光电印制电路板的发展评述（2）——光电印制电路板的基本概述（上）

介绍了光互连的种类及进展,概述了光电印制电路板用聚合物光波导材料的要求,列举了主要的光波导线路用聚合物材料的性能。     

光电印制电路板的发展评述（1）——光电印制电路板的基本概述（下）

4光互连相对于电互连的优点为什么印制电路板的制造技术要进一步发展成为光电印制电路板?这是因为传统印制电路板受到电性连接物理特性的限制,其传输速度的增加几乎已达极限,对现代需求高速传输的宽频通讯的实用化造成瓶颈。我们知道,要实现铜背板信号传输更快有以下几个方法:(1)增厚导电铜层;(2)使介质层变得更薄;(3)使用更低介质损耗的介质层;(4)增加更多的信号层;(5)减少信号的长度;(6)增大信号之间的距离;(7)增加板面积(更宽和更长)以处理每层更多的信号。但是,从电子工业的发展要求来看,这是不现实的。有鉴于此,为迎合新一代需要的光电…     

埋置无源及有源元件的B2it印制电路板

文章介绍了在埋入凸块互连技术印制电路板内,埋置无源元件及有源元件的B2it印制电路板。     

印制电路板发展动向

一、印制板市场发展动态 1.印制电路板在电子产品中的地位在世界电子工业发展过程中,自从有源器件的革命——半导体三极管出现后,人们发现印制电路板(PCB)是一种最适配的元器件装配互连器件。随着五十年代半导体三极管的工业生产,用PCB装配互连的基本结构形式     

全球印制光-电路板的发展动态

文章分析了印制光-电路板的分类,综述了世界主要光互连研究公司的光-电线路板的现状,重点介绍了松下电工、中国台湾工研院、韩国ICU、英国UCL以及IBM的印制光-电路板的特点,简述了JPCA在2009年出台的一系列印制光-电路板的新标准,印制光-电路板将会给印制电路板行业带来更大的技术与市场的发展空间。     

全球印制电路板的产值与市场概况

根据互连与封装电子电路学会(IPC)技术市场研究委员会(TMRC)最近发表的世界市场报告,1997年全球印制电路板的产值打破了325亿美元的记录,其中硬性印制电路板产值为297亿美元,柔性印制电路板产值为28亿美元。     

印制光-电路板的发展评述（5）——印制光-电路板的市场与标准

文章介绍了印制光-电路板的市场,分析了光电装配技术的标准化项目,简要阐述了JPCA标准——光布线板通则和高分子光导通路的测试方法。     

印制电路板局部高密度互连的新方法

通过将PCB和高密度互连膜局部粘附到一起（LST－HDI－PCB），使得传统的印制电路板（PCB），如象陶瓷基板和环氧玻璃板，实现了局部高密度互连，这是解决印制电路板高密度互连（HDI－PCB）需求的一种新方法。这种概念可为传统的PCB任意区域提供HDI。在该技术中，使用了Cu/Pl(铜／聚酰亚胺）膜，可把Cu/PI膜层压到传统PCB上任意需要HDI的区域。按照这种新方法，使用批量生产线可同步制造传统的PCB和HDI－Cu/PI膜，其带来的成本优点胜过逐次组装的板子。目前我们开发的Cu/PI膜技术可在PI膜上沉积不同厚度的Cu层，而且没有针孔。这种技术特别适用于超细线和超细间距应用领域。此外，可对Cu/PI膜进行化学蚀刻及用激光打孔形成直径达50微米（micro)(2mil)的微孔，微孔和超细线及超细间距可实现超高密度的互连。在这种技术中，最细线和最线间距达10micro(0.4mil),使电路间距达到了20micro(0.8mil)。本讨论了完全用高I／O BGA、CSP及小型SMT器件组装的测试载体在开发研制过程中所遇到的问题和竞争的焦点以及该技术的发展现状。此外，还详细地论述了制造工艺和生产能力。     

