Interface control of conventional n-type silicon/metal by n-channel organic semiconductor

The rectifying and interface state density properties of n-Si/violanthrone-79/Au metal-diode have been investigated by current-voltage and capacitance-conductance-frequency methods. The ideality factor, barrier height and average series resistance of the diode were found to be 2.07, 0.81 eV and 5.04 kΩ respectively. At higher voltages, the organic layer contributes to I-V characteristics of the diode due to space-charge injection into the organic semiconductor layer and the trapped-charge-limited current mechanism is dominant mechanism for the diode. The barrier height obtained from C-V measurement is lower than the barrier height obtained I-V measurement and the organic layer creates an excess physical barrier for the diode. The interface state density of the diode was found to be 1.70 × 10¹¹ eV⁻¹ cm⁻² at 0.2 V and 1.72 × 10¹¹ eV⁻¹ cm⁻² at 0.4 V.The obtained electronic parameters indicate that the organic layer provides the conventional n-type silicon/metal interface control option.     

Interface electronic structure between organic semiconductor film and electrode metal probed by photoelectron yield spectroscopy

We present an investigation of the interface between organic semiconductor films and metal substrates (organic/metal interface) using photoelectron yield spectroscopy (PYS) as the probing technique. PYS studies were conducted on the pentacene/Au, copper phthalocyanine (CuPc)/Au, and perfluorinated zinc phthalocyanine (F₁₆ZnPc)/Au, and the results were compared with literature results obtained using conventional ultraviolet photoemission spectroscopy (UPS). PYS is advantageous for probing the electronic structure of the organic/metal interface because of the relatively long mean free path of photoexcited electrons with very low kinetic energy in PYS, which enables the detection of the photoelectrons from the metal substrate buried deep in the organic film. We demonstrate herein that the use of PYS reduces the significance of the final state effect of the electronic density surrounding the photohole at the organic molecule generated after the photoemission; this effect is known as the electric polarization effect. Although this effect has a significant influence on the results obtained using conventional UPS, the reduced influence of the final state effect in PYS makes it possible to construct an energy level diagram at the organic/metal interface with greater accuracy than can be achieved with UPS. In addition, a novel mechanism of the photoelectron detection for PYS enables us to apply PYS to very thick organic films, and therefore, PYS provides a reliable value of ionization energy for organic films without the influence of the substrate.Because the interface electronic structure has a significant influence on the carrier injection properties of organic devices, the increased reliability of the information obtained by PYS will render it very useful for the improvement of device performance as well for understanding their operation principles.     

Modification of metal/semiconductor junctions by self-assembled monolayer organic films

Two new metal/molecule/semiconductor contacts, Au/n-Si/TDA/Au and Au/p-Si/ODM/Au, were fabricated to understand effect of organic compounds, tridecylamine and octadecylmercaptan self-assembled monolayer (SAM) films, on electrical charge transport properties of the metal/semiconductor junctions. The morphology of the organic monolayers deposited on Si substrates was investigated by atomic force microscopy. The molecular coverage of ODM deposited on p-Si is poorer than that of TDA on n-Si substrate. The ideality factors of the p-Si/ODM and n-Si/TDA diodes were found to be 1.66 and 1.48, respectively. The electrical results show that the tridecylamine monolayer passivated junction has a lower ideality factor. The ideality factor indicates clear dependence on two different type functional groups R-SH (Thiol) and R-NH₂ (Amin) groups and it increases with different functional groups of organic molecule. The barrier height φ_b value of the n-Si/TDA diode is smaller than that of p-Si/ODM diode, as a result of chain length of the SAM organic molecules. The interface state density D_it values of the diodes were determined using conductance technique. The n-Si/TDA diode has the smaller interface state density according to p-Si/ODM diode.We have evaluated that the organic molecules control the electronic parameters of metal/semiconductor diodes and thus, organic modification helps to get one step closer towards to new organic assisted silicon based microelectronic devices.     

