一种用于功率模块热分布特性研究的精确模型

应用有限元法 ,对一个 IGBT功率模块的三维热分布进行了仿真研究 ,提出了通过 ANSYS仿真建立热模型的基本方法 ,进而探讨了功率模块上各芯片之间的热耦合关系 ,提出了考虑热耦合效应在内的功率模块热模型的统一结构 ,基于对瞬态热阻抗曲线的拟合 ,获得了热模型的相关参数 ,从而建立了热耦合模型 .该模型可方便地应用于电路仿真软件如 PSPICE中 ,仿真结果与有限元计算结果一致 ,并与实际测量值相符 .     

结温在线控制系统的IGBT功率模块热耦合模型

应用有限元法，对IGBT功率模块的三维热分布进行了仿真研究，得到了器件的稳态热阻及瞬态热阻抗。研究了功率模块各芯片之间的相互热影响，提出了热耦合效应热模型的统一结构，基于对瞬态热阻抗曲线的拟合，得到热模型的相关参数，从而建立了热耦合效应热模型。以一个降压变换器为例，阐述了结温在线控制系统的工作原理，并将热模型应用于该系统中，计算结果与测量结果非常一致。     

考虑热耦合的全桥功率模块功率循环方法

实际应用中,功率模块桥臂之间的热耦合非常普遍,提出了考虑热耦合的全桥功率模块功率循环方法,但电流路径很难与实际工况下的电流路径保持一致。通过时序电参数法,分析了有、无热耦合条件下功率循环试验中功率模块结温的分布特点。分析了电流路径对考虑热耦合的功率循环试验的影响,并进行了有、无热耦合条件下的功率循环试验。结果显示,考虑热耦合的功率循环试验应考虑电流路径差异造成的影响,热耦合对功率循环寿命有影响。通过有限元仿真,探究了热耦合和电流路径影响功率模块结温分布的机理,确定了考虑热耦合的功率循环方法。     

热电耦合微执行器温度分布的节点分析法

MEMS系统设计的节点分析法已经被成功地用于机械或机电耦合器件的仿真,但其无法用于热执行器中热-电耦合问题的分析仿真.本文提出一种通过傅里叶变换使用节点分析法动态分析仿真热执行器中热电耦合问题的方法,并建立了热执行器中基本单元--梁单元的热电耦合模型.这种模型的分析计算结果与有限元软件ANSYS吻合较好.     

基于ANSYS的IGBT热模拟与分析

根据IGBT的基本结构和工作原理,建立了一种新的IGBT三维热模型.运用基于有限元法的分析软件ANSYS,对功率分别为0.5W,1.0W,1.5W,2.0W条件下的器件热分布进行模拟分析.结果表明,热耦合加剧了器件的自升温,且功率越大,影响越明显.另外,考虑了热导率随温度变化情况下的器件热模拟结果显示:在相同的功率(1W)条件下,器件最高温升高4.8K.由模拟结果得到的热阻与红外实测结果基本一致.     

基于仿真的大功率功放模块强迫风冷散热结构设计

某数据链设备的功放模块发热问题比较突出,常温工作即发生热保护.分析了该功放模块原散热结构存在的问题,对其进行了改进设计.设计过程中应用热仿真软件辅助分析,建立了模块的热仿真模型,分析了常温和高温工作时模块散热性能.最后对常温散热性能进行了热测试,验证了仿真模型的准确性,表明改进后的模块散热结构方案有效可行.     

功率MMIC封装的热分析北大核心CSCD

介绍了一种利用计算流体动力学分析软件和有限元法多物理场分析软件对功率微波单片集成电路(MMIC)封装进行电热及热力特性数值模拟的方法。首先对功率MMIC封装的热传导路径及等效热模型进行了简化分析,基于简化模型对影响热分布和热传导的因素进行分析,并提取其材料和结构参数,建立功率MMIC封装的热模型,并对一款S波段5 W功率放大器MMIC封装进行仿真,得到功率MMIC及其封装的温度分布,仿真结果均与实际测试结果相吻合。所建立的简化模型和热应力分析对功率MMIC及其封装结构的设计和改进具有指导意义。     

LD侧边抽运板条激光器的热效应

对LD侧边抽运的板条激光介质热效应进行理论分析与数值模拟,根据2.5 mm×14 mm×40 mm Nd∶YAG板条实物建立了相应的三维(3D)热模型,采用有限元方法分析并模拟了板条激光介质内部温度场和热应力的分布,给出在120 W抽运功率下板条激光介质的热畸变特性,估算了在不同抽运功率下热焦距的大小.在此基础上设计并封装了LD侧边抽运的板条激光模块,对该模块的热焦距进行实验研究,得到热焦距随抽运功率变化的测量曲线,实验结果与理论分析一致.     

