Improved electrical properties using SrTiO3/Y2O3 bilayer dielectrics for MIM capacitor applications

In this paper, we show that the capacitance–voltage linearity of MIM structures can be enhanced using SrTiO₃ (STO)/Y₂O₃ dielectric bilayers. The C(V) linearity is significantly improved by combining two dielectric materials with opposite permittivity-voltage responses. Three STO/Y₂O₃ stacks with different thicknesses were realized and compared to a 20 nm STO single layer structure. We observed that an increase in the Y₂O₃ thickness leads to an improvement in the voltage linearity, while maintaining an overall capacitance density greater than 10 fF/μm².     

Modeling and optimization of series resistance of planar MIM capacitors

Integrated circuits for analog and telecom applications require metal insulator metal (MIM) capacitors with not only a high capacitance value (typically 5 nF/mm²), but also a low series resistance R_s. The optimization of this latter parameter is investigated in this paper, by means of a simple analytical model, taking into account both the impact of material parameters and device architectures, suggesting possible strategies for R_s minimization. Such a model is also suitable for MIM circuit simulation, and can be also extended to other devices, such as to the gate series resistance modeling of RF MOSFET. Results are in good agreement with numerical simulations and HF measurements, performed on state of the art planar MIM devices. Moreover, discussion on via placement to access the top electrode has been held, in order to optimize the series resistance of the capacitor.     

First investigation of metal–insulator–metal (MIM) capacitor using Pr2O3 dielectrics

Metal–insulator–metal (MIM) capacitors with Pr₂O₃ as high-k material have been investigated for the first time. We varied the thickness of the Pr₂O₃ layers as well as the bottom electrode material. The layers are characterised using X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), transmission electron microscopy (TEM) and secondary ion mass spectroscopy (SIMS). Preliminary information on the interaction of water with the films was obtained from XPS and ab initio pseudopotential calculations. The electrical characterisation shows that Pr₂O₃ MIM capacitors can provide higher capacitance densities than Si₃N₄ MIM capacitors while still maintaining comparable voltage coefficients of capacitance. The Pr₂O₃ dielectric material seems to be suitable for use in silicon RF applications.     

ZrAlO ternary oxide as a candidate for high-k dielectrics

ZrAlO thin films were prepared by the pyrosol process. Four different cases were considered taking as basis a solution of 0.025 M zirconium acetylacetonate (ZrAAc) and 5 at% of aluminum acetylacetonate (AlAAc) dissolved in pure methanol. Films of case A, were deposited with the mentioned solution and subjected to rapid thermal annealing (RTA). For case B, a small volume of water was added to start solution. Case C, were similar samples of case B, but with a post-deposition RTA. Case D, were Si/Al₂O₃/ZrAlO/Al stacks with post-deposition RTA, using water in the start solution. XPS profiles show that the relative chemical composition of deposited materials is affected by the volume of water added (Vw). The aluminum concentration in the films acquires values as high as or higher than zirconium concentration for increasing Vw. All the prepared samples were amorphous as indicated by the X-ray diffraction (XRD) spectra, even for large integration times. Current–voltage (I–V) and capacitance measurements were carried out in metal–insulator–metal (MIM) devices (Corning-glass/TCO/ZrAlO/Al) and I–V and simultaneous capacitance–voltage (C–V) measurements were performed in metal–oxide–semiconductor (MOS) devices (Si/ZrAlO/Al and Si/Al₂O₃/ZrAlO/Al). Leakage currents of the order of 10⁻⁴ A/cm², were typically obtained in MIM devices, whereas for some MOS devices, leakage currents of the order of 10⁻⁷ A/cm² were obtained. Dielectric constant (k) values of the order of 24 were calculated for MIM devices and k values ranging from 12.5 up to 17 were calculated for MOS devices.     

High κ for MIM and RRAM applications: Impact of the metallic electrode and oxygen vacancies

Influence of metallic electrode and oxygen vacancies in MIM capacitors and MIM RRAM high κ based devices is studied. For both MIM capacitors and MIM RRAM it is shown that the electrode composition strongly influences the overall behavior of the devices and more precisely, the capacitance–voltage curve (nonlinearities) for MIM capacitors, and the switching mechanism (SET/RESET) for MIM RRAM. Best results for HfO₂ RRAM are obtained with Pt as bottom electrode instead of TiN while very low capacitance variations are observed for high work function electrodes, or more precisely electrodes with low oxygen affinity. These evolutions are related to the oxygen vacancies concentration and migration to the cathode electrode/high κ interface.     

