N-对甲氧苯基马来酰亚胺与苯乙烯聚合的研究

考察了引发剂浓度、单体浓度、聚合时间、聚合温度、引发剂类型对N-对甲氧苯基马来酰亚胺与苯乙烯的共聚活性的影响,得到最佳聚合条件。通过GPC分析,测得共聚物相对分子质量。通过红外、核磁的联合测定,证明N-对甲氧苯基马来酰亚胺与苯乙烯(St)聚合时能有效地打开双键,并且聚合是按交替方式进行的。     

邻甲酚醛环氧树脂的合成

本文介绍了邻甲酚醛环氧树脂合成工艺,并对影响其合成的主要因素进行了讨论。此技术经过年产50吨规模试验获得成功。     

N-对羧基苯基马来酰亚胺的制备与表征

以顺丁烯二酸酐(MAn)和对氨基苯甲酸(P-AA)为原料、乙酸乙酯为溶剂、无水醋酸钠为脱水催化剂合成了N-对羧基苯基马来酰亚胺(P-CPMI)，并采用元素分析、核磁共振、红外光谱对目标产物的结构进行了表征。     

纳米SiO2/邻甲酚醛环氧树脂复合材料的性能与固化特性

制备了纳米SiO2/邻甲酚醛环氧树脂(o-CFER)复合材料,通过力学性能、热性能、扫描电镜以及DSC等方法对该复合材料的性能进行了研究,确定了工艺参数.结果表明,纳米SiO2的加入较大地提高了o-CFER的拉伸强度、冲击强度、热稳定性等性能;通过动态DSC测定确定了纳米SiO2/o-CFER复合材料的固化反应放热量-△H=128J/g,活化能为48.9 kJ/mol,反应级数n=0.871,频率因子A=3.4×103s-1;固化工艺参数为T凝胶=71℃,T固化=133℃,T后处理=165℃.     

N-邻位取代苯基马来酰亚胺的研究概述

介绍了N-苯基取代马来酰亚胺的主要应用和制备方法,叙述了邻位苯基取代马来酰亚胺的国内外研究概况,提出应对这类具有特殊性质的单体和聚合物进行更深入的研究。     

N-苯基马来酰亚胺的合成

以顺酐和苯胺为原料，磷钨酸作催化剂，磷酸作脱水剂，采用两步法制得N-苯基马来酰亚胺，得到最佳反应工艺条件，产品收率为88．7％，纯度为98．2％(质量分数)。     

N-苯基马来酰亚胺改性酚醛树脂的合成及其结构性能

采用滴加苯酚的方式合成了N-苯基马来酰亚胺改性酚醛树脂（PPMF）, 考察了N-苯基马来酰亚胺（PMI）参与酚醛缩聚反应的转化程度和树脂黏度特性的变化规律.发现延长苯酚滴加时间能提高PMI参与共缩聚反应的竞争能力和转化率;随着回流反应时间的增加,PMI转化率增加,树脂的黏度也随之增大;较高的反应温度或较大的PMI用量均会导致PMI转化率的显著下降.利用核磁、红外和元素分析等表征了改性酚醛树脂的结构及组成,确定N-苯基马来酰亚胺已共缩合于酚醛树脂中,其中PMI含量可达33％左右.利用DSC和TGA研究了N-苯基马来酰亚胺改性酚醛树脂的固化特性和耐热性能,发现PPMF树脂经历了两个固化阶段, 第一阶段是少量羟甲基的缩合, 第二阶段为马来酰亚胺的双键打开自交联形成. PPMF树脂固化产物的耐热性能优于传统的热塑性酚醛树脂.     

国内邻甲酚醛环氧树脂生产与应用展望

论述了邻甲酚醛环氧树脂的性质、我国的生产及应用现状 ,以及与国外之差距 ,并介绍了几种合成方法     

纳米有机蒙脱土改性邻甲酚醛环氧树脂的研究

利用插层复合技术制备了邻甲酚醛环氧树脂／蒙脱土纳米复合材料，对固化产物利用X射线衍射(XRD)分析有机蒙脱土的层间距变化。通过对复合材料的力学性能测试表明，少量有机化蒙脱土的加入可以较大地提高材料的拉伸强度和冲击强度，起到了同时增韧增强的作用。并且环氧树脂／蒙脱土复合材料的热分解温度和热变形温度也有明显提高。     

环氧树脂固化剂的改性研究

以异佛尔酮二胺和1,6-己二胺为原料,加入适量自制的催化剂,在190℃反应2.5 h,即制成新型环氧树脂固化剂(简称YFJA)。将其按不同比例添加到传统固化剂二氨基二苯甲烷(简称DDM)和甲基四氢苯酐(简称Me-THPA)中,通过对固化物的冲击强度、拉伸强度和力学损耗等性能的检测分析,发现当自制固化剂添加量为固化剂总量的50%时,体系的力学性能达到最佳效果,冲击强度最高可提高346.5%,拉伸强度可提高73.0%。     

潜伏性环氧固化剂研究进展

按固化条件的不同分别介绍了加热型、光固化型、潮湿型潜伏性环氧固化剂,列举了各类固化剂的典型代表及其性质,展望了今后潜伏性固化剂的研究重点和发展趋势。     

邻甲酚醛环氧/改性凹凸棒土复合材料的制备

采用硅烷偶联剂KH560对提纯后的凹凸棒土(AT)进行改性,得到有机化凹凸棒土,并对其进行FTIR和TG表征,结果表明,KH560对凹凸棒土起到了良好的修饰改性作用。采用熔融复合法制备了AT质量分数为0～5%的邻甲酚醛环氧/凹凸棒土纳米复合材料(ECN/(KH560-AT)x),对其进行了扫描电镜(SEM)分析、动态力学分析(DMA)和热重分析以及力学性能测试。结果表明,KH560-AT的加入使复合材料断裂由脆性断裂向韧性断裂转变。ECN/KH560-AT复合材料的拉伸强度、冲击强度和Tg可比纯ECN分别高出54.12%、78.95%和37.5℃,KH560-AT的加入明显提高了复合材料的力学性能和耐热性。     

