Printable inorganic nanomaterials for flexible transparent electrodes: from synthesis to application

Printed and flexible electronics are definitely promising cutting-edge electronic technologies of the future.They offer a wide-variety of applications such as flexible circuits,flexible displays,flexible solar cells,skinlike pressure sensors,and radio frequency identification tags in our daily life.As the most-fundamental component of electronics,electrodes are made of conductive materials that play a key role in flexible and printed electronic devices.In this review,various inorganic conductive materials and strategies for obtaining highly conductive and uniform electrodes are demonstrated.Applications of printed electrodes fabricated via these strategies are also described.Nevertheless,there are a number of challenges yet to overcome to optimize the processing and performance of printed electrodes.     

Room‐Temperature Printing of Organic Thin‐Film Transistors with π‐Junction Gold Nanoparticles

Printing semiconductor devices under ambient atmospheric conditions is a promising method for the large‐area, low‐cost fabrication of flexible electronic products. However, processes conducted at temperatures greater than 150 °C are typically used for printed electronics, which prevents the use of common flexible substrates because of the distortion caused by heat. The present report describes a method for the room‐temperature printing of electronics, which allows thin‐film electronic devices to be printed at room temperature without the application of heat. The development of π‐junction gold nanoparticles as the electrode material permits the room‐temperature deposition of a conductive metal layer. Room‐temperature patterning methods are also developed for the Au ink electrodes and an active organic semiconductor layer, which enables the fabrication of organic thin‐film transistors through room‐temperature printing. The transistor devices printed at room temperature exhibit average field‐effect mobilities of 7.9 and 2.5 cm² V^?1 s^?1 on plastic and paper substrates, respectively. These results suggest that this fabrication method is very promising as a core technology for low‐cost and high‐performance printed electronics.     

Direct Freeform Laser Fabrication of 3D Conformable Electronics

3D conformable electronic devices on freeform surfaces show superior performance to the conventional, planar ones. They represent a trend of future electronics and have witnessed exponential growth in various applications. However, their potential is largely limited by a lack of sophisticated fabrication techniques. To tackle this challenge, a new direct freeform laser (DFL) fabrication method enabled by a 5-axis laser processing platform for directly fabricating 3D conformable electronics on targeted arbitrary surfaces is reported. Accordingly, representative laser-induced graphene (LIG), metals, and metal oxides are successfully fabricated as high-performance sensing and electrode materials from different material precursors on various types of substrates for applications in temperature/light/gas sensing, energy storage, and printed circuit board for circuit. Last but not the least, to demonstrate an application in smart homes, LIG-based conformable strain sensors are fabricated and distributed in designated locations of an artificial tree. The distributed sensors have the capability of monitoring the wind speed and direction with the assistance of well-trained machine-learning models. This novel process will pave a new and general route to fabricating 3D conformable electronic devices, thus creating new opportunities in robotics, biomedical sensing, structural health, environmental monitoring, and Internet of Things applications.     

Paper with Power: Engraving 2D Materials on 3D Structures for Printed,High‐Performance,Binder‐Free,and All‐Solid‐State Supercapacitors

The prevalence of the Internet of Things (IoT) and wearable electronics create an unprecedented demand for new power sources which are low cost, high performance, and flexible in many application settings. In this paper, a strategy for the scalable fabrication of high‐performance, all‐solid‐state supercapacitors (SCs) is demonstrated using conventional paper and an inkjet printer. Emerging printed electronics technology and low‐cost chemical engraving methods are bridged for the first time to construct Cu_xO nanosheets, in situ, on the 3D metallized fiber structures. Benefitting from both the “2D Materials on 3D Structures” design and the binder‐free nature of the fabricated electrodes, substantial improvements to electrical conductivity, aerial capacitance, and electrochemical performance of the resulting SCs are observed. With the proposed strategy, the fabricated SCs can be seamlessly integrated into any printed circuit, sensors, or artwork; the properties of these SCs can be easily tuned by simple pattern design, fulfilling the increasing demand of highly customized power systems in the IoT and flexible/wearable electronics industries.     

