MEMS技术现状及应用

微机电系统(MEMS)技术是一门新兴的技术,它将微电子技术和精密机械加工技术融合在一起,实现了微电子与机械的融为一体。近年来,对MEMS的技术发展、加工工艺及其产业化的研究也被越来越多的人所重视。文章介绍了MEMS的特点与技术发展现状、MEMS器件的类型及其功能,并以多层弯曲磁芯结构微执行器为例介绍了磁驱动微执行器工作原理与制作工艺过程。     

微机电系统技术的研究现状和展望

微机电系统(MEMS)是由微加工技术制造的微型传感器、微型执行器及集成电路组成的器件或系统.介绍了MEMS技术的研究背景和发展历程,着重阐述了微机电系统的核心技术和商业应用,其中特别提到了单芯片系统方面的前沿研究,最后就MEMS技术的前景和研究方向进行了探讨和展望.     

微器件操作末端执行器研究现状

微纳制造技术和微机电系统(MEMS)的迅猛发展,推动了微器件向微型化、集成化、多功能化方向发展。微器件操作末端执行器是微操作工具与微器件直接作用的部件,具有重要研究意义。综述了微器件操作末端执行器的研究现状和成果;对国内外微器件操作末端执行器进行了汇总和分类;对微器件操作末端执行器的工作原理和结构进行了介绍;基于对接触式和非接触式末端执行器研究现状的总结,分析了各种末端执行器的优势和局限。最后,讨论了微器件操作末端执行器的应用现状和面临的挑战,并对末端执行器的发展进行了展望。该研究为微器件操作末端执行器的选取和开发提供了技术参考。     

基于MEMS技术的水平轴光纤加速度传感器

提出了一种基于微机电系统(MEMS)技术的水平轴光纤加速度传感器,并与Z轴光纤加速度传感器在同一MEMS芯片上制造,形成单一方向出纤的三轴光纤加速度传感器。分析了器件工作原理和器件结构参数与其性能的关系,利用MEMS技术成功制作出了加速度传感器样品。初步测试结果表明,本光纤加速度传感器灵敏度为164mV/g,3dB带宽的截止频率为1 600Hz。     

MEMS器件各向异性腐蚀过程中的Al连线保护

微电子机械系统 ( MEMS)器件制造过程中的各向异性腐蚀工序 ,会引起硅片正面的 Al连线被腐蚀 ,造成器件的失效。本文论述了使用一种环氧树脂和聚酰胺调配的胶体将器件正面电路密封起来的方法 ,使 MEMS器件在 85℃ ,浓度为 3 3 %的 KOH溶液里进行各向异性腐蚀 ,可以成功地保护 Al连线。这种方法的使用 ,为 MEMS器件的制作完成奠定了技术基础     

国产MEMS器件性能突破

微机电系统MEMS是指可批量制作的,集微型机构、微型传感器、微型执行器以及信号处理和控制电路、直至接口、通信和电源等于一体的微型器件或系统。2014松山湖中国IC创新高峰论坛推广了多款新型MEMS产品,从各角度展示了中国创造在应用和性能等方面的突破。     

国产微机电系统MEMS器件性能突破

微机电系统MEMS是指可批量制作的,集微型机构、微型传感器、微型执行器以及信号处理和控制电路、直至接口、通信和电源等于一体的微型器件或系统。2014松山湖中国IC创新高峰论坛推广了多款新型MEMS产品,从各角度展示了中国创造在应用和性能等方面的突破。     

MEMS器件各向异性腐蚀过程中的AI连线保护

微电子机械系统(MEMS)器件制造过程中的各向异性腐蚀工序，会引起硅片正面的AI连线被腐蚀，造成器件的失效。本文论述了使用一种环氧树脂和聚酰胺调配的胶体将器件正面电路密封起来的方法，使MEMS器件在85℃，浓度为33％的KOH溶液里进行各向异性腐蚀，可以成功地保护AI连线。这种方法的使用，为MEMS器件的制作完成奠定了技术基础。     

微机电系统关键技术及其研究进展

微机电系统(MEMS)是在微电子技术的基础上兴起的一个多学科交叉的前沿领域,集约了当今科学技术发展的许多尖端成果,在汽车电子、航空航天、信息通讯、生物医学、自动控制、国防军工等领域应用前景广阔.该文介绍了微机电系统发展的背景与基础理论研究,综述了微机电系统所涉及的器件设计、制作材料、3大加工工艺(硅微机械加工、精密微机械加工与光刻、电铸和注塑(LIGA)技术)、微封装与测试等关键技术,总结了微机电系统在微纳传感器、微执行器、微机器人、微飞行器、微动力能源系统、微型生物芯片等方面的典型应用,最后指明了MEMS技术的发展趋势,有望在近几十年将大量先进的MEMS器件从实验室推向实用化和产业化.     

