Physical properties of high pressure reactively sputtered hafnium oxide

Hafnium oxide films were deposited on silicon by High Pressure Reactive Sputtering (HPRS) at pressures between 0.8 and 1.6 mbar. Growth, composition and morphology were investigated using Transmission Electron Microscopy (TEM), Heavy Ion Elastic Recoil Detection Analysis (HI-ERDA), Fourier Transform Infrared spectroscopy (FTIR) and X-Ray Diffraction (XRD). The growth rate was found to decrease exponentially with deposition pressure. The films showed a monoclinic polycrystalline structure, with higher grain size for intermediate pressures. All the films were slightly oxygen rich with respect to stoichiometric HfO₂, which is attributed to the oxygen plasma. Additionally, it was observed the formation of an interfacial silicon oxide layer, with a minimum thickness for deposition pressures around 1.2 mbar. These results are explained by the oxidation action of the oxygen plasma and the diffusion of oxygen through the grain boundaries of the HfO₂ film.     

Interfacial layer growth of ZrO2 films on silicon

In this work, the interfacial layer growth for both as-deposited and annealed ZrO₂ thin films on silicon is analyzed in detail by the high-resolution cross-sectional transmission electron microscope and spectroscopic ellipsometry. For as-deposited ZrO₂/SiO₂/Si, the thickness of a SiO₂-like layer at the silicon interface was found to depend on the oxygen partial pressure during deposition. At oxygen partial pressure ratio of above 50% the interfacial silicon oxide thickness increased through oxygen diffusion through the ZrO₂ film and silicon consumption at the interface. At oxygen partial pressure ratio in the range 7-50%, the visible growth of interfacial silicon oxide layer was not present. The interfacial layer for ZrO₂/Si with optimal partial pressure (15%) during annealing at 600 °C was found to be the two-layer structure composed of the ZrSi_xO_y overlayer and the SiO_x downlayer. The formation of the interfacial layer is well accounted for diffusion mechanisms involving Si indiffusion and grain-boundary diffusion.     

Synthesis and characterization of HfO2 and ZrO2 thin films deposited by plasma assisted reactive pulsed laser deposition at low temperature

A plasma assisted reactive pulsed laser deposition process was demonstrated for low-temperature deposition of thin hafnia (HfO₂) and zirconia (ZrO₂) films from metallic hafnium or zirconium with assistance of an oxygen plasma generated by electron cyclotron resonance microwave discharge. The structure and the interface of the deposited films on silicon were characterized by means of Fourier transform infrared spectroscopy, which reveals the monoclinic phases of HfO₂ and ZrO₂ in the films with no interfacial SiO_x layer between the oxide film and the Si substrate. The optical properties of the deposited films were investigated by measuring the refractive indexes and extinction coefficients with the aid of spectroscopic ellipsometry technique. The films deposited on fused silica plates show excellent transparency from the ultraviolet to near infrared with sharp ultraviolet absorption edges corresponding to direct band gap.     

Investigation of the effect of different oxygen partial pressure to LaAlO3 thin film properties and resistive switching characteristics

The pulsed laser deposition and growth of a high-k dielectric lanthanum aluminate LaAlO₃ (LAO) thin film on indium tin oxide/glass substrate at different oxygen partial pressure was studied. Based on the pulsed laser deposition growth mechanism, we explain how a difference in the oxygen partial pressure influences the surface roughness, formation of an interfacial layer, and the transparent resistive switching characteristics of LAO thin films. The micro-structure and oxygen concentration difference inside LAO thin films may be the main reason for the difference in electrical and resistive switching properties. Films grown at higher oxygen partial pressure displayed more reliable resistive switching performance, due to the formation of the interfacial layer and a lower concentration of oxygen vacancies. The interfacial layer serves as a good oxygen reservoir and the involvement of more oxygen ions ensures the switching reliability. The migration of oxygen ions between the interfacial layer and the LAO film under applied bias may be the switching mechanism.     