DC/DC电源模块的有限元热分析

为解决电源模块的热可靠性问题,利用有限元热分析软件ANSYS对其进行热分析,得到整个模块的温度场分布情况;分析了模块中各生热元件的温升及其之间的热耦合情况;根据热分析结果提出热设计方法.最后,对模块各部分进行重新布局,证实了重新布局后的模块就其热可靠性而言更为合理.     

热电耦合微执行器温度分布的节点分析法

MEMS系统设计的节点分析法已经被成功地用于机械或机电耦合器件的仿真，但其无法用于热执行器中热电耦合问题的分析仿真．本文提出一种通过傅里叶变换使用节点分析法动态分析仿真热执行器中热电耦合问题的方法，并建立了热执行器中基本单元——梁单元的热电耦合模型．这种模型的分析计算结果与有限元软件ANSYS吻合较好．     

Developing a Simplified Analytical Thermal Model of Multi-chip Power Module

The study of the thermal behavior of power modules has become a necessity regarding the known rapid development in modern power electronics, and the prediction of temperature variation has generally been performed using transient thermal equivalent circuits. In this paper we have developed a simplified analytical thermal model of a power hybrid module. This analytical method is used to evaluate the thermal parameters of a device. The model takes into account the thermal mutual influence between the different module chips based on the analytical method. The thermal interaction between components is dependent on the boundary condition, the dissipated power value in the different components and the number of operating chips constituting the module. This effect is modelled as a source energy and a thermal resistance simply computed tanks to reasonably low measurement applied on the module. The derived thermal models offer an excellent trade-off between accuracy, efficiency and CPU-cost.     

Electrothermal simulation of multichip-modules with novel transient thermal model and time-dependent boundary conditions

The ability of monitoring the chip temperatures of power semiconductor modules at all times under various realistic working conditions is the basis for investigating the limits of the maximum permissible load. A novel transient thermal model for the fast calculation of temperature fields and hot spot temperature evolution presented recently is extended to include time-dependent boundary conditions for variations of ambient temperature and surface heat flows. For this a Green's function representation of the temperature field is used. Also, general initial temperature conditions are included. The method is exemplified by application to a dc/ac converter module for automotive hybrid drives. The thermal model, which can be represented by a thermal equivalent circuit, then is combined with an electrical PSpice-metal-oxide semiconductor field-effect transistor (MOSFET) model to allow for the fully self-consistent electrothermal circuit simulation of 42-V/14-V dc/dc-converter modules. 670 converter periods with altogether 8000MOSFET switching cycles in the six-chip module can be simulated within 1-h computing time on a Pentium PC. Various simulation results are presented, which demonstrate the feasibility of the simulation method and allow for the optimization of converter losses. Short circuit modes of converter operation are investigated with a high temperature increase also revealing the thermal interaction between different chips.     

百瓦级多芯片半导体激光器稳态热分析

半导体激光器在各领域的广泛应用要求其输出功率不断提高,使得多芯片集成封装大功率半导体激光器的发展成为主流之一。针对典型的12 只芯片以阶梯形式封装的百瓦级激光器,利用ANSYS 软件进行了稳态热分析,模拟得出芯片有源区温度及其热耦合温升与热沉结构尺寸变化的关系曲线,分析了该激光器热特性,进而提出一种使芯片散热较好的热沉结构。     

基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究

 叠层三维多芯片组件(3D Multi-Chip Module,MCM)芯片的位置布局直接影响其内部温度场分布,进而影响其可靠性.本文研究了叠层3D-MCM内芯片热布局优化问题,目标是降低芯片最高温度、平均芯片温度场.基于热叠加模型并结合热传导公式,选取芯片的温度作为评价指标,确定出用于3D-MCM热布局优化的适应度函数,采用遗传算法对芯片热布局进行优化,得出了最优芯片热布局方案,总结出了可用于指导叠层3D-MCM芯片热布局设计的热布局规则;采用有限元仿真方法,对所得的热布局优化结果进行验证,结果表明热布局优化结果与仿真实验结果一致,本文所提出的基于热叠加模型的MCM热布局优化算法可实现叠层3D-MCM芯片的热布局优化.     