MEMS技术发展的趋势

大多数专家预测MEMS技术在今后的主要发展趋势综合如下：（1）研究方向多样化：从历次大型MEMS国际会议的论文来看，MEMS技术的研究日益多样化。MEMS技术涉及的领域主要包括惯性器件如加速度计与陀螺、AFM（原了力显微镜）、数据存储、三维微型结构的制作、微型阀门、泵和微型喷口、流量器件、微型光学器件、各种执行器、微型机电器件性能模拟、各种制造工艺、封装键合、医用器件、实验表征器件、压力传感器、麦克风以及声学器件等16个发展方向。     

A BioMEMS review: MEMS technology for physiologically integrated devices

MEMS devices are manufactured using similar microfabrication techniques as those used to create integrated circuits. They often, however, have moving components that allow physical or analytical functions to be performed by the device. Although MEMS can be aseptically fabricated and hermetically sealed, biocompatibility of the component materials is a key issue for MEMS used in vivo. Interest in MEMS for biological applications (BioMEMS) is growing rapidly, with opportunities in areas such as biosensors, pacemakers, immunoisolation capsules, and drug delivery. The key to many of these applications lies in the leveraging of features unique to MEMS (for example, analyte sensitivity, electrical responsiveness, temporal control, and feature sizes similar to cells and organelles) for maximum impact. In this paper, we focus on how the biological integration of MEMS and other implantable devices can be improved through the application of microfabrication technology and concepts. Innovative approaches for improved physical and chemical integration of systems with the body are reviewed. An untapped potential for MEMS may lie in the area of nervous and endocrine system actuation, whereby the ability of MEMS to deliver potent drugs or hormones, combined with their precise temporal control, may provide new treatments for disorders of these systems.     

Active MEMS-based flow control using artificial neural network

These last years several research works have studied the application of Micro-Electro-Mechanical Systems (MEMS) for aerodynamic active flow control. Controlling such MEMS-based systems remains a challenge. Among the several existing control approaches for time varying systems, many of them use a process model representing the dynamic behavior of the process to be controlled. The purpose of this paper is to study the suitability of an artificial neural network first to predict the flow evolution induced by MEMS, and next to optimize the flow w.r.t. a numerical criterion. To achieve this objective, we focus on a dynamic flow over a backward facing step where MEMS actuators velocities are adjusted to maximize the pressure over the step surface. The first effort has been to establish a baseline database provided by computational fluid dynamics simulations for training the neural network. Then we investigate the possibility to control the flow through MEMS configuration changes. Results are promising, despite slightly high computational times for real time application.     

Applications of MEMS in surgery

In the past few decades, microelectromechanical systems (MEMS) have found themselves being adopted into a wide variety of fields and disciplines. Recently there has been an increased interest in the use of MEMS for surgical applications. MEMS technology has the potential to not only improve the functionality of existing surgical devices, but also add new capabilities, which allow surgeons to develop new techniques and perform entirely new procedures. MEMS can improve surgical outcomes, lower risk, and help control costs by providing the surgeon with real-time feedback on the operation. This paper discusses the challenges MEMS face in the medical device market along with current applications and future directions for the technology.     

The package integration of RF-MEMS switch and control IC for wireless applications

The integration of microelectromechanical systems (MEMS) switch and control integrated circuit (IC) in a single package was developed for use in next-generation portable wireless systems. This packaged radio-frequency (RF) MEMS switch exhibits an insertion loss under -0.4 dB, and isolation greater than -45 dB. This MEMS switch technology has significantly better RF characteristics than conventional PIN diodes or field effect transistor (FET) switches and consumes less power. The RF MEMS switch chip has been integrated with a high voltage charge pump plus control logic chips into a single package to accommodate the low voltage requirements in portable wireless applications. This paper discusses the package assembly process and critical parameters for integration of MEMS devices and bi-complementary metal oxide semiconductor (CMOS) control integrated circuit (IC) into a single package.     