Improving solution-processed n-type organic field-effect transistors by transfer-printed metal/semiconductor and semiconductor/semiconductor heterojunctions

Solution-processed n-type organic field effect transistors (OFETs) are in need of proper metal contact for improving injection and mobility, as well as balanced hole mobility for building logic circuit units. We address the two distinct problems by a simple technique of transfer-printing. Transfer-printed Au contacts on a terrylene-based semiconductor (TDI) significantly reduced the inverse subthreshold slope by 5.6 V/dec and enhanced the linear mobility by over 5 times compared to evaporated Au contacts. Hence, devices with a high-work-function metal (Au) are comparable with those with low-work-function metals (Al and Ca), indicating a fundamental advantage of transfer-printed electrodes in electron injection. We also transfer-printed a poly(3-hexylthiophene) (P3HT) layer onto TDI to construct a double-channel ambipolar transistor by a solution process for the first time. The transistor exhibits balanced hole and electron mobility (3.0 × 10⁻³ and 2.8 × 10⁻³ cm² V⁻¹ s⁻¹) even in a coplanar structure with symmetric Au electrodes. The technique is especially useful for reaching intrinsic mobility of new materials, and enables significant enlargement of the material tanks for solution-processed functional heterojunction OFETs.     

The metal/organic monolayer interface in molecular electronic devices

The metal/molecules/metal is the basic device used to measure the electronic properties of organic molecules envisioned as the key components in molecular-scale devices (molecular diode, molecular wire, molecular memory, etc.). This review paper describes the main techniques used to fabricate a metal/molecules/metal device (or more generally electrode/molecules/electrode junctions, with electrodes made of metal or semiconductor). We discuss several problems encountered for the metallization of organic monolayers. The organic/electrode interface plays a strong role in the electronic properties of these molecular devices. We review some results on the relationships between the nature of the electrode/molecule interface (physisorbed or chemisorbed, evaporated metal electrode, mechanical contact, etc.) and the electronic transport properties of these molecular-scale devices. We also discuss the effects of symmetric versus asymmetric coupling of the two ends of the molecules with the electrodes.     

Electrical analysis of organic dye-based MIS Schottky contacts

In this work, we prepared metal/interlayer/semiconductor (MIS) diodes by coating of an organic film on p-Si substrate. Metal(Al)/interlayer(Orange GOG)/semiconductor(p-Si) MIS structure had a good rectifying behavior. By using the forward-bias I-V characteristics, the values of ideality factor (n) and barrier height (BH) for the Al/OG/p-Si MIS diode were obtained as 1.73 and 0.77 eV, respectively. It was seen that the BH value of 0.77 eV calculated for the Al/OG/p-Si MIS diode was significantly larger than the value of 0.50 eV of conventional Al/p-Si Schottky diodes. Modification of the potential barrier of Al/p-Si diode was achieved by using thin interlayer of the OG organic material. This was attributed to the fact that the OG organic interlayer increased the effective barrier height by influencing the space charge region of Si. The interface-state density of the MIS diode was found to vary from 2.79 × 10¹³ to 5.80 × 10¹² eV⁻¹ cm⁻².     

Electrical and interface state density properties of the 4H-nSiC/[6,6]-phenyl C61-butyric acid methyl ester/Au diode

The electrical and interface state density properties of the Ni/4H-nSiC/PCBM/Au diode have been investigated by current-voltage, capacitance-voltage and conductance-frequency methods. The ideality factor, barrier height and series resistance values of the diode were found to be 2.28, 1.10 eV and 3.76 × 10⁴ Ω, respectively. The diode shows a non-ideal I-V behaviour with an ideality factor greater than unity that could be ascribed to the interfacial layer, interface states and series resistance. The obtained barrier height (1.10 eV) of the Ni/4H-nSiC/PCBM/Au diode is lower than that of Ni/4H-nSiC diode (1.32 eV). This indicates that the PCBM organic layer induces a change of 160 meV in the barrier height of the Ni/4H-nSiC diode. The interface state density of the diode was determined from G_p/ω-f plots and was of order of 5.61 × 10¹² eV⁻¹ cm⁻².     

