单组分中温固化耐碱胶黏剂的研制

从解决潜伏性中温固化和耐碱性问题入手,合成了新型促进剂,并选用具有耐碱化学结构的主体材料成分,配制出性能优良的单组分糊状胶黏剂并研究了其耐碱性、固化工艺、黏度变化和贮存期。采用双酚A环氧为主体树脂,以合成的韧性环氧进行增韧,以超细双氰胺为固化剂,以合成的混合胺的脲类衍生物为潜伏性固化促进剂,以气相SiO2调节触变性,制备出的单组分中温固化环氧胶黏剂具有良好粘接性能和稳定的分散性,其室温剪切强度（铝／铝）达28MPa,90℃剪切强度25MPa,用于橡胶粘接达到橡胶破坏。该胶体现出良好的耐碱性、耐湿热老化性能和较长的贮存期（室温一个月以上）。     

HT-6402单组分继电器密封胶在封装工艺中的应用

以环氧树脂、稀释剂、潜伏性固化剂、填料、触变剂等配制的高性能HT-6402单组分环氧继电器密封胶，具有贮存稳定性好、固化温度低、固化速度快等优点。该胶已批量用于部分厂家，用户反应良好。     

单组分快固环氧胶开发成功

三友（天津）高分子技术有限公司以E-51环氧树脂、潜伏性固化剂、固化促进刹、填充剂等开发成功热固化单组分快田环氧胶粘剂，具有无溶剂、低气味、不污染、粘接强度高、电性能优、防腐性好、储存稳定等优点，已在汽车、电子、机械等行业获得应用，特别适用于自动生产线使用。制备单组分快固环氧胶的关键组分是潜伏性固化剂，要求室温下（〈40℃=稳定，几乎不与环氧树脂反应，     

新型HT—0011环氧树脂潜伏性固化剂

湖北回天胶业股份有限公司最新研究开发一种新型环氧树脂潜伏性固化剂 ,该产品处于国内领先水平 ,属于胍、脲衍生物 ,具有固化及固化促进效果 ,可完全替代双氰胺、二酰肼类潜伏性固化剂。固化环氧树脂的温度降至 80～ 1 0 0℃ ,比纯双氰胺或二酰肼的固化温度 1 70～ 1 80℃ ,降低了近 1 0 0℃ ,并且在室温下具有良好的潜伏性 ,较长的贮存期 ,良好的环氧树脂固化性能。主要技术指标1、外观 :白色至灰黄色粉末2、粒度 :80～ 1 2 0目3、固化条件 (配单组分液体环氧胶 ) :固化温度 /℃ 80 1 0 0 1 2 0 1 40 1 6 0 1 80固化时间 /ｍｉｎ 1 80 6 0…     

存储芯片用单组分环氧胶粘剂的研制

介绍了电子存储芯片用密封用单组分环氧胶粘剂的制备方法及产品特点 ,详细讨论了潜伏性固化剂的制备条件 ,本固化剂采用杂环胺减活性同时进行包裹的方法制备 ,110℃× 30min可固化 ,2 0℃可贮存 6个月 ,使用结果证明可以取代进口胶     

中温固化的单组分环氧胶粘剂的制备与性能研究

采用改性胺类潜伏性固化剂制备单组分环氧胶粘剂,并研究固化剂含量、增韧剂含量、填料种类、偶联剂种类对终产物的性能影响。结果表明,当固化剂含量为15%,增韧剂含量为15%,粉料选择硅微粉,偶联剂选择M110时,所得单组分环氧胶粘剂可在80℃×30min条件下固化,并且固化后产品性能最优。     

单组分室温固化环氧建筑胶粘剂的研究动向

环氧建筑胶粘剂是一类应用非常广泛的建筑结构胶。本文结合应用实际,简述了单组分室温固化环氧建筑胶包括湿气固化型建筑胶粘剂、丙烯酸改性环氧建筑胶粘剂、单组分环氧乳液胶粘剂等的研究进展,并着重介绍了以酮亚胺为固化剂的建筑胶的几个典型研究案例。     

SU—1潜伏性中低温固化环氧结构胶的研究

以环氧树脂6101~#、新型潜伏固化剂、新型固化促进剂及丁腈橡胶等为主要组份的SU—1胶,可在100～110℃固化,是一种粘接性能较好、胶液贮存期长等综合性能优良的潜伏性中低温型固化的环氧结构胶。文中重点介绍了潜伏性固化剂、固化促进剂、固化剂—6101~#体系、潜伏性固化剂—6101~#—固化促进剂体系以及双氰胺—6101~#体系、固化促进剂—双氰胺—6101~#体系的DSC曲线。     