Improved manufacturability of ZrO2 MIM capacitors by process stabilizing HfO2 addition

A broad compositional range of the dielectric material Zr_1?xHf_xO₂ was evaluated with respect to its applicability in DRAM storage capacitors. The paper reports on phase composition, crystallization behavior, and electrical properties of the mixed system in planar metal-insulator-metal (MIM) capacitors. Admixture of HfO₂ into ZrO₂ proved to stabilize the deposition process at high temperatures without degrading the dielectric properties of the film. Compared to pure ZrO₂ the 30–40% HfO₂ containing films showed improved scalability (capacitance equivalent thickness 0.73 nm at 8 * 10^?9 A/cm²) as well as improved reliability.     

Structural, electrical and optical properties of GZO/HfO2/GZO transparent MIM capacitors

Metal–insulator–metal (MIM) transparent capacitors were prepared by pulsed laser deposition (PLD) on glass substrates. The effect of the thickness of the dielectric layer and oxygen pressure on structural, electrical, and optical properties of these capacitors was investigated. Experimental results show that film thickness and oxygen pressure have no effect on the structural properties. It is also found that the optical properties of the HfO₂ thin films depend strongly on both the film thickness and oxygen pressure. The electrical properties of transparent capacitors were investigated at various thickness of the dielectric layer. The capacitor shows an overall high performance, such as a high dielectric constant of 28 and a low leakage current of 2.03×10⁻⁶ A/cm² at ±5 V. Transmittance above 70% was observed in visible region.     

High-density MIM capacitors (/spl sim/85 nF/cm/sup 2/) on organic substrates

For the first time, transferring the prefabricated capacitors on a silicon wafer onto FR-4 has been used to realize high-density metal-insulator-metal (MIM) capacitors on an organic substrate. A high capacitance density /spl sim/85 nF/cm/sup 2/ was achieved on FR-4 substrate with PECVD silicon nitride as the dielectric layer. Excellent voltage coefficient (/spl sim/2.2 ppm/V/sup 2/) and temperature coefficient (/spl sim/38 ppm//spl deg/C) were obtained for capacitors on FR-4. Dielectric leakage and breakdown characteristics have been assessed, and the results demonstrated acceptable performance. Thus, this technology provides a new method to embed/integrate high-density capacitors on organic substrates for the system-in-package applications.     

RF inductors and capacitors integrated on silicon chip by CMOS compatible Cu interconnect technology

High-Q inductors and high-density capacitors have been designed and fabricated with a post-process of additional metal layers on the top of interconnect layers. The fabrication was carried out with advanced Cu interconnect technology, which was compatible with nowadays CMOS backend of line. The Q_max of inductors with inductance from 0.4 to 11 nH was over 11 on low-resistivity silicon substrates. Two kinds of structures of on-chip capacitors, MIM and MIMIM, have been studied. A capacitance of 1.75 fF/μm² has been achieved with MIMIM structure using Si₃N₄ as dielectric.     

High performance TaYOx-based MIM capacitors

TaYO_x-based metal-insulator-metal (MIM) capacitors with excellent electrical properties have been fabricated. Ultra-thin TaYO_x films in the thickness range of 15-30 nm (EOT ∼ 2.4-4.7 nm) were deposited on Au/SiO₂ (100 nm)/Si (100) structures by rf-magnetron co-sputtering of Ta₂O₅ and Y₂O₃ targets. TaYO_x layers were characterized by X-ray photoelectron spectroscopy (XPS), energy dispersive X-ray (EDX) and X-ray diffraction (XRD) to examine the composition and crystallinity. An atomic percentage of Ta:Y = 58.32:41.67 was confirmed from the EDX analysis while XRD revealed an amorphous phase (up to 500 °C) during rapid thermal annealing. Besides, a high capacitance density of ∼3.7-5.4 fF/μm² at 10 kHz (ε_r ∼ 21), a low value of VCC (voltage coefficients of capacitance, α and β) have been achieved. Also, a highly stable temperature coefficient of capacitance, TCC has been obtained. Capacitance degradation phenomena in TaYO_x-based MIM capacitors under constant current stressing (CCS at 20 nA) have been studied. It is observed that degradation depends strongly on the dielectric thickness and a dielectric breakdown voltage of 3-5 MV/cm was found for TaYO_x films. The maximum energy storage density was estimated to be ∼5.69 J/cm³. Post deposition annealing (PDA) in O₂ ambient at 400 °C has been performed and further improvement in device reliability and electrical performances has been achieved.     

