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1.
A composite material consisting of hydroxide‐modified hemp fibres and euphorbia resin was produced. The composites were tested in tension, short‐beam interlaminar shear stress and in impact. There was an increase in the tensile strength and modulus for resins with high‐hydroxyl‐group based composites. Similar results were obtained for interlaminar shear stress while low‐hydroxyl group euphorbia resin based composites exhibited high impact strength. The euphorbia resin with high hydroxyl content yielded composites with high stiffness. The use of euphorbia‐based resins in composite manufacture increases the value of the euphorbia oil as well as creating a new route of composite manufacturing.

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2.
Summary: Vinylester resin matrix composites were fabricated with 1, 3, 5 and 10 wt.‐% loadings of organoclay. The composite samples were subjected to various characterization techniques like X‐ray diffraction, flexural testing, dynamic mechanical analysis, thermogravimetric analysis, and scanning electron microscopy. The clay samples as well as the clay–resin composites were investigated by X‐ray diffraction. From the shift in the peak positions and the change in d‐spacing values, it was evident that there was intercalation in the 10 wt.‐% composites, whereas exfoliation occurred in the 1, 3, and 5 wt.‐% composites. The flexural strength and the breaking energy of all the composites were decreased compared with the unfilled resin, but there was an increase in flexural modulus value by 13%. From the dynamic mechanical analysis of the 3 and the 5 wt.‐% composites, it was observed that the loss modulus value was higher in the 3 wt.‐% composites, but the glass transition temperature was slightly higher in the 5 wt.‐% composites. Thermal degradation behavior was also improved in the 5 wt.‐% composites compared with the 3 wt.‐% composites.

Fracture surface of 3 wt.‐% clay filled vinylester resin matrix composite in different magnifications.  相似文献   


3.
A set of hybrid composite materials based on a PP matrix with multiwalled CNTs and clay particles is prepared and characterized. The incorporation of clay particles into a percolated composite with 3 wt% CNT disrupts the percolation, decreasing dramatically the electrical conductivity. As expected for layered fillers, PP/CNT/clay hybrid composite materials and PP/clay composites display increases as high as 100 °C in the temperature for the maximum rate of weight loss. Surprisingly, these temperatures are just slightly higher than those of PP/CNT composites. PP/CNT composites display viscosities that are considerably lower than those of PP/clay composites. A synergistic effect of both fillers is observed in the viscoelastic response of PP/CNT/clay materials.

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4.
Summary: This paper deals with the dynamic mechanical study of sisal/oil palm hybrid fiber reinforced natural rubber composites (at frequency 1 Hz) with reference to the role of silane coupling agents. Composites were prepared using sisal and oil palm fibers subjected to chemical modifications with different types of silane coupling agents. The silanes used were Silane F8261 [1,1,2,2‐perfluorooctyl triethoxy silane], Silane A1100 [γ‐aminopropyltriethoxy silane] and Silane A151 [vinyl triethoxy silane]. It was observed that for treated composites, storage modulus and loss modulus increased while the damping property was found to decrease. Maximum E' was exhibited by the composite prepared from fibers treated with silane F8261 and minimum by composites containing fibers treated with silane A151. This was attributed to the reduced moisture absorbing capacity of chemically modified fibers leading to improved wetting. This in turn produced a strong interfacial interface giving rise to a much stiffer composite with higher modulus. Surface characterization of treated and untreated sisal fibers by XPS showed the presence of numerous elements on the surface of the fiber. Scanning electron micrographs of tensile fracture surfaces of treated and untreated composites demonstrated better fiber–matrix bonding for the treated composites.

Scheme of interaction of silanes with cellulosic fibers.  相似文献   


5.
Dynamic mechanical and thermal properties of poly(propylene) (PP)/wood fiber composites have been studied using Dynamic Mechanical Analysis (DMA). In order to modify the PP matrix maleated poly(propylene) (PPMA) and poly(butadiene‐styrene) rubber were used as compatibilizer and impact modifier, respectively. tan δ peak temperature of the compatibilized systems was found to increase in comparison to that of composites without coupling agent, indicating improved adhesion and interaction between PP matrix and wood fibers. The storage modulus (E′)‐temperature (T) relationship of all composites is characterized by two transition points. The E′ of compatibilized composites exhibits higher values than those of the uncompatibilized ones at low temperatures (up to the β‐relaxation). In the temperature interval from β‐transition to 60 °C, the composites containing PPMA have lower modulus, and above 60 °C the E′T curves tend to converge. DSC indicates that the wood fibers act as nucleating agent for PP. Maleated poly(propylene) slightly retards the crystallization rate, resulting in a composite structure, composed mainly of large spherulites, with a higher crystallinity index. Fourier Transform Infrared (FT‐IR) microscopy was also applied to explore the interface between wood fibers and PP matrix. The strong absorption band at 1 738 cm?1 in the IR spectrum scanned at the interfacial region between the fiber and matrix indicated that PPMA had probably reacted either by formation of ester bonds or hydrogen bonding with hydroxyl groups from cellulose.

