中温固化环氧树脂芳纶Ⅲ纤维复合材料性能研究

对芳纶Ⅲ纤维和及其织物(F-3S175)的性能进行测试,采用热熔法制备了3233中温固化环氧树脂F-3S175芳纶布预浸料,通过热压罐法成型复合材料层合板和蜂窝夹层板,进行性能测试,与Kevlar 49纤维进行对比。结果表明,芳纶Ⅲ纤维、织物和其3233树脂复合材料性能高于Kevlar 49芳纶纤维、织物及其复合材料性能。     

中温固化碳纤维／环氧预浸料研究

本文介绍一种双酚A型环氧树脂/硼—胺复合体系(EN体系),该体系在120～140℃固化。固化的EN体系具有优良的力学性能。湿气对EN体系的影响用DSC、TBA和重量分析法进行研究。提出了预浸料合适的操作温度、湿度和贮存条件。     

环氧树脂/芳纶纤维预浸料的质量控制试验方法研究

测定了环氧树脂／芳纶纤维预浸料的固化度（红外法）、不可溶分含量及其复合材料的力学性能与储存时间的关系。结果表明,固化度、不可溶分含量与储存时间之间在９５％的置信条件下呈显著的线性关系。固化度、不可溶分含量可以作为预浸料的质量控制参数,其试验方法可用于预浸料的质量控制。     

中温固化碳纤维／环氧复合材料研究

本文详细介绍了中温固化的ＥＭ环氧基体及其复合材料的性能,固化工艺及应用情况,对ＥＭ环氧体系在湿法预浸料制造过程中的“现象进行了分析探讨。研究了５９４硼巡固化剂在丙酮中的溶解性,筛选出了助溶剂,解决了湿法预浸料制作时５９４固化剂在丙酮中的溶解发白现象。     

中温固化碳纤维／环氧复合材料研究

介绍中温固化的EM环氧树脂及其复合材料的性能,以及固化工艺和应用情况;对EM环氧树脂体系在湿法预浸料制造过程中的“白化”现象进行了分析探讨,解决了湿法预浸料制作中594固化剂在丙酮中的溶解发白现象。     

中温固化阻燃环氧树脂/芳纶复合材料的研究

研究了3233环氧树脂体系的粘度—温度关系、凝胶时间—温度关系、热力学性能、垂直燃烧性能和力学性能。结果表明，树脂的加压范围宽，工艺适应性强；100％以下具有较长的贮存期；复合材料玻璃化转变温度能达到130℃；阻燃性能达到FV—0级；3233环氧树脂体系芳纶复合材料的常规性能和耐热性能较好，夹层结构的滚筒剥离强度高。树脂具有良好的韧性。     

薄型碳纤维织物预浸料及其复合材料研究

采用国产1k T300级薄型碳纤维织物和中温固化高性能树脂制备预浸料。测试了该预浸料及其复合材料性能,并与国产3k T300级碳纤维织物预浸料及其复合材料性能进行对比。研究结果表明:国产1k T300级薄型碳纤维织物的复合材料性能与国产3k T300级碳纤维织物的复合材料性能相当;该薄型碳纤维织物复合材料的树脂体系是改性增韧环氧树脂,韧性好,适用于轻质夹层结构复合材料,具有较高滚筒剥离强度;同时,该轻质复合材料耐热性好,玻璃化转变温度能达到200℃。     

芳纶预浸料的研究

介绍了芳纶预浸料及其与碳纤、玻纤混杂预浸料的研制状况。探讨了不同因素对预浸料及其复合材料的性能影响。叙述该预浸料的性能和特点。     

中温固化环氧预浸料的综合性能研究

为提高预浸料在无人机上的国产化应用,对自制中温固化EP(环氧树脂)体系及其预浸料进行了综合性能研究。试验主要通过对基体及复合材料样件进行部分性能测试,采用DSC(差示扫描量热)法对基体进行了T_g(玻璃化转变温度)测试,采用24 h水煮试验方法对复合材料样件进行吸水率测试。研究结果表明:EP基体及预浸料制作的样件具有良好的综合力学、耐湿热性能和韧性特征;其中基体样件弯曲和压缩强度在130 MPa以上,各模量均在3.0 GPa以上,T_g值约142℃,样件断裂破坏具有明显的韧性特征;在0.7 MPa压力下,热压罐成型的各类复合材料样件经24 h水煮后吸水率皆在3%以下,UD(单向碳带预浸料)样件的0°弯曲强度约1 826 MPa,0°弯曲模量约139 GPa,层间剪切强度约80 MPa。     

