无源UHFRFID标签芯片基带处理器的低功耗设计

在分析ISO18000-6C标准内容的基础上,提出了一种基带处理器的结构,设计了一款符合ISO18000-6C标准的UHF RFID标签芯片的基带处理器。该基带处理器可支持协议规定的所有强制命令。设计通过降低工作电压、降低工作频率、使用门控时钟、增加功耗管理模块等一系列低功耗设计以降低处理器的功率消耗。在Xillinx的Virtex-4FPGA上验证满足协议功能要求,并在工作电压为1V,时钟为1.92MHz时,功耗仿真结果为9.9μW,很好的完成了低功耗电子标签的基带处理器设计。     

基于BLF时钟的RFID低功耗数字基带设计

提出了一种符合ISO/IEC 18000-6C协议中关于时序规定的射频识别(RFID)无源标签芯片低功耗数字基带处理器的设计.基于采用模拟前端反向散射链路频率(BLF)时钟的方案,将BLF的二倍频设置为基带中的全局时钟,构建BLF和基带数据处理速率之间的联系;同时在设计中采用门控时钟和行波计数器代替传统计数器等低功耗策略.芯片经TSMC 0.18 μmCMOS混合信号工艺流片,实测结果表明,采用该设计的标签最远识别距离为7 m,数字基带动态功耗明显降低,且更加符合RFID协议的要求.     

A low-power high-performance SiGe BiCMOS 802.11a/b/g transceiver IC for cellular and bluetooth Co-existence applications

This paper describes a high-performance WLAN 802.11a/b/g radio transceiver, optimized for low-power in mobile applications, and for co-existence with cellular and Bluetooth systems in the same terminal. The direct-conversion transceiver architecture is optimized in each mode for low-power operation without compromising the challenging RF performance targets. A key transceiver requirement is a sensitivity of -77 dBm (at the LNA input) in 54 Mb/s OFDM mode while in the presence of a GSM1900 transmitter interferer. The receiver chain achieves an overall noise figure of 2.8/3.2 dB, consuming 168/185 mW at 2.8 V for the 2.4/5GHz bands, respectively. Signal loopback and transmit power detection techniques are used in conjunction with the baseband modem processor to calibrate the transmitter LO leakage and the transceiver I/Q imbalances. Fabricated in a 70 GHz f/sub T/ 0.25-/spl mu/m SiGe BiCMOS technology for system-in-package (SiP) use, the dual-band, tri-mode transceiver occupies only 4.6 mm/sup 2/.     

Design of a 1.7-GHz low-power delay-fault-testable 32-b ALU in 180-nm CMOS technology

In this paper, we present the design of a 32-b arithmetic and log unit (ALU) that allows low-power operation while supporting a design-for-test (DFT) scheme for delay-fault testability. The low-power techniques allow for 18% reduction in ALU total energy for 180-nm bulk CMOS technology with minimal performance degradation. In addition, there is a 22% reduction in standby mode leakage power and 23% lower peak current demand. In the test mode, we employ a built-in DFT scheme that can detect delay faults while reducing the test-mode automatic test equipment clock frequency.     

KISS-16V2: a one-chip ASIC DSP solution for GSM

Outlines the requirements for the various digital signal processing functions of the pan-European digital mobile cellular telephone system in terms of computational power and RAM and ROM capacities, and describes a digital signal processor (DSP) solution which is able to integrate all of these digital baseband functions for a hand-held terminal onto one VLSI chip. The KISS-16V2 processor, a low-power CMOS 16-b DSP, is optimized for digital telecommunications, especially for Groupe Speciale Mobile (GSM). A power-down mode together with the capability of memory and multiplier standby operation make this DSP well suited for handheld devices. A design strategy based on the extensive use of cell compilers and synthesis tools reduces the design of further DSP derivations to a minimum.<>     

超高频RFID读写器基带处理器的设计

为实现单芯片的超高频读写器,提出了一种读写器基带处理器的设计方案.设计采用了微处理器IP核在AFS600上搭建一个读写器数字基带,在原本不支持调试模式的微处理器上扩展了片上调试功能,为集成开发环境Keil开发出动态链接库实现了对数字基带的在线调试.为实现ISO/IEC 18000-6C协议,用硬件实现了收发通路原型,并在AFS600平台上完成了FPGA验证.设计采用TSMC 0.25 μm Embedded Flash工艺完成了芯片的版图设计.该基带处理器实现了读写器基带和标签的正常通信,为最终实现单芯片读写器创造了条件.     