Optical micrograph of PPWF composite in polarized light.  相似文献   


6.
Spherical hollow epoxy particles (HEPs) that can serve as advanced reinforcing fillers for vinyl ester thermosets were prepared using the water‐based emulsion method. The HEP fillers were incorporated into the vinyl ester matrices at different loading amounts, ranging from 0 to 9 wt %, to reinforce and toughen the vinyl ester composite. The optimum mechanical properties of the HEP‐toughened epoxy composite can be achieved by the addition of 5 wt % HEP filler into the vinyl ester matrices. The toughening and strengthening of the epoxy composites involved the interlocking of vinyl ester resins into the pore regions on the HEP fillers. The toughening and interlocking mechanisms of HEP‐toughened vinyl ester composites were also proposed and discussed. The addition of HEP fillers into vinyl ester matrices increased the glass transition temperature (Tg) and thermal stability of the composites. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012  相似文献   

7.
Glass fiber biobased composites have been prepared by ROMP of a commercially available vegetable oil derivative possessing an unsaturated bicyclic moiety, and DCPD. The resins and the corresponding composites have been characterized thermophysically and mechanically. Higher DCPD content yields materials with higher glass transition temperatures. Glass fibers significantly improve the tensile modulus of the resin from 28.7 to 168 MPa. These biobased composites utilize only a limited amount of a petroleum‐based monomer, while employing substantial amounts of a renewable resource.

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8.
Summary: Polymeric thermosetting composites can be used as metal substitutes for certain applications if they possess high temperature stability in air, low coefficient of thermal expansion (CTE), and sufficient flexural strength, in combination with competitive costs. Commercial bismaleimide, bisnadimide, and cyanate ester thermosetting materials were selected due to their excellent thermal stability. Low CTEs were achieved by adding high loading levels of fused silica or silicon nitride fillers. Several optimized composites were fabricated by varying the materials, composition, and cure conditions. Characteristic composite properties, such as CTE, thermal stability, glass transition temperature (Tg), flexural strength, and filler distribution were investigated. The best system developed consists of Matrimide 5292, a commercial two‐component bismaleimide resin, filled with 75% Silbond FW100EST, and additionally reinforced with 0.5% Twaron short fibers. This composite is distinguished by a CTE around 15 ppm · K−1, a Tg around 340 °C, flexural strength above 100 MPa, and attractive material costs.

Matrimid 5292 (75%)/Silbond FW100AST (24.5%), and Twaron 2 mm short fibers (0.5%). Three fibers are visible, embedded and well dispersed in the matrix.  相似文献   


9.
An acrylic resin emulsion containing a quaternary ammonium salt (hybrid q‐chitosan/acrylic resin emulsion) was prepared by emulsion polymerization using an acrylic monomer with and without DAAM. DAAM was used to incorporate a functional keto group into the acrylic resin emulsion. Furthermore, a hybrid chitosan/acrylic resin emulsion was prepared for comparison. The elution of q‐chitosan in water from the acrylic resin film with a keto group was less than that from the acrylic resin emulsion without a keto group. In addition, the mechanical properties of the hybrid q‐chitosan/acrylic resin film could be modified by q‐chitosan that was crosslinked between acrylic resin particles. Furthermore, hybrid q‐chitosan/acrylic resin films had adsorption ability for formaldehyde, and the antimicrobial properties of these films were superior to those of the hybrid chitosan/acrylic resin film.

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10.
Phenolic resin/clay composites were prepared by high‐shear mixing of clay suspended in CH3OH solutions of Novolac resin and curing agent. Pure clay Cloisite Na+ and pillared clays Cloisite 10A, 30B, and Na+Cloisite that was pillared by 3‐hexadecyl‐1‐methylimidazolium bromide were studied. After CH3OH evaporation, Novolac was cured at low temperatures. XRD showed that clay gallery d‐spacings decreased upon solvent evaporation and partial curing. Slight d‐spacing increases were sometimes observed from a partially cured stage to a further cured composite. Na+Cloisite gave the highest nanodispersion, Cloisites 10A and 30B the lowest. TGA revealed that Na+ clay or organoclay incorporation in partially cured and cured composites did not improve the thermal stability of Novolac.