Modifying organic/metal interface via solvent treatment to improve electron injection in organic light emitting diodes

By simply spin-coating the solvents, such as ethanol and methanol, on top of the organic active layer, the performance of polymer organic light-emitting diodes is significantly enhanced. The quantum efficiency is increased by as large as 58% for low work function Ba/Al cathode devices after solvent treatment. An interface dipole between the organic layer and the metal layer induced by the solvent, either from the intrinsic dipole or the interaction between the solvent and the cathode metal, is responsible for the device performance improvement. The interface dipole layer, which is confirmed by the Kelvin Probe Force Microscopy and the photovoltaic measurements, lifts the vacuum level on the metal side, thereby reducing the electron injection barrier at the organic/metal interface, and leading to better device performance.     

In situ monitoring of photovoltaic properties in organic solar cells during thermal annealing

This paper reports a simple and useful technique that monitors the changes of poly(3-hexylthiophene) (P3HT):1-(3-methoxycarbonyl)-propyl-1-phenyl-(6,6)C₆₁-based organic solar cells (OSCs) during thermal annealing in situ. Thermal annealing was divided into five stages in which the variations of the cell parameters were obtained in detail. Annealing temperature that was higher than the glass transition temperature of P3HT (127 °C) was found critical to the improvement of open-circuit voltage. The initial rise of the short-circuit current was explained by in situ monitoring of the transport behaviors of electrons and holes. Finally, in situ monitoring was adopted to compare OSCs that were or were not solvent-annealed, indicating the effectiveness in optimizing, modeling and understanding in depth the effects of the thermal annealing of OSC with a blended active layer.     

XPS Analysis of Surface and Interface States for PTCDA/p-Si Heterojunction

The surface and interface of heterojunction (HJ) formed with organic semiconductor (3,4,9,10-perylenetetracarboxylic dianhydride (PTCDA) and inorganic semiconductor p-Si were measured and analyzed by X-ray photoelectron spectroscopy(XPS).The results indicate that ,in PTCDA molecule, the binding energy(Eb) of C is 284.6eV and 288.3eV, corresponding to C of the perylene and Cof the anhydride, respectively, and the binding energy of O is 531.3 eV and 531.1eV, corresponding to C of C=O in the anhydrides and C of C-O-C, respectively.Moreover, PTCDA lost its anhydrides and only its perylenes were left in the HJ interface.     

The relevance of correct injection model to simulate electrical properties of organic semiconductors

In this work we demonstrate how a full comprehensive model can be used to understand the electrical behavior of actual organic devices. We address all the aspects which need to be taken into account for realistic simulations of a wide range of device structures and configurations. In particular we stress the relevance of the correct modeling of contact/organic interfaces. The model is applied to perform predictive simulations of organic light-emitting diodes and to deduce how a full experimental characterization of an organic device should be performed in order to completely grasp its electrical behavior.     

Annealing temperature effect on electrical and structural properties of Cu/Au Schottky contacts to n-type GaN

Schottky contacts were fabricated on n-type GaN using a Cu/Au metallization scheme, and the electrical and structural properties have been investigated as a function of annealing temperature by current-voltage (I-V), capacitance-voltage (C-V), Auger electron spectroscopy (AES) and X-ray diffraction (XRD) measurements. The extracted Schottky barrier height of the as-deposited contact was found to be 0.69 eV (I-V) and 0.77 eV (C-V), respectively. However, the Schottky barrier height of the Cu/Au contact slightly increases to 0.77 eV (I-V) and 1.18 eV (C-V) when the contact was annealed at 300 °C for 1 min. It is shown that the Schottky barrier height decreases to 0.73 eV (I-V) and 0.99 eV (C-V), 0.56 eV (I-V) and 0.87 eV (C-V) after annealing at 400 °C and 500 °C for 1 min in N₂ atmosphere. Norde method was also used to extract the barrier height of Cu/Au contacts and the values are 0.69 eV for the as-deposited, 0.76 eV at 300 °C, 0.71 eV at 400 °C and 0.56 eV at 500 °C which are in good agreement with those obtained by the I-V method. Based on Auger electron spectroscopy and X-ray diffraction results, the formation of nitride phases at the Cu/Au/n-GaN interface could be the reason for the degradation of Schottky barrier height upon annealing at 500 °C.     