All‐Printed Flexible and Stretchable Electronics with Pressing or Freezing Activatable Liquid‐Metal–Silicone Inks

Liquid‐metal (LM)‐based flexible and stretchable electronics have attracted widespread interest in wearable computing, human–machine interaction, and soft robotics. However, many current examples are one‐off prototypes, whereas future implementation requires mass production. To address this critical challenge, an integrated multimaterial 3D printing process composed of direct ink writing (DIW) of sealing silicone elastomer and special LM‐silicone (LMS) inks for manufacturing high‐performance LM‐based flexible and stretchable electronics is presented. The LMS ink is a concentrated mixture of LM microdroplets and silicone elastomer and exhibits excellent printability for DIW printing. Guided by a verified theoretical model, a printing process with high resolution and high speed can be easily implemented. Although LMS is not initially conductive, it can be activated by pressing or freezing. Activated LMS possesses good conductivity and significant electrical response to strain. Owing to LMS's unique structure, LMS‐embedded flexible electronics exhibit great damage mitigation, in that no leaking occurs even when damaged. To demonstrate the flexibility of this process in fabricating LM‐based flexible electronics, multilayer soft circuits, strain sensors, and data gloves are printed and investigated. Notably, utilizing LMS's unique activating property, some functional circuits such as one‐time pressing/freezing‐on switch can be printed without any structural design.     

Seriography‐Guided Reduction of Graphene Oxide Biopapers for Wearable Sensory Electronics

Novel nacre‐mimic bio‐nanocomposites, such as graphene‐based laminates, are pushing the boundaries of strength and toughness as flexible engineering materials. Translating these material advances to functional flexible electronics requires methods for generating print‐scalable microcircuits (conductive elements surrounded by dielectric) into these strong, tough, lightweight bio‐nanocomposites. Here, a new paradigm for printing flexible electronics by employing facile, eco‐friendly seriography to confine the reduction of graphene oxide biopapers reinforced by silk interlayers is presented. Well‐defined, micropatterned regions on the biopaper are chemically reduced, generating a 10⁶ increase in conductivity (up to 10⁴ S m^?1). Flexible, robust graphene‐silk circuits are showcased in diverse applications such as resistive moisture sensors and capacitive proximity sensors. Unlike conductive (i.e., graphene‐ or Ag nanoparticle‐loaded) inks printed onto substrates, seriography‐guided reduction does not create mechanically weak interfaces between dissimilar materials and does not require the judicious formation of ink. The unimpaired functionality of printed‐in graphene‐silk microcircuits after thousands of punitive folding cycles and chemical attack by harsh solvents is demonstrated. This novel approach provides a low‐cost, portable solution for printing micrometer‐scale conductive features uniformly across large areas (>hundreds of cm²) in layered composites for applications including wearable health monitors, electronic skin, rollable antennas, and conformable displays.     

Highly Conductive,Flexible, Polyurethane‐Based Adhesives for Flexible and Printed Electronics

Flexible interconnects are one of the key elements in realizing next‐generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, adhesives to support flip‐chip and surface‐mount interconnections are less commonly used and reported. A polyurethane (PU)‐based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10^?5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU‐ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die‐attach material for flip‐chip, as vertical interconnect access (VIA)‐filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio‐frequency devices.     

Hexagonal Boron Nitride–Enhanced Optically Transparent Polymer Dielectric Inks for Printable Electronics