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11.
Summary: Novel formaldehyde resins bearing diaminodiphenylmethane groups were synthesized by the polymerization of a mixture of diaminodiphenylmethane (DDM), cyclohexanone (CHx) and o‐cresol (o‐Cz) with formaldehyde (FA) in the presence of an acid catalyst (HCl). The resins obtained were characterized by spectral, elemental and thermal analysis and used as a hardener for epoxy resins. The curing and temperature behavior of these epoxy resin/formaldehyde systems were investigated using differential scanning calorimetry and thermogravimetry techniques. The resins had good thermal stability and the activation energies of degradation reactions had values between 70–98 kJ · mol?1.

The curing reaction of epoxy resins with the DDM/CHx/o‐Cz/formaldehyde resins.  相似文献   


12.
Poly(propylene) (PP) composites were prepared by using eggshell (ES) as filler and their mechanical properties were compared with those using talc (TA) and calcium carbonate (CC) of different grain sizes (X50). A decrease in impact strength and deformation at break with increase in filler content was observed. The PP composite with ES (X50 = 8.4 µm) was stiffer than those with CC (X50 = 0.7 µm). The hybrid composite PP‐ES‐TA showed a similar stiffness as the PP‐TA composites due to the similar morphology of TA (X50 = 0.5 µm) and ES, when TA was replaced up to 75 wt.‐% by ES. SEM study revealed evidence of improved interfacial bonding between PP and ES in theirs composites.

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13.
Summary: The effect of silica and its surface treatment on the mechanical properties of composites was studied as part of the evaluation of cyanate ester matrices as potential electronic encapsulants. Three filler surface treatments were used, as a qualitative interfacial adhesion scale, in an attempt to gauge the magnitude of interfacial adhesion between untreated filler and the cyanate ester matrix. There was strong interfacial adhesion between matrix and untreated filler. The level of silica content most affected composite modulus and fracture toughness. Filler surface treatment most affected composite strength and fracture toughness/energy. Composite fracture was found to occur via crack pinning and/or crack blunting depending on the strength of adhesion. The composites evaluated were found to possess suitable mechanical properties for potential use as electronic encapsulants.

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14.
Electrically conducting films containing AgNws, hydrophilic and hydrophobic resins were prepared. FT‐IR reveals that the interface between the AgNws and epoxy could be successfully modified by APTES. XPS shows that the AgNws were attracted by hydrogen bonds of ? NH2 and ? NH? groups after APTES modification. SEM analysis shows that the AgNws were well dispersed in the resin. The AgNws were also blended with hydrophilic and acrylic resins, and the resulting blends were compared with AgNws/epoxy blends. Results show that AgNw/PVA‐resin films possess the lowest surface electrical resistance. The AgNw/PVA‐resin and silane‐modified AgNw/epoxy resin conductive films possess a similar electrical percolation threshold.

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15.
Summary: The study and development of polymeric composite materials, especially using lignocellulosic fibers, have received increasing attention. This is interesting from the environmental and economical viewpoints as lignocellulosic fibers are obtained from renewable resources. This work aims to contribute to reduce the dependency on materials from nonrenewable sources, by utilizing natural fibers (sisal) as reinforcing agents and lignin (a polyphenolic macromolecule obtained from lignocellulosic materials) to partially substitute phenol in a phenol‐formaldehyde resin. Besides, it was intended to evaluate how modifications applied on sisal fibers influence their properties and those of the composites reinforced with them, mainly thermal properties. Sisal fibers were modified by either (i) mercerization (NaOH 10%), (ii) esterification (succinic anhydride), or (iii) ionized air treatment (discharge current of 5 mA). Composites were made by mould compression, of various sisal fibers in combination with either phenol‐formaldehyde or lignin‐phenol‐formaldehyde resins. Sisal fibers and composites were characterized by thermogravimetry (TG) and DSC to establish their thermal stability. Scanning electron microscopy (SEM) was used to investigate the morphology of unmodified and modified surface sisal fibers as well as the fractured composites surface. Dynamic mechanical thermoanalysis (DMTA) was used to examine the influence of temperature on the composite mechanical properties. The results obtained for sisal fiber‐reinforced phenolic and lignophenolic composites showed that the use of lignin as a partial substitute of phenol in phenolic resins in applications different from the traditional ones, as for instance in other than adhesives is feasible.

