S波段0.3W AlGaAs/GaAsHBT功率管

采用标准的湿法刻蚀工艺研制出了 S波段工作的非自对准 Al Ga As/ Ga As异质结双极晶体管 .对于总面积为 8× 2 μm× 10 μm的 HBT器件 ,测得其直流电流增益大于 10 ,电流增益截止频率 f T 大于 2 0 GHz,最高振荡频率fmax大于 30 GHz.连续波功率输出为 0 .3W,峰值功率附加效率 41%     

自对准AlGaAs/GaAs微波异质结双极晶体管(HBT)

本文提出了一种制作HBT采用的垂直台面结构自对准工艺.利用该工艺及对A1GaAs/GaAs具有高选择比的化学湿法腐蚀剂,已研制成微波HBT.发射区台面与基极电极间隙为0.1μm,最大直流电流增益为40,截止频率f_T为10GHz.     

C波段3.5W/mm,PAE＞40%的InGaP/GaAs HBT功率管

通过优化InGaP/GaAs异质结双极晶体管(HBT)的材料结构和器件结构,采用BE金属自对准、发射极镇流和电镀空气桥等工艺技术,研制了C波段InGaP/GaAs HBT功率管.其击穿电压BVCBO大于31V,BVCEO大于21V;在5.4GHz时连续波(CW)饱和输出功率达到1.4W,功率密度达到3.5W/mm,功率附加效率(PAE)大于40%.     

C波段3.5W/mm,PAE＞40%的InGaP/GaAs HBT功率管

通过优化InGaP/GaAs异质结双极晶体管(HBT)的材料结构和器件结构,采用BE金属自对准、发射极镇流和电镀空气桥等工艺技术,研制了C波段InGaP/GaAs HBT功率管.其击穿电压BVCBO大于31V,BVCEO大于21V;在5.4GHz时连续波(CW)饱和输出功率达到1.4W,功率密度达到3.5W/mm,功率附加效率(PAE)大于40%.     

4GHz300mW InGaP/GaAs HBT功率管研制

通过采用发射极-基极金属自对准、发射极镇流电阻,电镀空气桥等工艺改善了器件的高频特性,提高了器件热稳定性与功率特性.当器件工作在AB类,工作频率为4 GHz,集电极偏置电压为3.5 V时,尺寸为16×(3 μm×15 μm)的功率管获得了最大输出功率为24.9 dBm(309.0 mW)、功率增益为8.1dB的良好性能.     

AlGaAs/GaAs HBT电压比较器

本文对异质结双极晶体管(HBT)电压比较器进行了理论分析,设计并制作了国内第一个AlGaAs/GaAs HBT电压比较器电路。首先,分析了HBT的基本工作原理;然后比较详细地分析了ECL电压比较器的工作原理并进行了设计。随后介绍了HBT的E-M模型,提取了模型参数,并对电路进行了模拟;最后全面介绍了AlGaAs/GaAs HBT电压比较器的制作过程。测试结果表明,HBT器件直流电流增益大于100,f_T为15.2GHz,f_(max)为14.8GHz;电路具有取样和锁存能力,并具有电压比较器的初步功能。     

S波段低相位噪声HBT MMIC VCO

Ｓ波段低相位噪声ＨＢＴＭＭＩＣＶＣＯ陈新宇，林金庭，陈效建（南京电子器件研究所，２１００１６）中图分类号：ＴＮ３２２ＴＮ４５４ＳＢａｎｄＬｗｏＰｈａｓｅＮｏｉｓｅＨＢＴＭＭＩＣＶＣＯ￥ＣｈｅｎＸｉｎｙｕ；ＬｉｎＪｉｎｔｉｎｇ；ＣｈｅｎＸｉａｏｊｉａｎ...     

两种不同结构InGaP/GaAs HBT的直流特性分析

InGaP/GaAs异质结双极晶体管(HBT)是当前微波毫米波领域中具有广阔发展前景的高速固态器件,其直流特性是器件重要参数之一.本文采用Medici软件对两种InGaP/GaAs外延结构HBT的直流特性和高频特性进行了模拟计算,并实际制备出了两种材料结构的大尺寸(发射极面积100μm×100μm)双台面InGaP/GaAs HBT器件,对其直流特性进行了测试和分析,两种外延结构的器件共射直流增益分别为50和350,模拟得其最大截止频率分别为8和10GHz.     