Multicore Flow Processor with Wire‐Speed Flow Admission Control

We propose a flow admission control (FAC) for setting up a wire‐speed connection for new flows based on their negotiated bandwidth. It also terminates a flow that does not have a packet transmitted within a certain period determined by the users. The FAC can be used to provide a reliable transmission of user datagram and transmission control protocol applications. If the period of flows can be set to a short time period, we can monitor active flows that carry a packet over networks during the flow period. Such powerful flow management can also be applied to security systems to detect a denial‐of‐service attack. We implement a network processor called a flow management network processor (FMNP), which is the second generation of the device that supports FAC. It has forty reduced instruction set computer core processors optimized for packet processing. It is fabricated in 65‐nm CMOS technology and has a 40‐Gbps process performance. We prove that a flow router equipped with an FMNP is better than legacy systems in terms of throughput and packet loss.     

Microelectromechanical systems and system-on-chip connectivity

The interconnection of microelectromechanical systems (MEMS) and other devices to a system-on-chip (SoC) implementation is described. MEMS technology can be used to fabricate both application specific devices and the associated micropackaging system that will allow for the integration of devices or circuits, made with non-compatible technologies, with a SoC environment. In the primary example presented, MEMS technology has been used to develop an acoustical array sensor for a hearing instrument application and also to provide a custom micropackaging solution suitable for in-the-ear canal implantation. A MEMS based modular micropackaging solution consisting of MEMS socket submodules and an insertable/removable microbus card has been developed to provide the necessary packaging and connectivity requirements. The modular socket concept can also be used for many other purposes, such as temporarily connecting a CMOS die to a SoC implementation of a die tester using MEMS based cantilevered bridge-type microspring contacts to provide connectivity to the die under test.     

基于MEMS工艺的微型制冷器

微机电系统MEMS(micro-electro-mechanical system)是一种集合了微电子与机械工程技术的新型高科技装置,其制造工艺可以进行最小至纳米尺度的加工以及高度集成化的微型制造.其产品微小体积、高度集成化以及高性能高产热的特性也决定了其需要匹配相应的制冷解决方案,本文重点阐述了基于MEMS制造工艺并...     

1D MEMS-based wavelength switching subsystem

Over the past few years, micro-electromechanical systems (MEMS) have emerged as a leading technology for realizing transparent optical switching subsystems. MEMS technology allows high-precision micromechanical components such as micromirrors to be mass produced at low cost. These components can be precisely controlled to provide reliable high-speed switching of optical beams in free space. Additionally, MEMS offers solutions that are scalable in both port (fiber) count and the ability to switch large numbers of wavelengths (> 100) per fiber. To date, most of this interest has focused on two-dimensional and three-dimensional MEMS optical crossconnect architectures. We introduce a wavelength-selective switch based on one-dimensional MEMS technology and discuss its performance, reliability, and superior scaling properties. We also review several important applications for this technology in all-optical networks.     

Microelectromechanical systems

The evolution and maturity of microelectromechanical systems (MEMS) in the coming years will be driven less by captive fabrication facilities and process development and more by innovative, aggressive electromechanical systems design. MEMS is poised to take full advantage of advances in information technology and couple them to advances in other disciplines to drive a fundamentally new approach to electromechanical system design and fabrication. By merging sensing and actuation with computation, MEMS will not only invest existing systems with enhanced capabilities and reliability but also will make possible radically new devices and systems designs that will exploit the miniaturization, multiplicity, and microelectronics of MEMS. For the first time, approaches akin to VLSI electronics can be taken to usher in an equally exciting and productive era of VLSI electromechanics     

FPGA-Based Decentralized Control of Arrayed MEMS for Microrobotic Application

In this paper, the authors have developed and implemented a decentralized decision-making strategy using field-programmable gate array (FPGA) technology as a prototype for an integrated controller of a microelectromechanical systems (MEMS) array for air-flow planar micromanipulation. The MEMS array was proposed to be integrated in a hybrid multichip module containing the FPGA-based controller. Algorithms and architectures, used for the decentralized control implementation and the hardware resource optimization, are described. A charge-coupled device camera was used to make each MEMS like an autonomous system when the distributed MEMS chip was tested. Finally, under air-flow condition, the FPGA-based decentralized control system successfully performed an object manipulation.