射频磁控反应溅射制备Al2O3薄膜的工艺研究

采用射频磁控反应溅射法,以高纯Al为靶材,高纯O2为反应气体,在不锈钢和单晶Si基片上成功地制备了氧化铝(Al2O3)薄膜,并对氧化铝薄膜的沉积速率、结构和表面形貌进行了研究.结果表明,沉积速率随着射频功率的增大先几乎呈线性增大而后缓慢增大;随着溅射气压的增加,沉积速率先增大,在一定气压时达到峰值后继续随气压增大而减小,同时随着靶基距的增大而减小;随着氧气流量的不断增加,靶面溅射的物质从金属态过渡到氧化物态,沉积速率也随之不断降低.X射线衍射图谱表明薄膜结构为非晶态;用原子力显微镜对薄膜表面形貌观察,薄膜微结构为柱状.     

An examination of the reactive sputtering of silicon nitride on to gallium arsenide

The deposition of silicon nitride thin films by the reactive sputtering of elemental silicon in a nitrogen/argon plasma has been investigated. The composition of the thin films has been examined using infra-red reflectance, X-ray photoelectron and Auger electron spectroscopies and spark source mass spectrometry. Oxygen has been found to be a major contaminant in these sputter deposited films, the oxygen concentration depending on the ambient gas pressure. The use of the silicon oxy-nitride films as annealing encapsulants for the activation of silicon ion implanted semi-insulating gallium arsenide has also been investigated.     

Investigation of the aluminum oxide/Si(1 0 0) interface formed by chemical vapor deposition

Thin films of aluminum oxide were deposited using trimethylaluminum and oxygen. The deposition rate was found to decrease with increasing temperature. Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy (XPS) were used to investigate the film/substrate interface. When dry O₂ was used during deposition, the film/substrate interface was free of any silicon dioxide or aluminum silicate phase. On annealing the as-deposited films in Ar, a layer of silicon dioxide film formed at the interface. XPS results indicated that the O/Al ratio in the as-deposited films was higher than that in stoichiometric Al₂O₃. However, the ratio was found to decrease in the annealed samples suggesting that excess oxygen present in the deposited films is responsible for the formation of interfacial silicon dioxide layer. Interfacial phase formation was observed in the as-deposited samples, when small amounts of ozone along with oxygen were used as the oxygen precursor.     

Extension of Far UV spectroscopic ellipsometry studies of High-κ dielectric films to 130 nm

Next generation CMOS devices use a high-κ dielectric layer (HfO₂, HfSiO, HfSiON and La₂O₃) grown on thin interfacial silicon dioxide as the gate dielectric. The higher dielectric constant of the Hf oxide based film stack allows a decrease in equivalent oxide thickness (EOT). Because the high-κ film stack has a greater physical thickness than an electrically equivalent SiO₂ film, the tunneling current decreases. It is a critical metrology requirement to measure the thickness of silicon dioxide and high-κ film stacks. Spectroscopic ellipsometry (SE) in the far UV wavelength region can be used to differentiate the high-κ films from silicon dioxide. This is due to the non-zero nature of the imaginary part of the dielectric function (beyond 6 eV) in the far UV region for high-κ films. There has been some conjecture that optical studies should be extended beyond 150 nm further into the VUV. This study addresses these concerns through determination of the dielectric function down to 130 nm. We show the fitted dielectric function of hafnium silicates and lanthanum oxide down to 130 nm. X-ray reflectivity (XRR) measurements were also performed on the high-κ films to complement the thickness measurements performed with SE.     

