Ni掺杂ZnO晶体的制备及红外光谱特性

采用水热法制备了不同比例Ni掺杂ZnO晶体。XRD结果表明,Ni掺杂浓度较低时,生成置换型氧化锌镍固溶体,当Ni掺杂浓度增加到5%时,Ni2+过饱和,析出部分立方NiO。FT-IR结果显示:当水热温度达到160℃时,粒子运动速率越快,晶格空隙越开放,Ni2+替代Zn2+形成固溶体的数目增多,掺杂ZnO在906cm-1附近出现了一个新的吸收带,并且随着掺杂浓度的增加,吸收带变强变宽;提高前驱物的pH值,实际进入ZnO晶格Ni2+浓度越高,造成的晶格缺陷越多,从而使吸收带出现了蓝移,表现出良好的红外吸收特性。     

掺Nd的（Sr,Pb）TiO3陶瓷的热敏特性研究

研究了用固相法制备的掺（Ｓｒ，Ｐｂ）ＴｉＯ３陶瓷的热敏特性。结果表明，掺Ｎｄ的（Ｓｉ，Ｐｂ）ＴｉＯ３陶瓷具有良好的ＮＴＣ－ＰＴＣ复合热敏特性，主要参数：Ｔｃ＝１２３℃，ｐＲＴ＝１５０Ωｃｍ，ｐｍｉｎ＝１５．４４Ωｃｍ，α（－）５０＝－３．０６％／℃，α（＋）５０＝７．５７％／℃，降阻后材料仍为典型的ＡＢＯ３型钙肽矿结构；Ｎｄ＾３＋一部分以施主形式进入Ａ位，一部分仍以Ｎｄ２Ｏ３的形式残留在试样中。Ｓ     

Ni2＋掺杂聚苯胺膜的制备及其抗腐蚀性能

聚苯胺是最常用的一种导电聚合物,它作为腐蚀抑制剂覆盖在金属表面并形成一层很薄的保护膜,可以降低金属的腐蚀速度。采用循环伏安法在不锈钢表面电化学合成掺杂态（NiH）聚苯胺膜。利用极化曲线法和交流阻抗法研究了掺杂态聚苯胺膜的耐腐蚀性能及其影响因素。结果表明：在3．5％NaCl溶液中,不锈钢表面覆盖掺杂态聚苯胺膜的腐蚀电位比...     

Mg-Al共掺杂ZnO薄膜的制备及其光学特性

采用溶胶-凝胶（sol—gel）旋涂法在载玻片上制备了不同A1掺杂量的Mg—Al共掺杂ZnO薄膜．在室温下利用X射线衍射仪（XRD）、扫描电子显微镜（SEM）和光致发光（PL）谱仪等手段分析了Mg—Al共掺杂Zn0薄膜的微结构、形貌和发光特性．XRD结果表明Mg．AI＆掺杂zn0薄膜具有六角纤锌矿结构;随着Al掺杂量的增加,共掺杂薄膜呈C轴取向生长．由SEM照片可知薄膜表面形貌随Al掺杂量的增加由颗粒状结构向纳米棒状结构转变．透射光谱表明共掺杂薄膜在可见光区内的透射率大于50％,紫外吸收边发生蓝移．在室温下的PL谱表明Mg—Al共掺杂zn0薄膜的紫外发射峰向短波长方向移动：Al掺杂摩尔分数为1％和3％的Mg—Al共掺杂ZnO薄膜的可见发射峰分别为596nm的黄光和565nm的绿光．黄光主要与氧间隙有关,而绿光主要与氧空位有关．     

Ni掺杂浓度对CdS:Ni体系电子和光学性质的影响

采用基于密度泛函理论框架下的第一性原理计算方法,对纤锌矿结构CdS:Ni的几何结构、能带结构、电子态密度和光学性质随Ni掺杂浓度的变化进行了系统地研究。计算结果显示,无论是在富镉,还是富硫条件下,计算得到不同Ni掺杂浓度的形成能都较小,说明CdS:Ni系统在实验上是可以实现的;Ni掺杂的CdS在价带顶附近出现杂质带,大大提高了材料的导电率。光学性质的计算结果显示,Ni掺杂后体系的光学性质有很大的改变,在吸收光谱上产生了新的吸收峰,并且随着掺杂浓度的增加,吸收范围增大。所有结果表明,CdS:Ni体系是极具潜力的透明导电材料。     

S掺杂CeO_2的第一性原理计算

为了探究S杂质对CeO_2体系的影响机理,采用基于密度泛函理论的第一性原理,通过S原子代替O原子建立同等条件下不同浓度的CeO_(2-x)S_x模型,并对CeO_2的晶体结构进行优化,计算并分析体系的几何结构、能带结构、态密度和光学特性。结果表明:S掺杂后CeO_2的晶格常数发生改变;S掺杂使体系的导带和价带均向低能方向移动,随着掺杂浓度的增大,禁带宽度先减小后增大,并在禁带中引入3条杂质能级;CeO_2吸收边红移,并且随着掺杂浓度的增大,对可见光的吸收增强,对紫外光的吸收减弱。     

