大规模集成电路封装用环氧树脂模塑料制备

主要对集成电路封装用环氧树脂模塑料的配方及工艺进行了研究,采用硅微粉偶联剂处理、高速混合、双辊开炼等,对环氧模塑料工艺流程进行了试验,获得了较佳的工艺条件;以高纯度邻甲酚醛环氧树脂为基体树脂,以硅微粉为填充剂,采用正交试验法对封装用模塑料进行了配方优化,获得了较优配方.结果表明,其性能达到了大规模集成电路封装用模塑料的性能要求.     

硅微粉等离子改性及其在IC封装用EMC中应用

使用射频等离子,通过等离子表面聚合技术对环氧树脂模塑料用硅微粉进行改性,考察了放电功率、处理压力、处理时间对硅微粉表面处理效果的影响。用于硅微粉表面等离子聚合包覆的单体有吡咯、1,3-二胺基丙烷、丙烯酸、尿素,包覆后硅微粉用红外光谱和接触角来表征。使用等离子包覆后的硅微粉制备了大规模集成电路封装用环氧树脂模塑料(EMC)。结果表明,硅微粉表面能够被吡咯、1,3-二胺基丙烷、丙烯酸、尿素包覆。利用等离子改性后的硅微粉制备的EMC性能被提高。     

固化促进剂用量对集成电路封装环氧模塑料固化行为的影响

选用酚醛树脂为固化剂,2-甲基咪唑为固化促进剂,制备了集成电路封装用环氧树脂模塑料。用非等温DSC法研究了固化促进剂用量对环氧模塑料的固化行为的影响,利用Kissinger方程、Crane方程和Ozawa方程计算出了环氧树脂模塑料的固化活化能、反应级数等固化反应动力学参数,推导出了固化过程的凝胶化温度、固化温度、后处理温度等最佳固化工艺条件,为环氧模塑料的配方优化和集成电路封装工艺的制定提供了基础数据。     

集成电路封装用MC型环氧模塑料的研制

本文涉及集成电路封装用环氧模塑料的基本配方和制造方法,讨论了环氧模塑料各组分的作用及其对模塑料性能的影响,尤其是对用它封装的半导体器件的耐湿可靠性的影响.     

硅微粉粒径及其匹配对IC封装用环氧模塑料流动性的影响

采用5种不同粒径的球形硅微粉（2、3、5、10、20 μm）,进行级配填充制备集成电路（IC）封装用环氧模塑料（EMC）,运用经典颗粒堆积理论,计算出符合粒度分布方程Dinger-Funk-Alfred的颗粒分布,使用Matlab软件编程计算出最佳的粒径配比方案。根据计算出的最佳粒径配比,混合填充于邻甲酚醛环氧树脂中,经过混炼后,制备出IC封装用EMC,分别用旋转流变仪和毛细管流变仪测定其流变性能。结果表明,不同粒径的硅微粉级配填充到模塑料中,可大大提高EMC的流动性。     

固化促进剂种类对集成电路封装材料固化行为的影响

选用酚醛树脂为固化剂,分别以2-甲基咪唑和三苯基磷为固化促进剂,制备了集成电路封装用环氧树脂模塑料。用非等温差示扫描量热（DSC）法研究了固化促进剂种类对环氧模塑料的固化行为的影响,利用Kissinger方程、Crane方程和Ozawa方程计算出了环氧树脂模塑料的固化活化能、反应级数等固化反应动力学参数,推导出了固化过程的凝胶化温度、固化温度、后处理温度等最佳固化工艺条件。     

固化剂用量对集成电路封装材料固化行为的影响

用酚醛树脂为固化剂,2-甲基咪唑为固化促进剂,制备了集成电路封装用环氧树脂模塑料(EMC)。用非等温差示扫描量热法(DSC)研究了固化剂用量对EMC固化行为的影响。利用Kissinger,Crane和Ozawa方程计算出了EMC的固化活化能、反应级数等固化反应动力学参数,推导出了固化过程的凝胶化温度、固化温度、后处理温度等最佳固化工艺条件。结果认为:随着固化剂用量增加,活化能降低;该研究为EMC塑料的配方优化和集成电路封装工艺提供了基础数据。     

六苯胺环三磷腈的制备及其对大规模集成电路封装用环氧模塑料的无卤阻燃

采用滴加工艺,制备了六苯胺基环三磷腈(HPACTPZ),对合成工艺进行了优化,并对其进行了FTIR、NMR表征和分析.采用自制的HPACTPZ作为阻燃剂,制备了无卤阻燃的大规模集成电路封装用环氧树脂模塑料(EMC).结果表明,HPACTPZ对环氧树脂具有优异的阻燃作用,所制备的EMC可达到UL-94 V0级阻燃性能,其氧指数达到35.8%,阻燃性能大大优于传统含溴阻燃体系,同时HPACTPZ加快了环氧树脂的固化反应,可用于制备快速固化及无后固化的大规模集成电路封装用EMC.     

