Synthesis and characterization of benzimidazole‐based low CTE block copolyimides

A series of block and random copolyimide films were synthesized from various molar ratios of two diamines, rigid 2‐(4‐aminophenyl)‐5‐aminobenzimidazole (APBI) and flexible 4,4′‐oxydianiline (ODA) by polycondensation with dianhydride 3,3′,4,4′‐biphenyltetracarboxylic dianhydride. The contents of APBI ranged from 10 to 60 mol % in copolyimides. The copolyimide films obtained by thermal imidization of poly(amic acid) solutions, were characterized by TMA, DMA, TGA, DSC, wide‐angle X‐ray diffraction, FTIR, tensile testing, water uptake (WU), and dielectric constant measurements. Rigid heterocyclic diamine APBI with interchain hydrogen bonding capability, led to low coefficient of thermal expansion (CTE), high T_g, high thermal stability and better mechanical properties. Increasing the APBI mol % caused a gradual decrease in the CTE and increase in T_g, thermal stability and tensile strength properties of the copolyimides films. Moreover, significantly enhanced thermal and mechanical properties of the block copolyimides were also found as compared to random copolyimides. The block copolyimide with APBI content of 60 mol %, achieved excellent properties, that is, a low CTE (4.7 ppm/K), a high T_g at 377°C, 5% weight loss at 562°C and a tensile strength at 198 MPa. This can be interpreted because of comparatively higher degree of molecular orientation in block copolyimides. These copolyimides also exhibited better dielectric constant and WU. This combination of properties makes them attractive candidates for base film materials in future microelectronics. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Preparation and properties of thermally stable copolyimides based on novel second‐order nonlinear–optical chromophore containing diamines

Thermally stable copolyimides were prepared from two novel second‐order nonlinear optical chromophores containing diamines, 4‐nitro‐4′‐[N‐(4,6‐di‐β‐aminoethylamino)‐1,3,5‐triazin‐2‐yl]aminoazobenzene (M1) and 4‐nitro‐4′‐[N‐(4,6‐di‐4‐aminophenylamino)‐1,3,5‐triazin‐2‐yl]aminoazobenzene (M2); two codiamines, 4,4′‐diamino‐3,3′‐dimethyl diphenylmethane (MMDA) and bis‐(3‐aminopropyl)‐1,1′,3,3′‐tetramethyldisiloxane (SiDA); and 3,3′,4,4′‐diphenyl ether tetracarboxylic acid dianhydride (OPDA). All copolyimides possess high glass transition temperatures (T_g's) between 237 and 271°C. Copolyimides based on M2 do not exhibit an obvious change in T_g as the M2 content is increased, while those based on M1 show a slight decrease in T_g as the M1 content is increased. All copolyimides exhibit high thermal decomposition temperatures. The copolyimides are soluble in aprotic solvents such as NMP, DMAc, DMF, DMSO, and 1,4‐butyrolactone. Some are even soluble in common low boiling point solvents such as THF and chloroform. The refractive index of a copolyimide is increased as the chromophore content is increased, while the birefringence of a copolyimide does not exhibit strong dependence on the chromophore content. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1619–1626, 2000     

Synthesis and characterization of copolyimides with high solubility

A series of copolyimides were prepared from various diamines (polysiloxane and isophorone units) with aromatic tetracarboxylic dianhydrides via a two‐step (thermal imidization) method. The monomers and polymers were produced in high yields, and the copolyimides containing Si? O? C bonds and asymmetric meta catenation in the polymer backbone exhibited good solubility. The glass‐transition temperatures (T_g's) of all the copolyimides were found to be 201–262 and 215–258°C by differential scanning calorimetry (DSC) and dynamic mechanical analysis, respectively. Thermogravimetric analyses indicated that the polymers were fairly stable up to 502–578°C (10 wt % loss in N2) and 490–574°C (10 wt % loss in air). The char yields at 800°C in N2 and air atmospheres were 26–59 and 20–53%, respectively. The copolymerization results, determined with 1H‐NMR and DSC, indicated a random copolymer. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 1963–1970, 2003     