Efficiency of body biasing in 90-nm CMOS for low-power digital circuits

The efficiency of body biasing for leakage reduction and performance improvement in a 90-nm CMOS low-power technology with triple-well option is evaluated. Static measurements of single devices and dynamic measurements of ring oscillators and 32-b parallel prefix adders are presented. Whereas forward biasing still provides a significant performance improvement of up to 37% for low-leakage devices with 2.2-nm gate oxide thickness, the application of reverse biasing to reduce subthreshold leakage currents is inefficient due to additional leakage currents such as gate leakage and gate-induced drain leakage. Experimental results confirm that, in 90-nm CMOS circuits, the efficiency of body biasing strongly depends on the device type and operating temperature. Moreover, the impact of the zero-temperature coefficient point on static device and dynamic circuit performance is investigated.     

Low-voltage swing logic circuits for a Pentium/spl reg/ 4 processor integer core

The Pentium/spl reg/ 4 processor architecture uses a 2/spl times/ frequency core clock to implement low latency integer operations. Low-voltage-swing (LVS) logic circuits implemented in 90-nm technology meet the frequency demands of a third-generation integer-core design.     

Overview of the architecture, circuit design, and physical implementation of a first-generation cell processor

This paper reviews the design challenges that current and future processors must face, with stringent power limits, high-frequency targets, and the continuing system integration trends. This paper then describes the architecture, circuit design, and physical implementation of a first-generation Cell processor and the design techniques used to overcome the above challenges. A Cell processor consists of a 64-bit Power Architecture processor coupled with multiple synergistic processors, a flexible IO interface, and a memory interface controller that supports multiple operating systems including Linux. This multi-core SoC, implemented in 90-nm SOI technology, achieved a high clock rate by maximizing custom circuit design while maintaining reasonable complexity through design modularity and reuse.     

An 80/20-MHz 160-mW multimedia processor integrated with embeddedDRAM, MPEG-4 accelerator and 3-D rendering engine for mobileapplications

A low-power multimedia processor for mobile applications is presented. An 80-MHz 32-b RISC with enhanced multiplier, two 20-MHz hardware accelerators with 7.125-Mb embedded DRAM for MPEG-4 visual SP@L1 decoding and 3-D graphics processing, 2-kB dual-port SRAM, and peripheral blocks are integrated together on a single chip, MPEG-4 SP@L1 video decoding and 3-D graphics rendering with a 16-b depth-buffer alpha-blending double-buffering and gouraud-shading features at 2, 2-Mpolygons/s speed are realized with the help of the dedicated hardware accelerators/ The architecture of the processor is optimized in terms of power consumption and performance, and various low-power circuit techniques are adopted in each hardware block. The chip is implemented using 0.18-μm embedded memory logic (EML) technology. Its area is 84 mm², and power consumption is 160 mW when all of the functions are activated     

GNSS接收机基带处理电路低功耗设计综述

通过时GNSS接收机基带处理电路低功耗设计技术进行调研和总结,发现大部分技术可归属于两个层次：电路级优化技术和算法级优化技术。电路级优化技术主要包括低功耗的并行相关器的设计、多通道的时分复用、多普勒补偿后的信号下采样、低功耗累加器的使用等技术;算法级优化技术是指接收机的间歇工作方式（在不需要定位输出时,使接收机运行在低功耗模式）,主要通过接收机的高级电源管理系统、快速首次定位、重新捕获定位等技术实现。本文对这些方法进行了总结和对比,给出了两个层次优化技术的优缺点。     