咪唑羧酸盐型环氧树脂潜伏性固化促进剂研究

通过2-甲基咪唑(2MZ)和1,3,5-苯三酸(TMA)反应制得咪唑羧酸盐型环氧潜伏性固化促进剂,将其用于双酚A型环氧树脂/酸酐灌封体系中。采用红外光谱、核磁共振光谱及粘度测试考察了该促进剂的潜伏性,并采用示差扫描量热法(DSC)研究了体系的非等温固化行为。结果表明,成盐改性有效抑制了室温下咪唑环3位上吡啶氮原子的反应性,其单组分体系室温贮存1个月后仍具有较好的流动性,潜伏性优于市售商品,且升温后释放的咪唑可高效地促进环氧固化,满足中高温固化的要求。     

环氧医疗针头胶性能影响因素的研究

采用双酚A环氧树脂GELR128及双氰胺Dyhard 100S和超低温潜伏性固化促进剂FXR-1081配制了一次性注射器用单组分加热固化型环氧针头胶。通过对胶的粘度、储存期、拉拔力、耐高压蒸汽性测试以及红外光谱分析及溶血试验,研究了胶的生产工艺和配方对其性能影响。结果表明:强力搅拌再配合两道三辊机研磨可有效降低胶的粘度,缩短固化时间。当Dyhard 100S与FXR-1081的质量比为1.52:1,两者的用量为胶总质量的10.6%时,配方的各项性能均能满足客户要求,且该配方的溶血率为0,远远满足标准要求。     

新型快速固化环氧树脂胶粘剂的制备及性能

以己二酸、多胺(如二乙烯三胺、三乙烯四胺或多乙烯多胺等)为原料,采用熔融缩聚法合成了3种低黏度、低毒性且可室温固化的环氧树脂(EP)胶粘剂用聚酰胺固化剂(PA1、PA2或PA3)。探讨了固化剂含量对EP胶粘剂的固化速率和粘接性能等影响,并采用单因素试验法优选出EP/固化剂的最佳配比。结果表明:EP胶粘剂的固化速率和剥离强度依次为EP/PA1胶粘剂>EP/PA2胶粘剂>EP/PA3胶粘剂;当m(PA1):m(EP)=0.6:1.0、w(促进剂)=1.0%(相对于EP质量而言)、固化温度为80℃和固化时间为60min时,相应胶粘剂的适用期较长,并且加热后能快速固化,而且用该胶粘剂制备的包封膜经处理后,其综合性能良好,可满足柔性印刷电路板(FPC)的生产要求。     

潜伏性环氧固化剂研究进展

按固化条件的不同分别介绍了加热型、光固化型、潮湿型潜伏性环氧固化剂,列举了各类固化剂的典型代表及其性质,展望了今后潜伏性固化剂的研究重点和发展趋势。     

Ultraviolet/heat dual‐curable film adhesives with pendant‐acryloyl‐functional‐group‐modified epoxy resin

To facilitate the fabrication of a reliable semiconductor package, the UV/heat dual curing of film adhesives was investigated. The curing system of the epoxy resin affected the film adhesive properties. As the UV/heat dual‐curable epoxy resin, a modified o‐cresol novolak epoxy resin, in which half of the glycidyl groups were substituted by acryloyl groups (OCN‐AE), was applied to the film adhesive. The formulated film adhesive contained acrylic copolymer, OCN‐AE, phenolic aralkyl resin as a heat‐curing agent of the glycidyl groups, and 1‐hydroxycyclohexyl phenyl ketone as a photoinitiator of the acryloyl groups. The formulated reference film adhesive contained unmodified o‐cresol novolak epoxy resin (OCN‐E) in place of OCN‐AE. Formulated film adhesives containing a mixture of OCN‐E and o‐cresol novolak epoxy acrylate were also used as references. The morphology and the film adhesive properties were investigated. In these investigations, the film adhesive of OCN‐AE showed better adhesive properties, lower modulus, and a better stress‐relaxation ability than the referenced adhesives. As a result, a reliable film adhesive for semiconductor packages was successfully developed. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

WD3102室温固化耐高温胶粘剂的研制

通过对环氧树脂、液体橡胶、固化剂的选择,研制了一种可以室温固化、耐高温性能好的双组份环氧胶粘剂。     

单组分环氧树脂胶粘剂用潜伏性固化剂

对单组分环氧树脂胶粘剂用潜伏性固化荆的研发进展进行了扼要的综述.     