Reliability and wireability optimizations for chip placement on multichip modules

The chip placement problem of multichip module (MCM) designs is to map the chips properly to the chip sites on the MCM substrate. Chip placement affects not only the thermal characteristics of an MCM but also routing efficiency, which translates directly into manufacturability, performance, and cost. This paper presents a solution methodology for the optimal placement problem considering both thermal and routing design objectives simultaneously. The coupling is achieved through use of a hybrid-force model that is a combination of the traditional interconnection-force model and a novel thermal-force model. The placement procedure can be used as a design tool to place chips and then determine the tradeoffs which can be made in placing for reliability and wireability. Experiments on five examples including three benchmarks show that the present algorithm yields very high-quality results.     

用高低温循环加速试验评估光源模块长期贮存寿命的研究

Light source modules are the most crucial and fragile devices that affect the life and reliability of the interferometric fiber optic gyroscope （IFOG）. While the light emitting chips were stable in most cases, the module packaging proved to be less satisfactory. In long-term storage or the working environment, the ambient temperature changes constantly and thus the packaging and coupling performance of light source modules are more likely to degrade slowly due to different materials with different coefficients of thermal expansion in the bonding interface. A constant temperature accelerated life test cannot evaluate the impact of temperature variation on the performance of a module package, so the temperature cycling accelerated life test was studied. The main failure mechanism affecting light source modules is package failure due to solder fatigue failure including a fiber coupling shift, loss of cooling efficiency and thermal resistor degradation, so the Norris-Landzberg model was used to model solder fatigue life and determine the activation energy related to solder fatigue failure mechanism. By analyzing the test data, activation energy was determined and then the mean life of light source modules in different storage environments with a continuously changing temperature was simulated, which has provided direct reference data for the storage life prediction of IFOG.     

Real-time 3D thermal modeling of a magnetically levitated planar actuator

A transient thermal model used to monitor the temperature distribution in real-time in a long-stroke moving-magnet planar actuator is presented. The temperature distribution in the stator coils of the planar actuator depends on the trajectory of the levitated magnet plate as the set of active coils changes with the position of the translator. Using the presented real-time model, the transient thermal behavior can be investigated. Using this thermal model, the commutation algorithm of the planar actuator is adjusted to actively limit the temperature of the coils, and better spread the temperature over the stator coils.     

基于多场耦合的电机暂态温度场研究

针对复杂工况下电机不稳定发热引起的温度场暂态计算问题,根据不稳定发热的规律建立电磁场与温度场的二维耦合模型。文中依据小型式异步电机的结构特点,进行电磁场-热场二维模型的结构参数、边界条件参数、材料的电、热物理参数的计算、等效及配置;依据复杂工况下发热变化的规律,进行耦合频率、热源耦合方式的设计及相关参数计算配置,实现不稳定负载下电机的暂态温度场计算并考察电机各部分的实际最高温度分布状况。基于实验平台的方案设计和搭建,进行温升实验。通过对比分析电机暂态温度场的仿真和实验数据,验证了二维模型参数等效的合理性和多场耦合法能够准确地计算复杂工况下电机全暂态温度场。     

Thermal analysis for indirect liquid cooled multichip module using computational fluid dynamic simulation and response surface methodology

This paper demonstrates the application of computational fluid dynamic (CFD) simulation and response surface methodology (RSM) in analyzing the thermal performance of a high input/outputs, seven chips, indirect liquid cooled multichip module which will be applied in a kind of supercomputer. A series of similar experiments and corresponding CFD simulations are conducted firstly to evaluate the validity of CFD simulation method and determine the interfacial thermal resistance of thermal grease iteratively, and then a three-dimensional CFD model is established to investigate the heat transfer and fluid flow of the multichip module. Based on the CFD model, the individual effects of factors such as thermal conductivity of the thermal interface material and thermal grease, thickness of the chips, space between chips, solder bump patterns, solder ball patterns, flow velocity and liquid inlet temperature on the thermal performance of the module are studied with one-factor-at-a-time experimentation, and after that, four significant factors are selected to establish a response surface model of the maximum temperature of the module with central composite design based RSM and analysis of variance.