Simulation and implementation of a porous silicon reflector for epitaxial silicon solar cells

One of the main challenges in the ongoing development of thin film crystalline silicon solar cells on a supporting silicon substrate is the implementation of a long‐wavelength reflector at the interface between the epitaxial layer and the substrate. IMEC has developed such a reflector based on electrochemical anodization of silicon to create a multi‐layer porous silicon stack with alternating high and low porosity layers. This innovation results in a 1–2% absolute increase in efficiency for screenprinted epitaxial cells with a record of 13·8%. To reach a better understanding of the reflector and to aid in its continued optimization, several extensive optical simulations have been performed using an in‐house‐developed optical software programme. This software is written as a Microsoft Excel workbook to make use of its user‐friendliness and modular structure. It can handle up to 15 individual dielectric layers and is used to determine the influence of the number and the sequence of the layers on the internal reflection. A sensitivity analysis is also presented. A study of the angle at which the light strikes the reflector shows separate regions in the physical working of the reflector which include a region where the Bragg effect is dominant as well as a region where total internal reflection plays the largest role. The existence of these regions is proved using reflection measurements. Based on these findings, an estimate is made for the achievable current gain with an ideal reflector and the potential of epitaxial silicon solar cells is determined. Copyright © 2008 John Wiley & Sons, Ltd.     

>16% thin‐film epitaxial silicon solar cells on 70‐cm2 area with 30‐µm active layer,porous silicon back reflector,and Cu‐based top‐contact metallization

We demonstrate the use of a copper‐based metallization scheme for the specific application of thin‐film epitaxial silicon wafer equivalent (EpiWE) solar cells with rear chemical vapor deposition emitter and conventional POCl₃ emitter. Thin‐film epitaxial silicon wafer equivalent cells are consisting of high‐quality epitaxial active layer of only 30 µm, beneath which a highly reflective porous silicon multilayer stack is embedded. By combining Cu‐plating metallization and narrow finger lines with an epitaxial cell architecture including the porous silicon reflector, a J_sc exceeding 32 mA/cm² was achieved. We report on reproducible cell efficiencies of >16% on >70‐cm² cells with rear epitaxial chemical vapor deposition emitters and Cu contacts. Copyright © 2011 John Wiley & Sons, Ltd.     

Heterojunction solar cells with 23% efficiency on n‐type epitaxial kerfless silicon wafers

We present a heterojunction (HJ) solar cell on n‐type epitaxially grown kerfless crystalline‐silicon with an in‐house‐measured conversion efficiency of 23%. The total cell area is 243.4 cm². The cell has a short‐circuit current density of 39.6 mA cm⁻², an open‐circuit voltage of 725 mV, and a fill factor of 0.799. The effect of stacking faults (SFs) is examined by current density (J) mapping measurements as well as by spectral response mapping. The J mapping images show that the localized lower J regions of the HJ solar cells are associated with recombination sites originating from SFs, independent of whether SFs are formed on the emitter or absorber side. The solar cell results and our analysis suggest that epitaxially grown wafers based on kerfless technology could be an alternative for low‐cost industrial production of Si HJ solar cells. Copyright © 2016 John Wiley & Sons, Ltd.     

Efficiency (>15%) for thin‐film epitaxial silicon solar cells on 70 cm2 area offspec silicon substrate using porous silicon segmented mirrors

We report on the beneficial use of embedded segmented porous silicon broad‐band optical reflectors for thin‐film epitaxial silicon solar cells. These reflectors are formed by gradual increase of the spatial period between the layer segments, allowing for an enhanced absorption of low energy photons in the epitaxial layer. By combining these reflectors with well‐established solar cell processing by photolithography, a conversion efficiency of 15·2% was reached on 73 cm² area, highly doped offspec multicrystalline silicon substrates. The corresponding photogenerated current densities (J_sc) were well above 31 mA/cm² for an active layer of only 20 µm. Copyright © 2010 John Wiley & Sons, Ltd.     