Electrical properties of oxidized polycrystalline silicon as a gate insulator for n-type 4H-SiC MOS devices

MOS capacitors were produced on n-type 4H-SiC using oxidized polycrystalline silicon (polyoxide). The polyoxide samples grown by dry oxidation without an anneal had a high interface state density (D_it) of 1.8 × 10¹² cm⁻² eV⁻¹ and the polyoxide samples grown by wet oxidation had a lower D_it of 1.2 × 10¹² cm⁻² eV⁻¹ (both at 0.5 eV below the conduction band). After 1 h Ar annealing, the D_it of wet polyoxide was reduced significantly to 2.6 × 10¹¹ cm⁻² eV⁻¹ (at 0.5 eV below the conduction band). Dry polyoxide exhibits higher breakdown electric fields than wet polyoxide. The interface quality and breakdown characteristics of polyoxide are comparable to published results of low-temperature CVD deposited oxides.     

Performance enhancement of diindenoperylene-based organic photovoltaic cells by nanocolumn-arrays

Crystalline and uniform nanocolumns of the organic semiconductor diindenoperylene (DIP) were fabricated by glancing-angle deposition and employed in organic photovoltaic cells (OPVCs) forming an interdigitated donor/acceptor heterojunction, with fullerene as electron acceptor. In comparison to reference bilayer devices the nanocolumn-based solar cells exhibit increased power conversion efficiency. Based on a comprehensive structural and morphological analysis, we identify three advantages of the interdigitated nanocolumn structures: (i) The active donor/acceptor interface area, crucial for exciton dissociation, is increased and the column diameter is in the range of the exciton diffusion length. (ii) The molecular orientation of DIP is such in the nanocolumns that light absorption is enhanced. (iii) The ubiquitous presence of vertical interfaces throughout nanocolumn-based devices is further beneficial to light absorption, as it fully compensates wavelength-dependent interference effects within the device structure. This work shows how the benefits of nanocolumns can go beyond simple interface area enlargement to improve the efficiency of OPVCs.     

Stress-induced degradation of p- and n-type organic thin-film-transistors in the ON and OFF states

In this work we analyzed the effect of different stress configurations on p- and n-type organic thin-film-transistors, to emulate the various operating conditions in a real application. Devices showed the largest degradation when they are stressed in the ON condition, because of the uniform charge injection and defect generation in the whole channel area. Charge trapping kinetics and mobility degradation was also strongly dependent on the semiconductor type, suggesting a key-role of the semiconductor on the device reliability.     

XPS Investigation on Surface and Interface Electronic States of Alq3／ITO

The surface and interface electronic states of tris-(8-hydroxyquinoline)aluminum(Alq3)/indium-tin oxid(ITO)were measured and analyzed by X-ray photoelectron spectroscopy(XPS).The results indicated that, in Alq3 molecule,the binding energy(Eb)of Al atoms is 70.7eV and 75.1eV,corresponding to Al(O)and Al(Ⅲ）,respectively;The binding energy of C is 285.8eV,286.3eV,and 286.8eV,corresponding to C of C-C group,C-O,and C-N bond,respectively,N is the main peak locating at 401.0eV, corresponding to Natom of C-N=C.Oatoms mainly bond o H atom,with the binding energy of 533.2 eV.As the sputtering time of Ar^ ion bearn increases,Al2p,C1s,N1s,O1s,Ind3d5/2 and Sn3d5/2 peaks slightly shift towards lower binding energy,and Al2p,C1s and N1s peaks get weaker,which contributed to diffusing the oxygen,indium and tin in ITO into Alq3 layr.     

