Electrical demonstration of thermally stable Ni silicides on Si1−xCx epitaxial layers

In this paper we report on electrical demonstration of thermally stable Ni silicides. It has been shown that when a sacrificial Si_1−xC_x epilayer is grown in the source-drain areas of NMOS transistors prior to silicidation, Ni silicides can withstand a 30 min anneal at 750 °C and demonstrate excellent electrical performance. We have observed carbon segregation at the NiSiC/Si_1−xC_x interface which can explain the increased NiSiC thermal stability. We have experimentally demonstrated feasibility of CMOS device implementation of thermally stable Ni silicides.     

Determination of boron concentration in heavily doped p-type Si1−xGex/Si heterostructure by infrared ellipsometric spectroscopy

Si_1−xGe_x/Si heterostructures play a primary role in the Si-based fast electronics developments of today. In this work, we will present the experimental results of infrared spectroscopic ellipsometry (IRSE) for structural determination of the boron heavily doped SiGe/Si sample grown by ultra-high vacuum chemical vapor deposition (UHVCVD) (the Ge atomic percent, the thickness of SiGe film and boron concentration). Especially, the principle of boron concentration in p-type SiGe film layer determined by IRSE was elucidated in detail. In addition, in order to corroborate the validity of IRSE for determining dopant concentration, secondary ion mass spectroscopy (SIMS) experiment has also been carried out. The close experimental agreement between IRSE and SIMS demonstrate that IRSE as a contactless, and non-destructive technology can be used in-line tools in production used for measuring the Ge content, the thickness of SiGe layer and boron concentration in p-type dopant SiGe/Si heterostructure, which often used the base layer of SiGe hetero-junction bipolar transistor (HBT) devices.     

Experimental and theoretical investigation of defects at (1 0 0) Si1−xGex/oxide interfaces

The identification of a nontrigonal Ge dangling bond at SiO₂/Si_1−xGe_x/SiO₂ heterostructures and its electrical activity are discussed, both from experimental and theoretical points of view. This dangling bond is observed from multifrequency electron-spin resonance experiments performed at 4.2 K, for typical Ge concentrations in the range 0.4 ≤ x ≤ 0.85. The electrical activity of this defect is revealed from capacitance-voltage characteristics measured at 300 and 77 K, and is found to behave like an acceptor defect. First-principles calculations of the electronic properties of this Ge dangling bond indicate that its energy level approaches the valence band edge of the Si_1−xGe_x layer as the Ge content increases, confirming its acceptor-like nature.     

Low sensitivity to temperature compressive-strained structure quantum well laser Ga1−xInxAs1−yNy/GaAs

The objective is to exploit the properties of the GaInNAs/GaAs alloy compressive strain structure to design a laser diode likely to meet the needs of optical communications. Modelling concerns mainly the study of the potentialities of thermal stability and dynamic response offered by these new techniques of electric and optical confinement. Band structure is modelled and typical quantum well properties are illustrated. A thorough study of the structural parameters is undertaken to take into account from the design criteria the temperature sensitivity. Minimising the Auger coefficient in the order of 10⁻²⁹ cm⁶/s appears to allow achieving efficient laser diodes production.     

InxGa1−xN refractive index calculations

The growth of In_xGa_1−xN Wurtzite structure is a well established fact. It permits to design optoelectronic devices such as laser diodes or LEDs, from the near ultraviolet to the infrared light spectrum. This sweeps indeed, the whole of the visible spectrum and, hence, appears to be very useful to the recent development of liquid crystal display screens, or designing photodiodes and perhaps solar cells (after studying their energetical efficiencies). Nevertheless, refractive indices of In_xGa_1−xN structure have not been studied.The refractive index of such structures is increasing from the GaN refractive index to the InN one, with therefore, a bowing of the curve due to the lattice mismatch between these two constituting binary alloys.The index is, in a certain range of the “n(x)” characteristic, less than the GaN one. This seems to be particularly interesting in the integrated optics domain or optical waveguides realization, because the growth of GaN is easier than the growth of In_xGa_1−xN.     