Broadband light trapping with disordered photonic structures in thin‐film silicon solar cells

We theoretically investigate light trapping with disordered 1D photonic structures in thin‐film crystalline silicon solar cells. The disorder is modelled in a finite‐size supercell, which allows the use of rigorous coupled‐wave analysis to calculate the optical properties of the devices and the short‐circuit current density J_sc. The role of the Fourier transform of the photonic pattern in the light trapping is investigated, and the optimal correlation between size and position disorder is found. This result is used to optimize the disorder in a more effective way, using a single parameter. We find that a Gaussian disorder always enhances the device performance with respect to the best ordered configuration. To properly quantify this improvement, we calculate the Lambertian limit to the absorption enhancement for 1D photonic structures in crystalline silicon, following the previous work for the 2D case [M.A. Green, Progr. Photovolt: Res. Appl. 2002; 10 (4), pp. 235–241]. We find that disorder optimization can give a relevant contribution to approach this limit. Finally, we propose an optimal disordered 2D configuration and estimate the maximum short‐circuit current that can be achieved, potentially leading to efficiencies that are comparable with the values of other thin‐film solar cell technologies. Copyright © 2013 John Wiley & Sons, Ltd.     

Screen‐printed epitaxial silicon thin‐film solar cells with 13·8% efficiency

Amidst the different silicon thin‐film systems, the epitaxial thin‐film solar cell represents an approach with interesting potential. Consisting of a thin active c‐Si layer grown epitaxially on top of a low‐quality c‐Si substrate, it can be implemented into solar cell production lines without major changes in the current industrial process sequences. Within this work, ∼30‐μm‐thick epitaxial layers on non‐textured and highly doped monocrystalline Czochralski (Cz) and multicrystalline (mc) Si substrates have been prepared by CVD. Confirmed efficiencies of 13·8% on Cz and 12·3% on mc‐Si substrates have been achieved by applying an industrial process scheme based on tube and in‐line phosphorus diffusion, as well as screen‐printed front and back contacts fired through a SiN_x anti‐reflection coating. An extensive solar cell characterisation, including infrared lock‐in thermography and spectral response measurements is presented. Copyright © 2003 John Wiley & Sons, Ltd.     

Boron‐doped hydrogenated silicon carbide alloys containing silicon nanocrystallites for highly efficient nanocrystalline silicon thin‐film solar cells

Boron‐doped hydrogenated silicon carbide alloys containing silicon nanocrystallites (p‐nc‐SiC:H) were prepared using a plasma‐enhanced chemical vapor deposition system with a mixture of CH₄, SiH₄, B₂H₆ and H₂ gases. The influence of hydrogen dilution on the material properties of the p‐nc‐SiC:H films was investigated, and their roles as window layers in hydrogenated nanocrystalline silicon (nc‐Si:H) solar cells were examined. By increasing the R_H (H₂/SiH₄) ratio from 90 to 220, the Si―C bond density in the p‐nc‐SiC:H films increased from 5.20 × 10¹⁹ to 7.07 × 10¹⁹/cm³, resulting in a significant increase of the bandgap from 2.09 to 2.23 eV in comparison with the bandgap of 1.95 eV for p‐nc‐Si:H films. For the films deposited at a high R_H ratio, the Si nanocrystallites with a size of 3–15 nm were formed in the amorphous SiC:H matrix. The Si nanocrystallites played an important role in the enhancement of vertical charge transport in the p‐nc‐SiC:H films, which was verified by conductive atomic force microscopy measurements. When the p‐nc‐SiC:H films deposited at R_H = 220 were applied in the nc‐Si:H solar cells, a high conversion efficiency of 8.26% (V_oc = 0.53 V, J_sc = 23.98 mA/cm² and FF = 0.65) was obtained compared to 6.36% (V_oc = 0.44 V, J_sc = 21.90 mA/cm² and FF = 0.66) of the solar cells with reference p‐nc‐Si:H films. Further enhancement in the cell performance was achieved using p‐nc‐SiC:H bilayers consisting of highly doped upper layers and low‐level doped bottom layers, which led to the increased conversion efficiency of 9.03%. Copyright © 2015 John Wiley & Sons, Ltd.     

