A low power 12-bit 200-kS/s SAR ADC with a differential time domain comparator

A low power 12-bit 200-kS/s SAR ADC is proposed.This features a differential time domain comparator whose offset is cancelled by using a charge pump and a phase frequency detector instead of the preamplifiers usually needed in a high resolution comparator.The proposed ADC is manufactured in 0.18-μm CMOS technology and the measured SNR and SNDR are 62.5 dB and 59.3 dB,respectively,with a power consumption of 72μW at a 200-kS/s sampling rate.The device operates with a 1.8-V power supply and achieves a FOM of 477 fJ/conversion-step.     

An area-efficient 55 nm 10-bit 1-MS/s SAR ADC for battery voltage measurement

An area-efficient CMOS 1-MS/s 10-bit charge-redistribution SAR ADC for battery voltage measurement in a SoC chip is proposed. A new DAC architecture presents the benefits of a low power approach without applying the common mode voltage. The threshold inverter quantizer(TIQ)-based CMOS Inverter is used as a comparator in the ADC to avoid static power consumption which is attractive in battery-supply application. Sixteen level-up shifters aim at converting the ultra low core voltage control signals to the higher voltage level analog circuit in a 55 nm CMOS process. The whole ADC power consumption is 2.5 mW with a maximum input capacitance of 12 pF in the sampling mode. The active area of the proposed ADC is 0.0462 mm2 and it achieves the SFDR and ENOB of 65.6917 dB and 9.8726 bits respectively with an input frequency of 200 kHz at 1 MS/s sampling rate.     

An 8 bit 1 MS/s SAR ADC with 7.72-ENOB

This paper presents a low power 8-bit 1 MS/s SAR ADC with 7.72-bit ENOB. Without an op-amp, an improved segmented capacitor DAC is proposed to reduce the capacitance and the chip area. A dynamic latch comparator with output offset voltage storage technology is used to improve the precision. Adding an extra positive feedback in the latch is to increase the speed. What is more, two pairs of CMOS switches are utilized to eliminate the kickback noise introduced by the latch. The proposed SAR ADC was fabricated in SMIC 0.18 μm CMOS technology. The measured results show that this design achieves an SFDR of 61.8 dB and an ENOB of 7.72 bits, and it consumes 67.5 μ W with the FOM of 312 fJ/conversion-step at 1 MS/s sample under 1.8 V power supply.     

一个单通道10位160兆每秒的逐次逼近式模数转换器

This paper demonstrates a single-channel 10-bit 160 MS/s successive-approximation-register （SAR） analog-to-digital converter （ADC） in 65 nm CMOS process with a 1.2 V supply voltage. To achieve high speed, a new window-opening logic based on the asynchronous SAR algorithm is proposed to minimize the logic delay, and a partial set-and-down DAC with binary redundancy bits is presented to reduce the dynamic comparator offset and accelerate the DAC settling. Besides, a new bootstrapped switch with a pre-charge phase is adopted in the track and hold circuits to increase speed and reduce area. The presented ADC achieves 52.9 dB signal-to-noise distortion ratio and 65 dB spurious-free dynamic range measured with a 30 MHz input signal at 160 MHz clock. The power consumption is 9.5 mW and a core die area of 250 ×200 μm^2 is occupied.     

A 10 bit 200 MS/s pipeline ADC using loading-balanced architecture in 0.18 μm CMOS

A new loading-balanced architecture for high speed and low power consumption pipeline analog-to-digital converter (ADC) is presented in this paper. The proposed ADC uses SHA-less, op-amp and capacitor-sharing technique, capacitor-scaling scheme to reduce the die area and power consumption. A new capacitor-sharing scheme was proposed to cancel the extra reset phase of the feedback capacitors. The non-standard inter-stage gain increases the feedback factor of the first stage and makes it equal to the second stage, by which, the load capacitor of op-amp shared by the first and second stages is balanced. As for the fourth stage, the capacitor and op-amp no longer scale down. From the system''s point of view, all load capacitors of the shared OTAs are balanced by employing a loading-balanced architecture. The die area and power consumption are optimized maximally. The ADC is implemented in a 0.18 μm 1P6M CMOS technology, and occupies a die area of 1.2×1.2 mm². The measurement results show a 55.58 dB signal-to-noise-and-distortion ratio (SNDR) and 62.97 dB spurious-free dynamic range (SFDR) with a 25 MHz input operating at a 200 MS/s sampling rate. The proposed ADC consumes 115 mW at 200 MS/s from a 1.8 V supply.     

