3英寸高纯半绝缘6H-SiC单晶的研制

采用物理气相传输(PVT)工艺,成功制备出3英寸高纯半绝缘(HPSI)6H-SiC单晶。依据氮在碳化硅晶格中占碳位的规律,通过生长过程温度和压力等工艺参数的优化,减少生长前沿碳空位的数量,实现了在较高碳硅比气氛下低氮含量碳化硅单晶生长的目标。二次离子质谱(SIMS)测试给出了晶体中氮及其他杂质的控制水平,证明单晶的高纯属性;非接触电阻率Mapping(CORE-MA)和电子顺磁共振(EPR)测试进一步证实其高纯半绝缘特性。     

大直径半绝缘4H-SiC单晶生长及表征

采用升华法稳定地生长出7.62 cm半绝缘4H-SiC单晶。通过优化钒掺杂工艺获得了均匀分布的电阻率1011Ω·cm。用激光拉曼光谱仪对晶片进行扫描,结果表明SiC单晶晶型为4H晶型。半绝缘4H-SiC单晶微管密度最好结果小于2 cm-2。用高分辨X射线衍射术表征了7.62 cm 4H-SiC单晶衬底片的结晶质量,（0004）衍射摇摆曲线半峰宽为40＂,说明晶体结晶性较好。     

用高分辨X射线衍射面扫描评估4H-SiC晶片结晶质量

介绍了高分辨X射线衍射(HRXRD)面扫描技术在评估4H-SiC抛光片整体结晶质量方面的应用。对4H-SiC抛光片整片及局部特定位置进行HRXRD摇摆曲线面扫描,并拟合摇摆曲线半高宽(FWHM)峰值得到的极图,观察4H-SiC抛光片表面的FWHM分布范围、分布特点和多峰聚集区。结合表面缺陷测试仪和偏振光显微镜测试方法,对因螺旋生长产生的晶界分布聚集区以及边缘高应力晶界聚集区进行了表征。二者测试结果与HRXRD摇摆曲线面扫描的结果一致。对多片样品在不同区域使用不同测试方法得到的结果均验证了HRXRD摇摆曲线面扫描可以宏观识别晶畴界面聚集区,清楚辨别出位于晶片中心附近由于螺旋生长面交界形成的晶畴界面,以及位于晶片边缘、受生长热场影响晶粒畸变产生的高应力晶畴界面。     

籽晶偏向对高纯半绝缘4H-SiC晶体影响的研究

采用PVT法得到高纯4H-SiC体单晶。研究了0°、1°、4°晶体对晶体台阶流、晶体结晶质量、晶体缺陷、晶体电学性能的影响;晶体台阶流采用奥林巴斯显微镜进行表征,晶体缺陷采用莱卡体系显微镜进行表征,晶体结晶质量采用高分辨XRD进行表征,晶体电学性能采用非接触电阻率测试仪进行表征。实验结果表明:4°籽晶生长的晶体缺陷最少,1°与4°籽晶生长的晶体结晶质量相当,0°籽晶生长的晶体电学性能最均匀。     

退火对掺钒半绝缘4H-SiC晶片质量影响的研究

通过物理气相传输(PVT)法成功地生长出直径大于7.62 cm的掺钒半绝缘4H-SiC晶体。抛光后的掺钒半绝缘4H-SiC晶片在真空且温度1 600℃～2 000℃条件下进行退火处理,利用高分辨X-ray衍射仪、显微拉曼光谱仪、非接触电阻率测试仪和应力仪对退火前后的晶片进行了测试与分析,研究了退火工艺对掺钒半绝缘4H-SiC晶片应力的影响,并且得到了合适的退火工艺。结果表明:合适的退火处理有利于进一步提高晶片的质量。     

半绝缘6H-SiC单晶的生长

用升华法生长出了电阻率高达1010Ω·cm的半绝缘6H-SiC体块晶体.用二次离子质谱(secondary ion mass spectrometry,SIMS)、辉光放电质谱(glow discharge mass spectroscopy,GDMS)测量了晶体和原料中的杂质浓度,包括硼、铝、钒.结果表明,钒的浓度会影响生长晶体的质量.分别用Pt和In做电极测试样品电阻率特性,发现不同的电极对测试结果有较大影响.     