光电印制电路板的发展评述（3）——聚合物光波导层的成型工艺（1）

文章简述了光电印制电路板中聚合物光波导层的制作应该遵循的原则,介绍了光波导层的主要成型工艺,包括反应离子蚀刻、平版影印、激光烧蚀和加热模压等方法。     

激光技术在当今印制电路板生产中的应用

本文综述了在当今印制电路板生产中特别是高密度互连产品的制造中，激光技术在照相底片制作、图形转移、图形形成、微小盲孔和贯通孔的形成、外形加工等方面的应用及特点。     

超高速光互连系统级封装技术前沿研究

光互连系统级封装技术是用光互连在封装尺度上代替铜互连,以突破目前芯片间通信低速度瓶颈。超高速光互连系统级封装的目标是开发出可集成光子收发器,并嵌入到现代尖端的系统级封装中(SiP)中,以提高并行计算系统的数据传输效率或速度。文章介绍了超高速光互连系统级封装关键技术及前沿研究情况,通过分析IMEC、Intel、BAE系统公司等研究机构的开发现状和技术发展路线,论述了光互连SiP关键技术的发展趋势。     

Polysiloxane based flexible electrical-optical-circuits-board

In the paper, a packaging technique of polysiloxane based flexible electrical-optical-circuits-board (EOCB) with Kapton (Dupont) foils was developed and introduced. The main mechanism of forming a good bonding between polysiloxane and Kapton foil was identified and verified. The optical and mechanical properties of the polysiloxane waveguide layer remained unchanged before and after packaging. According to the defined procedures, the environmental stability of packaged EOCBs has been tested with the result that they exhibited excellent mechanical, optical, and thermal stabilities. The mechanical stability limit of the tested EOCBs is determined only by the intrinsic mechanical stability of the used polysiloxane materials. The optical waveguide propagation loss at 850 nm is less than 0.1 dB/cm after surviving from the defined environmental test procedures.     

Predictions of CMOS compatible on-chip optical interconnect

Interconnect has become a primary bottleneck in the integrated circuit design process. As CMOS technology is scaled, the design requirements of delay, power, bandwidth, and noise due to the on-chip interconnects have become more stringent. New design challenges are continuously emerging, such as delay uncertainty induced by process and environmental variations. It has become increasingly difficult for conventional copper interconnect to satisfy these design requirements. On-chip optical interconnect has been considered as a potential substitute for electrical interconnect. In this paper, predictions of the performance of CMOS compatible optical devices are made based on current state-of-the-art optical technologies. Electrical and optical interconnects are compared for various design criteria based on these predictions. The critical dimensions beyond which optical interconnect becomes advantageous over electrical interconnect are shown to be approximately one-tenth of the chip edge length at the 22 nm technology node.     

An approach to the optical interconnect made in standard CMOS process

A standard CMOS optical interconnect is proposed, including an octagonal-annular emitter, a field oxide,metal 1-PSG/BPSG-metal 2 dual waveguide, and an ultra high-sensitivity optical receiver integrated with a fingered P/N-well/P-sub dual photodiode detector. The optical interconnect is implemented in a Chartered 3.3-V 0.35-μm standard analog CMOS process with two schemes for the research of the substrate noise coupling effect on the optical interconnect performance: with or without a GND-guardring around the emitter. The experiment results show that the optical interconnect can work at 100 kHz, and it is feasible to implement optical interconnects in standard CMOS processes.     

Systematic Simulation-Based Predictive Synthesis of Integrated Optical Interconnect

Integrated optical interconnect has been identified by the ITRS as a potential solution to overcome predicted interconnect limitations in future systems-on-chip. However, the multiphysics nature of the design problem and the lack of a mature integrated photonic technology have contributed to severe difficulties in assessing its suitability. This paper describes a systematic, fully automated synthesis method for integrated microsource-based optical interconnect capable of optimally sizing the interface circuits based on system specifications, CMOS technology data, and optical device characteristics. The simulation-based nature of the design method means that its results are relatively accurate, even though the generation of each data point requires only 5 min on a 1.3-GHz processor. This method has been used to extract typical performance metrics (delay, power, interconnect density) for optical interconnect of length 2.5-20 mm in three predictive technologies at 65-, 45-, and 32-nm gate length.     