Synthesis and characterization of novel borosiloxane‐containing aromatic copolyimides with excellent thermal stability and low coefficient of thermal expansion

The properties of borosiloxane‐containing copolyimides with borosiloxane in the main chain and in the side chain were studied. Two series of borosiloxane‐containing copolyimides were synthesized by the reaction of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA ) and 2,3′,3,4′‐biphenyltetracarboxylic dianhydride (a‐BPDA ) with p ‐phenylenediamine (PDA ), 4,4′‐oxydialinine (4,4′‐ODA ) and different borosiloxane diamine monomers (BSiAs ). The synthesized borosiloxane‐containing copolyimides exhibited better solubility than borosiloxane‐free copolyimides and showed high glass transition temperatures (320–360 °C), excellent thermal stability (570–620 °C for T ₁₀), great elongation at break (10% ? 14%) and a low coefficient of thermal expansion (14–24 ppm °C^?1). More specifically, the copolyimides containing BSiA‐2 formed nano‐scale protrusions and the copolyimides containing BSiA‐1 formed micro‐scale protrusions. The contact angles of the copolyimides increased from 72° for neat copolyimide to 96° for 5% of borosiloxane in the main chain of the copolymer up to 107° for 10% of borosiloxane in the side chain of the copolymer. © 2017 Society of Chemical Industry     

Incorporating bis‐benzimidazole into polyimide chains for effectively improving thermal resistance and dimensional stability

Heteroaromatic 6,6′‐bis[2‐(4‐aminobenzene)benzimidazole] and its corresponding copolyimides were synthesized to produce high temperature resistant polyimides (PIs). Due to the rigidity and aromaticity of heterocyclic bis‐benzimidazole, and the increased hydrogen bonding interactions, these PIs were found to have a high glass transition temperature (T_g) over 457 °C, which also guarantees a better dimensional stability with a coefficient of thermal expansion (CTE) lower than 10 ppm K^?1 in a wider temperature range of 50–400 °C. In addition, the PIs exhibit excellent thermal stability (5% weight loss temperature higher than 559 °C) along with outstanding mechanical properties. This study demonstrates the viability to access PIs with ultrahigh T_g and low CTE in a wider range of temperature by the incorporation of bis‐benzimidazole moieties. © 2019 Society of Chemical Industry     

Facile control of high temperature shape memory polymers

Glass transition temperature (T_g) is crucial in determining application areas of high temperature shape memory polymers (SMPs), but some T_gs are difficult or uneconomic to be obtained. Here we introduce a facile way to prepare high temperature SMPs with controllable T_gs from 183 to 230 °C by copolymerization of polyimides, and relationships between T_gs and diamine components of the shape memory copolyimides agree with Fox Equation. These copolyimides can fix temporary shape and return to original shape nicely, and the possible mechanisms of their high shape fixity and shape recovery are analyzed on the basis of thermomechanical properties and molecular structures. The copolymerization of shape memory polyimides has offered an effective way to obtain high temperature SMPs with desired properties. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44902.     

Quantitative study of the annealing of poly(vinyl chloride) near the glass transition

Poly(vinyl chloride) displays a normal DSC of DTA curve for the glass transition when quenched from above its T_g. However if cooled slowly or annealed near the glass transition temperature, a peak appears on the DSC or DTA curve at the T_g. In this paper quantitative studies of the time and temperature effects on the production of this endothermal peak during the annealing of PVC homopolymer and an acetate copolymer are presented. The phenomenon conforms to the Williams, Landell, and Ferry equation for the relaxation of polymer chains, the rate of the peak formation becoming negligible at more than 50°C below T_g. The energy difference between the quenched and annealed forms is small. For a PVC homopolymer annealed 2 hr at 68°C, which is T_g ?10°C, the difference is 0.25 cal/g. For a 13% acetate copolymer of PVC similarly annealed, the difference is 0.36 cal/g. The measured rates of the process give a calculated activation energy of 13–14 kcal/mole for PVC homopolymer and copolymer. This appearance of a peak on the T_g curve for a polymer when annealed near the glass temperature appears to be a general phenomenon.     