Solution‐processable thin‐film dielectrics represent an important material family for large‐area, fully‐printed electronics. Yet, in recent years, it has seen only limited development, and has mostly remained confined to pure polymers. Although it is possible to achieve excellent printability, these polymers have low (≈2–5) dielectric constants (ε_r). There have been recent attempts to use solution‐processed 2D hexagonal boron nitride (h‐BN) as an alternative. However, the deposited h‐BN flakes create porous thin‐films, compromising their mechanical integrity, substrate adhesion, and susceptibility to moisture. These challenges are addressed by developing a “one‐pot” formulation of polyurethane (PU)‐based inks with h‐BN nano‐fillers. The approach enables coating of pinhole‐free, flexible PU+h‐BN dielectric thin‐films. The h‐BN dispersion concentration is optimized with respect to exfoliation yield, optical transparency, and thin‐film uniformity. A maximum ε_r ≈ 7.57 is achieved, a two‐fold increase over pure PU, with only 0.7 vol% h‐BN in the dielectric thin‐film. A high optical transparency of ≈78.0% (≈0.65% variation) is measured across a 25 cm² area for a 10 μm thick dielectric. The dielectric property of the composite is also consistent, with a measured areal capacitance variation of <8% across 64 printed capacitors. The formulation represents an optically transparent, flexible thin‐film, with enhanced dielectric constant for printed electronics.     

Flexible Electronics: Stretchable Electrodes and Their Future

Flexible electronics, as an emerging and exciting research field, have brought great interest to the issue of how to make flexible electronic materials that offer both durability and high performance at strained states. With the advent of on‐body wearable and implantable electronics, as well as increasing demands for human‐friendly intelligent soft robots, enormous effort is being expended on highly flexible functional materials, especially stretchable electrodes, by both the academic and industrial communities. Among different deformation modes, stretchability is the most demanding and challenging. This review focuses on the latest advances in stretchable transparent electrodes based on a new design strategy known as kirigami (the art of paper cutting) and investigates the recent progress on novel applications, including skin‐like electronics, implantable biodegradable devices, and bioinspired soft robotics. By comparing the optoelectrical and mechanical properties of different electrode materials, some of the most important outcomes with comments on their merits and demerits are raised. Key design considerations in terms of geometries, substrates, and adhesion are also discussed, offering insights into the universal strategies for engineering stretchable electrodes regardless of the material. It is suggested that highly stretchable and biocompatible electrodes will greatly boost the development of next‐generation intelligent life‐like electronics.     

Ionoskins: Nonvolatile,Highly Transparent,Ultrastretchable Ionic Sensory Platforms for Wearable Electronics

The primary technology of next‐generation wearable electronics pursues the development of highly deformable and stable systems. Here, nonvolatile, highly transparent, and ultrastretchable ionic conductors based on polymeric gelators [poly(methyl methacrylate‐ran‐butyl acrylate), PMMA‐r‐PBA] and ionic liquids (IL) are proposed. A crucial strategy in the molecular design of polymer gelators is copolymerization of PMMA and IL‐insoluble low glass transition temperature (T_g) polymers that can be deformed and effectively dissipate applied strains. Highly stretchable (elongation limit ≈850%), mechanically robust (elastic modulus ≈3.1 × 10⁵ Pa), and deformation durable (recovery ratio ≈96.1% after 500 stretching/releasing cycles) gels are obtained by judiciously adjusting the molecular characteristics of polymer gelators and gel composition. An extremely simple “ionic” strain sensory platform is fabricated by directly connecting the stretchable gel and a digital multimeter, exhibiting high sensitivity (gauge factor ≈2.73), stable operation (>13 000 cycles), and nonvolatility (>10 d in air). Moreover, the skin‐type strain sensor, referred to as ionoskin, is demonstrated. The gels are attached to a part of the body (e.g., finger, elbow, knee, or ankle) and various human movements are successfully monitored. The ionoskin renders the opportunity to achieve wearable ubiquitous electronics such as healthcare devices and smart textile systems.     

