GH4141镍基合金的扩散连接工艺

对GH4141高温镍基合金的扩散连接进行了工艺研究，确定了扩散连接工艺参数对室温抗剪强度的影响，确定了获得优质接头的最佳工艺参数区间，即扩散连接温度r=990～1080℃，连接时间t=15～60min，连接比压力P=5～20MPa，选用Ni箔作为中间层，厚度为25um。通过SEM、EPMA和金相技术对接头微观组织进行了观察和分析。     

镍作中间层脉冲加压扩散连接钛合金与不锈钢

采用纳米Ni粉、纳米Ni镀层、Ni箔作中间过渡层,对TA17近。型钛合金与0Cr18Ni9Ti不锈钢进行了脉冲加压扩散连接,接头抗拉强度分别达到了175,212,334MPa。在金相显微镜下,对拉伸断口形貌进行了观察和分析;利用扫描电镜（SEM）、能谱仪（EDS）、X射线衍射分析（XRD）测定了连接接头各区域内的微区成分和物相。结果表明,纳米Ni粉致密度不够高,纳米Ni镀层质量不够高,在很大程度上限制了接头强度的提高;Ni箔中间层的存在成功地阻止了Fe与Ti之间的互扩散,避免了形成脆而硬的Fe—Ti系金属间化合物。     

93W/Ni/QSn4-3扩散焊接接头的显微结构和力学性能

采用扩散焊接的方法制备出加入Ni箔中间层的钨合金(93w)与锡青铜合金(QSn4-3)焊接接头样品.利用XRD,SEM和EPMA对焊接接头的物相组成和显微结构进行了分析,并测量了焊接接头样品的抗拉强度.结果表明,加镍的93W与QSn4-3进行扩散焊接时,焊接层的显微结构结合紧密,Ni与Cu元素之间以及93W合金的添加剂元素在Ni箔中分布存在明显的连续变化层.物相分析和显微硬度结果表明Ni元素与QSn4-3中的Cu元素和93W的添加剂元素的固溶反应,促进了93W,Ni/QSn4-3焊接接头强度的大幅度提高.

Abstract：

The 93W/Ni/QSn4-3 joint was prepared by diffusion bonding at vacuum using pure nickel foil as interface layer. The microstructure and composition were characterized by SEM and EP-MA. The tensile strength of joint was also measured. The test results show that Ni foil improves the tensile strength of 93W/Ni/QSn4-3 joint. The thickness of Ni interlayer becomes thiner obviously because of the diffusion layer between Ni element of Ni foil and W and additional elements of 93W alloy, as well as the gradient layer of Ni and Cu elements. Solution reactions between Ni element of Ni foil and Cu element of QSn4-3 alloy, W and additional elements of 93W alloy achieve the joint of 93W/Ni/QSn4-3, that is why tensile strength of 93W/Ni/QSn4-3 joint welded is improved.     

TiB2金属陶瓷与TiAl金属间化合物的扩散连接

对TiB2金属陶瓷与TiAl金属间化合物进行了扩散连接试验，研究了直接扩散连接和采用Ni为中间层进行扩散连接的接头界面结构及工艺参数对界面结构和连接性能的影响。直接扩散连接时，连接界面处生成了Ti(Cu，Al)2金属间化合物，采用Ni为中间层进行扩散连接时，界面处生成了单层TiAlNi2金属间化合物层和两层T1，Al，N2扩散层共三层结构。直接扩散连接时，连接温度T＝1223K，时间t=1．8ks，压力p＝80MPa时接头强度为103MPa；采用Ni为中间层时，连接温度T＝1273K，时间t=1．8ks，压力p=80MPa时接头强度为110MPa。     

SiC/Nb/SiC扩散连接接头的界面构造及接合强度

使用Ｎｂ箔作中间层对常压烧结ＳｉＣ陶瓷进行了真空扩散连接。在最初的反应阶段，六方晶的Ｎｂ２Ｃ和Ｎｂ６Ｓｉ３Ｃｘ反应物分别在Ｎｂ和Ｓｉ侧形成。随着连接时间的增加，立方晶的ＮｂＣ和六方晶的ＮｂＳｉ２相在界面出现。试验结果表明，在１７９０Ｋ，３６ｋｓ的连接条件下所获得的扫头，其室温剪切强度达到１８７ＭＰａ，高温剪切强度超过１５０ＭＰ。     

