共查询到20条相似文献,搜索用时 125 毫秒
1.
2.
3.
4.
6.
7.
随着微电子技术的需求和发展,倒装芯片技术在高密度微型化封装领域得到了快速发展和广泛应用,而现有的一些倒装芯片检测方法存在一定的不足之处。为此,研究了主动红外的倒装芯片缺陷检测方法。实验中使用激光加热对倒装样片施加非接触热激励,通过红外热像仪获取样片温度分布。采用小波分析方法提取包括小波熵在内的信号特征,采用自组织神经网络对不同类型焊球进行聚类识别。研究表明,通过自组织神经网络可以有效地将不同缺陷焊球与参考焊球通过距离映射法映射到不同区域从而区分开,并且可以将未知焊球信号映射到相应的区域实现聚类识别。因此该方法可以有效实现倒装芯片的缺陷检测。 相似文献
8.
倒装焊技术已被广泛地用于电子领域.对倒装焊而言,其焊点的可靠性、密封填充物与芯片或基板间的分层一直是特别重要的课题.介绍了一种加速环境试验--HAST,用于快速评价倒装焊接在FR-4基板上面阵列分布焊点的可靠性,试验结果说明HAST能够作为一个有效的可靠性试验评价工具用于倒装焊技术领域. 相似文献
9.
10.
随着应用频率的提高,微波芯片与基板间的互连更多地采用了倒装焊。文中用HFSS(高频结构仿真器)有限元软件对凸点变换及倒装互连结构进行建模、仿真和优化,提取了凸点变换的等效集总电路模型,介绍了凸点制作工艺和倒装焊结构互连的微组装过程,并完成了试验样品的测试。最后,对微波倒装焊的前景进行了展望。 相似文献
11.
采用有限元方法,运用ANSYS软件,分析计算了气密性陶瓷封装管壳内温度及热应力分布,比较了4种粘接剂对芯片温度及热应力分布的影响。热分析表明,芯片中心处温度最高,边角处最低;不同粘接剂都因为厚度较薄,对芯片温度的分布无较大影响。热应力分析表明,由于热分布不均匀,使芯片与粘接剂的接触处有较大的热应力,主要集中在粘接剂与芯片的下底面,此处也是最容易导致芯片脱落失效的部分。对比4种粘接剂的结果发现:采用H35作粘接剂时,应力峰值为17.0MPa,但芯片与粘接剂和底座之间的热应力较大;采用PbSnAg焊料作粘接剂时,应力峰值为41.9MPa,但芯片与粘接剂和底座之间的热应力较小。 相似文献
12.
Tsorng-Dih Yuan Bor Zen Hong Howard-H. Chen Li-Kong Wang 《Microelectronics Reliability》2002,42(1):101-108
An integrated electrical, fluid flow and thermomechanical analysis is presented to study a product reliability and thermal management solution in an actual or nonuniform chip power distribution of an integrated circuit device in a realistic system application environment. This study aims to improve the existing limitations both on electrothermal analysis where simplified thermal boundary conditions is mostly used and on the current thermal and fluid flow analysis where uniform chip power is widely used to calculate the temperature. In this approach, the localized on-chip power distribution is obtained by using a transistor-level circuit model for simulating the interaction between the macro and functional blocks. A computational fluid dynamics analysis is used to calculate the fluid flow and heat transfer solution with a realistic thermal boundary conditions. To address the ultimate thermal induced mechanical stress and reliability effects on the chip-packaged assembly due to the nonuniform chip power distribution, finite element model is employed for the sequential steady-state heat transfer and mechanical analysis. The results are then discussed and specifically compared with the solutions based on the uniform chip power conditions. 相似文献
13.