Series resistance characterization of industrial silicon solar cells with screen‐printed contacts using hotmelt paste

This work presents the results of a detailed series resistance characterization of silicon solar cells with screen‐printed front contacts using hotmelt silver paste. Applying the hotmelt technology energy conversion efficiencies up to 18·0% on monocrystalline wafers with a size of 12·5 cm × 12·5 cm have been achieved, an increase of 0·3% absolute compared to cells with conventional screen‐printed contacts. This is mainly due to the reduction in the finger resistance to values as low as 14 Ω/m, which reduces the series resistance of the solar cell significantly. To retrieve the lumped series resistance as accurately as possible under the operating condition, different determination methods have been analyzed. Methods under consideration were fitting of the two‐diode equation function to a dark IV‐curve, integration of the area A under an IV‐curve, comparison of a j_sc–V_oc with a one‐sun IV‐curve, comparison of the j_sc and V_oc points of a shaded curve with the one‐sun IV‐curve as well as comparison of a dark IV‐curve with a one‐sun IV‐curve, and comparison of IV‐curves measured at different light intensities. The performed investigations have shown that the latter four methods all resulted in reliable series resistance values. Copyright © 2007 John Wiley & Sons, Ltd.     

19% efficient n‐type Czochralski silicon solar cells with screen‐printed aluminium‐alloyed rear emitter

High and stable lifetimes recently reported for n‐type silicon materials are an important and promising prerequisite for innovative solar cells. To exploit the advantages of the excellent electrical properties of n‐type Si wafers for manufacturing simple and industrially feasible high‐efficiency solar cells, we focus on back junction n⁺np⁺ solar cells featuring an easy‐to‐fabricate full‐area screen‐printed aluminium‐alloyed rear p⁺ emitter. Independently confirmed record‐high efficiencies have been achieved on n‐type phosphorus‐doped Czochralski‐grown silicon material: 18·9% for laboratory‐type n⁺np⁺ solar cells (4 cm²) with shadow‐mask evaporated front contact grid and 17·0% for front and rear screen‐printed industrial‐type cells (100 cm²). The electrical cell parameters were found to be perfectly stable under illumination. Copyright © 2006 John Wiley & Sons, Ltd.     

Nanoparticle‐enhanced light trapping in thin‐film silicon solar cells

A systematic investigation of the nanoparticle‐enhanced light trapping in thin‐film silicon solar cells is reported. The nanoparticles are fabricated by annealing a thin Ag film on the cell surface. An optimisation roadmap for the plasmon‐enhanced light‐trapping scheme for self‐assembled Ag metal nanoparticles is presented, including a comparison of rear‐located and front‐located nanoparticles, an optimisation of the precursor Ag film thickness, an investigation on different conditions of the nanoparticle dielectric environment and a combination of nanoparticles with other supplementary back‐surface reflectors. Significant photocurrent enhancements have been achieved because of high scattering and coupling efficiency of the Ag nanoparticles into the silicon device. For the optimum light‐trapping scheme, a short‐circuit current enhancement of 27% due to Ag nanoparticles is achieved, increasing to 44% for a “nanoparticle/magnesium fluoride/diffuse paint” back‐surface reflector structure. This is 6% higher compared with our previously reported plasmonic short‐circuit current enhancement of 38%. Copyright © 2011 John Wiley & Sons, Ltd.     

Characterisation of rough reflecting substrates incorporated into thin‐film silicon solar cells

Four different categories of rough reflecting substrates as well as a single periodic grating are incorporated and tested within n‐i‐p type amorphous silicon (a‐Si:H) solar cells. Each category is characterised by its own texture shape; dimensions were varied within the categories. Compared to flat reflecting substrates, gains in short‐circuit current density (J_sc) up to 20% have been obtained on rough reflecting plastic substrates. As long as (1) the characteristic dimensions of the textures are lower than the involved light wavelengths, (2) the textures do not present any defects i.e. as long as they do not have large craters or bumps spread over the surface, the root mean square roughness (δ_RMS) as well as the ratio of average feature height to average period can be used to evaluate the gain in J_sc; if each category of randomly textured substrates is considered separately, the haze factor can be used to estimate δ_RMS and thereby the gains in J_sc. Copyright © 2006 John Wiley & Sons, Ltd.     