环氧树脂/芳纶布复合材料性能研究与应用

研究了3233环氧树脂/796芳纶布复合材料的力学性能。结果表明,3233环氧树脂/796芳纶布复合材料的常规性能和耐热性较好,采用模压法和热压罐法成型的层压板性能相当,夹层板的滚筒剥离强度高,树脂基体具有韧性,扫描电镜观察发现复合材料的界面粘接情况良好。该预浸料已用于直升机次承力结构。     

俄罗斯芳纶发展概况及其制备、性能与应用

对俄罗斯芳纶做了全面的综述,详细介绍了其间位芳纶、对位芳纶和杂环芳纶的发展概况、化学结构、性能及应用等,重点介绍了对位杂环芳纶SVM、Armos和Rusar的发展及应用情况,最后展望了杂环芳纶的应用前景。     

Studies on the reactivity of epoxy/polyol/isocyanate blend resins and the properties of epoxy/polyurethane composites

Epoxy resin (ER) is one of the most widely used synthetic resins, and the improvement of its toughness is an important issue. In this study, Epon 828 is used as ER resin, polytetramethylene ether glycol (PTMG) and liquefied wood (LW) are used as polyol, and IPDI, H₁₂-MDI, Desmodur N, and Desmodur L are used as isocyanate. The influence of polyurethane resin (PU) composition on the reactivity of ER/polyol/isocyanate blended resin and the properties of ER/PU composite are investigated. The results show that the mixture of ER/PTMG/IPDI has greater reactivity, followed by ER/PTMG/Desmodur N, while ER/PTMG/Desmodur L has lower reactivity. In the structure of ER/PU blended resin composites, ER and PU resins not only form a physical interpenetrating structure, but also undergo a copolymerization crosslinking reaction. The modulus of elasticity of ER/PU composites prepared with trifunctional Desmodur L and Desmodur N is greater than that of bifunctional IPDI and H₁₂-MDI, while those with LW as polyol is greater than that of PTMG as the raw material.     

国内杂环芳纶发展现状及其纺丝生产线开发

简介了国内杂环芳纶发展项目现状,重点对60锭杂环芳纶纺丝生产线的整机结构、纺丝工艺流程、基本工艺参数、具体结构以及主要技术特点进行了分析和探讨。指出60锭杂环芳纶纺丝生产线采用了很多先进技术,具有模块化、连续化、生产效力高、自动化程度高、结构紧凑、产能高、工作环境友好等技术特点,对促进我国杂环芳纶产业化发展具有重要意义。     

Interfacial studies on the surface modified aramid fiber reinforced epoxy composites

In this work, solutions of rare earth modifier (RES) and epoxy chloropropane (ECP) grafting modification method were used for the surface treatment of aramid fiber. The effect of chemical treatment on aramid fiber has been studied in a composite system. The surface characteristics of aramid fibers were characterized by Fourier transform infrared spectroscopy (FTIR). The interfacial properties of aramid/epoxy composites were investigated by means of the single fiber pull‐out tests. The mechanical properties of the aramid/epoxy composites were studied by interlaminar shear strength (ILSS). As a result, it was found that RES surface treatment is superior to ECP grafting treatment in promoting the interfacial adhesion between aramid fiber and epoxy matrix, resulting in the improved mechanical properties of the composites. Meanwhile, the tensile strengths of single fibers were almost not affected by RES treatment. This was probably due to the presence of reactive functional groups on the aramid fiber surface, leading to an increment of interfacial binding force between fibers and matrix in a composite system. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102:4165–4170, 2006     

