Precise FPN compensation circuit for CMOS APS [imager]

Fixed pattern noise (FPN) is one of the major disadvantages of CMOS imagers in comparison with CCD imagers. A simple and precise FPN compensation circuit for a CMOS active pixel sensor (APS) imager with an in-line non-destructive readout function is presented     

Linear Current-Mode Active Pixel Sensor

A current mode CMOS active pixel sensor (APS) providing linear light-to-current conversion with inherently low fixed pattern noise (FPN) is presented. The pixel features adjustable-gain current output using a pMOS readout transistor in the linear region of operation. This paper discusses the pixel's design and operation, and presents an analysis of the pixel's temporal noise and FPN. Results for zero and first-order pixel mismatch are presented. The pixel was implemented in a both a 3.3 V 0.35 and a 1.8V 0.18 CMOS process. The 0.35 process pixel had an uncorrected FPN of 1.4%/0.7% with/without column readout mismatch. The 0.18 process pixel had 0.4% FPN after delta-reset sampling (DRS). The pixel size in both processes was 10times10 mum², with fill factors of 26% and 66%, respectively.     

一种6T像素全局曝光CMOS图像传感器

提出了一种基于6T像素结构的全局曝光CMOS图像传感器。通过采用PPD结构的6T像素、高复位电平和低阈值器件,提高了动态范围,并优化设计了像素单元的版图,使之获得较高的填充系数;模拟读出电路部分,通过采用双采样、增益放大和减小列级固定模式噪声(FPN)处理,以及对列选控制电路进行优化,减小了对全局PGA的运放设计要求。芯片的工作频率为20MHz,动态范围为66dB,实现了全局曝光方式CMOS图像传感器的设计。     

Analysis of low fixed pattern noise cell structures forphotoconversion layer overlaid CCD or CMOS image sensors

A new low fixed pattern noise (FPN) cell structure, which can be used for photoconversion layer overlaid CCD or CMOS image sensors, was proposed and analyzed with a two-dimensional (2-D) device simulator. One of the most serious problems for this type of image sensor is the mixing of signal charges of neighboring cells during signal charge readout. The magnitude of signal mixing was as much as 20% for the conventional 2/3-in 2-million pixel STACK-CCD cell structure. FPN was very visible as a result of this signal mixing. This time, a new cell structure was proposed and analyzed to reduce signal mixing and FPN. It was possible to reduce signal mixing to a low value of 0.7% of the signal level using the new cell structure     

低照度CMOS图像传感器设计与实现

设计了一种基于电容反馈跨阻放大器型（Capacitive Trans-impedance Amplifier,CTIA）像元电路与双采样（Delta Double Sampling,DDS）的低照度CMOS图像传感器系统。采用CTIA像元电路提供稳定的光电二极管偏置电压以及高注入效率,完成在低照度情况下对微弱信号的读取;同时采用数字DDS结构,通过在片外实现像元积分信号与复位信号的量化结果在数字域的减法,达到抑制CMOS图像传感器中固定图案噪声的目的,进一步提高低照度CIS的成像质量。基于0.35 m标准CMOS工艺对此基于CTIA像元电路的CMOS图像传感器芯片进行流片,像元阵列为256256,像元尺寸为16 m16 m。测试结果表明该低照度CMOS图像传感器系统可探测到0.05 lx光照条件下的信号。     

包含交流耦合CTIA与数字CDS的CMOS图像传感器设计

设计了一种带隔直电容的交流耦合CTIA像元电路与数字相关双采样（DCDS）结构的CMOS图像传感器系统。在传统的CTIA像元电路中增加隔直电容,通过控制光电二极管的偏压,达到减小光电二极管暗电流的目的;同时采用片外数字CDS结构,通过在片外实现复位信号与像元积分信号的量化结果在数字域的减法,可以减小图像传感器像元的复位噪声和固定图案噪声（FPN）。基于0.35 m标准CMOS工艺对此CMOS图像传感器进行流片,像元阵列为256256,像元尺寸为16 m16 m。测试结果表明交流耦合CTIA像元电路可以将光电二极管的偏压控制在零偏点附近,此时其暗电流最小;采用了数字CDS结构后,图像传感器像元的时域噪声及固定图案噪声均有不同程度降低。     

一种具有高填充因数和动态数字双采样技术的CMOS图像传感器

介绍了基于0.35μm工艺设计的单片CMOS图像传感器芯片.该芯片采用有源像素结构,像素单元填充因数可达到43%,高于通常APS结构像素单元30%的指标.此外还设计了一种数字动态双采样技术,相对于传统的双采样技术(固定模式噪声约为0.5%),数字动态双采样技术具有更简洁的电路结构和更好抑制FPN噪声的效果.传感器芯片通过MPW计划采用Chartered 0.35μm数模混合工艺实现.实验结果表明芯片工作良好,图像固定模式噪声约为0.17%.     

