Lateral schottky GaN rectifiers formed by Si<Superscript>+</Superscript> ion implantation

Type conversion of p-GaN by direct Si⁺ ion implantation and subsequent annealing was demonstrated by the fabrication of lateral Schottky diodes. The Si⁺ activation percentage was measured as a function of annealing time (30–300 sec) and temperature (1,000–1,200°C), reaching a maximum of ∼30% for 1,200°C, 2-min anneals. The resulting n-type carrier concentration was 1.1×10¹⁸ cm⁻³ for a moderate Si⁺ ion dose of ∼2×10¹⁴ cm⁻². The lateral Schottky diodes displayed a negative temperature coefficient of −0.15 V·K for reverse breakdown voltage.     

A study of chemical beam epitaxy of GaAs using tris-dimethylaminoarsenic

The growth of GaAs by chemical beam epitaxy using triethylgallium and trisdimethylaminoarsenic has been studied. Reflection high-energy electron diffraction (RHEED) measurements were used to investigate the growth behavior of GaAs over a wide temperature range of 300–550°C. Both group III- and group Vinduced RHEED intensity oscillations were observed, and actual V/III incorporation ratios on the substrate surface were established. Thick GaAs epitaxial layers (2–3 μm) were grown at different substrate temperatures and V/III ratios, and were characterized by the standard van der Pauw-Hall effect measurement and secondary ion mass spectroscopy analysis. The samples grown at substrate temperatures above 490°C showed n-type conduction, while those grown at substrate temperatures below 480°C showed p-type conduction. At a substrate temperature between 490 and 510°C and a V/III ratio of about 1.6, the unintentional doping concentration is n ∼2 × 10¹⁵ cm⁻³ with an electron mobility of 5700 cm²/V·s at 300K and 40000 cm²/V·s at 77K.     

Hot-implantation of nitrogen donors into p- type α-SiC and characterization of n+-p junction

N⁺ implantation into p-type a-SiC (6H-SiC, 4H-SiC) epilayers at elevated temperatures was investigated and compared with implantation at room temperature (RT). When the implant dose exceeded 4 × 10₁₅ cm₋₂, a complete amorphous layer was formed in RT implantation and severe damage remained even after post implantation annealing at 1500°C. By employing hot implantation at 500~800°C, the formation of a complete amorphous layer was suppressed and the residual damage after annealing was significantly reduced. For implant doses higher than 10¹⁵ cm⁻², the sheet resistance of implanted layers was much reduced by hot implantation. The lowest sheet resistance of 542Ω/ was obtained by implantation at 500 ~ 800°C with a 4 × 10¹⁵ cm⁻² dose. Characterization of n⁺-p junctions fabricated by N⁺ implantation into p-type epilayers was carried out in detail. The net doping concentration in the region close to the junction showed a linearly graded profile. The forward current was clearly divided into two components of diffusion and recombination. A high breakdown voltage of 615 ∼ 810V, that is almost an ideal value, was obtained, even if the implant dose exceeded 10¹⁵ cm⁻². By employing hot implantation at 800°C, the reverse leakage current was significantly reduced.     

Temperature-Dependent Studies of Si-Implanted Al<Subscript>0.33</Subscript>Ga<Subscript>0.67</Subscript>N with Different Annealing Temperatures and Times

Electrical activation studies were carried out on Si-implanted Al_0.33Ga_0.67N as a function of ion dose, annealing temperature, and annealing time. The samples were implanted at room temperature with Si ions at 200 keV in doses ranging from 1 × 10¹⁴ cm⁻² to 1 × 10¹⁵ cm⁻², and subsequently proximity-cap annealed from 1150°C to 1350°C for 20 min to 60 min in a nitrogen environment. One hundred percent electrical activation efficiency was obtained for Al_0.33Ga_0.67N samples implanted with a dose of 1 × 10¹⁵ cm⁻² after annealing at either 1200°C for 40 min or at 1300°C for 20 min. The samples implanted with doses of 1 × 10¹⁴ cm⁻² and 5 × 10¹⁴ cm⁻² exhibited significant activations of 74% and 90% after annealing for 20 min at 1300°C and 1350°C, respectively. The mobility increased as the annealing temperature increased from 1150°C to 1350°C, showing peak mobilities of 80 cm²/V s, 64 cm²/V s, and 61 cm²/V s for doses of 1 × 10¹⁴ cm⁻², 5 × 10¹⁴ cm⁻², and 1 × 10¹⁵ cm⁻², respectively. Temperature-dependent Hall-effect measurements showed that most of the implanted layers were degenerately doped. Cathodoluminescence measurements for all samples exhibited a sharp neutral donor-bound exciton peak at 4.08 eV, indicating excellent recovery of damage caused by ion implantation.     