半绝缘6H-SiC单晶的生长

用升华法生长出了电阻率高达1010Ω·cm的半绝缘6H-SiC体块晶体.用二次离子质谱(secondary ion mass spectrometry,SIMS)、辉光放电质谱(glow discharge mass spectroscopy,GDMS)测量了晶体和原料中的杂质浓度,包括硼、铝、钒.结果表明,钒的浓度会影响生长晶体的质量.分别用Pt和In做电极测试样品电阻率特性,发现不同的电极对测试结果有较大影响.     

高质量6英寸4H-SiC同质外延层快速生长

采用化学气相沉积法在6英寸(1英寸= 2.54 cm)4°偏角4H-SiC衬底上进行快速同质外延生长,通过研究Si/H2比(所用气源摩尔比)与生长速率的相互关系,使4H-SiC同质外延层生长速率达到101 μm/h.同时,系统研究了 C/Si比对4H-SiC同质外延层生长速率、表面缺陷密度和基面位错密度的影响.采用光学...     

4H-SiC埋沟MOSFET的研制

研制了4H-SiC热氧化生长氧化层埋沟nMOSFET.用室温下N离子注入的方法形成埋沟区和源漏区,然后在1600℃进行激活退火.离子注入所得到的埋沟区深度大约为0.2μm.从转移特性提取出来的峰值场效应迁移率约为18.1cm2/(V·s).造成低场效应迁移率的主要因素可能是粗糙的器件表面(器件表面布满密密麻麻的小坑).3μm和5μm器件的阈值电压分别为1.73V和1.72V.3μm器件饱和跨导约为102μS(VG=20V,VD=10V)     

4H-SiC同质外延中的缺陷

从实验出发,用LPCVD外延系统在偏向<11-20>方向8°的4H-SiC(0001)Si面衬底上,利用CVD技术进行了4H-SiC同质外延生长。外延后在熔融KOH腐蚀液中进行腐蚀,使用SEM和光学显微镜表征方法探讨了CVD法4H-SiC同质外延中的位错、微管和孪晶等缺陷形貌,并分析其形成机理。     

Investigations of 3C-SiC inclusions in 4H-SiC epilayers on 4H-SiC single crystal substrates

Synchrotron white beam x-ray topography (SWBXT) and Nomarski optical microscopy (NOM) have been used to characterize 4H-SiC epilayers and to study the character of triangular inclusions therein. 4H-SiC substrates misoriented by a range of angles from (0001), as well as (1 100) and (1120) oriented substrates were used. For epilayers grown on substrates misoriented by 3.5° from (0001) toward <1120>, the triangular inclusions were identified as consisting of two 3C-SiC structural configurations which are related to each other by a 180° rotation about the [111] axis. The epitaxial relationships between the 3C inclusions and the 4H-SiC epilayers (or substrates) were also determined. No evidence was found for the nucleation of 3C-SiC inclusions at superscrew dislocations (along the [0001] axis) in the 4H-SiC substrates. Increasing the off-axis angle of the substrates from 3.5 to 6.5° was found to greatly suppress the formation of the triangular inclusions. In the case of substrates misoriented by 8.0° from (0001) toward <1120>, the triangular inclusions were virtually eliminated. The crystalline quality of 4H-SiC epilayers grown on the substrates misoriented by 8.0° from (0001) was very good. For the (1100) and (1120) samples, there is no indication of 3C-SiC inclusions in the epilayers. Possible formation mechanisms and the morphology of 3C-SiC inclusions are discussed.     