以铜和Cu-Ti作为中间层的TiAl/GH3536扩散焊

采用铜箔和Cu-Ti合金作为中间层进行了TiAl和GH3536的扩散焊试验.以铜箔作为中间层在935℃/10 MPa/1 h参数下获得的焊缝组织以Ti（Cu,Al）2,AlCu2Ti和AlNi2Ti相为主,焊缝中存在裂纹.接头室温平均抗剪强度仅有31 MPa.以Cu-Ti合金作为中间层在935℃下采用三种不同参数进行了TiAl和GH3536的液相扩散焊试验.当加压3 MPa,保温10 min时,扩散焊缝中央还存在着宽度约5μm的残留相.保温时间延长至1 h,焊缝形成了较为均匀的分层组织,获得的接头室温抗剪强度最高,达180 MPa.增大压力至20 MPa,保温2 h获得的接头中出现AlNi2Ti相,接头平均室温抗剪强度下降至90 MPa.     

铜中间层钛-钢扩散复合界面组织与性能

利用真空扩散焊方法制备了铜中间层钛-钢焊接接头,并采用OM、SEM、EDS、显微硬度和拉伸试验方法,研究了铜中间层钛-钢扩散复合界面组织和性能。结果表明,Fe、Ti原子在界面处发生了互扩散,钛侧形成α-βTi+αTi或βTi+α-βTi+αTi组织,钢侧发生脱碳并形成柱状晶组织;拉伸强度随扩散温度升高呈现先增加后减小的趋势,950℃、30 min扩散试样拉伸强度最高,达到262 MPa;拉伸断口具有塑性断裂区与脆性断裂区特征,并在断口上检测出TiC相。     

Study of diffusion bonding of Ti-6Al-4V and ZQSn10-10 with metal interlayer

The diffusion bonding was carried out to join Ti alloy (Ti-6Al-4V) and tin-bronze (ZQSn10-10) with Ni and Ni Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). The results show that when the interlayer is Ni or Ni Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds (Cu3Ti, CuTi etc.). But the Ni-Ti intermetallic compounds (NiTi, Ni3Ti) are formed on the Ti-6Al-4V/Ni interface. When the interlayer is Ni, the optimum bonding parameters are 830℃/10 MPa/30min. And when the interlayer is Ni Cu, the optimum bonding parameters are 850℃/10MPa/20min. With the optimum bonding parameters, the tensile strength of the joints with Ni and Ni Cu interlayer both are 155.8MPa, which is 65 percent of the strength of ZQSn10-10 base metal.     

加Ti箔中间层的钼-钼扩散焊接

在1 000℃、10 MPa、60 min的工艺条件下,添加5μm的Ti箔作为中间层材料,进行钼-钼基体之间的真空扩散焊接。利用扫描电镜(SEM)观察接头界面形貌,并利用其自带的X射线能谱仪对界面元素扩散情况和中间层区域的元素成分进行测试和分析。结果表明,添加Ti箔作中间层实现钼-钼真空扩散焊接时,Ti原子和Mo原子能够实现良好的扩散,界面区域均为Mo-Ti固溶体,界面焊合率100%。     

钒/镍复合中间层扩散焊接钨与钢的界面结构及力学性能

通过添加钒/镍复合中间层,在1 050℃/10 MPa/1 h的工艺条件下,对钨/钢异种材料进行真空扩散焊接.采用扫描电镜(SEM)、能谱仪(EDS)、电子探针(EPMA)、纳米压痕、X射线衍射对接头的微观组织、元素分布及显微硬度进行分析和测试;对焊接接头的拉伸性能进行测试,并对拉伸断口的形貌特征,元素分布及物相组成进行分析.结果表明,采用钒/镍复合层可实现钨与钢的可靠焊接;钨/钢焊接接头界面区由钨-钒固溶体层、未反应的钒层、钒-镍界面层、未反应的镍层、镍-铁固溶体层五部分组成,其中钒-镍界面层结构为碳化钒层/钒-镍金属间化合物和碳化钒混合层/钒-镍金属间化合物层;钒/镍界面由于硬脆碳化物与金属间化合物的产生,具有最高的显微硬度,硬度高达9.7 GPa;接头强度达164 MPa,断裂点位于含脆性相碳化钒及钒-镍金属间化合物的钒/镍界面.     