Micrograph of the impact fracture surface of phenolic composite reinforced with mercerized sisal fiber (500 X).  相似文献   


16.
Composites with several hierarchical structures were prepared by using different clays, compatibilizers, and PPs. TGA showed that the thermal stability of the composites can be strongly improved, under either inert or thermo‐oxidative conditions, depending on the type of clay and its morphology. Drastic increases in the temperature of the maximum rate of weight loss (ΔTpeak ≈ 170 °C) under thermo‐oxidative conditions were observed depending on the clay dispersion. Furthermore, some composites had a complex multi‐step degradation behavior instead of a single‐step process related with different clay morphologies that can be present simultaneously. Finally, it was concluded that the TGA has a higher sensitivity toward the composite morphology than the mechanical properties.

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17.
Summary: The present study examines the effect of polymeric tougheners on the performance of silica filled cyanate ester composites. The polymeric tougheners used have been shown to enhance cyanate ester tougheners in binary toughener/matrix systems. Tougheners that were able to form a favourable phase‐separated morphology resulted in the greatest increase in crack resistance. The addition of these tougheners resulted in minimal loss of strength, and a slight decrease in modulus. Importantly the viscosity of the compounded systems was low enough for them to be readily processable. Whilst conserving most secondary properties, toughener addition did result in a slight increase in composite hydrolytic degradation. This issue was linked to the additive/ additive compounding processes. Removal of this extra moisture should eliminate this concern, permitting the used of these composites in electronic applications.

Effect of ETBN content on the crack resistance of particle filled cyanate ester composites and SEM image of 15 matrix wt.‐% ETBN.  相似文献   


18.
Summary: The effects of bio‐scavengers on the formaldehyde emission, bonding strength, curing behavior, and thermal decomposition properties of MF resins for engineered flooring and adhesion for wood were investigated. Four varieties of bio‐scavengers, tannin powder, wheat flour, rice husk flour, and charcoal, were added to MF resin at 5 wt.‐%. To determine formaldehyde emission and bonding strength, we manufactured engineered floorings. MF‐charcoal was most effective in reducing formaldehyde emission because of its porous nature, but its bonding strength was decreased. Tannin powder and wheat flour, which contain more hydroxyl groups, showed higher bonding strength and curing degree than pure MF resin did. Although the hydroxyl groups of the bio‐scavengers were effective in reducing formaldehyde emission and improve bonding strength and curing degree, rice husk flour and charcoal behaved like inorganic substances, thereby disturbing the adhesion between MF resin and wood and thus reducing the bonding strength. In thermogravimetric analysis, MF‐tannin showed the highest thermal stability in the low‐temperature range from 100 to 300 °C.

Storage modulus (E′) of MF resin with various bio‐scavengers at a heating rate of 10 °C · min?1.  相似文献   


19.
Summary: Novel multifunctional formaldehyde resins bearing diaminodiphenylmethane groups are synthesized by the polymerization of a mixture of diaminodiphenylmethane (DDM), o‐cresol (o‐Cz), and cyclohexanone (CHx) with formaldehyde (FA) (at a molar ratio of monomers/formaldehyde, 1/1), in the presence of acid catalyst (HCl). The obtained resins are epoxidated with a large excess of epichlorohydrin and transformed into multifunctional epoxy resins. The multifunctional epoxy maleimide resins are obtained by reaction of the epoxy resins with carboxy phenyl maleimide in the presence of triethylamine as a catalyst. The resultant resins are characterized by IR and NMR spectroscopy, elemental, and thermal analysis. The curing and thermal behavior of these epoxy maleimide resin/DDM systems are investigated using differential scanning calorimetry (DSC) and thermogravimetry (TG) techniques. The activation energies of the curing reactions are situated in the range of 53–90 kJ · mol?1. The cured products have good thermal properties, and activation energies of degradation reactions have values between 42–74 kJ · mol?1.

The curing reaction of multifunctional epoxy maleimide resins with DDM.  相似文献   


20.
A reactive organic montmorillonite clay (VMMT), modified with (4‐vinylbenzyl) triethylammonium cations, has been prepared and used as a nanofiller to reinforce a corn‐oil‐based polymer resin. The polymer resin was prepared by the cationic polymerization of conjugated corn oil, styrene and divinylbenzene, using boron trifluoride diethyl etherate modified with Norway fish oil as the initiator. The results indicate that the VMMT is intercalated in the corn‐oil‐based polymer resins. When compared with the pure polymers, these novel nanocomposites reinforced with 2 to 3 wt.‐% VMMT exhibit significant improvements in modulus, strength, strain and toughness. Furthermore, incorporating VMMT into the corn‐oil‐based polymer matrix also leads to improved thermal stability of the nanocomposites over the pure resins of up to 400 °C.

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