Electrical properties of ultra-thin oxynitrided layer using N2O plasma in inductively coupled plasma chemical vapor deposition for non-volatile memory on glass

In this work, the silicon oxynitride layer was studied as a tunneling layer for non-volatile memory application by fabricating low temperature polysilicon thin film transistors on glass. Silicon wafers were oxynitrided by only nitrous oxide plasma under different radio frequency powers and plasma treatment times. Plasma oxynitridation was performed in RF plasma using inductively coupled plasma chemical vapor deposition. The X-ray energy dispersive spectroscopy was employed to analyze the atomic concentration ratio of nitrogen/oxygen in oxynitride layer. The oxynitrided layer formed under radio frequency power of 150 W and substrate temperature of 623 K was found to contain the atomic concentration ratio of nitrogen/oxygen as high as 1.57. The advantage of high nitrogen concentration in silicon oxide layer formed by using nitrous oxide plasma was investigated by capacitance-voltage measurement. The analysis of capacitance-voltage characteristics demonstrated that the ultra-thin oxynitride layers of 2 nm thickness formed by only nitrous oxide plasma have good properties as tunneling layer for non-volatile memory device.     

A study of structural transition in nanocrystalline titania thin films by X-ray diffraction Rietveld method

Structural and microstructural analyses of nanocrystalline titania thin films prepared by pulsed laser deposition have been carried out. At lower oxygen partial pressures (≤10⁻⁴ mbar), rutile films were formed, whereas at 1.2 × 10⁻³ mbar of oxygen partial pressure, the thin films contained both rutile and anatase phases. At 0.04 and 0.05 mbar of oxygen partial pressure, the film was purely anatase. Addition of oxygen has also shown a profound influence on the surface morphology of the as deposited titania films. Modified Rietveld method has been used to determine crystallite size, root mean square strain and fractional coordinates of oxygen of the anatase films. The influence of crystallite size and strain on the rutile to anatase phase transition is investigated.     

Electrical resistivity of Ti-Zn mixed oxide thin films deposited by atomic layer deposition

Ti-Zn mixed oxide thin films, with thickness less than 50 nm, were grown with atomic layer deposition (ALD) technique at low temperature (90 °C) varying the composition. ALD is a powerful chemical technique to deposit thin films with thickness of few atomic layers. ALD oxide material growth is achieved by dosing sequentially the metal precursor and the oxidizing agent. Thanks to ALD nature of layer by layer growth it was possible to realize mixed metal, Ti and Zn, oxide thin films with controlled composition, simply by changing the number of cycles of each metal oxide layer. Structural and electrical properties of the prepared thin films were studied as a function of their composition. Synchrotron radiation X-ray diffraction technique was used to follow thin film crystallization during sample annealing, performed in situ. It was observed that the onset temperature of crystallization raises with Ti content, and sample structure was Zn₂TiO4 phase. Electrical resistivity measurements were performed on crystalline samples, annealed at 600 °C, revealing an increase in resistivity with Ti content.     

ZnO thin films prepared by pulsed laser deposition

Zinc oxide (ZnO) thin films were deposited on soda lime glass substrates by pulsed laser deposition (PLD) in an oxygen-reactive atmosphere. The structural, optical, and electrical properties of the as-prepared thin films were studied in dependence of substrate temperature and oxygen pressure. High quality polycrystalline ZnO films with hexagonal wurtzite structure were deposited at substrate temperatures of 100 and 300 °C. The RMS roughness of the deposited oxide films was found to be in the range 2-9 nm and was only slightly dependent on substrate temperature and oxygen pressure. Electrical measurements indicated a decrease of film resistivity with the increase of substrate temperature and the decrease of oxygen pressure. The ZnO films exhibited high transmittance of 90% and their energy band gap and thickness were in the range 3.26-3.30 eV and 256-627 nm, respectively.     

Angle resolved X-ray photoemission spectroscopy double layer model for in situ characterization of metal organic chemical vapour deposition nanometric films

In situ Angle Resolved X-ray Photoemission Spectroscopy (ARXPS) characterizations of TiO₂ thin films grown on silicon by Metal Organic Chemical Vapour Deposition were performed in order to get information on interfacial reactions at the first stages of the growth, one of the aims being to understand the influence of deposition conditions. Thickness measurements were also carried out from ARXPS analyses. As the real structure of the films was shown to be a double layer system such as TiO₂/SiO₂/Si, an ARXPS model of thickness and surface coverage determination was applied to each layer independently. However, the application of this model to very thin films underestimates the surface coverage of the interfacial layer. A “Double Layer” model taking into account the attenuation of the silicon oxide and substrate signals by the external layer was also developed.     