Reliability is a very important concern for the embedded systems. Thermal distribution has become an important reliability concern for today’s integrated circuits and these circuits are being used increasingly in embedded systems. In traditional design flows, the temperature of the chip is assumed to be uniform across the substrate. However, non-uniform thermal distribution can be a major source of inaccuracy in delay and clock skew computations, and can have an impact on elctromigration reliability and self-heating effects for today’s very deep submicron technology. Hence, it has become necessary to obtain design with uniform temperature distribution to ensure minimum temperature gradient and avoid hot spots across the chip area. This will minimise reliability problems during the operation of the chip. The uniform temperature distribution can be achieved by appropriate placement of circuit blocks during the physical design. In this paper, thermal distribution of single chip embedded system on silicon is discussed. The thermal distribution calculations require evaluation of switching activity factor of circuit blocks. This factor is determined by computing activities of the blocks based on the application software of embedded system. 相似文献
14.
T.Y. Hung S.Y. Chiang C.J. Huang C.C. Lee K.N. Chiang 《Microelectronics Reliability》2011,51(9-11):1819-1823
Two analytical methods were proposed in this research, coupled electro-thermal finite element (FE) analysis and thermal–mechanical FE analysis, to analyze the mechanical behavior of bonding wire of power module under cyclic power loads, and the International Electrotechnical Commission standard is adopted in conducting a power cycling test. The exterior temperature distribution was measured by an infrared thermometer. Moreover, the junction temperature is calculated from the given thermal impedance of the semiconductor chip, chip power loss, and case temperature. Subsequently, the simulated temperature distribution via electro-thermal FE analysis is compared with experimental results to validate the methodology used in the aforementioned analysis. The analysis shows compressive stress at the wire/chip interface due to CTE mismatch between the aluminum and the chip. Moreover, the major driving force contributing to the shear stress at the interface is the self-expansion of the wire bump. 相似文献
15.
16.
As the increasing number of buses in multi-core SoC designs, bus planning problems become a dominant factor in determining the chip performance. To cope with these issues, it is desirable to consider them in the early floorplanning stage. Recently, many bus-driven floorplanners have been proposed in the literature. However, these proposed algorithms only consider the bus planning problem without the thermal effect. As a result, there are hotspots, which result in high chip temperature, on the chip. In this paper, a thermal-driven bus-driven floorplanning algorithm is proposed to separate hotspots during the perturbation stage and to keep buses away from hotspots during the routing stage. To avoid time-consuming thermal simulations, the superposition of thermal profiles, which are the thermal distribution of each module, is adopted to efficiently estimate the module temperature. Compared with the state-of-the-art bus-driven floorplanner, experimental results demonstrate that the proposed algorithm can effectively separate hotspots and reduce the chip temperature. 相似文献
17.
采用通用有限元软件MSC.Marc,模拟分析了一种典型的多层超薄芯片叠层封装器件在经历回流焊载荷后的热应力及翘曲分布情况,研究了部分零件厚度变化对器件中叠层超薄芯片翘曲、热应力的影响。结果表明:在整个封装体中,热应力最大值(116.2 MPa)出现在最底层无源超薄芯片上,结构翘曲最大值(0.028 26 mm)发生于模塑封上部边角处。适当增大模塑封或底层无源芯片的厚度或减小底充胶的厚度可以减小叠层超薄芯片组的翘曲值;适当增大底层无源超薄芯片的厚度(例如0.01 mm),可以明显减小其本身的应力值10 MPa以上。 相似文献
18.
19.
Simulations of the thermal behavior of AlGaAs/GaAs HBT power transistors have been carried out to establish the quantitative tradeoff between power density, chip layout and junction temperatures. Numerical programs were used to model different aspects of HBT thermal behavior. These programs provide a dynamic solution for temperature distribution using a three-dimensional model which is very general in its ability to model composite chip cross sections. A model was developed to calculate threshold power densities for thermal instability. Standard and novel methods of controlling maximum temperatures in the devices are explored and evaluated. These methods include flip chip bonding and the use of partial vias. The prevention of thermal instability is described. The thermal time constants are found to have a fast component, on order of a few microseconds, and a slower component that depends on substrate thickness 相似文献