Halogen lamp rapid thermal annealing of Si- and Be-implanted In0.53Ga0.47As

Halogen lamp rapid thermal annealing was used to activate 100 keV Si and 50 keV Be implants in In_0.53Ga_0.47As for doses ranging between 5 × 10¹²−4 × 10¹⁴ cm⁻². Anneals were performed at different temperatures and time durations. Close to one hundred percent activation was obtained for the 4.1 × 10¹³ cm⁻² Si-implant, using an 850° C/5 s anneal. Si in-diffusion was not observed for the rapid thermal annealing temperatures and times used in this study. For the 5 × 10¹³ cm⁻² Be-implant, a maximum activation of 56% was measured. Be-implant depth profiles matched closely with gaussian profiles predicted by LSS theory for the 800° C/5 s anneals. Peak carrier concentrations of 1.7 × 10¹⁹ and 4 × 10¹⁸ cm⁻³ were achieved for the 4 × 10¹⁴ cm⁻² Si and Be implants, respectively. For comparison, furnace anneals were also performed for all doses.     

Control of emission wavelength for InGaAs/GaAs quantum wells and laser structures on their basis by means of proton irradiation

Features of controlling the wavelength of emission from laser heterostructures with strained InGaAs/GaAs quantum wells by irradiation with medium-energy (with the energy as high as 150 keV) protons are studied. It is established that irradiation with H⁺ ions and subsequent thermal annealing at a temperature of 700°C make it possible to decrease the wavelength of emission from quantum wells. As the dose of ions is increased from 10¹³ to 10¹⁶ cm⁻², the magnitude of change in the wavelength increases to 20 nm. Starting with a dose of 10¹⁵ cm⁻², a significant decrease in the intensity of emission is observed. The optimum dose of H⁺ ions (6 × 10¹⁴ cm⁻²) and annealing temperature (700°C) for modifying the InGaAs/GaAs/InGaP laser structures are determined; it is shown that, in this case, one can obtain a shift of ∼(8–10) nm for the wavelength of laser radiation with low losses in intensity with the quality of the surface of laser structures retained. The observed “blue” shift is caused by implantation-stimulated processes of intermixing of the In and Ga atoms at the InGaAs/GaAs interface.     

MeV energy sulfur implantation in GaAs and InP

Room temperature and elevated temperature sulfur implants were performed into semi-insulating GaAs and InP at variable energies and fluences. The implantations were performed in the energy range 1–16 MeV. Range statistics of sulfur in InP and GaAs were calculated from the secondary ion mass spectrometry atomic concentration depth profiles and were compared with TRIM92 values. Slight in-diffusion of sulfur was observed in both InP and GaAs at higher annealing temperatures for room temperature implants. Little or no redistribution of sulfur was observed for elevated temperature implants. Elevated temperature implants showed higher activations and higher mobilities compared to room temperature implants in both GaAs and InP after annealing. Higher peak electron concentrations were observed in sulfur-implanted InP (n ≈ 1 × 10¹⁹ cm⁻³) compared to GaAs (n ≈ 2 × 10¹⁸ cm⁻³). The doping profile for a buried n⁺ layer (n ≈ 3.5 × 10¹⁸ cm⁻³) of a positive-intrinsic-negative diode in GaAs was produced by using Si/S coimplantation.     

Nearly Perfect Electrical Activation Efficiencies from Silicon-Implanted Al<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Ga<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>N with High Aluminum Mole Fraction

Electrical activation studies of Al _x Ga_1−x N (x = 0.45 and 0.51) implanted with Si for n-type conductivity have been made as a function of ion dose and anneal temperature. Silicon ions were implanted at 200 keV with doses ranging from 1 × 10¹⁴ cm⁻² to 1 × 10¹⁵ cm⁻² at room temperature. The samples were subsequently annealed from 1150°C to 1350°C for 20 min in a nitrogen environment. Nearly 100% electrical activation efficiency was successfully obtained for the Si-implanted Al_0.45Ga_0.55N samples after annealing at 1350°C for doses of 1 × 10¹⁴ cm⁻² and 5 × 10¹⁴ cm⁻² and at 1200°C for a dose of 1 × 10¹⁵ cm⁻², and for the Al_0.51Ga_0.49N implanted with silicon doses of 1 × 10¹⁴ cm⁻² and 5 × 10¹⁴ cm⁻² after annealing at 1300°C. The highest room-temperature mobility obtained was 61 cm²/V s and 55 cm²/V s for the low-dose implanted Al_0.45Ga_0.55N and Al_0.51Ga_0.49N, respectively, after annealing at 1350°C for 20 min. These results show unprecedented activation efficiencies for Al _x Ga_1−x N with high Al mole fractions and provide suitable annealing conditions for Al _x Ga_1−x N-based device applications.     