DCPD环氧树脂的合成及在IC封装中的应用

制备了DCPD苯酚树脂，利用该树脂与环氧氯丙烷反应，制备出了DCPD环氧树脂，采用红外光谱分析对所生成的DCPD环氧树脂结构进行了表征，测定了DCPD环氧树脂的羟基值、环氧值、相对分子质量和氯含量。同时采用自制的DCPD环氧树脂作为基体树脂，制备了集成电路（IC）封装用DCPD环氧树脂模塑料。结果表明，制得的DCPD环氧模塑料的吸水率低（0．22％），玻璃化温度高（175℃），热变形温度高（282℃），可用于大规模集成电路IC的无铅封装。     

六苯氧基环三磷腈的合成及对IC封装用EMC的无卤阻燃

采用滴加工艺,制备了六苯氧基环三磷腈,探索出了较佳的合成工艺,并对其进行了FT-IR表征和分析。采用自制的六苯氧基环三磷腈作为阻燃剂,制备了无卤阻燃的大规模集成电路封装用环氧树脂模塑料（EMC）。结果表明,六苯氧基环三磷腈对环氧树脂具有较好的阻燃作用,所制备的EMC可达到UL-94 V0级阻燃性能,其氧指数达到33.1%,阻燃性能大大优于传统含溴阻燃体系,可用于制备大规模集成电路封装用EMC。     

PVC/改性废EMC粉复合材料结构和性能的研究

以电子元器件生产塑封过程中产生的废环氧模塑料(废EMC)作为填料,以模压成型的方法制备PVC/废EMC粉复合材料.研究了用硅烷偶联剂KH-550改性前后废EMC粉不同含量对复合材料力学性能的影响,用扫描电子显微镜观察了复合材料的微观结构和形貌,并研究了偶联剂的加入对复合材料耐热性能的影响.结果表明,KH-550明显提高了复合材料的力学性能,废EMC粉经改性后对复合材料起到了增强增韧作用,可相应增大填充量,有利于提高废料再利用率.KH-550的加入改善了废EMC粉和PVC基体间的界面结合性能,提高了复合材料的维卡软化温度.     

Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation

Owing to the trend of faster and denser circuit design, the dielectric properties of packaging materials for semi-conductors will have greater influence on performance and reliability. Also, as chips become more densely packaged, thermal dissipation becomes a critical reliability issue. Consequently, four important properties for manufacturing semi-conductor packaging are: low values of dielectric constants, high values of thermal conductivity, relatively low values of thermal expansion coefficients, and low cost. Thus, in this study, AlN (Aluminum Nitride) was selected as the filler for an epoxy matrix to achieve increased performance of an EMC. As a result, the thermal conductivity of an EMC filled with 70 vol% of AlN increased as much as 7–8 times compared with the EMC filled with a crystalline silica (vol. 70%). When more than 60 vol% of AlN was added to the EMC, the dielectric constants and thermal expansion coefficient decreased rapidly.     

电子塑封用脂环族环氧树脂研究进展

结合电子封装的现状、电子塑封材料的发展以及电子封装对塑封材料提出的高性能要求,介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景,其包括耐热型液体、含磷三官能团型、有机硅多官能团脂环族环氧树脂。同时简略介绍了脂环族环氧树脂增韧改性研究动向。     

Effects of curing accelerators on physical properties of epoxy molding compound (EMC)

The effects of various curing accelerators on the physical properties of epoxy molding compounds (EMCs) were investigated. Such properties as elasticities in rubbery and glassy regions, glass transition temperature, thermal expansion coefficient, and water absorption at 60°C of neat epoxy resins using various curing accelerators were found to be directly reflected in the properties of the EMCs that were prepared by using each resin system. However, volume resistivity and saturated water absorption at 120°C were not reflected. This was attributed to differences in the catalytic reactivity of accelerators causing different melt viscosity for the EMC, which resulted in different densities (packing degrees) and affected physical properties of molded EMC. On the other hand, it was found that the density of molded EMC was also affected by the molding conditions. To improve the physical properties of the molded EMC, in addition to proper selection of accelerators, it was very important to set the melt viscosity of the EMC as high as possible within the moldable range and to select suitable molding conditions.     