AlGaAs/GaAs HBT for high-temperature applications

A high-temperature N-p-n AlGaAs/GaAs HBT with a wide-bandgap emitter which can be operated up to a ambient temperature of 350°C is presented. It is demonstrated that a high Al mole fraction of 0.45 in the emitter in combination with a GaAs base layer yields excellent temperature stability. A useful common-emitter small-signal current gain h_FE higher than 35 was measured in the range between room temperature and 350°C     

AlGaAs／GaAs HBT集成电路的CAD

介绍了一套用于ＡｌＧａＡｓ／ＧａＡｓＨＢＴ集成电路的ＣＡＤ软件，它可完成ＨＢＴ的器件模拟、模型参数提取及电路模拟。应用该软件对ＨＢＴ运算放大器进行了模拟，为电路的研制提供了依据。     

高功率密度自对准结构AlGaAs/GaAs异质结双极晶体管

利用各向异性的湿法刻蚀和侧墙隔离技术实现了发射极金属和基极金属的自对准 ,采用该自对准技术成功地研制出了自对准结构的 Al Ga As/ Ga As异质结双极晶体管 ,器件直流电流增益大于 2 0 ,电流增益截止频率 f T 大于30 GHz,最高振荡频率 fmax大于 5 0 GHz,连续波功率测量表明 :在 1d B增益压缩时 ,单指 HBT可以提供 10 0 m W输出功率 ,对应的功率密度为 6 .6 7W/ m m,功率饱和时最大输出功率 112 m W,对应功率密度为 7.48W/ m m,功率附加效率为 6 7%     

高功率密度自对准结构AlGaAs/GaAs 异质结双极晶体管

利用各向异性的湿法刻蚀和侧墙隔离技术实现了发射极金属和基极金属的自对准,采用该自对准技术成功地研制出了自对准结构的AlGaAs/GaAs异质结双极晶体管,器件直流电流增益大于20,电流增益截止频率fT大于30GHz,最高振荡频率fmax大于50GHz,连续波功率测量表明：在1dB增益压缩时,单指HBT可以提供100mW输出功率,对应的功率密度为6.67W/mm,功率饱和时最大输出功率112mW,对应功率密度为7.48W/mm,功率附加效率为67%．     

AlGaAs/GaAs HBT linearity characteristics

Communication systems require linear power amplifiers with high efficiency and very low intermodulation distortion. AlGaAs/GaAs heterojunction bipolar transistors (HBT's) were found to have very low intermodulation distortion in power operation. Two-tone tests were carried out on both common-emitter (CE) and common-base (CB) power HBT's. At 7 GHz, the CE HBT showed -20 dBc IM₃ (third-order intermodulation ratio) and 12% power added efficiency (PAE) per tone at the 1 dB gain compression point; IM₃ dropped to -30 dBc at 1.5 dB output power backoff. The CE HBT has lower intermodulation distortion than CB HBT. Load pull data were collected to aid the understanding of the intermodulation. Parameters of the Gummel-Poon model (as used in SPICE) were derived for HBT's based on dc data and small-signal S parameters at various bias points. The accuracy and validity of the model were confirmed by comparison to experimental two-tone results. SPICE predicts that the emitter and base resistances linearize the HBT and reduce the third-order intermodulation distortion. The excellent third-order intermodulation performance of the CE HBT makes it a very attractive choice for linear power amplifiers     

Millimeter-wave AlGaAs/GaAs p-n-p HBT

The total emitter-to-collector delay for a p-n-p AlGaAs/GaAs heterojunction bipolar transistor (HBT) has been reduced to 5.7 ps by extending the cutoff frequency for these devices to the millimeter-wave range. A total charging delay of 1.2 ps was obtained by a lightly doped emitter and by reducing the collector resistance. Low transit delays totaling 4.5 ps were achieved with a thin (440 Å) uniformly doped base and a thin (2800 Å) collector. The reduction in these delays permitted a non-self-aligned (1-μm emitter mesa/base contact separation) device with two emitters (2.6×10 μm² each) and a single base contact to exhibit an f_t of 28 GHz     

用于HBT的AlGaAs/GaAs MOVPE材料

通过LP-MOVPE研制了实用化的AlGaAs/GaAsHBT材料。采用CCl4作为P型掺杂剂进行基区重掺杂。所作HBT增益为20～35,截止频率fT>50GHz,最大振荡频率fmax>60GHz,X波段功率HBT输出功率大于5W。     

Novel doubly self-aligned AlGaAs/GaAs HBT

A novel, doubly self-aligned process technology for AlGaAs/GaAs heterojunction bipolar transistors (HBT) has been developed. This doubly self-aligned process enables self-alignment for all emitter, base, and collector contacts and the fabricated device occupies an area approaching the intrinsic device area. The resulting base-collector capacitance of a fabricated device is reduced below half of the base-collector capacitance of conventional devices. The reductions in the capacitance are reflected in the superior cutoff frequency and maximum oscillation frequency of the doubly self-aligned devices as compared with conventional devices.<>     

AlGaAs/GaAs HBT的低频噪声

测试了AlGaAs／GaAsHBT的低频噪声，并将测试结果分解为1／f噪声、G－R噪声和白噪声，阐述了它们的产生机理，在此基础上建立了AlGaAs／GaAsHBT输入噪声电压的等效电路模型，该模型有助于AlGaAs／GaAsHBT电路的CAD。