Characterization of phosphorus implantation in 4H-SiC

We report the characterization of phosphorus implantation in 4H-SiC. The implanted layers are characterized by analytical techniques (secondary ion mass spectrometry, transmission electron microscopy) as well as electrical and a sheet resistance value as low as 160 Ω/□ has been measured. We have also studied the effect of annealing time and temperature on activation of phosphorus implants. It has been shown to possible to obtain low sheet resistance (∼260 Ω/□) by annealing at a temperature as low as 1200°C. High-dose (∼ 4 × 10¹⁵ cm⁻²) implants are found to have a higher sheet resistance than that on lower dose implants which is attributed to the near-surface depletion of the dopant during high temperature anneal. Different implantation dosages were utilized for the experiments and subsequently junction rectifiers were fabricated. Forward characteristics of these diodes are observed to obey a generalized Sah-Noyce-Shockly multiple level recombination model with four shallow levels and one deep level.     

Low-temperature processing of antimony-implanted silicon

It is shown for the first time that antimony-implanted silicon produces the highest electrical activation (90%) with low resistivity (<200 ohms/square) following low-temperature processing. Thus, annealing at 650°C produces the best results for antimony, whereas for arsenic, it is necessary to anneal at temperatures above 1000°C to get optimum results. Silicon was implanted with antimony at 12 keV and 40 keV and doses of 8.5×10¹⁴ cm⁻² and 4×10¹⁴ cm⁻², respectively, and arsenic at equivalent energies and doses. The electrical data from both implants are compared in order to identify the process conditions require to obtain optimum results. It is demonstrated that annealing below 800°C produces electrical profiles with no measurable diffusion of the antimony, but higher temperature anneals produce significant diffusional broadening.     

Rapid thermal annealing of dual Si and P implants in InP

In this study we evaluate the effects of dual implantation with different doses of Si and P on dopant activation efficiency and carrier mobility in InP:Fe. The implants were activated by a rapid thermal annealing step carried out in an optimized phosphoruscontaining ambient. For high dose implants (10¹⁴–10¹⁵ cm⁻²), which are typically employed for source/drain regions in FETs, dual implantation of equal doses of Si and P results in a higher sheet carrier concentration and lower sheet resistance. For 10¹⁴ cm⁻² Si implants at 150 keV, the optimal P co-implant dose is equal to the Si dose for most anneal temperatures. We obtain an activation efficiency of ∼70% for dual implanted samples annealed at 850° C for 10 sec. The high activation efficiencies and low sheet resistances obtained in this study emphasize the importance of stoichiometry control through the use of P co-implants and a phosphorus-containing ambient during the thermal processing of InP.     

Correlation of arsenic incorporation and its electrical activation in MBE HgCdTe

The behavior of arsenic for p-type doping of MBE HgCdTe layers has been studied for various annealing temperatures and arsenic doping concentrations. We have demonstrated that arsenic is in-situ incorporated into HgCdTe layers during MBE growth. The carrier concentration has been measured by the Van der Pauw technique, and the total arsenic concentration has been determined by secondary ion mass spectroscopy. After annealing at 250°C under an Hg over pressure, As-doped HgCdTe layers show highly compensated n-type properties and the carrier concentration is approximately constant (∼mid 10¹⁵ cm⁻³) until the total arsenic concentration in the HgCdTe layers approach mid 10¹⁷ cm⁻³. The source of n-type behavior does not appear to be associated with arsenic dopants, such as arsenic atoms occupying Hg vacancy sites, but rather unidentified structural defects acting as donors. When the total arsenic concentration is above mid 10¹⁷ cm⁻³, the carrier concentration shows a dependence on the arsenic concentration while remaining n-type. We conjecture that the increase in n-type behavior may be due to donor arsenic tetramers or donor tetramer clusters. Above a total arsenic concentration of 1∼2×10¹⁸ cm⁻³, after annealing at 300°C, the arsenic acceptor activation ratio rapidly decreases below 100% with increasing arsenic concentration and is smaller than that after annealing at 450°C. The electrically inactive arsenic is inferred to be in the form of neutral arsenic tetramer clusters incorporated during the MBE growth. Annealing at 450°C appears to supply enough thermal energy to break some of the bonds of neutral arsenic tetramer clusters so that the separated arsenic atoms could occupy Te sites and behave as acceptors. However, the number of arsenic atoms on Te sites is saturated at ∼2×10¹⁸ cm⁻³, possibly due to a limitation of its solid solubility in HgCdTe.     