8.9-Megapixel Video Image Sensor With 14-b Column-Parallel SA-ADC

An 8.9-megapixel 60-frames/s video image sensor with a 14-b column-parallel analog-to-digital converter (ADC) has been developed. A gain amplifier, a 14-b successive approximation ADC (SA-ADC), and a new column digital processor are employed in each column. The SA-ADC has sufficient operation speed to convert the pixel reset and the pixel signal into digital data in a row operation cycle. The column digital processor receives bit serial data from the SA-ADC output and performs subtraction of the reset data from the signal data in order to reduce column fixed pattern noise (FPN). Column FPN is successfully reduced to 0.36 e_rms ^- by this digital-domain column FPN correction. Low-voltage low-power serial video interface and noise decoupling on pixel drive voltages contribute to row-temporal-noise reduction to 0.31 e_rms ^-. Both column FPN and row temporal noise are not visible in spite of a low readout noise floor of 2.8 e_rms ^-.     

低噪声CMOS图像传感器技术研究综述

文章总结了低噪声CMOS图像传感器代表性关键技术的最新研究进展。从CMOS图像传感器架构及各模块设计的角度,介绍了有源像素结构和图像传感器架构,分析了广泛采用的像素内源跟随CMOS图像传感器读出电路及其噪声等效模型,重点介绍了低噪声CMOS图像传感器关键技术,包括共享参考像素差分共源放大器技术、相关多采样技术、像素内斩波技术,以及相关技术的电路级实现方式。     

Low-power reduced transistor image sensor

An image sensor comprising an array of 128 by 50 super pixels, column parallel current conveyors and global difference double sampling (DDS) unit is presented. The super pixel consists of: a reset transistor, a readout transistor, four transfer transistors and four photodiodes. The photo pixel address switch is placed outside the pixel, effectively implementing 1.5 transistors per pixel using a sharing scheme of the readout and reset transistor. The column FPN of 0.43% from saturated level and SNR of 43.9 dB is measured. The total power consumption is 5 mW at 30 frame/s.     

Dark current reduction in stacked-type CMOS-APS for charged particle imaging

A stacked CMOS-active pixel sensor (APS) with a newly devised pixel structure for charged particle detection has been developed. At low operation temperatures (<200 K), the dark current of the CMOS-APS is determined by the hot carrier effect. A twin well CMOS pixel with a p-MOS readout and n-MOS reset circuit achieves low leakage current as low as 5/spl times/10/sup -8/ V/s at the pixel electrode under liquid nitrogen temperature of 77 K. The total read noise floor of 0.1 mV/sub rms/ at the pixel electrode was obtained by nondestructive readout correlated double sampling (CDS) with the CDS interval of 21 s.     

CMOS图像传感器固定模式噪声抑制新技术。

针对有源像素(APS)CMOS图像传感器中的固定模式噪声(FPN),设计了一种动态数字双采样的噪声抑制新技术;该技术比普通双采样技术具有更佳的抑制效果,其电路结构简单,适合于像素尺寸不断缩小的CMOS图像传感器发展趋势。通过MPW计划,采用Chartered0.35μmCMOS工艺制作了测试ASIC芯片,试验结果表明动态数字双采样技术有效抑制了FPN噪声。     

Noise analysis of high-gain, low-noise column readout circuits for CMOS image sensors

The temporal read noise on the signal path of a complementary metal-oxide semiconductor image sensor is analyzed to investigate the effectiveness of high-gain column amplifiers in enhancing sensor sensitivity. The signal path examined includes a pixel source follower, a switched-capacitor, noise-cancelling, high-gain amplifier, and a sample-and-hold circuit in each column. It is revealed that the total random readout noise consists of a component due to noise charge sampled and held at the charge summation node of the amplifier and transferred to the output, and a direct noise component sampled at the sample-and-hold stage at the output of the column amplifier. The analysis suggests that the direct noise components can be greatly reduced by increasing the column amplifier gain, indicating that an extremely low-noise readout circuit may be achievable through the development of a double-stage noise-cancelling architecture.     

1400万像素CMOS传感器高速读出及信号采集的研究

面阵图像传感器的读出电路和信号采集电路是影响图像信号性能的关键部分之一.文章介绍了采用2路双通道AD及USB2.0实现了1400万像素高分辨率CMOS面阵传感器的大动态范围,低读出噪音的高速信号采集系统,并对系统的传输速度、分辨率、图像噪音、光强测量稳定性、近红外响应等进行了实验研究.     

