Role of spontaneous polarization in the formation of <Emphasis Type="Italic">NH</Emphasis>-SiC/3<Emphasis Type="Italic">C</Emphasis>-SiC/<Emphasis Type="Italic">NH</Emphasis>-SiC structures based on silicon carbide polytypes

The effect of the electrostatic field caused by spontaneous polarization in hexagonal plates of a heterostructure based on NH-SiC/3C-SiC/NH-SiC silicon carbide polytypes on relative positions of energy bands is considered. It was shown that the asymmetry arising in the system is associated with the superposition of polarization and contact fields.     

Excess leakage currents in high-voltage 4<Emphasis Type="Italic">H</Emphasis>-SiC Schottky diodes

The high-voltage 4H-SiC Schottky diodes are fabricated with a nickel barrier and a guard system in the form of “floating” planar p-n junctions. The analysis of I–V characteristics measured in a wide temperature range shows that the forward current is caused by thermionic emission; however, the current is “excessive” in the reverse direction. It is assumed that the reverse current flows locally through the points of the penetrating-dislocation outcrop to the Ni-SiC interface. The shape of reverse I–V characteristics makes it possible to conclude that the electron transport is governed by the monopolar-injection mechanism (the space-charge limited current) with participation of capture traps.     

Study of the 3<Emphasis Type="Italic">C</Emphasis>-SiC layers grown on the 15<Emphasis Type="Italic">R</Emphasis>-SiC substrates

The 3C-SiC layers grown on the 15R-SiC substrates by sublimation epitaxy in vacuum are studied. Using X-ray topography and Raman spectroscopy, it is shown that the obtained layers are of a rather high structural quality. By the data of the Raman spectroscopy and capacitance-voltage measurements, it is established that the electron concentration in the 3C-SiC layer is (4–6) × 10¹⁸ cm^?3.     

Experimental 4<Emphasis Type="Italic">H</Emphasis>-SiC junction-barrier Schottky (JBS) diodes

4H-SiC junction-barrier Schottky (JBS) diodes have been fabricated with local p–n junctions under the Schottky contact formed by nonequilibrium diffusion of boron. Static and dynamic characteristics of the JBS diodes are compared with those of similar 4H-SiC Schottky diodes. It is shown that, compared with ordinary Schottky diodes, the JBS diodes have leakage currents that are, on average, a factor of 200 lower at the same reverse bias. The reverse recovery charge is the same for both types of diodes and equal to the charge of majority carriers removed from the n-type base region in switching.     

3<Emphasis Type="Italic">C</Emphasis>-SiC <Emphasis Type="Italic">p-n</Emphasis> structures grown by sublimation on 6<Emphasis Type="Italic">H</Emphasis>-SiC substrates

Sublimation epitaxy in a vacuum has been employed to grow n-and p-type 3C-SiC layers on 6H-SiC substrates. Diodes have been fabricated on the basis of the p-n structure obtained, and their parameters have been studied by measuring their current-voltage and capacitance-voltage characteristics and by applying the DLTS and electroluminescence methods. It is shown that the characteristics of the diodes studied are close to those of diodes based on bulk 3C-SiC. A conclusion is made that sublimation epitaxy can be used to fabricate 3C-SiC p-n structures on substrates of other silicon carbide polytypes.     

High-voltage (900 V) 4 <Emphasis Type="Italic">H</Emphasis>-SiC Schottky diodes with a boron-implanted guard <Emphasis Type="Italic">p-n</Emphasis> junction

High-voltage (900 V) 4H-SiC Schottky diodes terminated with a guard p-n junction were fabricated and studied. The guard p-n junction was formed by room-temperature boron implantation with subsequent high-temperature annealing. Due to transient enhanced boron diffusion during annealing, the depth of the guard p-n junction was equal to about 1.7 μm, which is larger by approximately 1 μm than the projected range of 11 B ions in 4H-SiC. The maximum reverse voltage of fabricated 4H-SiC Schottky diodes is found to be limited by avalanche breakdown of the planar p-n junction; the value of the breakdown voltage (910 V) is close to theoretical estimate in the case of the impurity concentration N = 2.5 × 10¹⁵ cm^?3 in the n-type layer, thickness of the n-type layer d = 12.5 μm, and depth of the p-n junction r _j = 1.7 μm. The on-state diode resistance (3.7 mΩ cm²) is controlled by the resistance of the epitaxial n-type layer. The recovery charge of about 1.3 nC is equal to the charge of majority charge carriers that are swept out of an epitaxial n-type layer under the effect of a reverse voltage.     

Au-TiB<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>-<Emphasis Type="Italic">n</Emphasis>-6<Emphasis Type="Italic">H</Emphasis>-SiC Schottky barrier diodes: Specific features of charge transport in rectifying and nonrectifying contacts

Mechanism of charge transport in a diode of a silicon carbide’s Schottky barrier formed by a quasi-amorphous interstitial phase TiB _x on the surface of n-6H-SiC (0001) single crystals with an uncompensated donor (nitrogen) concentration of ～10¹⁸ cm^?3 and dislocation density of ～(10⁶–10⁸) cm^?2 has been studied. It is demonstrated that, at temperatures T ? 400 K, the charge transport is governed by the tunneling current along dislocations intersecting the space charge region. At T > 400 K, the mechanism of charge transport changes to a thermionic mechanism with a barrier height of ～0.64 eV and ideality factor close to 1.3.     