Activation of silicon ion-implanted gallium nitride by furnace annealing

Ion implantation into III–V nitride materials is animportant technology for high-power and high-temperature digital and monolithic microwave integrated circuits. We report the results of the electrical, optical, and surface morphology of Si ion-implanted GaN films using furnace annealing. We demonstrate high sheet-carrier densities for relatively low-dose (n_atoms=5×10¹⁴ cm⁻²) Si implants into AlN/GaN/sapphire heteroepitaxial films. The samples that were annealed at 1150°C in N₂ for 5 min exhibited a smooth surface morphology and a sheet electron concentration n_s ∼9.0×10¹³ cm⁻², corresponding to an estimated 19% electrical activation and a 38% Si donor activation in GaN films grown on sapphire substrates. Variable-temperature Hall-effect measurem entsindicate a Si donor ionization energy ∼15 meV.     

Strain evolution and dopant activation in P-lmplanted metastable pseudomorphic Si(100)/Ge0.12Si0.88

A metastable Ge_0.12Si_0.88 layer 265 nm thick was deposited pseudomorphically on a Si(100) substrate and then implanted with 100 keV phosphorus ions at room temperature for doses of 5 × 10¹³/cm² to 1.5 × 10¹⁵/cm². The ions stop within the epilayer (projected range ∼125 nm). MeV⁴He backscattering/channeling spectrometry, transmission electron microscopy, and double-crystal x-ray diffractometry were used to characterize the damage and strain in the films. The samples were subsequently annealed in high vacuum from 400-800°C for 30 min at each temperature. For the nonamorphized samples (doses of 5 and 10 × 10¹³/cm²), most of the implantation-induced damage and strain disappear after annealing at 400-550°C, but the implanted P ions activate poorly. After annealing at 700-800°C, near complete activation is achieved but the strain relaxes. For the amorphized samples (dose of 1.5 × 10¹⁵/cm²), the amorphous GeSi regrows by solid-phase epitaxy and the dopants are ∼100% activated after annealing at 550°C, but the regrown GeSi relaxes with a high density of dislocations. The strain relaxes more extensively upon annealing in an implanted sample than in a nonimplanted one, other conditions being equal. This effect is more pronounced at higher ion doses, probably due to the increased amount of damage introduced at high doses. On leave from Yonsei University, Seoul 120-749, Korea     

Analysis of ion beam induced damage and amorphization of 6H-SiC by raman scattering

Raman scattering analysis of damaged SiC layers obtained by 200 keV Ge⁺ ion implantation into 6H-SiC has been performed as a function of the implanted dose (up to 10¹⁵ cm⁻²) and annealing temperature (up to 1500°C). The results obtained show the presence of three different damage levels: low damage level (doses ≤3 × 10¹² cm⁻²), medium to high damage level (doses between 10¹³ and 10¹⁴ cm^-2), and formation of a continuous amorphous layer for doses higher than the amorphization threshold of 2–3 × 10¹⁴ cm⁻². Moreover, at doses of about 10¹⁴ cm⁻² (below the amorphization threshold) amorphous domains are already observed. The Raman spectra indicate the existence of structural differences between the amorphous phase at doses below and above the threshold. After annealing, there is a residual damage which cannot be removed even at the highest annealing temperature of 1500°C. Differences in residual damage between the samples implanted at doses of 10¹⁴ and 10¹⁵ cm^-2 and annealed at the highest temperatures are observed from the peaks in the 1000–1850 cm^-1 spectral region. Finally, annealing at the highest temperature is required to observe the complete disappearance of the amorphous bands.     

Effect of annealing temperature on 1.5 μm photoluminescence from Er-lmplanted 6H-SiC

The effect of post-implantation anneal on erbium-doped 6H-SiC has been investigated. 6H-SiC has been implanted with 330 keV Er⁺ at a dose of 1 × 1013 /cm2. Er depth profiles were obtained by secondary ion mass spectrometry (SIMS). The as-implanted Er-profile had a peak concentration of∼1.3 × 10¹⁸/cm³ at a depth of 770Å. The samples were annealed in Ar at temperatures from 1200 to 1900°C. The photoluminescence intensity integrated over the 1.5 to 1.6 μm region is essentially independent of annealing temperature from 1400 to 1900°C. Reduced, but still significant PL intensity, was measured from the sample annealed at 1200°C. The approximate diffusivity of Er in 6H SiC was calculated from the SIMS profiles, yielding values from 4.5 × 10⁻¹⁶ cm²/s at 1200°C to 5.5 × 10⁻¹⁵ cm²/s at 1900°C.     

