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LIGA工艺的发展及应用 总被引:5,自引:1,他引:4
介绍了LIGA(lithographie,galvanoformungandabformung)技术以及在此基础上开发出来的准LIGA(like-LIGA)技术、SLIGA(sacrificialLIGA)、M2LIGA(movingmaskLIGA)技术和抗蚀剂回流LIGA(PRLIGA———photoresistreflowLIGA)技术等。利用这一系列LIGA技术,可以生成具有高深宽比的复杂微结构,如微尖阵列、球形曲面、活动部件等,能较好地满足MEMS发展的需要。最后指出了目前这些方法存在的缺陷。 相似文献
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提出了一种基于光刻胶牺牲层技术的用于制作多层次SU-8模具的新方法,并进一步采用浇注成型的方法制作了聚二甲基硅氧烷(PDMS)多层次蘑菇形微结构。在多层次SU-8模具的制作过程中,使用了正性光刻胶BP212作为牺牲层,并采用超声辅助显影的方法使显影的时间大大缩短。通过对多层次SU-8模具预处理,有效减小了多层次SU-8模具与PDMS的结合力,从而提高了PDMS脱模的成功率。对制作的PDMS多层次蘑菇形微结构和PDMS单层次微柱结构进行了接触角测试。结果表明,PDMS多层次蘑菇形微结构的接触角为150.93°±1.6°,PDMS单层次微柱结构的接触角为139.19°±0.1°。由此可知PDMS多层次蘑菇形微结构具有优异的超疏水性能。 相似文献
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高深宽比结构是提高微器件性能的重要环节之一。利用RIE深刻技术加工具有高深宽比结构的图形 ,方法简单 :它不象LIGA技术那样 ,需昂贵的同步辐射光源和特制的掩模板 ,对光刻胶的要求也不是特别高 ,利用这种技术深刻蚀PMMA膜 ,以Ni作掩模 ,采用普通的光刻胶曝光技术和湿法刻蚀的方法将Ni掩模图形化 ,然后利用O2 RIE技术刻蚀PMMA ,可以得到深度达 1 0 0 μm ,深宽比大于 1 0的微结构 ,图形表面平整 ,侧壁光滑垂直。在刻蚀过程中 ,氧气压、刻蚀功率等工艺参数对刻蚀结果影响较大。 相似文献
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Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems: a review 总被引:3,自引:0,他引:3
The by far leading technology for manufacturing MEMS devices is Si-micromachining with its various derivatives. However, many applications of microsystems have requirements on materials basis, geometry, aspect ratio, dimensions, shape, accuracy of microstructures, and number of parts that cannot be fulfilled easily by mainstream silicon-based micromachining technologies. LIGA, an alternative microfabrication process combining deep X-ray lithography, plating-through-mask and molding, enables the highly precise manufacture of high-aspect-ratio microstructures with large structural height ranging from hundreds to thousands of micrometers thick. These tall microstructures can be produced in a variety of materials with well-defined geometry and dimensions, very straight and smooth sidewalls, and tight tolerances. LIGA technology is also well suited for mass fabrication of parts, particularly in polymer.Many microsystems benefit from unique characteristics and advantages of the LIGA process in terms of product performance. The LIGA technology is briefly reviewed. The strengths of the manufacturing method and its main fields of application are emphasized with examples taken from various groups worldwide, especially in micromechanics and microoptics. 相似文献
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The LIGA technique, which is being developed at the Research Center Karlsruhe, offers the possibility to manufacture microstructures with arbitrary lateral geometry, lateral dimensions down to below 1 μm and aspect ratios up to 500 from a variety of materials (metals, plastics, and ceramics). The basic steps of X-ray lithography, electroplating, and plastic molding, are briefly described. Examples of applications of the LIGA technique are: optical components (high performance microspectrometer), mechanical components (acceleration sensor with integrated temperature compensation), and fluidic components (micropumps) which are presented and discussed. Microcomponents will be of limited interest in the future if it will not be possible to integrate them into microsystems. Microsystems must be more powerful than the sum total of their components. This is discussed in the final chapter of this article 相似文献
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《Microelectronic Engineering》1986,4(1):35-56