3D Printing of Hydrogels for Stretchable Ionotronic Devices

In the booming development of flexible electronics represented by electronic skins, soft robots, and human–machine interfaces, 3D printing of hydrogels, an approach used by the biofabrication community, is drawing attention from researchers working on hydrogel-based stretchable ionotronic devices. Such devices can greatly benefit from the excellent patterning capability of 3D printing in three dimensions, as well as the free design complexity and easy upscale potential. Compared to the advanced stage of 3D bioprinting, 3D printing of hydrogel ionotronic devices is in its infancy due to the difficulty in balancing printability, ionic conductivity, shape fidelity, stretchability, and other functionalities. In this review, a guideline is provided on how to utilize the power of 3D printing in building high-performance hydrogel-based stretchable ionotronic devices mainly from a materials’ point of view, highlighting the systematic approach to balancing the printability, printing quality, and performance of printed devices. Various 3D printing methods for hydrogels are introduced, and then the ink design principles, balancing printing quality, printed functions, such as elastic conductivity, self-healing ability, and device (e.g., flexible sensors, shape-morphing actuators, soft robots, electroluminescent devices, and electrochemical biosensors) performances are discussed. In conclusion, perspectives on the future directions of this exciting field are presented.     

All-inkjet-printed dissolved oxygen sensors on flexible plastic substrates

Inkjet printing is a promising alternative manufacturing method to conventional standard microfabrication techniques for the development of flexible and low-cost devices. Although the use of inkjet printing for the deposition of selected materials for the development of sensor devices has been reported many times in literature, it is still a challenge and a potential route towards commercialization to completely manufacture sensor devices with inkjet technology. In this work is demonstrated the fabrication of a functional low-cost dissolved oxygen (DO) amperometric sensor with feature sizes in the micrometer range using inkjet printing. All the required technological steps for the fabrication of a complete electrochemical three electrodes system are discussed in detail. The working and counter electrodes have been printed using a gold nanoparticle ink, whereas a silver nanoparticle ink was used to print a pseudo-reference electrode. Both inks are commercially available and can be sintered at low temperatures, starting already at 120 °C, which allows the use of plastic substrates. In addition, a printable SU8 ink formulation cured by UV is applied as passivation layer in the sensor device. Finally, as the performance of analytical methods strongly depends on the working electrode material, is demonstrated the electrochemical feasibility of this printed DO sensor, which shows a linear response in the range between 0 and 8 mg L⁻¹ of DO, and affords a detection limit of 0.11 mg L⁻¹, and a sensitivity of 0.03 μA L mg⁻¹. The use of flexible plastic substrates and biocompatible inks, and the rapid prototyping and low-cost of the fabricated sensors, makes that the proposed manufacturing approach opens new opportunities in the field of biological and medical sensor applications.     

Bioinspired Self-healing Soft Electronics

Inspired by nature, various self-healing materials that can recover their physical properties after external damage have been developed. Recently, self-healing materials have been widely used in electronic devices for improving durability and protecting the devices from failure during operation. Moreover, self-healing materials can integrate many other intriguing properties of biological systems, such as stretchability, mechanical toughness, adhesion, and structural coloration, providing additional fascinating experiences. All of these inspirations have attracted extensive research on bioinspired self-healing soft electronics. This review presents a detailed discussion on bioinspired self-healing soft electronics. Firstly, two main healing mechanisms are introduced. Then, four categories of self-healing materials in soft electronics, including insulators, semiconductors, electronic conductors, and ionic conductors, are reviewed, and their functions, working principles, and applications are summarized. Finally, human-inspired self-healing materials and animal-inspired self-healing materials as well as their applications, such as organic field-effect transistors (OFETs), pressure sensors, strain sensors, chemical sensors, triboelectric nanogenerators (TENGs), and soft actuators, are introduced. This cutting-edge and promising field is believed to stimulate more excellent cross-discipline works in material science, flexible electronics, and novel sensors, accelerating the development of applications in human motion monitoring, environmental sensing, information transmission, etc.     

Polysilicon thin-film transistors on polymer substrates

Different approaches to fabricate low-temperature polycrystalline silicon (LTPS) thin film transistors (TFTs) on polymer substrates are reviewed and the two main routes are discussed: (1) standard fabrication of LTPS TFTs on glass substrates followed by a transfer process of the devices on the polymeric substrate; (2) direct fabrication of the devices on the polymeric substrate. Among the different techniques we have described in more detail the process we have recently developed for the fabrication of LTPS TFTs directly on ultra-thin polyimide (PI) substrate. LTPS TFT technology is particularly suited for high performance flexible electronics applications, due to the excellent device characteristics, good electrical stability and CMOS technology. Flexible display application remains the most attractive application for LTPS technology, especially for AMOLED displays, where device stability and the possibility to integrate the driving circuits make LTPS technology superior to all the other competitive TFT technologies. Among the other applications, particularly promising is also the application to flexible smart sensors, where integration of a front-end electronics is essential. Some examples of flexible gas sensors and pressure sensors, integrated with simple readout electronics based on LTPS TFTs and fabricated on ultra-thin PI substrate, are presented.     