Rapid capless annealing of28Si,64Zn,and9Be implants in GaAs

We report the use of tungsten-halogen lamps for rapid (−10 s) thermal annealing of ion-implanted (100) GaAs under AsH₃/Ar and N₂ atmospheres. Annealing under flowing AsH₃/Ar was carried out without wafer encapsulation. Rapid capless annealing activated implants in GaAs with good mobility and surface morphology. Typical mobilities were 3700–4500 cm²/V-s for n-layers with about 2×10¹⁷cm⁻³ carrier concentration and 50–150 cm²/v-s for 0.1–5xl0¹⁹ cm⁻³ doped p-layers. Rapid thermal annealing was performed in a vertical quartz tube where different gases (N₂, AsH₃/H₂, AsH₃/Ar) can be introduced. Samples were encapsulated with SiO when N₂ was used. Tungsten-halogen lamps of 600 or 1000 W were utilized for annealing GaAs wafers ranging from 1 to 10 cm² in area and 0.025 to 0.040 cm in thickness. The transient temperature at the wafer position was monitored using a fine thermocouple. We carried out experiments for energies of 30 to 200 keV, doses of 2×10¹² to 1×10¹⁵ cm⁻², and peak temperatures ranging from 600 to 1000‡C. Most results quoted are in the 700 to 870‡C temperature range. Data on implant conditions, optimum anneal conditions, electrical characteristics, carrier concentration profiles, and atomic profiles of the implanted layers are described. Presented at the 25th Electronic Materials Conference, Burlington, VT, June 22, 1983.     

Acceptor and donor doping of AlxGa1−xN thin film alloys grown on 6H-SiC(0001) substrates via metalorganic vapor phase epitaxy

Thin films of Si-doped Al_xGa_1−xN (0.03≤x≤0.58) having smooth surfaces and strong near-band edge cathodoluminescence were deposited at 0.35–0.5 μm/h on on-axis 6H-SiC(0001) substrates at 1100°C using a 0.1 μm AlN buffer layer for electrical isolation. Alloy films having the compositions of Al_0.08Ga_0.92N and Al_0.48Ga_0.52N exhibited mobilities of 110 and 14 cm²/V·s at carrier concentrations of 9.6×10¹⁸ and 5.0×10¹⁷ cm⁻³, respectively. This marked change was due primarily to charge scattering as a result of the increasing Al concentration in these random alloys. Comparably doped GaN films grown under similar conditions had mobilities between 170 and ∼350 cm²/V·s. Acceptor doping of Al_xGa_1−xN for x≤0.13 was achieved for films deposited at 1100°C. No correlation between the O concentration and p-type electrical behavior was observed.     

Doping of 3C-SiC by implantation of nitrogen at high temperatures

Doping profiles and electrical properties are investigated on SiC samples doped with single energy implants from nitrogen. The profiles are analyzed using Pearson distributions for different implantation energies and temperatures. Implantations are performed for temperatures up to 1200°C. Diffusion during high temperature implantation is investigated and the diffusion coefficients measured range from 1.09 × 10⁻¹⁵ to 1.53 × 10⁻¹⁴cm²/s depending on temperature. The activation energy for implantation enhanced diffusion is estimated to be 0.91 eV. A comparison is made with diffusion during annealing. The activated dopants from high temperature implantation are investigated by the Hall probe method, showing that activation and mobility increase with temperature.     

Defects in annealed 1.5 MeV boron implanted p-type silicon

Effects of temperature and dosage on the evolution of extended defects during annealing of MeV ion-implanted Czochralski (CZ) p-type (001) silicon have been studied using transmission electron microcopy. Excess interstitials generated in a 1 10¹⁵ cm⁻²/1.5 MeV B⁺ implanted Si have been found to transform into extended interstitial {311} defects upon rapid thermal annealing at 800°C for 15 sec. During prolonged furnace annealing at 960°C for 1 h, some of the {311} defects grow longer at the expense of the smaller ones, and the average width of the defects seems to decrease at the same time. Formation of stable dislocation loops appears to occur only above a certain threshold annealing temperature (∼1000°C). The leakage current in diodes fabricated on 1.5 MeV B⁺ implanted wafers was found to be higher for a dosage of 1 10¹⁴cm⁻² and less, as compared to those fabricated with a dosage of 5 10¹⁴ cm⁻² and more. The difference in the observed leakage current has been attributed to the presence of dislocations in the active device region of the wafers that were implanted with the lower dosage.