38–3.47 eV. The largest band gap value of 3.47 eV for the IGTO film annealed at 200 °C could be attributed to an increase in Fermi-level due to an increase of carrier concentration in the conduction band. These spectroscopic results well matched with electrical properties of IGTO films according to annealing temperatures. Excellent electrical properties of IGTO thin films annealed at 200 °C could be largely due to Sn donors besides oxygen vacancies, resulting in a significant increase in free carriers despite a low annealing. temperature.     

Influence on the sp3/sp2 character of the carbon on the insertion of nitrogen in RFMS carbon nitride films

RFMS carbon nitride films have been elaborated at several substrate temperatures between 150 °C and 450 °C, where they evolve from a highly resistive to highly conductive comportment. Their local structure has been determined from X-ray photoemission, Raman and infrared spectroscopic results. The films composition has been measured by nuclear reaction analysis and elastic recoil detection.We will correlate the strong modifications of the electronic properties of the films to their well characterized structural changes. We will show how the substrate temperature acts on the incorporation of nitrogen in carboneous RFMS films and which is the resulting consequence on the sp³/sp² character of the carbon network.     

Removal of sp2-boron nitride transition layer in the growth of cubic boron nitride films

Practical application of cubic boron nitride (cBN) films is known to be hindered by its bad adhesion to substrates. One reason is that an sp²-bonded boron nitride (sp²-BN) transition layer is formed on the substrate surface at the early stage of deposition prior to the nucleation of cBN, which weakens the link between the cBN-rich layer and the substrate. In this study, we demonstrated the feasibility of removing this sp²-BN layer, by replacing it with a zirconium- (Zr-) rich composite layer. The method is to deposit a multilayer of Zr layer/sp²-BN layer/cBN-rich layer at 680 °C on a tungsten carbide substrate, followed by annealing the structure at 850 °C for 1 h. X-ray photoelectron spectroscopy, transmission electron microscopy and electron energy loss spectroscopy analyses showed that the Zr metal layer and sp²-BN layer reacted completely, to produce a composite interfacial layer consisting of metal Zr, Zr nitride, boride and oxide. The depth profiles of the elemental distributions and chemical states were investigated and discussed to reveal the diffusion of the elements associated with this deposition process.     

Stability of carbon nitride films prepared from volatile CN species via atomic transport reactions

Thin CN_x films were deposited by inductively coupled plasma chemical vapour deposition (ICP-CVD) at different substrate temperatures. Instead of the conventional gaseous carbon precursors, a pure carbon mesh was used as carbon source with nitrogen as a carrier/reaction gas. The CN_x films are formed from volatile CN species produced via atomic transport reactions. The deposition rate decreases from 3.2 nm/min at room temperature to almost zero at 150°C. The nitrogen fraction N/(N+C) is at about 0.5, as revealed by various analytical techniques; the composition remains unchanged when varying the substrate temperature. The films are composed mainly of sp² carbon atoms bonded to nitrogen atoms. The CN_x layers are stable upon annealing at temperatures up to 300°C; the surface contamination is removed, while no changes in the nitrogen atomic fraction and in the bonding structure are observed.     

Low‐Temperature Deposition of Hexagonal Boron Nitride via Sequential Injection of Triethylboron and N2/H2 Plasma

Hexagonal boron nitride (hBN) thin films were deposited on silicon and quartz substrates using sequential exposures of triethylboron and N₂/H₂ plasma in a hollow‐cathode plasma‐assisted atomic layer deposition reactor at low temperatures (≤450°C). A non‐saturating film deposition rate was observed for substrate temperatures above 250°C. BN films were characterized for their chemical composition, crystallinity, surface morphology, and optical properties. X‐ray photoelectron spectroscopy (XPS) depicted the peaks of boron, nitrogen, carbon, and oxygen at the film surface. B 1s and N 1s high‐resolution XPS spectra confirmed the presence of BN with peaks located at 190.8 and 398.3 eV, respectively. As deposited films were polycrystalline, single‐phase hBN irrespective of the deposition temperature. Absorption spectra exhibited an optical band edge at ~5.25 eV and an optical transmittance greater than 90% in the visible region of the spectrum. Refractive index of the hBN film deposited at 450°C was 1.60 at 550 nm, which increased to 1.64 after postdeposition annealing at 800°C for 30 min. These results represent the first demonstration of hBN deposition using low‐temperature hollow‐cathode plasma‐assisted sequential deposition technique.     