Plasma-enhanced chemical vapor deposition of TiO2 thin films for dielectric applications

Amorphous TiO₂ thin films were formed by plasma-enhanced chemical vapor deposition (PECVD) from mixtures of titanium IV isopropoxide (Ti(O-i-C₃H₇)₄) and oxygen. The deposition rate was found to be weakly activated, with an apparent activation energy of 4.5 kJ/mol. The deposition rate increased with equivalence ratio and decreased with plasma power. This dependence on atomic oxygen density was consistent with behavior observed in other metal oxide PECVD systems. Metal-insulator-silicon devices were fabricated, and characterized using capacitance-voltage measurements. The apparent dielectric constant of the TiO₂ thin films increased from 15 to 82 with film thickness. The observed variations were consistent with the formation of an interfacial SiO₂ layer. Assuming that a TiO₂/SiO₂ bilayer behaves as two capacitors in series, an intrinsic TiO₂ dielectric constant of 82 ± 10 and an interfacial SiO₂ layer thickness of 3 ± 1 nm were extracted from electrical measurements.     

Durability of nanosized oxygen-barrier coatings on polymers

Research on silicon oxide thin films developed as gas-barrier protection for polymer-based components is reviewed, with attention paid to the relations between (i) coating defects, cohesive strength and internal stress state, and (ii) interfacial interactions and related adhesion to the substrate. The deposition process of the oxide from a vapor or a plasma phase leads in both cases to the formation of covalent bonds between the two materials, with high adhesion levels. The oxide coating contains nanoscopic defects and microscopic flaws, and their respective effect on the barrier performance and mechanical resistance of the coating is analyzed. Potential improvements are discussed, including the control of internal stresses in the coating during deposition. Controlled levels of compressive internal stresses in the coating are beneficial to both the barrier performance and the mechanical reliability of the coated polymer. An optimal coating thickness, with low oxygen permeation and high cohesive strength, is determined from experimental and theoretical analyses of the failure mechanisms of the coating under mechanical load. These investigations are found relevant to tailor the interactions and stress state in the interfacial region, in order to improve the reliability of the coating/substrate assembly.     

Tailoring of the morphology and chemical composition of thin organosilane microwave plasma polymer layers on metal substrates

The growth of thin microwave organosilicon plasma polymers on model zinc surfaces was investigated as a function of the film thickness and the oxygen partial pressure during film deposition. The evolution of the topology of the film was studied by atomic force microscopy (AFM). The nano- and micro-roughness was investigated at the inner and the outer surfaces of the plasma polymers. A special etching procedure was developed to reveal the underside of the plasma polymer and thereby its inner surface. Rough films contained voids at the interface, which reduced the polymer/metal contact area. The increase in oxygen partial pressure led to a smoother film growth with a perfect imitation of the substrate topography at the interface. The chemical structure of the films was determined by infrared reflection absorption spectroscopy (IRRAS), X-ray photoelectron spectroscopy and time-of-flight secondary ion mass spectroscopy (ToF-SIMS). ToF-SIMS at the outer and the inner surface of the plasma polymers showed that the density of methylsilyl groups increases in the outer surface layer of the plasma polymer and depends on the oxygen partial pressure. The chemical composition of the films could be altered to pure SiO₂ without changing the morphology by using oxygen-plasma post-treatment. This was proved by means of IRRAS and AFM. Chemistry and topology of the films were correlated with the apparent water contact angle. It was found that a linear relationship exists between the nanoscopic roughness of the plasma polymer and the static contact angle of water. Superposition of a nanoscopic roughness of the metal surface and the nanoscopic roughness of methylsilyl-rich films led to ultra-hydrophobic films with water contact angles up to 160°.     