Diffusion bonding of a superplastic inconel 718SPF superalloy by electroless nickel plating

Although intimate contact can be obtained for diffusion bonding of a superplastic Inconel 718SPF superalloy under a low pressure of 7 MPa, the precipitates formed at the interface retarded achievement of a sound joint. The shear strength was only 41.5 MPa for an overlap length of 12 T (T=1.3 mm, sheet thickness). The diffusion bondability of this Inconel 718SPF superalloy was enhanced by electroless nickel plating. In this situation, the bonding shear strength increased to 70.4 MPa for the same overlap length of 12 T under the same bonding condition, regardless of the roughness of the surface to be bonded. Upon decreasing the overlap length from 12 to 6 T, the bonding strength remained constant.     

Formation mechanism of the porous zone at the bonded Si3 N4/Ni interface

Diffusion bonding of Si3N4 ceramic to itself was performed using Ni interlayer. A flat Si3N4/Ni interface was found at a lower temperature （ 1 273 K）. Whereas at a higher temperature （ 1 473 K）, a porous zone located at the Si3N4/Ni interface and some petal-like Ni3 Si compounds precipitated in the Ni interlayer were observed. The formation mechanism of the porous zone was investigated based on a fracture analysis. An additional stress （O＇add ） generated at the Si3NJNi interface played an important role in the formation of the porous zone, which was resulted from the aggregation of nitrogen during the bonding process. A calculation equation of the O＇aaj was derived to analyze its effects. The results indicated that %~ was directly in dependent with diffusion bonding temperature and dwell time.     

钼与石墨的扩散焊接

研究了直接扩散焊接时接头的组织与性能，并研究了不同中间层材料以及不同中间层形态对接头组织和性能的影响。结果表明：直接扩散焊接时由于接头的形成伴随着硬脆碳化物反应层的生成而使接头强度降低。加入中间层，尤其是以镍为中间层时，由于接头中不形成硬脆反应层而具有较高的强度，其剪切强度达到甚至超过石墨本身的剪切强度。中间层形态对接头组织状态及性能有影响。     

1420铝锂合金扩散焊工艺及中间层材料对接头性能的影响

研究了1420铝锂合金在一定工艺条件下，添加中间层金属进行真空扩散焊接的可行性，通过对接头显微组织、断口形貌、显微硬度和成分的测试与分析，发现在一定的工艺条件下，扩散焊接接头处原子扩散充分，形成了良好的冶金结合；采用铜中间层金属可以获得组织均匀的焊接接头；采用镍中间层能使接头处原子通过相互扩散形成金属间化合物强化相，可适当提高接头强度。     

镍箔中间层对不锈钢/铝合金激光深熔焊的影响

以不锈钢201和铝合金5052作为试验材料,添加镍箔作为中间层,配合钢上铝下的搭接接头形式,采用激光深熔焊方法进行了焊接试验,分析了热输入对焊缝成形的影响以及添加镍箔后接头力学性能与不锈钢／铝合金焊接性的变化,并提出了焊缝下凹深宽比r以表征焊缝对应力集中的敏感程度．结果表明,热输入升高会导致焊接过程中飞溅增加,焊缝宽度与下凹程度增大,熔穿深度升高;不锈钢焊缝金属嵌入到铝合金内的熔穿深度对焊缝的力学性能有着重要的影响;镍中间层的添加有效地改善了接头力学性能,扩大了可用的工艺参数范围．     

铁中间层钛-钢扩散复合界面组织与性能

利用真空扩散焊方法制备了铁中间层钛-钢扩散焊接头,并采用OM、SEM、EDS、XRD、显微硬度和拉伸试验方法,研究了铁中间层钛-钢扩散复合界面组织和性能。结果表明,在900～1050℃、30 min扩散条件下,Fe、Ti原子在界面处发生了互扩散;钛侧形成βTi+α-βTi+αTi组织,钢侧发生脱碳,铁中间层形成柱状晶组织;拉伸强度随扩散温度升高呈现先增加后减小的趋势,900℃、30 min扩散试样拉伸强度最高,达到260 MPa;拉伸断口具有粗糙断裂区、脆性断裂区及二次断裂区特征,并在断口上检测出TiC、FeTi和Fe2Ti相。     

Investigation on reactive diffusion bonding of SiCp/6063 MMC by using mixed powders as interlayers