Electrical properties of <Emphasis Type="Italic">n-</Emphasis>GaN/<Emphasis Type="Italic">p</Emphasis>-SiC heterojunctions

Epitaxial GaN layers were grown by hydride vapor phase epitaxy (HVPE) on commercial (CREE Inc., USA) p⁺-6H-SiC substrates (Na ? Nd ≈ 7.8 × 10¹⁷ cm^s?3) and n⁺-6H-SiC Lely substrates with a predeposited p⁺-6H-SiC layer. A study of the electrical properties of the n-GaN/p-SiC heterostructures obtained confirmed their fairly good quality and demonstrated that the given combination of growth techniques is promising for fabrication of bipolar and FET transistors based on the n-GaN/p-SiC heterojunctions.     

High-efficiency LEDs based on <Emphasis Type="Italic">n</Emphasis>-GaSb/<Emphasis Type="Italic">p</Emphasis>-GaSb/<Emphasis Type="Italic">n</Emphasis>-GaInAsSb/<Emphasis Type="Italic">P</Emphasis>-AlGaAsSb type-II thyristor heterostructures

A new type of light-emitting diodes (LEDs), a high-efficiency device based on an n-GaSb/p-GaSb/n-GaInAsSb/P-AlGaAsSb thyristor heterostructure, with the maximum emission intensity at wavelength λ = 1.95 μm, has been suggested and its electrical and luminescent characteristics have been studied. It is shown that the effective radiative recombination in the thyristor structure in the n-type GaInAsSb active region is provided by double-sided injection of holes from the neighboring p-type regions. The maximum internal quantum efficiency of 77% was achieved in the structure under study in the pulsed mode. The average optical power was as high as 2.5 mW, and the peak power in the pulsed mode was 71 mW, which exceeded by a factor of 2.9 the power obtained with a standard n-GaSb/n-GaInAsSb/P-AlGaAsSb LED operating in the same spectral range. The approach suggested will make it possible to improve LED parameters in the entire mid-IR spectral range (2–5 μm).     

High-temperature nuclear-detector arrays based on 4 <Emphasis Type="Italic">H</Emphasis>-SiC ion-implantation-doped <Emphasis Type="Italic">p</Emphasis><Superscript>+</Superscript>-<Emphasis Type="Italic">n</Emphasis> junctions

Results obtained in a study of spectrometric characteristics of arrays of four detectors based on 4H-SiC ion-implantation-doped p ⁺-n junctions in the temperature range 25–140 °C are reported for the first time. The junctions were fabricated by ion implantation of aluminum into epitaxial 4H-SiC layers of thickness ≤45 μm, grown by chemical vapor deposition with uncompensated donor concentration N _d ? N _a = (4–6) × 10¹⁴ cm^?3. The structural features of the ion-implantation-doped p ⁺-layers were studied by secondary-ion mass spectrometry, transmission electron microscopy, and Rutherford backscattering spectroscopy in the channeling mode. Parameters of the diode arrays were determined by testing in air with natural-decay alpha particles with an energy of 3.76 MeV. The previously obtained data for similar single detectors were experimentally confirmed: the basic characteristics of the detector arrays, the charge collection efficiency and energy resolution, are improved as the working temperature increases.     

Current flow mechanism in ohmic contact to <Emphasis Type="Italic">n</Emphasis>-4<Emphasis Type="Italic">H</Emphasis>-SiC

Current flow in an In-n-4H-SiC ohmic contact (n ≈ 3 × 10¹⁷ cm⁻³) has been studied by analyzing the temperature dependence of the per-unit-area contact resistance. It was found that the thermionic emission across an ∼0.1-eV barrier is the main current flow mechanism and the effective Richardson constant is ∼2 × 10⁻² A cm⁻² K⁻¹.     

The mechanisms of current transport and properties of <Emphasis Type="Italic">a</Emphasis>-SiC:H/<Emphasis Type="Italic">c</Emphasis>-Si heterostructures

The properties of a-SiC:H/c-Si heterostructures formed at various alloy carbon contents are studied. A dominant mechanism of carrier transport in the heterostructures is established. Equivalent electric circuits, which make it possible to describe the current-voltage characteristics of heterostructures over entire bias range under study, are suggested. The band-gap temperature coefficient and electron affinity for a-SiC:H are estimated.     

Low-temperature (77 K) impurity breakdown in <Emphasis Type="Italic">p</Emphasis>-type 4<Emphasis Type="Italic">H</Emphasis>-SiC

The impact ionization of acceptors in aluminum-doped 4H-SiC epitaxial films (Al concentration 2 × 10¹⁵ cm^?3) at a temperature of 77 K is studied. It is found that the impact-ionization coefficient exponentially depends on the reverse electric field: α _p = α*_pexp(?F*/F). The largest ionization coefficient is α* _p = 7.1 × 10⁶ cm^?3 s^?1, and the threshold field is F* = 2.9 × 10⁴ V/cm.     