Crystal growth of Hg1−xMnxSe for infrared detection

In this work, we report on the successfully growing Hg_1−xMn_xSe bulk crystals using a mixed, travelling heater method and Bridgman method, two-step procedure. Firstly, and with the aim of reducing Hg high pressure related to the high temperature synthesis reaction between the components in elemental form, HgSe crystals were synthesized and grown by the cold travelling heater method. Secondly, previously sublimated Mn and Se were incorporated to complete the desired composition. Then, the Bridgman growth was carried out by heating the alloy at a temperature of about 880 °C and lowering it at rate of 1 mm/h through a gradient of 25 °C/cm. The Hg_1−xMn_xSe crystals were characterized by scanning electron microscopy, energy dispersive X-ray analysis, X-ray diffractometry, Fourier transform infrared spectroscopy and magnetic susceptibility measurements. The summary of the experimental results allows us to be optimistic with the potential of Hg_1−xMn_xSe as regards using Hg_1−xMn_xTe and Hg_1−xCd_xTe for infrared photodetection.     

High-mobility pentacene thin-film transistor by using LaxTa(1−x)Oy as gate dielectric

Pentacene organic thin-film transistors (OTFTs) using La_xTa_(1−x)O_y as gate dielectric with different La contents (x = 0.227, 0.562, 0.764, 0.883) have been fabricated and compared with those using Ta oxide or La oxide. The OTFT with La_0.764Ta_0.236O_y can achieve a carrier mobility of 1.21 cm² V⁻¹s⁻¹s, which is about 40 times and two times higher than those of the devices using Ta oxide and La oxide, respectively. As supported by XPS, AFM and noise measurement, the reasons lie in that La incorporation can suppress the formation of oxygen vacancies in Ta oxide, and Ta content can alleviate the hygroscopicity of La oxide, resulting in more passivated and smoother dielectric surface and thus larger pentacene grains, which lead to higher carrier mobility.     

Characterization of UV photodetectors with MgxZn1−xO thin films

In this study the metal-semiconductor-metal (MSM) structure ultraviolet (UV) photodetectors (PDs) based on Mg_xZn_1−xO thin films were fabricated. The Mg_xZn_1−xO thin films were grown on glass substrates by sol-gel method. The results show that the optical absorption has a blue shift and higher transmittance with increasing Mg dopant. The optical band gap were modified by 3.28-3.52 eV, which corresponded to x = 0 and x = 0.16. For a 10 V applied bias, the dark currents of the Mg_xZn_1−xO MSM-PDs were 637 nA (x = 0) to 0.185 nA (x = 0.16) and showed good Schottky contacts. This UV-visible rejection ratio of the Mg_xZn_1−xO UV PDs at x = 0, 0.16, 0.21 and 0.33 were 18.82, 35.36, 40.91 and 42.92, respectively.     

AlxGa1−xN/GaN multi-quantum-well ultraviolet detector based on p-i-n heterostructures

We report on characterization of a set of AlGaN/GaN multiple-quantum-well (MQW) photodetectors. The model structure used in the calculation is the p-i-n heterojunction with 20 AlGaN/GaN MQW structures in i-region. The MQW structures have 2 nm GaN quantum well width and 15 nm Al_xGa_1−xN barrier width. The cutoff wavelength of the MQW photodetectors can be tuned by adjusting the well width and barrier height. Including the polarization field effects, on increasing Al mole fraction, the transition energy decreases, the total noise increases, and the responsivity has a red shift, and so the detectivity decreases and has a red shift.     

Effect of annealing on Zn1−xCoxO thin films prepared by electrodeposition

Polycrystalline thin films of Zn_1−xCo_xO with different cobalt (Co) content were grown on indium tin oxide (ITO) substrates by cathodic electrodeposition technique and subsequently annealed in air at 400 °C. The effect of annealing in their structural, optical and chemical properties has been characterized by X-ray diffraction (XRD), energy-dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS), Raman scattering and optical spectroscopy. Our measurements indicate that moderate annealing increases the crystal quality of the films. The films are highly transparent in the visible range and evidence an increase of the band gap and of the intensity of three typical Co absorption bands in the visible with the amount of Co. Thermal annealing produces an increase of the intensity of the Co²⁺-related absorption bands revealing that higher amount of Co atoms are occupying Zn sites.     

Effects of high doping on the bandgap bowing for AlxGa1−xN

This paper gives the composition dependence of the bandgap energy for highly doped n-type Al_xGa_1−xN. We report results of the bowing parameter obtained using a random simulation. Three groups of Al_xGa_1−xN semiconductors were considered and which are distinguishable by their non degenerate or degenerate character in the doping density (10¹⁷?N_D?10²⁰ cm⁻³). A striking feature is the large discrepancy of the bandgap bowing (−2.02?b?2.94 eV), as was demonstrated from our calculations. This suggests that high doping may be a possible cause able to induce the large range of bowing parameters reported for Al_xGa_1−xN alloys.     