Printed Solar Cells and Energy Storage Devices on Paper Substrates

Paper is a flexible material, commonly used for information storage, writing, packaging, or specialized purposes. It also has strong appeal as a substrate in the field of flexible printed electronics. Many applications, including safety, merchandising, smart labels/packing, and chemical/biomedical sensors, require an energy source to power operation. Here, progress regarding development of photovoltaic and energy storage devices on cellulosic substrates, where one or more of the main material layers are deposited via solution processing or printing, is reviewed. Paper can be used simply as the flexible substrate or, exploiting its porous fiber‐like nature, as an active film by infiltration or copreparation with electronic materials. Solar cells with efficiencies of up to 9% on opaque substrates and 13% on transparent substrates are demonstrated. Recent developments in paper‐based supercapacitors and batteries are also reviewed with maximum achieved capacity of 1350 mF cm^?2 and 2000 mAh g^?1, respectively. Analyzing the literature, it becomes apparent that more work needs to be carried out in continuing to improve peak performance, but especially stability and the application of printing techniques, even roll‐to‐roll processing, over large areas. Paper is not only environmentally friendly and recyclable, but also thin, flexible, lightweight, biocompatible, and inexpensive.     

Self-Healing,Robust, and Stretchable Electrode by Direct Printing on Dynamic Polyurea Surface at Slightly Elevated Temperature

Printed electronics on elastomer substrates have found wide applications in wearable devices and soft robotics. For everyday usage, additional requirements exist for the robustness of the printed flexible electrodes, such as the ability to resist scratching and damage. Therefore, highly robust electrodes with self-healing, and good mechanical strength and stretchability are highly required and challenging. In this paper, a cross-linking polyurea using polydimethylsiloxane as the soft segment and dynamic urea bonds is prepared and serves as a self-healing elastomer substrate for coating and printing of silver nanowires (AgNWs). Due to the dynamic exchangeable urea bond at 60 °C, the elastomer exhibits dynamic exchange of the cross-linking network while retaining the macroscopic shape. As a result, the AgNWs are partially embedded in the surface of the elastomer substrate when coated or printed at 60 °C, forming strong interfacial adhesion. As a result, the obtained stretchable electrode exhibits high mechanical strength and stretchability, the ability to resist scratching and sonication, and self-healing. This strategy can be applied to a variety of different conducting electrode materials including AgNWs, silver particles, and liquid metal, which provides a new way to prepare robust and self-healing printed electronics.     

Reduced Graphene Oxide Micromesh Electrodes for Large Area,Flexible, Organic Photovoltaic Devices

A laser‐based patterning technique—compatible with flexible, temperature‐sensitive substrates—for the production of large area reduced graphene oxide micromesh (rGOMM) electrodes is presented. The mesh patterning can be accurately controlled in order to significantly enhance the electrode transparency, with a subsequent slight increase in the sheet resistance, and therefore improve the tradeoff between transparency and conductivity of reduced graphene oxide (rGO) layers. In particular, rGO films with an initial transparency of ≈20% are patterned, resulting in rGOMMs films with a ≈59% transmittance and a sheet resistance of ≈565 Ω sq^?1, that is significantly lower than the resistance of ≈780 Ω sq^?1, exhibited by the pristine rGO films at the same transparency. As a proof‐of‐concept application, rGOMMs are used as the transparent electrodes in flexible organic photovoltaic (OPV) devices, achieving power conversion efficiency of 3.05%, the highest ever reported for flexible OPV devices incorporating solution‐processed graphene‐based electrodes. The controllable and highly reproducible laser‐induced patterning of rGO hold enormous promise for both rigid and flexible large‐scale organic electronic devices, eliminating the lag between graphene‐based and indium–tin oxide electrodes, while providing conductivity and transparency tunability for next generation flexible electronics.     