A new CMOS pixel structure for low-dark-current and large-array-size still imager applications

A pixel structure for still CMOS imager application called the pseudoactive pixel sensor (PAPS) is proposed and analyzed in this paper. It has the advantages of a low dark current, high signal-to-noise ratio, and a high fill factor over the conventional passive pixel sensor imager or active pixel sensor imager. The readout circuit called the zero-bias column buffer-direct-injection structure is also proposed to suppress both the dark current of the photodiode and the leakage current of row switches by keeping both biases of photodiode and the parasitic p-n junction in the column bus at or near zero voltage. The improved double delta sampling circuits are also used to suppress fixed pattern noise, clock feedthrough noise, and channel charge injection. An experimental chip of the proposed PAPS CMOS imager with the format of 352/spl times/288 (CIF) has been fabricated by using a 0.25-/spl mu/m single-poly-five-level-metal (1P5M) n-well CMOS process. The pixel size is 5.8 /spl mu/m/spl times/5.8 /spl mu/m. The pixel readout speed is from 100 kHz to 10 MHz, corresponding to the maximum frame rate above 30 frames/s. The proposed still CMOS imager has a fill factor of 58%, chip size of 3660 /spl mu/m/spl times/3500 /spl mu/m, and power dissipation of 24 mW under the power supply of 3.3 V. The experimental chip has successfully demonstrated the function of the proposed new PAPS structure. It can be applied in the design of large-array-size still CMOS imager systems with a low dark current and high resolution.     

红外探测器高性能读出电路的研究

设计了一种高性能电容反馈跨阻放大器(CTIA)与相关双采样电路(CDS)相结合的红外探测器读出电路。该电路采用CTIA电路实现对微弱电流信号的高精度读出,并通过CDS电路抑制CTIA引入的固定模式噪声(FPN),最后采用失调校正技术减小CDS引入的失调,从而减小了噪声对电路的影响,提高了读出电路的精度。采用特许半导体(Chartered)0.35μm标准CMOS工艺对电路进行流片,测试结果表明:在20pA～10nA范围内该电路功能良好,读出精度可达10bit以上,线性度达97%,达到了设计要求。该读出电路可用于长线列及面阵结构红外探测系统。     

Extended Dynamic Range From a Combined Linear-Logarithmic CMOS Image Sensor

A CMOS image sensor that can operate in both linear and logarithmic mode is described. Two sets of data are acquired and combined in the readout path to render a high dynamic range image. This is accomplished in real-time without the use of frame memory. A dynamic range in excess of 120 dB was achieved at 26 frames/s (352$,times ,$288-array). The system addresses the problems of high fixed pattern noise (FPN), slow response time, and low signal-to-noise ratio (SNR) in logarithmic mode. FPN has been effectively reduced by single and two parameter calibration, the latter achieving FPN of 2% per decade. A novel on-chip method of deriving a reference point has been implemented. The system is fabricated in a 0.18-$mu$m 1P4M process and achieves a pixel pitch of 5.6$muhbox m$with 7 transistors per pixel.     

Readout circuit for CMOS active pixel image sensor

The design and simulation results of a new readout circuit for a CMOS active pixel image sensor are presented. This scheme removes the fixed pattern noise and reduces the signal degradation while offering an increase in readout speed, compared with the conventional approach     

A pixel size shrinkage of amplified MOS imager with two-line mixing

This paper describes a pixel size shrinkage of an amplified MOS image sensor (AMI). We have developed a new circuit technique to achieve the reduction of a pixel size while realizing vertical two-line mixing and high sensitivity. A 1/4-in format 250-k pixel image sensor was developed using a 0.8-μm CMOS process. The difference from the conventional CMOS process is an additional layer of ion-implantation process. The power supply voltages of this imager are 4 and 6 V. The dynamic range of 75 dB, the sensitivity of 1.8 μA/Ix, and the smear noise of less than -120 dB have been attained for the pixel size of 7.2 (H)×5.6 (V) μm². Although the measured fixed pattern noise ratio (FPN) of this imager is -55 dB, analysis with a test chip shows that FPN can be improved by 2 dB by adopting a suitable gate length for amplifier and resetting MOSFET, respectively     

A 10000 frames/s CMOS digital pixel sensor

A 352×288 pixel CMOS image sensor chip with per-pixel single-slope ADC and dynamic memory in a standard digital 0.18-μm CMOS process is described. The chip performs "snapshot" image acquisition, parallel 8-bit A/D conversion, and digital readout at continuous rate of 10000 frames/s or 1 Gpixels/s with power consumption of 50 mW. Each pixel consists of a photogate circuit, a three-stage comparator, and an 8-bit 3T dynamic memory comprising a total of 37 transistors in 9.4×9.4 μm with a fill factor of 15%. The photogate quantum efficiency is 13.6%, and the sensor conversion gain is 13.1 μV/e^-. At 1000 frames/s, measured integral nonlinearity is 0.22% over a 1-V range, rms temporal noise with digital CDS is 0.15%, and rms FPN with digital CDS is 0.027%. When operated at low frame rates, on-chip power management circuits permit complete powerdown between each frame conversion and readout. The digitized pixel data is read out over a 64-bit (8-pixel) wide bus operating at 167 MHz, i.e., over 1.33 GB/s. The chip is suitable for general high-speed imaging applications as well as for the implementation of several still and standard video rate applications that benefit from high-speed capture, such as dynamic range enhancement, motion estimation and compensation, and image stabilization