Design of polymers for migration imaging application II: Synthesis and polymerisation of p-isobutyl styrene

A copolymer series was synthesized for migration imaging applications from isobutyl methacrylate and isobutyl styrene such that each homopolymer and all copolymers had glass transition temperature (T_g) near 55°C. The T_g of poly (p-isobutylstyrene) was predicted from literature values of similar polymers to be near 55°C. Poly (p-isobutylstyrene) was synthesised by acetylation of isobutyl benzene, reduction of p-isobutylacetoph-enone to the carbinol, dehydration to p-isobutylstyrene and free radical polymerisation to the polymer. The T_g of the homopolymer was 55°C, in excellent agreement with the predicted value. Copolymers of isobutyl methacrylate and p-isobutyl styrene were synthesised and their T_g's measured across the series by DSC (57°C ± 5°C). refractive index temperature coefficient (42°C ± 5°C). The copolymer series was also characterised by melt viscosity measurements.     

N‐(2‐biphenylenyl)‐4‐[2′‐phenylethynyl] phthalimide: 2. Detailed study of the monomer cure and properties of the resulting polymer

A detailed study is presented of the high‐temperature cure of the difunctional monomer N‐(2‐biphenylenyl)‐4‐[2′‐phenylethynyl]phthalimide (BPP) and the thermal properties of the resulting homopolymer. Although the phenylethynyl groups are consumed within 1 h at 370 °C, other reactions continue well after this, leading to a cured polymer whose glass transition temperature (T_g) is highly dependent on cure time and temperature. A T_g of 450 °C is achieved after a 16 h cure at 400 °C. Use of chemometrics to analyse the infrared spectra of curing BPP provides evidence for changes in the aromatic moieties during cure, perhaps indicative of co‐reaction between the biphenylene and phenylethynyl groups; however, other processes also contribute to the overall complex cure mechanism. Despite the high T_g values, BPP homopolymer exhibits unacceptably poor thermo‐oxidative stability at 370 °C, showing a weight loss of about 50 % after 100 h ageing. This is perhaps a result of formation of degradatively unstable crosslink structures during elevated‐temperature cure. Copyright © 2004 Society of Chemical Industry     

Syntheses and properties of polyimides derived from diamines containing 2,5‐disubstituted pyridine group

A series of novel homo‐ and copolyimides containing pyridine units were prepared from the heteroaromatic diamines, 2,5‐bis (4‐aminophenyl) pyridine and 2‐(4‐aminophenyl)‐5‐aminopyridine, with pyromelltic dianhydride (PMDA), and 3,3′, 4,4′‐biphenyl tertracarboxylic dianhydride (BPDA) via a conventional two‐step thermal imidizaton method. The poly(amic acid) precursors have inherent viscosities of 1.60–9.64 dL/g (c = 0.5 g/dL in DMAC, 30°C) and all of them can be cast and thermally converted into flexible and tough polyimide films. All of the polyimides show excellent thermal stability and mechanical properties. The polyimides have 10% weight loss temperature in the range of 548–598°C in air. The glass transition temperatures of the PMDA‐based samples are in the range of 395–438°C, while the BPDA‐based polyimides show two glass transition temperatures (T_g1 and T_g2), ranging from 268 to 353°C and from 395 to 418°C, respectively. The flexible films possess tensile modulus in the range of 3.42–6.39 GPa, strength in the range of 112–363 MPa and an elongation at break in the range of 1.2–69%. The strong reflection peaks in the wide‐angle X‐ray diffraction patterns indicate that the polyimides have a high packing density and crystallinity. The polymer films are insoluble in common organic solvents exhibiting high chemical resistance. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1844–1851, 2006     

Isothermal Cure of an Epoxy System Containing Tetraglycidyl-4,4′-diaminodiphenylmethane (TGDDM), a Multifunctional Novolac Glycidyl Ether and 4,4′-Diaminodiphenylsulphone (DDS): Vitrification and Gelation