Curing characteristics of epoxy resin systems that include a biphenyl moiety

The curing characteristics of epoxy resin systems that include a biphenyl moiety were investigated according to the change of curing agents. Their curing kinetics mainly depend on the type of hardener. An autocatalytic kinetic reaction occurs in epoxy resin systems with phenol novolac hardener, regardless of the kinds of epoxy resin and the epoxy resin systems using Xylok and DCPDP (dicyclopentadiene‐type phenol resin) curing agents following an nth‐order kinetic mechanism. The kinetic parameters of all epoxy resin systems were reported in terms of a generalized kinetic equation that considered the diffusion term. The fastest reaction conversion rate among the epoxy resin systems with a phenol novolac curing agent was obtained in the EOCN‐C epoxy resin system, and for systems with Xylok and DCPDP hardeners, the highest reaction rate values were obtained in NC‐3000P and EOCN‐C epoxy resin systems, respectively. The system constants in DiBenedetto's equation of each epoxy resin system with different curing agents were obtained, and their curing characteristics can be interpreted by the curing model using a curing agent as a spacer. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1942–1952, 2002     

耐高温环氧胶固化工艺研究

制得了耐高温固化剂TTOA,并采用凝胶时间、示差扫描热分析以及Prime外推法研究了耐高温环氧胶固化特性,得到该体系的固化工艺参数（140℃/2h＋160℃/4h＋180℃/8h）。     

环氧树脂室温快速固化剂的合成

以羟基化合物(聚己内酯三元醇、正丁醇)和多聚磷酸为原料合成环氧树脂室温固化剂,研究了原料配比、反应温度和反应时间对固化剂性能的影响,并考察了固化剂用量对环氧树脂胶黏剂性能的影响。结果表明:正丁醇与聚己内酯三元醇、羟基化合物与多聚磷酸的摩尔比分别为1.0∶10.0,2.0∶1.0,在75℃条件下反应4 h,合成了能使环氧树脂室温快速固化的固化剂。该固化剂用量为环氧树脂质量的30%时,环氧树脂在室温条件下5 min即可固化,且胶黏剂具有优异的黏接性能。     

Curing of epoxy resin contaminated with water

Epoxy resins used for reinforcement of bridges and buildings are explored in the light of both curing rates and mechanical properties when resins are contaminated with water in outdoor construction. The developed resin is composed of a conventional resin of bisphenol A diglycidyl ether and a hardener with a polyoxipropyldiamine base. Curing rates were obtained by time variation of the near infrared absorbance of amine groups in the hardener at various water contents. They obeyed the second‐order reaction law with respect to the hardener, of which the activation energy was 70 kJ mol⁻¹. Water increased the reaction rate. Mechanical properties such as ultimate tensile strength, adhesive shear stress, and flexural strength were measured at various water contents for the developed epoxy resin and the commercially available low‐temperature epoxy resin. The developed cured resin shows not only higher mechanical strengths but also much less deterioration by water than the conventional cured resin. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 214–220, 2001     

Preparation and analysis of a flexible curing agent for epoxy resin

A kind of novel aromatic amine bis(4‐nonyl‐2,5‐diamine‐penoxyl)alkylate (RA_n) as curing agents for epoxy resins were prepared through three steps of reactions using nonyl phenol and dibromoalkylate as materials. Dynamic mechanical analysis (DMA) indicated that the secondary relaxation for the resins cured by RA_n were generated by the nonyls in RA_n molecules when temperature was below ?50°C. Comparing with other reference resins, the enhancement for toughness of RA_n cured‐resins were at least 15%, which were contributed by such secondary relaxation. Furthermore, stiffness of the networks and thermal properties of the resins were not influent by the flexible groups (nonyl) in RA_n after curing, since the groups were located only in the branched chains of the networks. The mechanical and thermal properties of the new material have been significantly enhanced. The relevant method and procedure developed through this research have been granted Chinese patent recently (Yang and Gong, Chin. Pat. CN1978483A, 2007). © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Curing behavior and thermal property of epoxy resin with boron‐containing phenol‐formaldehyde resin

The curing reaction of bisphenol‐A epoxy resin (BPAER) with boron‐containing phenol–formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER‐BPFR was shown to follow autocatalytic kinetics. The activation energy in the dynamic cure reaction was derived. The influence of the composition of BPAER and BPFR on the reaction was evaluated. In addition, the glass transition temperatures (T_gs) were measured for the BPAER‐BPFR samples cured partially at isothermal temperatures. With the curing conditions varying, different glass transition behaviors were observed. By monitoring the variation in these T_gs, the curing process and the thermal property of BPAER–BPFR are clearly illustrated. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1054–1061, 2000     

一种新型环氧树脂固化剂的合成

以乙二胺和含有8个丙烯酸酯双键的化合物(I)为原料,甲醇为溶剂和催化剂,经迈可尔加成反应合成了多氨基的化合物。考察了投料比、反应温度、反应时间以及溶剂等因素对反应产率和纯度的影响。并研究了此化合物作为环氧树脂固化剂的不同固化时间,得其比乙二胺体系的固化速度快3-60倍。