High temperature characterization of high-κ dielectrics on SiC

We have fabricated thin catalytic metal–insulator–silicon carbide based structure with palladium (Pd) gates using TiO₂ as the dielectric. The temperature stability of the capacitor is of critical importance for use in the fabrication of electronics for deployment in extreme environments. We have evaluated the response to temperatures in excess of 450 °C in air and observed that the characteristics are stable. Results of high temperature characterization are presented here with extraction of interface state density up to 650 °C. The results show that at temperatures below 400 °C the capacitors are stable, with a density of interface traps of approximately 6×10¹¹ cm² eV⁻¹. Above this temperature the C–V and G–V characteristics show the influence of a second set of traps, with a density around 1×10¹³ cm² eV⁻¹, which is close to that observed for slow states near the conduction band edge. The study of breakdown field as a function of temperature shows two distinct regions, below 300 °C where the breakdown voltage has a strong temperature dependence and above 300, where it is weaker. We hypothesize that the oxide layer dominates the breakdown voltage at low temperature and the TiO₂ layer above 300 °C. These results at high temperatures confirms the suitability of the Pd/TiO₂/SiO₂/SiC capacitor structure for stable operation in high temperature environments.     

Atomic - vapour - deposited HfO2 and Sr4Ta2O9 layers for metal-insulator-metal applications

Sr₄Ta₂O₉ and HfO₂ films were prepared on 200 mm TiN/Si(100) substrates by Atomic Vapour Deposition (AVD). Depositions were carried out within a thermal budget of CMOS back end of line. Electrical properties have been investigated in metal-insulator-metal capacitors after sputter deposition of Au top electrodes. Both Sr₄Ta₂O₉ and HfO₂ dielectrics show excellent electrical performances. Oxides possess high capacitance densities of 3.5 fF/μm²(HfO₂) and 4.5 fF/μm² (Sr₄Ta₂O₉) in combination with high voltage linearity (α < 100ppm/V²). Sr₄Ta₂O₉ MIM capacitors provide lower leakage currents at 2 V, while HfO₂ MIMs offer higher operating voltage values for 10 years lifetime than Sr₄Ta₂O₉ based capacitors. The dielectric breakdown fields of HfO₂ (5.8 MV/cm) and Sr₄Ta₂O₉ (3.2 MV/cm) were obtained from I(V) characteristics.     

Single FDCCII-based mixed-mode biquad filter with eight outputs

The transconductance and the transresistance modes might act as the bridge transferring from voltage-mode to current-mode and vice versa, respectively. A novel mixed-mode (including voltage, current, transconductance, and transresistance modes) biquad filter with one input and seven outputs or two inputs and eight outputs is presented. The proposed filter structure only uses a single fully differential current conveyor (FDCCII), three resistors and two grounded capacitors, which are the least components necessary for realizing voltage, current, transresistance modes all five standard filter functions and transconductance-mode band-pass, high-pass filter functions from eight output terminals. Moreover, the new mixed-mode biquad filter still enjoys (i) the employment of two grounded capacitors (attractive for absorbing shunt parasitic capacitance and ideal for IC implementation), (ii) orthogonal control of ω₀ and Q (easy for tunability), and (iii) high output impedance of three current outputs (good for cascadability). H-Spice simulation results verify the theoretical analysis.     

High-density MIM capacitors using Al2O3 andAlTiOx dielectrics

We have investigated the electrical characteristics of Al₂ O₃ and AlTiO_x MIM capacitors from the IF (100 KHz) to RF (20 GHz) frequency range. Record high capacitance density of 0.5 and 1.0 μF/cm² are obtained for Al₂ O₃ and AlTiO_x MIM capacitors, respectively, and the fabrication process is compatible to existing VLSI backend integration. However, the AlTiO_x MIM capacitor has very large capacitance reduction at increasing frequencies. In contrast, good device integrity has been obtained for the Al₂O₃ MIM capacitor as evidenced from the small frequency dependence, low leakage current, good reliability, small temperature coefficient, and low loss tangent     

Very high-density (23 fF//spl mu/m/sup 2/) RF MIM capacitors using high-/spl kappa/ TaTiO as the dielectric

A very high density of 23 fF//spl mu/m/sup 2/ has been measured in RF metal-insulator-metal (MIM) capacitors which use high-/spl kappa/ TaTiO as the dielectric. In addition, the devices show a small reduction of 1.8% in the capacitance, from 100 kHz to 10 GHz. Together with these characteristics the MIM capacitors show low leakage currents and a small voltage-dependence of capacitance at 1 GHz. These TaTiO MIM capacitors should be useful for precision RF circuits.     