Times to gelation and vitrification have been determined at different isothermal curing temperatures between 200 and 240°C for an epoxy/amine system containing both tetraglycidyl-4,4′-diaminodiphenylmethane (TGDDM) and a multifunctional Novolac glycidyl ether with 4,4′-diaminodiphenylsulphone (DDS). The mixture was rich in epoxy, with an amine/epoxide ratio of 0·64. Gelation occurred around 44% conversion. Vitrification was determined from data curves of glass transition temperature, T_g, versus curing time obtained from differential scanning calorimetry experiments. The minimum and maximum values T_g determined for this epoxy system were T_g0=12°C and T_gmax=242°C. Values of activation energy for the cure reaction were obtained from T_g versus time shift factors, a_T, and gel time measurements. These values were, respectively, 76·2kJmol^-1 and 61·0kJmol^-1. The isothermal time–temperature–transformation (TTT) diagram for this system has been established. Vitrification and gelation curves cross at a cure temperature of 102°C, which corresponds to glass transition temperature of the gel. © of SCI.     

Investigation of thermal behavior of poly(2‐hydroxyethyl methacrylate‐co‐itaconic acid) networks

The thermal behavior of poly(2‐hydroxyethyl methacrylate) [PHEMA] homopolymer and poly(2‐hydroxyethyl methacrylate‐co‐itaconic acid) [P(HEMA/IA)] copolymeric networks synthesized using a radiation‐induced polymerization technique was investigated by differential scanning calorimetry, thermogravimetric analysis, and Fourier transform infrared spectroscopy. The glass‐transition temperature (T_g) of the PHEMA homopolymer was found to be 87°C. On the other hand, the T_g of the P(HEMA/IA) networks increased from 88°C to 117°C with an increasing amount of IA in the network system. The thermal degradation reaction mechanism of the P(HEMA/IA) networks was determined to be different from the PHEMA homopolymer, as confirmed by thermogravimetric analysis. It was observed that the initial thermal degradation temperature of these copolymeric networks increased from 271°C to 300°C with IA content. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1602–1607, 2007     

Dimensionally stable polyimide copolymers for microelectronics applications

Polyimides are finding increased applications in microelectronics due to their high thermal stability, good chemical resistance, good adhesion, low moisture absorption, good mechanical properties, and low coefficient of thermal expansion (CTE). Four series of random copolyimides were synthesized and characterized for potential application as encapsulants, stress-relief layers, and interlevel dielectrics. Several candidates exhibited good combinations of physical and mechanical properties with inherent viscosities from 1.21 to 1.42 dL/g, T_g's ranging from 251 to 277°C, 10% weight loss temperatures between 503 and 527°C, and CTEs ranging from 33 to 39 ppm/°C. Mechanical properties at room temperature for the best candidates included tensile strengths of 17.8–21.3 ksi, moduli between 388 and 506 ksi, and elongations of 11–43%. Moisture absorption for these copolyimides ranged between 0.85 and 1.38 wt %. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 69: 2383–2393, 1998     

Hydrolysis and blistering of cyanate ester networks

The hydrolysis of a cyanate ester network made from the monomer 2,2′-bis(4-cyanatophenyl) isopropylidene (bisphenol A dicyanate homopolymer) was studied. Hydrolysis reactions were performed isothermally at temperatures from 150 to 180°C under conditions of excess water. The kinetics of the reaction were characterized by the decrease in T_g as measured by differential scanning calorimetry. The rate of change of T_g was found to be adequately described as first order in T_g, which is an indirect measure of the concentration of crosslink junctions. The activation energy of the reaction was found to be 115 kJ/mol. In addition, moisture-conditioned, glass-reinforced laminate samples were heated and the time to delamination or blistering was recorded as a function of temperature. The blister time at solder temperatures (T = 220–260°C) was modeled using the above kinetic results. Heat transfer to the laminate was considered and the criteria used for blister time was the time at T = T_g of the sample. At lower temperatures (T < 220°C), loss of water from the laminate is sufficiently fast to prevent blistering. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 64: 107–113, 1997     

Synthesis and characterization of soluble poly(arylene ether ketone)s with high glass transition temperature based on 3,6‐bi(4‐fluorobenzoyl)‐N‐alkylcarbazole