Optical and microstructural properties of diamond-like carbon films grown by pulsed laser deposition

Diamond-like carbon films have been fabricated using 308 nm excimer laser ablation in vacuum followed by deposition at temperatures between 77 K and 573 K. Optical band gap energies are obtained from UV/optical spectroscopy. Raman spectra and X-ray photoelectron spectra (XPS) show that the sp³/(sp² + sp³) ratio in these films is in excess of 0.7 in films deposited at 77 K and 300 K. This ratio decreases to 0.2 in films deposited at 573 K. It is found that films deposited at cryogenic temperatures consist of a matrix structure assembled from embedded nanometer clusters, while films deposited at 300 K or higher temperature are amorphous and atomically flat. Microstructural features in cryogenic films are discussed in relation to the mechanism of deposition and possible phase transitions during assembly of these films.     

Diamond nucleation and growth on zeolites

In this work, we report the use of zeolites as substrates for the deposition of porous diamond films. Films were deposited in a hot-filament chemical vapor deposition (HFCVD) apparatus. The HFCVD system was fed with a mixture of methane (0.8%) with the balance being hydrogen. A series of depositions were done in the pressure range 20–120 Torr and at substrate temperature 880 °C. The morphologies of the as-deposited films were analyzed by scanning electron microscopy and show isolated diamond grains in the initial nucleation stages, which develop into a microporous film in the next stage and form a continuous film after long time deposition. Raman spectroscopy was used to investigate the crystal morphology, structure and non-diamond impurities in the films deposited at various growth conditions. The nature of the hydrogen bonding with sp³ and sp² network and the quantitative analysis were done by Fourier transform infrared spectroscopy.     

Low surface temperature synthesis and characterization of diamond thin films

Polycrystalline diamond films are deposited on p-type Si(100) and n-type SiC(6H) substrates at low surface deposition temperatures of 370–530 °C using a microwave plasma enhanced chemical vapor deposition (MPECVD) system. The surface temperature during deposition is monitored by an IR pyrometer capable of measuring temperature between 250 and 600 °C in a microwave environment. The lower deposition temperature is achieved by using an especially designed cooling stage. The influence of the deposition conditions on the growth rate and structure of the diamond film is investigated. A very high growth rate up to 1.3 μm/h on SiC substrate at 530 °C surface temperature is attributed to an optimized Ar-rich Ar/H₂/CH₄ gas composition, deposition pressure, and microwave power. The structure and microstructure of the films are characterized by X-ray diffraction, scanning electron microscopy, and Raman spectroscopy. A detailed stress analysis of the deposited diamond films of grain sizes between 2 and 7 μm showed a net tensile residual stress and predominantly sp³-bonded carbon in the deposited films.     

Chemical bonding in carbon nitride films studied by X-ray spectroscopies

Carbon nitride films are deposited using dc magnetron sputtering in a N₂ discharge. The nature of chemical bonding of the films is investigated using X-ray photoelectron spectroscopy, near-edge X-ray absorption fine structure, and X-ray emission spectroscopy. X-Ray photoelectron spectroscopy spectra show that N1s binding states depend on substrate temperature, in which two pronounced peaks can be observed. The near edge X-ray absorption fine structure at C1s and N1s exhibits a similar absorption profile in the π* resonance region, but the σ* resonance is sharper in the N1s spectra. Resonant N K-emission spectra show a strong dependence on excitation photo energies. Compared XPS N1s spectra with recent theoretical calculations by Johansson and Stafstrom, two main nitrogen sites are assigned in which N bound to sp³ hybridized C and sp² hybridized C, respectively. The correlation of X-ray photoelectron, X-ray absorption, and X-ray emission spectra for N in carbon nitride films is also discussed.     

Substrate temperature effects on the electron field emission properties of nitrogen doped ultra-nanocrystalline diamond

For the purpose of improving the electron field emission properties of ultra-nanocrystalline diamond (UNCD) films, nitrogen species were doped into UNCD films by microwave plasma chemical vapor deposition (MPCVD) process at high substrate temperature ranging from 600° to 830 °C, using 10% N₂ in Ar/CH₄ plasma. Secondary ion mass spectrometer (SIMS) analysis indicates that the specimens contain almost the same amount of nitrogen, regardless of the substrate temperature. But the electrical conductivity increased nearly 2 orders of magnitude, from 1 to 90 cm^− 1 Ω^− 1, when the substrate temperature increased from 600° to 830 °C. The electron field emission properties of the films were also pronouncedly improved, that is, the turn-on field decreased from 20 V/μm to 10 V/μm and the electron field emission current density increased from less than 0.05 mA/cm² to 15 mA/cm². The possible mechanism is presumed to be that the nitrogen incorporated in UNCD films are residing at grain boundary regions, converting sp³-bonded carbons into sp²-bonded ones. The nitrogen ions inject electrons into the grain boundary carbons, increasing the electrical conductivity of the grain boundary regions, which improves the efficiency for electron transport from the substrate to the emission sites, the diamond grains.     