Accelerated-curing epoxy structural film adhesive for bonding lightweight honeycomb sandwich structures

Accelerating the curing of epoxy/aromatic amine adhesives and improving their toughness are challenges in heat-resistant epoxy structural adhesives. Herein, we report an epoxy/aromatic amine adhesive accelerated curing system with an oxo-centered trinuclear (chromium III) complex, which is toughened using a thermoplastic block copolymer (TPBC). The reaction characteristics, heat resistance, microstructure, and bonding properties of the accelerated epoxy adhesives were analyzed. The reaction peak temperature of the epoxy with 3% catalyst was 113.1°C, which was 113.6°C lower than that of epoxy without catalyst, and the modified epoxy resin demonstrated a potential for rapid curing at medium temperature. The glass transition temperature of the TPBC-toughened epoxy adhesive was 125°C after curing, indicating excellent thermal stability after medium temperature curing. The introduction of the TPBC increased the single-lap shear strength of the epoxy adhesive without reducing its heat resistance. The shear strength at room temperature and 120°C of the modified epoxy adhesive with 50 phr of TPBC was 25.2 and 10.9 MPa, respectively. Moreover, the epoxy film adhesive exhibited outstanding bonding properties when used in the bonding of lightweight honeycomb sandwich structures.     

Effect of Deposition Conditions on Structure and Properties of Plasma-Polymerized Silica Primers

Plasma polymerized silica (PP-SiO₂) has been investigated as a surface pretreatment for adhesive bonding of metals. Strength and durability of adhesive joints prepared from PP-SiO₂ coated substrates using aerospace and automotive adhesives is excellent. However, epoxy adhesive systems based on primary amine curing agents do not perform well without further chemical derivatization of the PP-SiO₂. This work discusses the relationship between deposition conditions and primer structure as determined by FTIR and XPS and shows that curing agents containing primary amines are capable of catalyzing hydrolysis of silica in the near-interface regions in the presence of water. This hydrolysis does not occur with dicyandiamide-cured adhesives.     

UV/heat dual‐curable adhesive tapes for fabricating stacked packages of semiconductors

To facilitate the fabrication of a reliable stacked package for a semiconductor, UV/heat dual curing of adhesives was investigated. The formulated adhesives contained acrylic monomer and epoxy resins. First, UV curing was conducted on the acrylic monomer, followed by heat curing. It was found that UV‐curable acrylic monomers affected the adhesive's properties, e.g., adhesion, water absorption, and viscoelasticity. As the acrylic monomer, neopentylglycol diacrylate (NPGDA), trimethylolpropane triacrylate (TMPTA), dipentaerythritol hexaacrylate (DPHA), and tricyclodecanedimethanol acrylate (TCDDA) were used to investigate the effect of functional group numbers and structure. As a result, an acrylic monomer that has two functional groups with a rigid moiety (TCDDA) showed acceptable properties as adhesives for the fabrication, and thus a UV/heat‐curing adhesive has been successfully developed. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Adhesive Bonding of Clean and Oil-Contaminated Electrogalvanized Steel Substrates

The performance of two-part, amidoamine-cured epoxy adhesives on clean and oil-contaminated electrogalvanized steel (EGS) was studied using screening and lap shear tests. On exposure to boiling water, the cured epoxy adhesives with amidoamines having higher amine value delaminated from the clean and oil-contaminated EGS surfaces before those cured with amidoamines having low amine value. The results of X-ray photoelectron spectroscopy (XPS) showed that the adhesives cured with amidoamines having high amine value were unable to displace the oil from the EGS substrate. However, the durability and the strength of the adhesive bonds on the oiled EGS could be improved by adding proper amounts of silane or wetting agent to the adhesive. The preferential adsorption of amino curing agents occurred on the clean EGS surface, confirmed by XPS and reflection absorption infrared spectroscopy, and this decreased the durability of the bonds in boiling water. In addition, from XPS analyses of various specimens, different amounts of cured resins were detected in the adhesive/EGS interfacial regions which affecting the durability of the adhesive bonds. In addition, the amidoamine curing agents may form complexes on the EGS surface.