3,6‐bi(4‐fluorobenzoyl)‐N‐methylcarbazole and 3,6‐bi(4‐fluorobenzoyl)‐N‐ethylcarbazole were synthesized and used to prepare poly(arylene ether ketone)s (PAEKs) with high glass transition temperatures (T_g) and good solubility. High molecular weight amorphous PAEKs were prepared from these two difluoroketones with hydroquinone, phenolphthalein, 9,9‐bis(4‐hydroxyphenyl)fluorene and 4‐(4‐hydroxylphenyl)‐2,3‐phthalazin‐1‐one, respectively. All these polymers presented high thermal stability with glass transition temperatures being in the range 239–303 °C and a 5% thermal weight loss temperature above 460 °C. Compared with the T_g of phenolphthalein‐based PAEK (PEK‐C), fluorene‐based PAEK (BFEK) and phthalazinone‐based PAEK (DPEK) not containing a carbazole unit, these polymers presented a 30–50 °C increase in T_g. Meanwhile, PAEKs prepared from N‐ethylcarbazole difluoroketone showed good solubility in ordinary organic solvents, and all polymers exhibited excellent resistance to hydrochloric acid (36.5 wt%) and sodium hydroxide (50 wt%) solutions. In particular, phthalazinone‐based PAEK bearing N‐ethylcarbazole afforded simultaneously a T_g of 301 °C with good solubility. Tensile tests of films showed that these polymers have desirable mechanical properties. The carbazole‐based difluoroketones play an important role in preparing soluble PAEKs with high T_g by coordinating the relationship between chain rigidity resulting from the carbazole unit and chain distance from the side alkyl. © 2014 Society of Chemical Industry     

New epoxy resins. II. The preparation,characterization, and curing of epoxy resins and their copolymers

A polymer having high aromaticity and/or cyclic ring structures in the chain backbone usually gives high heat resistance and flame resistance. Five glycidyl ether-type epoxy resins are prepared from bisphenol A (DGEBA), 9,9-bis(4-hydroxyphenyl)fluorene (DGEBF), 3,6-dihydroxyspiro-[fluorene-9,9′-xanthane] (DGEFX), 10,10-bis(4-hydroxyphenyl) anthrone (DGEA), and 9,9,10,10-tetrakis(4-hydroxyphenyl)anthracene (TGETA) in order to study structure–thermal stability–flame resistance property relationships. In this study, trimethoxyboroxine (TMB) and diaminodiphenylsulfone (DDS) are employed as the curing agents. The char yield at 700°C under a nitrogen atmosphere and the glass transition temperature (T_g) for the uncured resins decrease according to the sequence TGETA > DGEFX > DGEA > DGEBF > DGEBA. The Tg values for these cured epoxy resins are DGEBA < DGEBF < DGEFX < DGEA. A T_g for the TGETA is not obtainable but would be expected to be the highest. The char yields at 700°C of these cured epoxy resins have the same trend as the uncured resins. DGEBF, DGEFX, DGEA, and TGETA added to the DGEBA system show increases in the char yield, T_g, and oxygen index with increasing concentration of these novel epoxy resins.     

Thermomechanical behavior of poly(carborane–siloxane)s containing ?CB5H5C? cages

The thermomechanical spectra of two new carborane–siloxane polymers containing five-boron carborane cages in the backbones are reported and discussed. The polymers are the homopolymer, HO? [Si(CH₃)₂? CB₅H₅C? Si(CH₃)₂? O? ]_nH, and the random copolymer with 20 mole-% of the ten-boron meta-carborane analogue, ? [Si(CH₃)₂? CB₁₀H₁₀C? Si(CH₃)₂? O? ]. The mechanical spectra (～1 cps) were determined from ?180° → +625° → ?180°C (ΔT/Δl = 3.6°C/min for T > 25°C and 2°C/min for T < 25°C) using the semimicro thermomechanical technique, torsional braid analysis. In nitrogen, both polymers displayed secondary transitions at ?140°C. The glass transition (T_g) for the homopolymer was ?60°C and for the copolymer was ?52°C. The homopolymer had a melting point of +70°C. The copolymer was amorphous. The high-temperature stability in nitrogen of both polymers appeared to be identical; thermal stiffening commenced at 400°C, continued to 625°C, and resulted in materials that were typical of highly crosslinked resins. In air, the homopolymer began to stiffen catastrophically near 270°C, while the copolymer began to stiffen similarly nearly 50°C higher. The intrinsic elastomeric nature together with the thermomechanical results prompted further study of the copolymer. Thermomechanical cycling studies in nitrogen and air are reported for the copolymer. Some correlating TGA and DTA are also discussed.     