Thermally reversible and self‐healing novolac epoxy resins based on Diels–Alder chemistry

The modified novolac epoxy resins with furan pendant groups were prepared by novolac epoxy resin and furfuryl alcohol and then crosslinked by bifunctional maleimide via Diels–Alder (DA) chemistry to obtain the thermally reversible and self‐healing novolac epoxy resins. The as‐prepared crosslinked novolac epoxy resins were characterized by FT‐IR, NMR, TGA, and DMA. The results indicate that the novel crosslinked novolac epoxy resins present higher storage modulus (2.37 GPa at 30°C) and excellent thermal stability (348°C at 5% mass loss). Furthermore, the thermal reversible and self‐healing properties were studied in detail by DSC, SEM, thermal re‐solution, and gel–solution–gel transition experiments. All the results reveal that the crosslinked novolac epoxy resins based on DA reaction can be used as smart material for the practical application of electronic packaging and structural materials. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42167.     

Preparation and properties of bisphenol A epoxy resin microcapsules coated with melamine–formaldehyde resin

Microcapsules containing epoxy resins have potential applications, such as in adhesive, electronic packaging, and self-healing polymeric composites. A series of microcapsules were prepared by in situ polymerization with poly(melamine–formaldehyde) as the shell materials and a mixture of diglycidyl ether of bisphenol A and epoxy diluent as the core substances. Morphology, chemical structure, mean particle size, and thermal properties of the microcapsules were studied by means of optical microscope, Fourier transform infrared spectroscopy, laser particle size analyzer, and microcomputer differential thermal balance, respectively. Effects of kind of epoxy diluent, surfactant type, emulsifier concentration, and emulsifying rate on the physical properties of microcapsules were investigated. Results indicate that the formation of microcapsules is affected by the epoxy diluent type and surfactant type. The highest core content of the resultant microcapsules is about 88 wt% and average diameters of the capsules range from 67 to 201 μm, which can be adjusted by changing the emulsifier concentration and emulsifying rate. Thermo gravimetric analysis indicated that the prepared microcapsules experienced excellent stability up to 235 °C.     

Microstructure,adhesion strength and failure path at a polymer/roughened metal interface

Metals and polymers are extensively used in microelectronics packaging where they are joined together. Since both the yield and reliability of packages are strongly affected by the interfacial adhesion between polymers and metals, extensive studies have been performed in order to improve the resistance to debonding of many resulting interfaces. In the present work, the interfacial fracture energy of representative polymer/metal interfaces commonly encountered in micoroelectronics packaging was characterized. A copper-based alloy leadframe was used as the metal and an epoxy molding compound (EMC) was used as the polymer. The leadframe surfaces were roughened by chemical oxidation in a hot alkaline solution and molded with the EMC. In general, roughening of metal surfaces enhances their adhesion to polymers by mechanical interlocking, yet often produces a cohesive failure in the polymer. Sandwiched double-cantilever beam (SDCB) specimens were employed to measure the adhesion strength in terms of interfacial fracture energy. After the adhesion test, the microstructures of metal surfaces before molding with the EMC were correlated to the adhesion strength, and the fracture surfaces were analyzed using various techniques to determine the failure path.     

环氧化硅油改性邻甲酚醛环氧树脂的研究

采用侧基环氧化硅油(ES)及其改性物(PSA)改性邻甲酚醛环氧树脂(ECN),制备出一系列可用于电子封装等具有高韧性高耐热性的环氧基料。通过对固化物的冲击强度、拉伸强度、断裂伸长率和玻璃化转变温度(Tg)以及断裂面形态的测定,探讨了改性方法、有机硅组成与含量等对改性材料性能的影响。结果表明,用有机硅改性ECN后,其韧性和耐热性均有不同程度的提高,且环氧值高的ES和PSA的改性效果较好。其中环氧树脂经10份(质量份数,下同)ES-16或10份PSA-16改性后,韧性和耐热性均提高,符合电子封装等材料的改性要求,后者的耐热效果更为显著,Tg达183.46℃,比未改性环氧树脂提高了近20℃。     

环氧灌封材料的阻燃研究动态

介绍了国内外环氧灌封材料的生产现状及其在电子封装业中的发展前景,并概述了对现代电子封装材料的环保新要求及电子封装无卤化阻燃对环氧树脂提出的挑战。