Gettering in multicrystalline silicon wafers with screen‐printed emitters

In this paper, the gettering potential of phosphorus dopant pastes used in single‐sided screen‐printing processes is investigated including the consequences for essential solar cell parameters. These results are supported by minority carrier lifetime measurements with the quasi‐steady‐state photoconductance method and certified by the analysis of the recombination current density in solar cells on mc‐Si wafers. Copyright © 2011 John Wiley & Sons, Ltd.     

Lambertian matched absorption enhancement in PECVD poly‐Si thin film on aluminum induced textured glass superstrates for solar cell applications

This paper examines the effectiveness of a range of aluminum induced textured (AIT) glass topographies at enhancing light absorption in silicon thin film diode structures deposited on the textured glass side, operating in the superstrate configuration. The aluminum layer used to produce the AIT can be deposited either by thermal evaporation or magnetron sputtering. Varying AIT process parameters produces a wide range of feature roughness and uniformity, providing scope to optimize texture effectiveness and process repeatability. We report strong correlation between the degree of absorption enhancement from these textures and both dark field microscope images of the AIT glass and reduction of the interference envelope in spectral reflectance of the deposited silicon films. Our findings corroborate earlier modeling work based on ray tracing, which predicted that the best enhancement occurs when the feature size is close to the film thickness. In this paper we investigate AIT samples in the 1 – 3 µm film thickness range, some of which trap light in silicon as strongly as at the Lambertian limit. Copyright © 2010 John Wiley & Sons, Ltd.     

High efficiency large area n‐type front junction silicon solar cells with boron emitter formed by screen printing technology

In this paper, we report on commercially viable screen printing (SP) technology to form boron emitters. A screen‐printed boron emitter and ion‐implanted phosphorus back surface field were formed simultaneously by a co‐annealing process. Front and back surfaces were passivated by chemically grown oxide capped with plasma‐enhanced chemical vapor deposition silicon nitride stack. Front and back contacts were formed by traditional SP and firing processes with silver/aluminum grid on front and local silver back contacts on the rear. This resulted in 19.6% efficient large area (239 cm²) n‐type solar cells with an open‐circuit voltage V_oc of 645 mV, short‐circuit current density J_sc of 38.6 mA/cm², and fill factor of 78.6%. This demonstrates the potential of this novel technology for production of low‐cost high‐efficiency n‐type silicon solar cells. Copyright © 2014 John Wiley & Sons, Ltd.     

Polycrystalline silicon thin‐film solar cells on glass by aluminium‐induced crystallisation and subsequent ion‐assisted deposition (ALICIA)

A research project is under way at The University of New South Wales aiming at the realisation of a novel type of polycrystalline silicon thin‐film solar cell on glass. The idea is to first create a thin large‐grained polycrystalline seed layer on glass by aluminium‐induced crystallisation of amorphous silicon and then to epitaxially thicken the seed layer with ion‐assisted deposition. By mid‐2003 this ALICIA project had achieved laboratory cells with voltages of up to 163 mV, as reported elsewhere. In the present paper we give an overview of recent progress (improved Si epitaxy process, improved control of base doping profile due to the use of phosphorus dopants instead of gallium, hydrogen passivation) that has improved the voltages of ALICIA solar cells to 270 mV. Furthermore, the strategy for further voltage improvements is presented. At the present point in time only the voltages of ALICIA cells are known, but obviously solar cells also require current for good efficiency. Hence much improvement in both voltage and current is still needed. Copyright © 2004 John Wiley & Sons, Ltd.     