Preparation and characterization of inherently heat‐sealable polyimides with high glass transition temperatures

A series of inherently heat‐sealable copolyimides (CPIs) with high glass transition temperatures were synthesized from 2,3,3′,4′‐oxydiphthalic anhydride (aODPA) and bicomponent diamines, 4,4′‐oxydianiline (ODA) and para‐phenylenediamine (PDA). The PI chain rigidity was manipulated by the regulation of the diamine ratio, and its effects on the heat sealability and thermal resistance of the derived CPI films were investigated in detail. The results show that these films are in possession of both good heat sealability and thermal resistance due to the synergetic effect of the asymmetry of aODPA and the rigidity of PDA. It is also found that there exists one critical PDA content that distinguishes the heat‐sealing behaviors of the CPI films, and the relevant mechanism was established. Especially for CPI‐5, the heat‐sealing strength is up to 350 N m^?1 simultaneously with a relatively high T_g of 310°C. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43058.     

Compatibility and tensile behavior of polypropylene/ethylene-propylene rubber blends

This study clarifies and quantifies factors which increase the ductility of a low-molecular-weight propylene homopolymer having an intrinsic viscosity of 0.89 dl/g. The tensile behavior of homopolymer/ethylene-propylene rubber (EPR) blends was studied from the viewpoint of the associated molecular structure of EPR and its compatibility with the homopolymer. When EPR is “dissolved” in a homopolymer, the glass transition temperature (T_g) of the amorphous phase of a homopolymer was found to shift to a lower temperature, with homopolymer/EPR compatibility being subsequently evaluated using this shift, i.e., Δt_g. Results show two conditions are required to improve the ductility of the low-molecular weight propylene homopolymer: ΔT_g must be ≥ 3°C and ≥ 30 wt% EPR must be blended with the homopolymer.     

Physical aging of epoxy resin blended with poly(ether sulfone): Effect of poly(ether sulfone) molecular weight

The physical aging process of 4-4′-diaminodiphenylsulfone (DDS) cured diglycidyl ether bisphenol-A (DGEBA) blended with various molecular weights of poly(ether sulfone) (PES; M_n = 28,600, 10,600, and 6,137) was studied by DSC. For DGEBA/DDS system blended with a low MW PES-3 (M_n = 6,137), no phase separation of the polymer blend and only one enthalpic relaxation process due to physical aging was observed. Since the high MW PES-1 (M_n = 28,600) had a T_g close to that of fully cured DGEBA/DDS, the fully cured DGEBA/DDS/PES-1 blend had a broader glass transition than a neat DGEBA/DDS system. However, the DSC results showed two enthalpic relaxation processes due to the physical aging of PES-rich and cured epoxy-rich phases as the material was aged at 155 °C (30 °C below T_g). Since the T_gs of PES-1-rich and epoxy-rich phases overlapped with each other, the enthalpic relaxation processes corresponding to each phase coupled to each other in the earlier stage of physical aging. The medium MW PES-2 (M_n = 10,600) has a much lower T_g than that of fully cured DGEBA/DDS, two well separated T_gs were observed for the cured DGEBA/DDS/PES-2 blend, indicating the cured epoxy was immiscible with PES. Aging the polymer blend at 155 °C (24 °C below T_g1 of the PES-2-rich phase and 53 °C below T_g2 of the epoxy-rich phase) produced two well separated relaxation processes due to PES-2-rich and epoxy-rich phases. The experimental results suggested that aging the polymer blend at a suitable temperature would improve the phase separation between PES-1-rich and epoxy-rich phases.