LP-MOCVD growth of ternary BxGa1−xAs epilayers on (0 0 1)GaAs substrates using TEB, TMGa and AsH3

Zinc-blende B_xGa_1−xAs alloys have been successfully grown on exactly oriented (0 0 1)GaAs substrates using triethylboron, trimethylgallium and arsine sources. The growth has been accomplished in a vertical low-pressure metalorganic chemical vapor deposition (LP-MOCVD) reactor. Boron incorporation behaviors have been extensively studied as a function of growth temperature and gas-phase boron mole fraction. The evolution of surface morphology was also observed.The maximum boron composition of 5.8% is obtained at the optimum growth temperature of 580 °C. RMS roughness over the surface area of 1×1 μm² is only 0.17 nm at such growth conditions. Based on the experimental results, it has been clearly shown that boron incorporation will decrease significantly at higher temperature (>610 °C) or at much lower temperature (?550 °C).     

Effect of Ta addition on magnetic properties of (Fe45Pt55)1−x-Tax thin films

It was studied that FePt-Ta thin films prepared on MgO (1 0 0) buffer-layer by DC/RF magnetron co-sputtering have shown better magnetic properties and micro structural improvement. The Ta-doped FePt-Ta films indicate somewhat differences in micro structural ordering and the aspect of grain growth after annealing. With respect to magnetic property, the sample having 30% increased coercivity was obtained after a heat treatment at 700 °C. In particular the addition of Ta (5.5%) enhances the L1₀ ordering of FePt at relatively high temperature (above 500 °C).     

Low-loss CaxBa1−xNb2O6 ridge waveguide for electro-optic devices

Optical ridge waveguide using calcium barium niobate (CBN) on silicon substrate for the first time is designed, fabricated and characterized for future integrated electro-optic devices. To obtain single-mode propagation, the CBN thin strip is designed to be surrounded by thick silicon dioxide layer forming a ridge waveguide. Deposition of CBN film on profiled silicon dioxide introduces spatial separation which solves the CBN etching problem. Fabrication, edge polishing and near-field mode profile measurement of the waveguide are carried out. The measurement is in good agreement with the simulation and an exact loss as low as 2.15 dB/cm was obtained for the fabricated waveguide.     

Highly (1 0 0)-oriented Pb(Zr0.20Ti0.80)O3/(Pb1−xLax)Ti1−x/4O3 multilayered thin films prepared by RF magnetron sputtering

The Pb(Zr_0.20Ti_0.80)O₃/(Pb_1−xLa_x)Ti_1−x/4O₃ (x = 0, 0.10, 0.15, 0.20) (PZT/PLT_x) multilayered thin films were in situ deposited on the Pt(1 1 1)/Ti/SiO₂/Si(1 0 0) substrates by RF magnetron sputtering technique with a PbO_x buffer layer. With this method, all PZT/PLT_x multilayered thin films possess highly (1 0 0) orientation. The PbO_x buffer layer leads to the (1 0 0) orientation of the multilayered thin films. The effect of the La content in PLT_x layers on the dielectric and ferroelectric properties of the PZT multilayered thin films was systematically investigated. The enhanced dielectric and ferroelectric properties are observed in the PZT/PLT_x (x = 0.15) multilayered thin films. The dielectric constant reaches maximum value of 365 at 1 KHz for x = 0.15 with a low loss tangent of 0.0301. Along with enhanced dielectric properties, the multilayered thin films also exhibit large remnant polarization value of 2P_r = 76.5 μC/cm², and low coercive field of 2E_c = 238 KV/cm.     

Evaluating the abrasive wear of Zn1−xMnxO heteroepitaxial layers using a nanoscratch technique

In this study, we used nanoscratch techniques under a ramping load to evaluate the abrasive wear of Zn_1−xMn_xO epilayers (0 ? x ? 0.16) grown through molecular beam epitaxy (MBE) on sapphire substrates. We analyzed the surface roughness and damage using atomic force microscopy (AFM) and nanoindenter techniques. The scratched surfaces of the Zn_1−xMn_xO epilayers were significantly different for the various Mn compositions. AFM imaging of the Zn_1−xMn_xO films revealed that pileup phenomena were important on both sides of each scratch. During the scratching process, we found that cracking dominated in the case of Zn_1−xMn_xO films while ploughing; also we observed lower values of the coefficient of friction and shallower penetration depths for the films upon increasing the Mn content (x) from 0 to 0.16, suggesting that higher Mn contents provided the Zn_1−xMn_xO epilayers with higher shear resistances, enhanced by the presence of MnO bonds.     