Electrical and photovoltaic properties of a n-Si/chitosan/Ag photodiode

The electrical and photovoltaic properties of AuSb/n-Si/chitosan/Ag diode have been investigated. The ideality factor, barrier height and Richardson constant values of the diode at room temperature were found to be 1.91, 0.88 eV and 121.4 A/cm² K², respectively. The ideality factor of the diode is higher than unity, suggesting that the diode shows a non-ideal behaviour due to series resistance and barrier height inhomogeneities. The barrier height and ideality factor values of Ag/CHT/n-Si diode at room temperature are significantly larger than that of the conventional Ag/n-Si Schottky diode. The φ_B value obtained from C-V measurement is higher than that of φ_B value obtained from I-V measurement. The discrepancy between φ_B(C-V) and φ_B(I-V) barrier height values can be explained by Schottky barrier height inhomogeneities. AuSb/n-Si/chitosan/Ag diode indicates a photovoltaic behaviour with open circuit voltage (V_oc = 0.23 V) and short-circuit current density (J_sc = 0.10 μA/cm⁻²) values.     

Bandwidth and transient analysis of bilayer organic photodetectors

Utilization of organic photodetectors (OPDs) and their applications for assembling on flexible and curved substrates have increased in recent years. However, organic semiconductors suffer from low carrier mobility that demands an optimized design and precise modeling for their applications. The OPDs frequency bandwidth is one of the most important criteria that needs to be investigated carefully. In this paper a comprehensive physical time-domain framework is introduced for bandwidth calculations as well as other several evaluation criteria. This model is verified by experimental measurements. According to the results, increasing the reverse bias voltage boosts the bandwidth of OPD owing to the increase of the carrier mobility. Based on the introduced simulation approach, the trade-off between the bandwidth and the responsivity has been investigated and an efficient design method is also proposed which could effectively improve the OPD performance.     

Effects of semiconductor/dielectric interfacial properties on the electrical performance of top-gate organic transistors

We investigated the effects of varying the properties of the interface between a semiconductor P3HT layer and a dielectric Cytop™ layer on the performances of the resulting transistor devices by comparing the mobilities of devices prepared with bottom gate/bottom contact or top gate/bottom contact architectures. The reduced channel roughness that arose from the thermal annealing step dramatically enhanced the field-effect mobility, yielding the highest mobility yet obtained for a top-gate transistor: 0.12 cm²/V s. High-performance OFETs may be fabricated by controlling the channel roughness and the properties of the interface between the semiconductor and the gate dielectric.     

Temperature and frequency dependent electrical and dielectric properties of Al/SiO2/p-Si (MOS) structure

The electrical and dielectric properties of Al/SiO₂/p-Si (MOS) structures were studied in the frequency range 10 kHz-10 MHz and in the temperature range 295-400 K. The interfacial oxide layer thickness of 320 Å between metal and semiconductor was calculated from the measurement of the oxide capacitance in the strong accumulation region. The frequency and temperature dependence of dielectric constant (ε′), dielectric loss (ε″), dielectric loss tangent (tan δ) and the ac electrical conductivity (σ_ac) are studied for Al/SiO₂/p-Si (MOS) structure. The electrical and dielectric properties of MOS structure were calculated from C-V and G-V measurements. Experimental results show that the ε′ and ε″ are found to decrease with increasing frequency while σ_ac is increased, and ε′, ε″, tan δ and σ_ac increase with increasing temperature. The values of ε′, ε″ and tan δ at 100 kHz were found to be 2.76, 0.17 and 0.06, respectively. The interfacial polarization can be more easily occurred at low frequencies, and the number of interface state density between Si/SiO₂ interface, consequently, contributes to the improvement of dielectric properties of Al/SiO₂/p-Si (MOS) structure. Also, the effects of interface state density (N_ss) and series resistance (R_s) of the sample on C-V characteristics are investigated. It was found that both capacitance C and conductance G were quite sensitive to temperature and frequency at relatively high temperatures and low frequencies, and the N_ss and R_s decreased with increasing temperature. This is behavior attributed to the thermal restructuring and reordering of the interface. The C-V and G/ω-V characteristics confirmed that the N_ss, R_s and thickness of insulator layer (δ) are important parameters that strongly influence both the electrical and dielectric parameters and conductivity in MOS structures.