Under the LIGA process for fabricating microstructures having high aspect ratios and great structural heights, synchrotron radiation lithography produces a primary template which is filled with a metal by electrodeposition. The metallic structure so produced is used as a mould insert for fabricating secondary plastic templates which, in mass production, replace the primary template. This is a report about the status of work performed by the Karlsruhe Nuclear Research Center with the cooperation of Siemens AG and the Fraunhofer Institute for Solid State Technology: By irradiation and development of polymethyl methacrylate (PMMA) plates, primary templates were produced which, for structural heights of several hundred μm, exhibit deviations in critical dimensions of less then some 0.1 μm. The best results were obtained with an X-ray mask consisting of a 25 μm thick beryllium foil and 18 μm thick absorber structures consisting of copper and gold. Practically perfect metallic replicas were obtained by electrodeposition of nickel in the PMMA microstructures and even details in structure of less than 0.1 μm size were reproduced. Moulding was done with a methacrylate-based casting resin with an internal mould release agent. By electrodeposition of nickel in the secondary templates, secondary metal structures were produced which practically do not differ from the primary structures. The LIGA process can be expected to be superior to other methods for fabricating microstructures with high aspect ratios if, in series production of microstructures with complex shapes, stringent requirements are imposed on the resolution, the aspect ratio, the structural height, and the parallelism of the structural walls. 相似文献
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用金刚石薄膜作为支撑层,金作为吸收体;同时,采用Ni合金过渡层来解决金刚石与金之间结合力小,热匹配性能差等问题。制作的掩模版具有较好的反差效果。同时,还具有工艺简单,成品率高等特点。 相似文献
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微细加工新技术—LIGA技术 总被引:5,自引:1,他引:5
LIGA技术是近几年才开展起来的一门新技术,是微细加工的一种新方法。本文对这一技术,从简单工艺过程到每个具体工序环节都详细、深入地进行了介绍。LIGA技术是由光刻、电铸、塑铸三个环节组成,尤刻以同步辐射深度X光曝光为主。由于同步辐射X光有非常好的平行性、极高的辐射强度、连续的光谱,使这项技术能够制造出高宽比大到100、厚度可达几百微米、结构侧壁平行线偏差在亚微米范围内的微米级三维立体结构。通过电铸、塑铸就可将这一结构转换成金属或塑料的微结构产品。 这项技术在短短几年的发展过程中,已制造出电机、齿轮、发动机、涡轮、联杆、单色器、光纤联接器、电联接器、喷嘴、泵、阀、加速度传感器等微型结构与器件,被认为是将对下一世纪带来重大影响的一门新技术。 相似文献
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塑料成型模具设计多媒体与动态演示系统的研制 总被引:3,自引:0,他引:3
在对塑料成型工艺、成型设备、成型所用模具的特点进行系统分析的基础上,研制开发了旨在对初入模具行业的技术人员以模具设计知识为指导的塑料成型模具设计多媒体与动态演示系统。该系统利用多媒体计算机的文本、图像、动画、视频和音频的综合处理能力和其交互式特点,借助VB、AUTOCAD、3DS MAX等高级软件,为塑料成型模具设计学习人员创造了一个图文并茂、生动逼真的学习环境。 相似文献
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《Industrial Electronics, IEEE Transactions on》2009,56(8):2955-2960
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Newlin D.P. Pham A.-V.H. Harriss J.E. 《Components and Packaging Technologies, IEEE Transactions on》2002,25(3):506-510
We present the design and development of an ultra-violet (UV) LIGA (a German acronym for electroplating, lithography and molding) micromachining process on silicon substrates at microwave/millimeter wave frequencies. The process employs an ultra-thick negative photoresist SU-8 that can be spin-coated and processed using conventional lithography techniques. Using this process, we have developed micromachined coplanar waveguide (CPW) interconnects on Si substrates. The conductor-backed micromachined CPW on Si (7.2 /spl Omega/-cm) achieves a measured attenuation of 0.18 dB/cm at 20 GHz. 相似文献