Thin-film polycrystalline <Emphasis Type="Italic">n</Emphasis>-ZnO/<Emphasis Type="Italic">p</Emphasis>-CuO heterojunction

Results of X-ray diffraction and spectral-optical studies of n-ZnO and p-CuO films deposited by gas-discharge sputtering with subsequent annealing are presented. It is shown that, despite the difference in the crystal systems, the polycrystallinity of n-ZnO and p-CuO films enables fabrication of a heterojunction from this pair of materials.     

Graphite/<Emphasis Type="Italic">p</Emphasis>-SiC Schottky Diodes Prepared by Transferring Drawn Graphite Films onto SiC

Graphite/p-SiC Schottky diodes are fabricated using the recently suggested technique of transferring drawn graphite films onto p-SiC single-crystal substrates. The current–voltage and capacitance–voltage characteristics are measured at different temperatures and at different frequencies of a small-signal AC signal, respectively. The temperature dependences of the potential-barrier height and of the series resistance of the graphite/p-SiC junctions are measured and analyzed. The dominant mechanisms of the charge–carrier transport through the diodes are determined. It is shown that the dominant mechanisms of the transport of charge carriers through the graphite/p-Si Schottky diodes at a forward bias are multi-step tunneling recombination and tunneling described by the Newman formula (at high bias voltages). At reverse biases, the dominant mechanisms of charge transport are the Frenkel–Poole emission and tunneling. It is shown that the graphite/p-SiC Schottky diodes can be used as detectors of ultraviolet radiation since they have the open-circuit voltage V_oc = 1.84 V and the short-circuit current density I_sc = 2.9 mA/cm² under illumination from a DRL 250-3 mercury–quartz lamp located 3 cm from the sample.     

Temperature dependence of the band structure of 3<Emphasis Type="Italic">C</Emphasis>, 2<Emphasis Type="Italic">H</Emphasis>, 4<Emphasis Type="Italic">H</Emphasis>, and 6<Emphasis Type="Italic">H</Emphasis> SiC polytypes

The temperature dependences of significant energy extrema at the high-symmetry points Γ, X, L, K, M, A, and H of the Brillouin zone in the cubic and hexagonal modifications of SiC, as well as the energies of the main interband transitions at these points, were calculated for the first time by the empirical-pseudopotential method. The effect of the temperature dependence of the electron-phonon interaction on the crystal band structure was taken into account via the Debye-Waller factors, and the contribution of the linear expansion of the lattice was accounted for via the temperature dependence of the linear-expansion coefficient. The special features of the temperature dependences of the energy levels and of energies of the interband and intraband transitions are analyzed in detail. The results of the calculations are in good agreement with the known experimental data on the characteristics of SiC-based p-n structures operating in the breakdown mode. For example, the temperature coefficient of the energy of the X_1c–X_3c transition, which is responsible for the narrow violet band in the breakdown-electroluminescence spectra of reverse-biased p-n junctions, was found to be significantly smaller than the temperature coefficients for the interband transitions (from the conduction to valence band). This fact is quite consistent with the experimental curve of the temperature coefficient of the emission spectrum, which has a minimum in the same wavelength range.     

Subnanosecond 4<Emphasis Type="Italic">H</Emphasis>-SiC diode current breakers

Mesa epitaxial 4H-SiC-based p ⁺-p-n ₀-n ⁺ diodes have been fabricated and their reverse recovery characteristics have been measured in modes typical of fast semiconductor current breakers, drift step recovery diodes, and SOS diodes. It has been found that, after the short (～10 ns) pulsed injection of nonequilibrium carriers by a forward current with a density of 200–400 A cm^?2 and the subsequent application of a reverse voltage pulse (with a rise time of 2 ns), diodes can break a reverse current with a density of 5–40 kA cm^?2 in a time of about (or less than) 0.3 ns. A possible mechanism for ultrafast current breaking is discussed.     

Thermal calculation of SiC <Emphasis Type="Italic">p-i-n</Emphasis> diodes

Thermal calculations of various design models of SiC p-i-n diodes with a structure capacity of 0.2 pF are carried out for substrate thicknesses of 360, 50, and 2 mm. Comparison with a silicon p-i-n structure on an integrated heat sink is performed.     

Light-Harvesting in <Emphasis Type="Italic">n</Emphasis>-ZnO/<Emphasis Type="Italic">p</Emphasis>-Silicon Heterojunctions

Zinc oxide (ZnO) films were deposited onto Si to form n-ZnO/p-Si heterojunctions. Under the illumination of by both ultraviolet (UV) light and sunlight, obvious photovoltaic behavior was observed. It was found that the conversion efficiency of the heterojunctions increased significantly with increasing thickness of the ZnO film, and the mechanism for light-harvesting in the heterojunctions is discussed. The results suggest that ZnO films may be helpful to increasing the harvesting of UV photons, thus decreasing the thermalization loss of UV energy in Si-based solar cells.