All-digital TX frequency synthesizer and discrete-time receiver for Bluetooth radio in 130-nm CMOS

We present a single-chip fully compliant Bluetooth radio fabricated in a digital 130-nm CMOS process. The transceiver is architectured from the ground up to be compatible with digital deep-submicron CMOS processes and be readily integrated with a digital baseband and application processor. The conventional RF frequency synthesizer architecture, based on the voltage-controlled oscillator and the phase/frequency detector and charge-pump combination, has been replaced with a digitally controlled oscillator and a time-to-digital converter, respectively. The transmitter architecture takes advantage of the wideband frequency modulation capability of the all-digital phase-locked loop with built-in automatic compensation to ensure modulation accuracy. The receiver employs a discrete-time architecture in which the RF signal is directly sampled and processed using analog and digital signal processing techniques. The complete chip also integrates power management functions and a digital baseband processor. Application of the presented ideas has resulted in significant area and power savings while producing structures that are amenable to migration to more advanced deep-submicron processes, as they become available. The entire IC occupies 10 mm/sup 2/ and consumes 28 mA during transmit and 41 mA during receive at 1.5-V supply.     

A 2/spl times/ load/store pipe for a low-power 1-GHz embedded processor

The load/store pipe for a low-power 1-GHz embedded processor is described. For area savings and logic complexity reduction, the load/store pipe is clocked at twice the frequency of the processor core. It can sustain two load or store operations per core clock cycle with zero load to use issue latency. The address generation unit for one of the two load/store pipes takes advantage of the common addressing mode in MIPS 64 ISA to generate the address within a core clock phase. Phase borrowing is employed in the translation lookaside buffer (TLB) design to enable a lookup process within a core clock phase. The data cache design enables the activation of a minimum number of data bank arrays for power savings. Small-swing differential buses are used for multiple address and data buses for improved signal transmission latency. The quadrature clocks used to derive the 2/spl times/ clock are generated with a novel 4-to-1 divider and distributed with matched paths, all to reduce the duty cycle variation of the 2/spl times/ clock phase. The design has been implemented in a 0.13-/spl mu/m CMOS process.     

A Low-Spurious Low-Power 12-bit 160-MS/s DAC in 90-nm CMOS for Baseband Wireless Transmitter

A low-spurious low-power 12-bit 160-MS/s digital to analog converter (DAC) for baseband wireless transmitter is proposed and demonstrated. Degenerated current switches are introduced and benefits of using them are discussed. Mismatch behavior under packaging-induced die stress is also presented. The mobility shift caused by package stress inherited from a thin-die is a dominant source of I/Q mismatch. A 2-channel I/Q DAC core consumes 4 mA with a 1.3/2.6 V dual supply. The 0.13 mm² I/Q DAC core fabricated in 90-nm digital CMOS process with a highly-integrated digital processor achieves 74 dB SFDR, 55 dB SNDR, and -73 dB THD for a 975 kHz sinusoid at 153.6 MS/s sample rate     

An Adaptively Dividable Dual-Port BiTCAM for Virus-Detection Processors in Mobile Devices

Network security for mobile devices is in high demand because of the increasing virus count. Since mobile devices have limited CPU power, dedicated hardware is essential to provide sufficient virus detection performance. A TCAM-based virus-detection unit provides high throughput, but also challenges for low power and low cost. In this paper, an adaptively dividable dual-port BiTCAM (unifying binary and ternary CAMs) is proposed to achieve a high-throughput, low-power, and low-cost virus-detection processor for mobile devices. The proposed dual-port BiTCAM is realized with the dual-port AND-type match-line scheme which is composed of dual-port dynamic AND gates. The dual-port designs reduce power consumption and increase storage efficiency due to shared storage spaces. In addition, the dividable BiTCAM provides high flexibility for regularly updating the virus-database. The BiTCAM achieves a 48% power reduction and a 40% transistor count reduction compared with the design using a conventional single-port TCAM. The implemented 0.13 mum processor performs up to 3 Gbps virus detection with an energy consumption of 0.44 fJ/pattern-byte/scan at peak throughput.     