Investigation of high-K gate stacks with epitaxial Gd2O3 and FUSI NiSi metal gates down to CET=0.86 nm

Novel gate stacks with epitaxial gadolinium oxide (Gd₂O₃) high-k dielectrics and fully silicided (FUSI) nickel silicide (NiSi) gate electrodes are investigated. Ultra-low leakage current densities down to 10^–7 A cm^–2 are observed at a capacitance equivalent oxide thickness of CET=1.8 nm. The influence of a titanium nitride (TiN) capping layer during silicidation is studied. Furthermore, films with an ultra-thin CET of 0.86 nm at a Gd₂O₃ thickness of 3.1 nm yield current densities down to 0.5 A cm⁻² at V_g=+1 V. The extracted dielectric constant for these gate stacks ranges from k=13 to 14. These results emphasize the potential of NiSi/Gd₂O₃ gate stacks for future material-based scaling of CMOS technology.     

Challenges of Ta2O5 as high-k dielectric for nanoscale DRAMs

The present status, successes, challenges and future of Ta₂O₅, and mixed Ta₂O₅-based high-k layers as active component in storage capacitors of nanoscale DRAMs are discussed. The engineering of new Ta₂O₅-based dielectrics (doped Ta₂O₅ and multicomponent Ta₂O₅-based high-k dielectrics) as well as of metal/high-k interface in MIM capacitor configuration are identified as critical factors for further reduction of EOT value below 1 nm.     

Nanoscale Resistive Switching in Amorphous Perovskite Oxide (a‐SrTiO3) Memristors

Memristive devices are the precursors to high density nanoscale memories and the building blocks for neuromorphic computing. In this work, a unique room temperature synthesized perovskite oxide (amorphous SrTiO₃: a‐STO) thin film platform with engineered oxygen deficiencies is shown to realize high performance and scalable metal‐oxide‐metal (MIM) memristive arrays demonstrating excellent uniformity of the key resistive switching parameters. a‐STO memristors exhibit nonvolatile bipolar resistive switching with significantly high (10³–10⁴) switching ratios, good endurance (>10⁶I–V sweep cycles), and retention with less than 1% change in resistance over repeated 10⁵ s long READ cycles. Nano‐contact studies utilizing in situ electrical nanoindentation technique reveal nanoionics driven switching processes that rely on isolatedly controllable nano‐switches uniformly distributed over the device area. Furthermore, in situ electrical nanoindentation studies on ultrathin a‐STO/metal stacks highlight the impact of mechanical stress on the modulation of non‐linear ionic transport mechanisms in perovskite oxides while confirming the ultimate scalability of these devices. These results highlight the promise of amorphous perovskite memristors for high performance CMOS/CMOL compatible memristive systems.     

Electrical characterization of metal-oxide-high-k dielectric-oxide-semiconductor (MOHOS) structures for memory applications

Conventional SONOS (polysilicon-oxide-nitride-oxide-silicon) non-volatile memory devices use silicon nitride as the charge storage layer. In this work, metal-oxide-high-k dielectric-oxide-silicon (MOHOS) structures are fabricated using HfO₂ and Dy₂O₃ high-k dielectrics as the charge storage layer. The Al/SiO₂/Dy₂O₃/SiO₂/Si capacitors have a C–V memory window of 1.88 V and a leakage current density of 10⁻⁸ A/cm². This leakage current is lower than those of Al/SiO₂/HfO₂/SiO₂/Si capacitors and other similar capacitors reported in the literature. A minimum detection window of 0.5 V for MOHOS capacitors can be maintained up to 2 × 10⁸ s using as-deposited Dy₂O₃. The better performance of the Al/SiO₂/Dy₂O₃/SiO₂/Si structure over Al/SiO₂/HfO₂/SiO₂/Si is attributed to the larger conduction band offset at the Dy₂O₃/SiO₂ interface (2.3 eV) versus 1.6 eV at the HfO₂/SiO₂ interface.     

Electrochemical investigation of graphene/cerium oxide nanoparticles as an electrode material for supercapacitors

Mechanisms of charge storage, stability, capacitance, morphology and response current of graphene/cerium oxide (CeO₂) nanoparticles as an electrode material for electrochemical capacitors have been investigated. Electrochemical properties of the assembled electrodes were studied using cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS) techniques in 3 M NaCl, NaOH and KOH electrolytes. Scanning electron microscopy (SEM) is used to characterize the microstructure and the nature of prepared electrodes. SEM images confirm the layered structure (12 nm thickness) of the used graphene. The proposed electrode shows a maximum specific capacitance as high as 11.09 F g⁻¹ in the potential range between −0.55 and 0.3 (V vs. SCE) at scan rate of 5 mV s⁻¹. The charge/discharge cycling test shows a good reversibility and confirms that capacitance will increase after 500 cycles by 37%.