A 130 nm CMOS low-power SAR ADC for wide-band communication systems

This paper presents a low power 9-bit 80 MS/s SAR ADC with comparator-sharing technique in 130 nm CMOS process. Compared to the conventional SAR ADC, the sampling phase is removed to reach the full efficiency of the comparator. Thus the conversion rate increases by about 20% and its sampling time is relaxed. The design does not use any static components to achieve a widely scalable conversion rate with a constant FOM. The floorplan of the capacitor network is custom-designed to suppress the gain mismatch between the two DACs. The ＇set-and- down＇ switching procedure and a novel binary-search error compensation scheme are utilized to further speed up the SA bit-cycling operation. A very fast logic controller is proposed with a delay time of only 90 ps. At 1.2 V supply and 80 MS/s the ADC achieves an SNDR of 51.4 dB and consumes 1.86 mW, resulting in an FOM of 76.6 fJ/conversion-step. The ADC core occupies an active area of only 0.089 mm2.     

A sub-sampling 4-bit 1.056-GS/s flash ADC with a novel track and hold amplifier for an IR-UWB receiver

A sub-sampling 4-bit 1.056-GS/s flash ADC with a novel track and hold amplifier(THA) in 0.13μm CMOS for an impulse radio ultra-wideband(IR-UWB) receiver is presented.The challenge is in implementing a sub-sampling ADC with ultra-high input signal that further exceeds the Nyquist frequency.This paper presents,to our knowledge for the second time,a sub-sampling ADC with input signals above 4 GHz operating at a sampling rate of 1.056 GHz.In this design,a novel THA is proposed to solve the degradation in amplitude and improve the linearity of signal with frequency increasing to giga Hz.A resistive averaging technique is carefully analyzed to relieve noise aliasing.A low-offset latch using a zero-static power dynamic offset cancellation technique is further optimized to realize the requirements of speed,power consumption and noise aliasing.The measurement results reveal that the spurious free dynamic range of the ADC is 30.1 dB even if the input signal is 4.2 GHz sampled at 1.056 GS/s.The core power of the ADC is 30 mW,excluding all of the buffers,and the active area is 0.6 mm~2.The ADC achieves a figure of merit of 3.75 pJ/conversion-step.     

A low-power 10-bit 250-KSPS cyclic ADC with offset and mismatch correction

A low power 10-bit 250-k sample per second(KSPS) cyclic analog to digital converter(ADC) is presented. The ADC’s offset errors are successfully cancelled out through the proper choice of a capacitor switching sequence.The improved redundant signed digit algorithm used in the ADC can tolerate high levels of the comparator’s offset errors and switched capacitor mismatch errors.With this structure,it has the advantages of simple circuit configuration,small chip area and low power dissipation.The cyclic ADC manufactured with the Chartered 0.35μm 2P4M process shows a 58.5 dB signal to noise and distortion ratio and a 9.4 bit effective number of bits at a 250 KSPS sample rate.It dissipates 0.72 mW with a 3.3 V power supply and occupies dimensions of 0.42×0.68 mm~2.     

1-V电源65nm GP CMOS工艺下一款十位80MS/s 1.6mW逐次逼近型模数转换器

This paper presents a 10-bit 80-MS/s successive approximation register(SAR) analog-to-digital converter (ADC) suitable for integration in a system on a chip(SoC).By using the top-plate-sample switching scheme and a split capacitive array structure,the total capacitance is dramatically reduced which leads to low power and high speed.Since the split structure makes the capacitive array highly sensitive to parasitic capacitance,a three-row layout method is applied to the layout design.To overcome the charge leakage in the nanometer process,a special input stage is proposed in the comparator.As 80 MS/s sampling rate for a 10-bit SAR ADC results in around 1 GHz logic control clock,and a tunable clock generator is implemented.The prototype was fabricated in 65 nm 1P9M (one-poly-nine-metal) GP(general purpose) CMOS technology.Measurement results show a peak signal-to-noise and distortion ratio(SINAD) of 48.3 dB and 1.6 mW total power consumption with a figure of merit(FOM) of 94.8 fJ/conversion-step.     

A 10-bit 80-MS/s opamp-sharing pipelined ADC with a switch-embedded dual-input MDAC

A 10-bit 80-MS/s opamp-sharing pipelined ADC is implemented in a 0.18-μm CMOS.An opampsharing MDAC with a switch-embedded dual-input opamp is proposed to eliminate the non-resetting and successive-stage crosstalk problems observed in the conventional opamp-sharing technique.The ADC achieves a peak SNDR of 60.1 dB(ENOB = 9.69 bits) and a peak SFDR of 76 dB,while maintaining more than 9.6 ENOB for the full Nyquist input bandwidth.The core area of the ADC is 1.1 mm~2 and the chip consumes 28 mW with a 1.8 V power supply.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.