环氧树脂基介电复合材料的制备和性能研究

以环氧树脂(EP)为基体树脂、经硅烷偶联剂改性后的压电陶瓷钛酸钡(BaTiO3)为增强填料,采用浇铸法制备了有机/无机介电复合材料。研究了填料用量对复合材料介电性能、力学性能和热性能的影响。实验结果表明,BaTiO3能显著提高材料的介电常数,当w(BaTiO3)=60%时,复合材料的介电常数为23.6,比纯EP的介电常数(4.0)提高了近6倍,而且复合材料的介电常数受频率影响较小,具有较好的频率稳定性;随着BaTiO3含量的增加,材料的弯曲强度和冲击强度都呈先增后减的趋势,最大弯曲强度和冲击强度分别为123.8 MPa和26.3 kJ/m2;材料的热稳定性研究表明,材料的起始热分解温度随着BaTiO3含量的增加而提高,材料的耐热性能得到改善。     

丁腈基聚氨酯/芳纶浆粕纤维复合材料的结构与性能

以端羟基聚丁二烯-丙烯腈、甲苯二异氰酸酯、扩链剂2,4/2,6-二氨基-3,5-二甲硫基甲苯为原料,芳纶浆粕纤维为填料制备丁腈基聚氨酯(PBA-PU)/芳纶浆粕纤维复合材料,并对其结构和性能进行了研究。结果表明,扫描电子显微镜显示芳纶浆粕纤维与PBA-PU基体结合得很好。随着芳纶浆粕纤维用量的增加,拉伸强度和撕裂强度先增大后降低,当其质量为0.5份左右(以预聚体为100份计)时,复合材料力学性能最佳;芳纶浆粕纤维的加入使PBA-PU复合材料的耐热性明显提高,而玻璃化转变温度下降,损耗因子降低。     

Thermal and air permeation properties of a carbon fiber/toughened epoxy based prepreg system

This study addresses thermal and air permeation properties of a new toughened prepreg system. Voids in the uncured prepreg structure can affect the void content in the final composite structure. A new, toughened prepreg system, commercially available for aircraft structural application, was utilized in this study. The prepreg was subjected to thermal and rheological characterization to understand the basic prepreg properties. These experiments were followed by a prepreg air permeation study to investigate prepreg processing and its influence on the prepreg structure. Crosslinking of the resin matrix was monitored with prepreg specimens without extracting resin from the prepreg. Along with thermal property measurements, the air flow rate significantly decreased in initial static experiments, followed by equilibrium permeability values. An air permeation model divided the air permeability into intralaminar and interlaminar permeabilities. Interlaminar air permeation was found to be more pronounced than intralaminar air permeation in this particular prepreg system. These permeation measurement results were explained using optical microscopy, proving that the application of vacuum could eliminate significant porosity in the laminate. Collectively, understanding prepreg thermal and air permeation properties was considered to be important; the voids in uncured prepreg may cause the voids in the final composite structure. Voids in the prepreg can be attributed to the heterogeneity and anisotropy of the toughened prepreg structure, resulting from particular prepreg processing techniques. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 65: 5–16, 1997     

Influence of silicon carbide filler on mechanical and dielectric properties of glass fabric reinforced epoxy composites

Fiber‐reinforced polymeric composites (FRPCs) have emerged as an important material for automotive, aerospace, and other engineering applications because of their light weight, design flexibility, ease of manufacturing, and improved mechanical performance. In this study, glass‐epoxy (G‐E) and silicon carbide filled glass‐epoxy (SiC‐G‐E) composite systems have been fabricated using hand lay‐up technique. The mechanical properties such as tensile strength, tensile modulus, elongation at break, flexural strength, and hardness have been investigated in accordance with ASTM standards. From the experimental investigations, it has been found that the tensile strength, flexural strength, and hardness of the glass reinforced epoxy composite increased with the inclusion of SiC filler. The results of the SiC (5 wt %)‐G‐E composite showed higher mechanical properties compared to G‐E system. The dielectric properties such as dielectric constant (permittivity), tan delta, dielectric loss, and AC conductivity of these composites have been evaluated. A drastic reduction in dielectric constant after incorporation of conducting SiC filler into epoxy composite has been observed. Scanning electron microscopy (SEM) photomicrographs of the fractured samples revealed various aspects of the fractured surfaces. The failure modes of the tensile fractured surfaces have also been reported. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009