4H-SiC SBD和JBS退火研究

在4H-SiC外延材料上制备了SBD和JBS器件,研究并分析了退火温度对这两种器件正反向特性的影响。结果表明,低于350℃退火可同时提高SBD和JBS的正反向特性。当退火温度高于350℃时,二者的正向特性都出现退化,SBD退化较JBS更为严重。JBS阻断电压随退火温度升高而增大,在退火温度高于450℃时增加趋势变缓。SBD阻断电压随退火温度升高先升后降,在500℃退火时达到一个最大值。可见一定程度的退火有助于提高4H-SiCSBD和JBS器件的正反向特性,但须考虑其对正反向特性的不同影响。综合而言,退火优化后JBS优于SBD器件性能。     

4H-SiC光导开关性能的仿真研究

碳化硅光导开关是相关领域的研究热点,但是文献中对4H-SiC光导开关的理论研究仍然以集总元件模型为主,仅能给出定性结果,典型文献中瞬态条件下的实验数据还没有定量的理论解释。文章使用Silvaco TCAD软件中的器件-电路混合模式,结合自编的载流子迁移率接口程序,对4H-SiC光导开关的光学电学特性进行模拟仿真。单脉冲响应的仿真结果表明,器件在瞬态条件下的峰值光电流随光能的变化与文献中的实验数据相符合,表明所用模型和参数具有合理性。对影响单脉冲响应的主要因素,包括脉冲能量、脉冲宽度、碳化硅厚度,进行了计算和分析。同时,针对两种碳化硅厚度的器件,进行了多脉冲串响应的计算和分析。文章得到的结果和结论对碳化硅光导开关的进一步研究具有较好的参考价值。     

n型4H-SiC同质外延层上欧姆接触的研究

介绍了n -SiC/Ti/Pt欧姆接触的制备方法及其接触特性,其中n -SiC外延层是通过化学气相淀积的方法在偏离(0001)方向7.86.的4H-SiC衬底上进行同质外延生长所得.对于n -SiC/Ti/Pt接触系统,通过合金实验得到最优的欧姆接触制备条件,得到最小的比接触电阻为2.59×10-6 Ω·cm2,满足器件性能,为各种SiC器件的实现奠定了基础.同时,该接触系统还具有很好的高温稳定性,在100 h的400℃高温存储实验后,其比接触电阻基本稳定.     

Identification of a Three-Site Defect in Semi-Insulating 4H-SiC

Using electron paramagnetic resonance (EPR), we observe a defect that increases significantly with annealing temperature. This spin S = 1 defect is characterized by g _x ≈ g _y ≈ g _z = 2.0056 and a fine structure splitting D ∼ 100 G whose principal axis lies in a plane perpendicular to the c-axis. Also resolved are several hyperfine interactions with the low abundance ²⁹Si and ¹³C neighboring nuclei. A careful analysis of the intensity of these hyperfine lines allows a precise determination of the identity and the quantity of interacting nuclei. This center is diamagnetic in the ground state but can be excited into a paramagnetic triplet state by sub-bandgap light. We identify this new defect as a three-site vacancy involving V _C-V _Si-V _C. The angular dependence of the ¹³C hyperfine interaction supports the proposed model. These may be the simplest of a family of more complex and extended defects that play a role in the semi-insulating (SI) character of SiC.     

Effects of Electron Irradiation on Deep Centers in High-Purity Semi-Insulating 6H-SiC

Many point-defect–related centers have been investigated in electron-irradiated 6H-SiC by deep-level transient spectroscopy (DLTS). Most of them are believed to be related to vacancies. Our DLTS studies on deep centers produced by electron-irradiation (EI) in conductive epi-6H-SiC are in agreement with the literature data. However, for semi-insulating SiC, DLTS cannot be used for trap studies so we have applied thermally stimulated current (TSC) spectroscopy. At least nine TSC traps have been observed in high-purity/semi-insulating (HPSI) 6H-SiC. To understand the nature of these centers, 1-MeV EI and postirradiation annealing at 600°C were applied to the sample. The TSC spectroscopy and 4.2 K photoluminescence (PL) have been used to study the effects of EI and annealing on the centers in HPSI 6H-SiC. It was found that (1) some of the major EI-induced DLTS centers in conductive 6H-SiC, such as ED1, E₁/E₂, E_i, Z₁/Z₂, and L₉, have TSC counterparts even in as-grown HPSI 6H-SiC; (2) EI-induced TSC centers in HPSI 6H-SiC are due to point defects, which have been confirmed by typical PL lines (such as S, L, and V lines); and (3) the concentration of the 1.1-eV center, which controls material conductivity, can be increased by 1-MeV EI and decreased by 600°C annealing.