Inkjet‐Printed Flexible Gold Electrode Arrays for Bioelectronic Interfaces

Bioelectronic interfaces require electrodes that are mechanically flexible and chemically inert. Flexibility allows pristine electrode contact to skin and tissue, and chemical inertness prevents electrodes from reacting with biological fluids and living tissues. Therefore, flexible gold electrodes are ideal for bioimpedance and biopotential measurements such as bioimpedance tomography, electrocardiography (ECG), electroencephalography (EEG), and electromyography (EMG). However, a manufacturing process to fabricate gold electrode arrays on plastic substrates is still elusive. In this work, a fabrication and low‐temperature sintering (≈200 °C) technique is demonstrated to fabricate gold electrodes. At low‐temperature sintering conditions, lines of different widths demonstrate different sintering speeds. Therefore, the sintering condition is targeted toward the widest feature in the design layout. Manufactured electrodes show minimum feature size of 62 μm and conductivity values of 5 × 10 ⁶ S m^?1. Utilizing the versatility of printing and plastic electronic processes, electrode arrays consisting of 31 electrodes with electrode‐to‐electrode spacing ranging from 2 to 7 mm are fabricated and used for impedance mapping of conformal surfaces at 15 kHz. Overall, the fabrication process of an inkjet‐printed gold electrode array that is electrically reproducible, mechanically robust, and promising for bioimpedance and biopotential measurements is demonstrated.     

Role of Polymeric Metal Nucleation Inducers in Fabricating Large‐Area,Flexible, and Transparent Electrodes for Printable Electronics

The advent of special types of transparent electrodes, known as “ultrathin metal electrodes,” opens a new avenue for flexible and printable electronics based on their excellent optical transparency in the visible range while maintaining their intrinsic high electrical conductivity and mechanical flexibility. In this new electrode architecture, introducing metal nucleation inducers (MNIs) on flexible plastic substrates is a key concept to form high‐quality ultrathin metal films (thickness ≈ 10 nm) with smooth and continuous morphology. Herein, this paper explores the role of “polymeric” MNIs in fabricating ultrathin metal films by employing various polymers with different surface energies and functional groups. Moreover, a scalable approach is demonstrated using the ionic self‐assembly on typical plastic substrates, yielding large‐area electrodes (21 × 29.7 cm²) with high optical transmittance (>95%), low sheet resistance (<10 Ω sq^?1), and extreme mechanical flexibility. The results demonstrate that this new class of flexible and transparent electrodes enables the fabrication of efficient polymer light‐emitting diodes.     

Conformal Printing of Graphene for Single‐ and Multilayered Devices onto Arbitrarily Shaped 3D Surfaces

Printing has drawn a lot of attention as a means of low per‐unit cost and high throughput patterning of graphene inks for scaled‐up thin‐form factor device manufacturing. However, traditional printing processes require a flat surface and are incapable of achieving patterning onto 3D objects. Here, a conformal printing method is presented to achieve functional graphene‐based patterns onto arbitrarily shaped surfaces. Using experimental design, a water‐insoluble graphene ink with optimum conductivity is formulated. Then single‐ and multilayered electrically functional structures are printed onto a sacrificial layer using conventional screen printing. The print is then floated on water, allowing the dissolution of the sacrificial layer, while retaining the functional patterns. The single‐ and multilayer patterns can then be directly transferred onto arbitrarily shaped 3D objects without requiring any postdeposition processing. Using this technique, conformal printing of single‐ and multilayer functional devices that include joule heaters, resistive deformation sensors, and proximity sensors on hard, flexible, and soft substrates, such as glass, latex, thermoplastics, textiles, and even candies and marshmallows, is demonstrated. This simple strategy promises to add new device and sensing functionalities to previously inert 3D surfaces.