The Circuits and Robust Design Methodology of the Massively Parallel Processor Based on the Matrix Architecture

Novel circuits and design methodology of the massively parallel processor based on the matrix architecture are introduced. A fine-grained processing elements (PE) circuit for high-throughput MAC operations based on the Booth's algorithm enhances the performance of a 16-bit fixed-point signed MAC, which operates up to 30.0GOPS/W. The dedicated I/O interface circuits are designed for converting the direction of data access and supporting the interleaved memory architecture, and they are implemented for maximizing the processor core efficiency. Power management techniques for suppressing current peaks and reducing average power consumption are proposed to enhance the robustness of the macro. The circuits and the design methodology proposal in this paper are attractive for achieving a high performance and robust massively parallel SIMD processor core employed in multimedia SoCs     

A 125 μW , Fully Scalable MPEG-2 and H.264/AVC Video Decoder for Mobile Applications

A low-power dual-standard video decoder has been developed for mobile applications. It supports MPEG-2 SP@ML and H.264/AVC BL@L4 video decoding in a single chip and features a scalable architecture to reach area/power efficiency. This chip integrates diverse algorithms of MPEG-2 and H.264/AVC to reduce silicon area. Three low-power techniques are proposed. First, a domain-pipelined scalability (DPS) technique is used to optimize the pipelined structure according to the number of processing cycles. Second, bandwidth scalability is implemented via a line-pixel-lookahead (LPL) scheme to improve the external bandwidth and reduce the internal memory size, leading to 51% of memory power reduction compared to a conventional design. Third, low-power motion compensation and deblocking filter are designed to reduce the operating frequency without degrading system performance. A test chip is fabricated in a 0.18mum one-poly six-metal CMOS technology with an area of 15.21 mm². For mobile applications, H.264/AVC and MPEG-2 video decoding of quarter-common intermediate format (QCIF) sequences at 15 frames per second are achieved at 1.15 MHz clock frequency with power dissipation of 125 muW and 108 muW, respectively, at 1V supply voltage     

Low-Power 32-bit Dual-MAC 120 $mu$W/MHz 1.0 V icyflex1 DSP/MCU Core

A low-power programmable processor named icyflex1 was designed combining features of a digital signal processor (DSP) and a micro-controller unit (MCU). Implemented as a synthesizable VHDL software intellectual property core, the processor implements a broad range of power saving features including its customizable architecture and reconfigurable instruction set. Its performance is compared with other processors from the market and values are given for its integration in a 180 nm technology. The processor targets applications with tight power consumption constraints and correspondingly significant processing performance.      

System-level power consumption modeling and tradeoff analysistechniques for superscalar processor design

This paper presents systematic techniques to find low-power high-performance superscalar processors tailored to specific user applications. The model of power is novel because it separates power into architectural and technology components. The architectural component is found via trace-driven simulation, which also produces performance estimates. An example technology model is presented that estimates the technology component, along with critical delay time and real estate usage. This model is based on case studies of actual designs. It is used to solve an important problem: decreasing power consumption in a superscalar processor without greatly impacting performance. Results are presented from runs using simulated annealing to reduce power consumption subject to performance reduction bounds. The major contributions of this paper are the separation of architectural and technology components of dynamic power the use of trace-driven simulation for architectural power measurement, and the use of a near-optimal search to tailor a processor design to a benchmark     

High-efficiency multiple-output DC-DC conversion for low-voltagesystems

This versatile power converter controller provides dual outputs at a fixed switching frequency and can regulate either output voltage or target system delay (using an external L-C filter). In the voltage regulation mode, the output voltage is monitored with an analog-digital (A/D) converter, and the feedback compensation network is implemented digitally. The generation of the pulsewidth modulation (PWM) signal is done with a hybrid delay line/counter approach, which saves power and area relative to previous implementations. Power devices are included on chip to create the two independently regulated output PWM signals. The key features of this design are its low-power dissipation, reconfigurability, use of either delay or voltage feedback, and multiple outputs