Morphological, optical and electrical properties of samarium oxide thin films

We present here results on samarium oxide thin films, obtained by pulsed laser deposition and by radio frequency assisted pulsed laser deposition. Three different substrate types were used: silicon, platinum covered silicon and titanium covered silicon. The influence of the deposition parameters (oxygen pressure and laser fluence) on the structure and morphology of the thin films was studied. The substrate-thin film interface zone was investigated; the optical and electrical properties (the losses, dielectric constant and leakage currents) were also determined.     

A ZnO/PET assembly study: Optimization and investigation of the interface region

Zinc oxide thin films are deposited on polyethylene terephthalate (PET) by r.f. magnetron sputtering process from a ceramic target in oxygen–argon plasmas. Structural studies show that the thin films are highly oriented along the (0 0 2) direction of the würtzite phase when the oxygen partial pressure is lower than 0.2 Pa. The crystallinity is accentuated when the oxygen partial pressure of the sputtering gas is increased from 0 to 0.02 Pa. The composition of the films determined by Rutherford backscattering spectrometry (RBS) varies in a wide range and it is necessary to add a few amount of oxygen in the plasma composition to establish the stoichiometry. The oxygen partial pressure is found to influence also the microstructure and consequently the density of the coatings.Various cold plasmas are used to treat the polymer surface before the deposition of zinc oxide films. Wettability measurements show an increase in the polar component of the PET surface free energy whatever the nature of the plasma used for the treatment. This increase is more obvious with the carbon dioxide plasma. XPS examinations of the CO₂ plasma treated PET surface in optimized conditions show a functionalisation of the polymer surface. The carbon dioxide plasma treatments of PET surface are found to enhance the peeling energy. The adhesion level depends also on the sputtering parameters, mainly the oxygen partial pressure and the r.f. power which influence the coating properties. The zinc oxide/PET interface is studied by XPS at the different stages of deposition and at various take-off angles. AFM observations show a regular growth of zinc oxide layers with smooth topographies on PET films. The different findings obtained from C1s, O1s, Zn2p3/2, Zn3p peaks and Auger Zn L₃M_4.5M_4.5 peak are corroborated and discussed. New chemical bonds between the polymer and the further coming zinc oxide thin layer are evidenced.     

Highly conductive p-type nanocrystalline silicon films deposited by RF-PECVD using silane and trimethylboron mixtures at high pressure

In this paper we present a study of boron-doped nc-Si:H films prepared by PECVD at high deposition pressure (≥4 mbar), high plasma power and low substrate temperature (≤200 °C) using trimethylboron (TMB) as a dopant gas. The influence of deposition parameters on electrical, structural and optical properties is investigated. We determine the deposition conditions that lead to the formation of p-type nanocrystalline silicon thin films with very high crystallinity, high value of dark conductivity (>7 (Ω cm)⁻¹) and high optical band gap (≥1.7 eV). Modeling of ellipsometry spectra reveals that the film growth mechanism should proceed through a sub-surface layer mechanism that leads to silicon crystallization.The obtained films are very good candidates for application in amorphous and nanocrystalline silicon solar cells as a p-type window layer.     

On the preparation of PLZT thin films grown by pulsed laser deposition

Polycrystalline PLZT thin films have been grown onto glass slides substrate, from a sintered stoichiometric 9/65/35 commercial target, by using a Nd:YAG laser (1064 nm, 7 ns, 10 Hz). The substrate temperature and oxygen pressure were varied during the deposition, as was the post-deposition annealing temperature in order to achieve stoichiometric films with a perovskite structure and with a composition near the ratio 9/65/35. Perovskite PLZT is formed around the substrate temperature of 500°C and oxygen pressure of ∼0.5 mbar after annealing at 580°C during 90 min. The pyrochlore structure, on the other hand, is always formed in the films during the deposition. However, this structure disappear for annealing temperatures above 550°C, for the films grown at oxygen pressure in the range 0.5–1 mbar and temperature deposition above 450°C. The degree of crystallinity and the structure present in the films is correlated with the deposition conditions. The influence of post-deposition annealing conditions on the formation of perovskite PLZT structure and optical transparency of the films is also discussed.