Fabrication and electrical characteristics of ultrathin (HfO2)x(SiO2)1−x films by surface sol-gel method and reaction-anneal treatment

Hafnium oxide (HfO₂) films were deposited on Si substrates with a pre-grown oxide layer using hafnium chloride (HfCl₄) source by surface sol-gel process, then ultrathin (HfO₂)_x(SiO₂)_1−x films were fabricated due to the reaction of SiO₂ layer with HfO₂ under the appropriate reaction-anneal treatment. The observation of high-resolution transmission electron microscopy indicates that the ultrathin films show amorphous nature. X-ray photoelectron spectroscopy analyses reveal that surface sol-gel derived ultrathin films are Hf-Si-O alloy instead of HfO₂ and pre-grown SiO₂ layer, and the composition was Hf_0.52Si_0.48O₂ under 500 °C reaction-anneal. The lowest equivalent oxide thickness (EOT) value of 0.9 nm of film annealed at 500 °C has been obtained with small flatband voltage of −0.31 V. The experimental results indicate that a simple and feasible solution route to fabricate (HfO₂)_x(SiO₂)_1−x composite films has been developed by means of combination of surface sol-gel and reaction-anneal treatment.     

Electrical properties of metal-ferroelectric-insulator-semiconductor structure using BaxSr1−xTiO3 for ferroelectric-gate field effect transistor

Perovskite ferroelectric Ba_xSr_1−xTiO₃ (x = 0.5, 0.6, 0.7 and 0.8) thin films have been fabricated as metal-ferroelectric-insulator-semiconductor (MFIS) configurations using a sol-gel technique. The C-V characteristics for different Ba-Sr ratios and different film thicknesses have been measured in order to investigate the ferroelectric memory window effect. The results show that the memory window width increases with the increase both of Ba content and film thickness. This behavior is attributed to the grain size and dipole dynamics effect. It is found also that the memory window increases as the applied voltage increases. In addition, the leakage current density for the films is measured and it is found to be of the order of 10⁻⁸ A/cm² for all tested samples, indicating that the films have good insulating characteristics.     

Temperature dependent current-voltage characteristics of n-MgxZn1−xO/p-GaN junction diodes

This study investigates the temperature dependence of the current-voltage (I-V) characteristics of n-Mg_xZn_1−xO/p-GaN junction diodes. The n-Mg_xZn_1−xO films were deposited on p-GaN using a radio-frequency (rf) magnetron sputtering system followed by annealing at 500, 600, 700, and 800 °C in nitrogen ambient for 60 s, respectively. The n-Mg_xZn_1−xO/p-GaN diode at a substrate temperature of 25 °C had the lowest leakage current in reverse bias. However, the leakage current of the diodes increased with an increase in annealing temperatures. The temperature sensitivity coefficients of the I-V characterizations were obtained at different substrate temperatures (25, 50, 75 100, and 125 °C) providing extracted values of 26.4, 27.2, 17.9, and 0.0 mV/°C in forward bias and 168.8, 143.4, 84.6, and 6.4 mV/°C in reverse bias, respectively. The n-Mg_xZn_1−xO/p-GaN junction diode fabricated with Mg_xZn_1−xO annealed at 800 °C demonstrated the lowest temperature dependence. Based on these findings, the n-Mg_xZn_1−xO/p-GaN junction diode is feasible for GaN-based heterojunction bipolar transistors (HBTs).     

Properties of NixZn(1−x)Fe2O4 thick films at microwave frequencies

The thick film Ni_xZn_(1−x)Fe₂O₄ on alumina substrate was prepared by screen printing of the ferrite powder synthesized by chemical co-precipitation method using nitrate precursors. These Ni_xZn_(1−x)Fe₂O₄ thick films of varying x were characterized by X-ray diffraction, FTIR spectroscopy and SEM (scanning electron microscopy). The permittivity and permeability were measured by overlay technique. Voltage standing wave ratio method was also used to measure the dielectric constant. The permittivity was found to increase with Ni content varying between 13 and 18. The permeability was ∼3.01. The overlay technique provides an easy method for measurement of permittivity and permeability of ferrite thick film.