Electron‐beam crystallized large grained silicon solar cell on glass substrate

Thin film hetero‐emitter solar cells with large‐grained poly‐silicon absorbers of around 10 µm thickness have been prepared on glass. The basis of the cell concept is electron‐beam‐crystallization of an amorphous or nanocrystalline silicon layer deposited onto a SiC:B layer. The SiC:B layer covers a commercially well available glass substrate, serving as diffusion barrier, contact layer and dopand source. For silicon absorber deposition a low pressure chemical vapour deposition was used. The successively applied e‐beam crystallization process creates poly‐silicon layers with grain sizes up to 1 × 10 mm² with low defect densities. The high electronic quality of the absorber is reflected in open circuit voltages as high as 545 mV, which are realized making use of the well‐developed a‐Si:H hetero‐emitter technology. Copyright © 2011 John Wiley & Sons, Ltd.     

Diffusion‐based model of local Al back surface field formation for industrial passivated emitter and rear cell solar cells

In this work, the back surface field (BSF) formation of locally alloyed Al‐paste contacts employed in recent industrial passivated emitter and rear cell solar cell designs is discussed. A predictive model for resulting local BSF thickness and doping profile is proposed that is based on the time‐dependent Si distribution in the molten Al paste during the firing step. Diffusion of Si in liquid Al away from the contact points is identified as the main differentiator to a full‐area Al‐BSF; therefore, a diffusion‐based solution to the involved differential equation is pursued. Data on the Si distribution in the Al and the resulting BSF structures are experimentally obtained by firing samples with different metal contact geometries, peak temperature times and pastes as well as by investigating them by means of scanning electron microscopy and energy dispersive X‐ray spectroscopy. The Si diffusivity in the Al paste is then calculated from these results. It is found that the diffusivity is strongly dependent on the paste composition. Furthermore, the local BSF doping profiles and thicknesses resulting from different contact geometries and paste parameters are calculated from the Si concentration at the contact sites, the diffusivity and solubility data. These profiles are then used in a finite element device simulator to evaluate their performance on solar cell level. With this approach, a beneficial paste composition for any given rear contact geometry can be determined. Two line widths are investigated, and the effects of the different paste properties are discussed in the light of the solar cell results obtained by simulation. Copyright © 2013 John Wiley & Sons, Ltd.     

High‐efficiency microcrystalline silicon single‐junction solar cells

This short communication highlights our latest results towards high‐efficiency microcrystalline silicon single‐junction solar cells. By combining adequate cell design with high‐quality material, a new world record efficiency was achieved for single‐junction microcrystalline silicon solar cell, with a conversion efficiency of 10.69%, independently confirmed at ISE CalLab PV Cells. Such significant conversion efficiency could be achieved with only 1.8 µm of Si. Copyright © 2013 John Wiley & Sons, Ltd.     

Autodiffusion: a novel method for emitter formation in crystalline silicon thin‐film solar cells

The in situ formation of an emitter in monocrystalline silicon thin‐film solar cells by solid‐state diffusion of dopants from the growth substrate during epitaxy is demonstrated. This approach, that we denote autodiffusion, combines the epitaxy and the diffusion into one single process. Layer‐transfer with porous silicon (PSI process) is used to fabricate n‐type silicon thin‐film solar cells. The cells feature a boron emitter on the cell rear side that is formed by autodiffusion. The sheet resistance of this autodiffused emitter is 330 Ω/□. An independently confirmed conversion efficiency of (14·5 ± 0·4)% with a high short circuit current density of (33·3 ± 0·8) mA/cm² is achieved for a 2 × 2 cm² large cell with a thickness of (24 ± 1) µm. Transferred n‐type silicon thin films made from the same run as the cells show effective carrier lifetimes exceeding 13 µs. From these samples a bulk diffusion length L > 111 µm is deduced. Amorphous silicon is used to passivate the rear surface of these samples after the layer‐transfer resulting in a surface recombination velocity lower than 38 cm/s. Copyright © 2006 John Wiley & Sons, Ltd.