集成电路芯片上光互连研究的新进展

讨论了集成电路向高集成度、高工作频率和高传输速率继续发展时,常规金属互连出现的困难以及集成电路芯片上光互连具有的潜在优势．介绍了组成芯片上光互连的光发射器件、光接收器件和光传输器件等三种基本器件及其与硅集成电路集成的研究新进展．最后展望了集成电路芯片上光互连的应用前景．     

集成电路芯片上光互连研究的新进展

讨论了集成电路向高集成度、高工作频率和高传输速率继续发展时 ,常规金属互连出现的困难以及集成电路芯片上光互连具有的潜在优势 .介绍了组成芯片上光互连的光发射器件、光接收器件和光传输器件等三种基本器件及其与硅集成电路集成的研究新进展 .最后展望了集成电路芯片上光互连的应用前景 .     

Design limitations of highly parallel free-space opticalinterconnects based on arrays of vertical cavity surface-emitting laserdiodes, microlenses, and photodetectors

We utilize a novel diffraction formalism to study the crosstalk effect in a highly parallel free-space optical interconnect based on two-dimensional arrays of surface-emitting laser diodes, microlenses, and photodetectors. The diffraction induced crosstalk between adjacent laser diodes in each detector to the system limitations is investigated. Optimum design rules and formulas are given for the first time, to include the relation of channel packaging density and interconnect length to the design parameters of the optical interconnect components. The design formulas developed here yield an optimum detector size and indicate a tradeoff between channel packaging density and interconnect length. The feasibility of such a free-space interconnect with a channel packaging density of 3460 channels/cm² and 2.0 cm interconnection length is determined using typical parameters of detector radius from ~5 to ~45 μm, lens radius of 85 μm, and laser diode radius of ~5 pm operating at wavelength 0.67 pm for signal-to-noise ratio above 17 dB. Some experiments were conducted to measure the diffraction induced crosstalk and optical link efficiency     

平行光纤互联技术：高性能和低能耗的结合

This paper analyzes the physical potential,computing performance benefit and power consumption of optical interconnects. Compared with electrical interconnections, optical ones show undoubted advantages based on physical factor analysis. At the same time, since the recent developments drive us to think about whether these optical interconnect technologies with higher bandwidth but higher cost are worthy to be deployed, the computing performance comparison is performed. To meet the increasing demand of large-scale parallel or multi-processor computing tasks, an analytic method to evaluate parallel computing performance of interconnect systems is proposed in this paper. Both bandwidth-limit model and full-bandwidth model are under our investigation. Speedup and efficiency are selected to represent the parallel performance of an interconnect system. Deploying the proposed models, we depict the performance gap between the optical and electrically interconnected systems. Another investigation on power consumption of commercial products showed that if the parallel interconnections are deployed, the unit power consumption will be reduced. Therefore, from the analysis of computing influence and power dissipation, we found that parallel optical interconnect is valuable combination of high performance and low energy consumption. Considering the possible data center under construction, huge power could be saved if parallel optical interconnects technologies are used.     

High-Speed Optical Interconnect Coupler Based on Soft Lithography Ribbons

In this paper, high-speed optical ribbon couplers for card-to-backplane interconnect applications are presented. The ribbon couplers are based on evanescent coupling between flexible multimode waveguide arrays. A soft lithographic technique is utilized to fabricate the ribbons. A flexible nonterminating optical data bus has been developed. Using BeamPROP software, we simulated the evanescent light coupling between two closely spaced ribbon waveguides to study the effects of waveguides separation, interaction length, and misalignment on coupling efficiency. Further experimental analysis and tests have been performed to quantify these effects. To investigate data transmission performance, a 12-channel optical interconnect link has been assembled. Experimental results demonstrated successful evanescent coupling; facilitating auto alignment coupling between card and backplane ribbon waveguides at data speeds as high as 10 Gb/s per channel. The evident high-speed interconnect performance and rapid ribbon prototyping approach can result in overall lower cost coupler fabrication for prospective optical interconnect applications.