Rearrangements of sp/sp hybridized bonding with phosphorus incorporation in pulsed laser deposited semiconducting carbon films by X-ray photoelectron spectroscopic analysis

The carbon films were grown on p-type silicon substrate at room temperature by pulsed (XeCl) laser deposition technique using camphoric carbon target containing 1%, 3%, 5% and 7% of phosphorus (P) by mass. The analysis of X-ray photoelectron spectroscopy spectra of the C1s region in these films shows the presence of sp² and sp³ hybridized carbon and a sp² satellite peak due to π–π shake up. The sp² content is seen to remain almost constant with P content. The FWHM of the sp² peak increases up to 5% P but decreases for 7% P probably due to clustering of sp² chains and this clustering in the sp² phase probably decreases the band gap for the 7% P film. With P incorporation, the tetrahedral bonding configurations of the carbon network do not change appreciably, therefore, suggesting the scope of phosphorus as a potential dopant in carbon films.     

Etching process of hydrogenated amorphous carbon (a-C:H) thin films in a dual ECR–r.f. nitrogen plasma

Hydrogenated amorphous carbon (a-C:H) films deposited from CH₄ in a dual electron cyclotron resonance (ECR)–r.f. plasma were treated in N₂ plasma at different r.f. substrate bias voltages after deposition. The etching process of a-C:H films in N₂ plasma was observed by in situ kinetic ellipsometry, mass spectroscopy (MS), and optical emission spectroscopy (OES). Ex situ atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS) were used to characterize the etched film surface. XPS analysis proves that the nitrogen treatment on the a-C:H film, induced by r.f. substrate bias, causes a direct nitrogen incorporation in the film surface up to 15–17 at.% to a depth of about 20–40 Å depending on the r.f. bias. Various bonding states between carbon and nitrogen, such as tetrahedral sp³ C–N, and trigonal sp² C–N were confirmed by the deconvolution analysis of C 1s and N 1s core level spectra. The evolution of etching rate and the surface roughness in the film measured by AFM exhibit a clear dependence on the applied r.f. bias. MS and OES show the various neutral species in the N₂ plasma such as HCN, CN, and C₂N₂, which may be considered as the chemical etching products during the N₂ plasma treatment of a-C:H film.     

Raman study of the microstructure changes of phenolic resin during pyrolysis

After curing, phenol‐formaldehyde resins were post‐cured at 160°C, and then carbonized and graphitized from 300°C to 2400°C. The structure of the resulting carbonized and graphitized resins were studied using X‐ray diffraction and Raman spectroscopy. Thermal fragmentation and condensation of the polymer structure occurred above 300°C. The crystal size of the cured phenolic resins increased with an increase in temperature. The crystal size increased from 0.997 nm to 1.085 nm when the heat‐treatment temperature rose from 160°C to 500°C. Above 600°C, the original resin structures disappeared completely. Below 1000°C, the stack size (L_c) increased very slowly. The values increased from 0.992 to 1.192 nm when the heattreatment temperature rose from 600°C to 1000°C. Above 1000°C, the stack size showed an increase with the increase in heat‐treatment temperature. The values increased from 1.192 to 2.366 nm when the temperature rose from 1000°C to 2400°C. The carbonized and graphitized resins were characterized using Raman spectroscopy. The Raman spectrra were recorded between 700 and 2000 cm⁻¹. Below 400°C, there were no carbon structures in the Raman spectra analysis. Above 500°C, G and D bands appeared. Raman spectra confirmed progressive structure ordering as heat‐treatment temperature increased. The frequency of the G band of all carbonized and graphitized samples shifted to 1600 cm⁻¹ from the 1582 cm⁻¹ of graphite. At the same temperature, the D band shifted to 1330 cm⁻¹ from the 1357 cm⁻¹ of the imperfect carbon. In the curve fitting analysis of the Raman spectra, a Gaussian shaped band centered at 1165 cm⁻¹ was included. This band has not been described before in the literature and is attributed to disordered structures, which are formed from the original polymeric structures. These polymeric structures formed unknown disordered structures and remained in the carbonized phenolic resins. Above 1800°C, this band disappeared completely. But, a weak peak is present near 1620 cm⁻¹. This indicated that those disoriented molecules and some disordered carbons were removed as volatiles or repacked into the glassy carbon structures during graphitization. The carbonized and graphitized phenolic resins were found to correspond to low order sp² bonded carbon, but cannot be considered as truly glassy or amorphous carbon materials since they have some degree of order in the basal plane.