Mixed Al–Si, Al–Cu and Al–Si–SiC powders were used as interlayers to reactive diffusion bond SiCp/6063 MMC. The microstructure and the effects of bonding parameters on the shear strength of SiCp/6063 MMC joints were investigated. The results show that SiCp/6063 MMC joints bonded by using the interlayers of mixed Al–Si, Al–Cu powders have a dense joining layer of high quality. The mass transfer between the bonded materials and the interlayers during bonding leads to the hypoeutectic microstructure of the joining layers. Using mixed Al–Si–SiC powder as an interlayer, SiCp/6063 MMC can be reactive diffusion bonded by a composite joint. Because of the SiC segregation, however, there are a number of porous zones in the joining layer. This is responsible for the low shear strength of the joints, even lower than those reactive diffusion bonded by using the interlayers of mixed Al–Si and Al–Cu powders. Ti added in the interlayer obviously improves the joint strength reactive diffusion bonded by using the mixed Al–Si–SiC powder.     

TC4/Cu/ZQSn10-2-3扩散连接接头微观分析

TC4/ZQSn10-2-3直接扩散连接时,结合区由于生成CuSn_3Ti_5,Cu_3Ti等金属间化合物及集聚的Pb质点,接头强度不高(τ_(max)=102 MPa),断口为脆性断口,并发生在靠近ZQSsn10-2-3侧;填加金属中间层铜时,TC4/Cu/ZQSn10-2-3扩散连接接头强度获得显著提高(τ_(max)=196 MPa),这主要是铜中间层有效地抑制了Sn,Pb等元素向TC4侧的扩散,减少CuSn_3Ti_5,Cu_3 Ti等金属间化合物相生成,断口具有一定塑性;TC4/Cu,ZQSn10-2-3最佳扩散连接参数为:连接温度830℃,连接压力10 MPa,连接时间30 min.

Abstract：

The experimental investigation on the diffusion bonding of TC4 to ZQSn10-2-3 was carried out in vacuum. CuSn_3 Ti_5, Cu_3 Ti and rich-Pb layer were formed at the interface zone. The maximum joint strength was 102 MPa. Brittle fracture was explored after shear test, and occurred proximity to ZQSn10-2-3 side. Using copper as the interlayer, element Sn and Pb can be avoid diffusing from ZQSn10-2-3 to TC4. Then there were little CuSn_3Ti_5 in the interface. Fracture had certain plasticity, and the maximum strength of joint was 196 MPa. The optimum bonding parameters were: bonding temperature T = 830 ℃ , bonding pressure p = 10 MPa and bonding time t = 30 min.     

"相变-扩散钎焊(T/DB)"新工艺及其接头界面形貌

为减小相变超塑性扩散连接的循环次数,提出了一种新型焊接工艺"相变-液相扩散焊(T/DB)",即在待焊母材间预先放入液相扩散焊用的中间层,然后按传统相变超塑性扩散连接工艺施焊,但要求温度循环的峰值温度须同时大于母材的相变点与中间层的熔点.试验以低碳钢为母材,以镍基非晶箔带(BNi2)为中间层,进行了低碳钢的相变-扩散钎焊(循环3次)与液相扩散焊接(1200℃×3 min)的对比试验.结果表明相变-液相扩散焊所需温度循环次数少,接头无界面空洞,其接合线呈非平面状;而液相扩散焊接头的接合线较平直.分析认为,界面的起伏是母材的适度溶解与超塑性流变共同作用的结果;非平面状界面有利于增大金属-金属接触面积及扩散通道的面积,为获得合格接头做出了相应贡献.     

纯铜与不锈钢扩散焊接头性能及原子扩散动态解析

采用微观组织观察、硬度测试、拉伸试验、EPMA(电子探针)等手段研究了焊接工艺条件对纯铜与铁素体410L以及奥氏体304不锈钢扩散焊接接头性能的影响,结合理论计算对两种接头的原子扩散机理进行了解析.结果表明,在焊接压力、时间一定的条件下,接头的抗拉强度随焊接温度的升高而增大.Cu原子与410L最适宜的焊接温度比Cu原子与304的大约小50K,这是由于Cu原子向体心立方晶体(bcc)铁素体系中的扩散速度比在面心立方晶体(fcc)奥氏体系中快的缘故.Cu原子向不锈钢一侧扩散的实测值比理论值小是由于理论的初期条件是假定试样100%完全密接,而实际的接合界面却是粗糙不平,要达到接合初期的完全密接是需要时间的.