真空蒸发制备稀土Dy掺杂CdTe薄膜及其特性研究

采用双源蒸镀法制备了稀土Dy掺杂CdTe薄膜,并对薄膜的晶体学和光学性质进行了研究。结果表明,掺杂Dy使薄膜中富Te的情况更加严重,且使CdTe薄膜具有了沿(111)晶向的择优取向,同时掺杂抑制了CdTe的化合与结晶,使薄膜的晶粒尺寸明显增大、光学带隙明显减小。     

La掺杂Sr0.4Pb0.6TiO3陶瓷热敏机理研究

液相掺杂施主元素La，在1100－1200℃烧结制备出了Sr0.4Pb0.6TiO3基陶瓷。该陶瓷具有显著的NTCR－PTCR复合效应，其室温电阻率随烧结温度提高而增大；而添加少量PbO用于补偿铅损失，则明显降低了陶瓷的室温电阻率及减弱了居里点下的NTCR效应。同时利用XRD，SEM和TEM分别对陶瓷的相结构，形貌和畴结构进行了研究。根据实验结果，探讨了La掺杂Sr0.4Pb0.6TiO3陶瓷的半导化机理及其热敏特性。     

Ni掺杂型OMS-2低温抗硫脱硝性能研究

使用前掺杂法,在水热合成OMS-2分子筛的过程中进行不同比例的Ni元素掺杂,成功制备出了一种能够在100℃,含SO_2烟气中脱硝率达到95%以上的分子筛催化剂;并且利用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、比表面积分析仪(BET)、X射线光电子能谱分析(XPS)对所制备的催化剂进行了表征,结果表明掺杂Ni物种在催化剂中主要以金属原子的形式分散在OMS-2中,主要取代OMS-2中的K~+位,少量取代Mn~(4+)位,并且使得OMS-2微观的一维管状结构变得细短,提高了OMS-2的比表面积和介孔数量,相比较于未掺杂的OMS-2,Ni_((0.2))-OMS-2在无硫环境下脱硝率从50℃的86%上升到了98%,在含硫环境下仍能保持92%的脱硝率。     

Ni掺杂黑液木质素基活化木材陶瓷的制备与性能研究

以造纸黑液木质素和NiCl₂·6H₂O为原料、经1200℃高温烧结制备Ni掺杂木材陶瓷, 并用KOH进行活化处理, 得到呈泡沫状的三维网络结构的Ni掺杂活化石墨化木材陶瓷。采用X射线衍射(XRD)、拉曼光谱(RS)、扫描电镜(SEM)、透射电镜(TEM)、比表面积测试仪及电化学工作站等对其性能进行分析与表征。结果表明: Ni既参与构筑木材陶瓷骨架, 又对无定形碳进行催化石墨化。所制备样品的石墨化倾向明显, 有石墨烯片层结构出现, 部分晶格间距接近理想石墨的点阵参数。同时, 活化处理可以有效地形成多层次孔隙结构, 增加微孔与超微孔数量。800℃活化3 h后, 样品中的孔径主要集中在3.60 nm左右, 比表面积从359 m²·g^-1提高到856 m²·g^-1。活化能够改善Ni掺杂木材陶瓷的电化学性能, 在20 mV·s^-1扫描速率下, 其比电容为153.8 F·g^-1, 是未活化样品的2.2倍。     

Characterization of sputter deposited Au/Ni/Al multilayers on Si substrates

Multilayered Au/Ni/Al thin film metallization deposited by DC sputtering on n⁺Si substrates has been investigated. AES depth profiling was performed to reveal the concentration depth profiles of the Au/Ni/Al multilayers before and after annealing at different temperatures in the range 623-723 K. It was found that Ni aluminide layers begin to form during heat treatments at temperatures above 623 K. In addition to this process, Ni was found to diffuse significantly through the Au layer and segregates at the surface, proportionally to the increased annealing temperature. Consequently, the Ni oxidation process was found to take place thus causing the degradation of electrical contact. On the other hand Ni diffuses faster as well toward the Si/Al interface. No contamination traces at interfaces were observed. Electrical measurements of the metallized diode forward characteristics showed minor influence of the metallization heat treatment on the series resistance. Degradations were observed only in the reverse characteristics if the annealing was performed above 723 K.     

激光加热条件下 SnPb共晶钎料与Au/Ni/Cu焊盘界面反应动力学

激光重熔在电子封装领域中SnPb共晶钎料凸点制作方面存在极大的优势。采用扫描电子显微镜（SEM）分析了激光加热条件下SnPb共晶钎料与Au/Ni/Cu焊盘之间的界面反应，探讨了钎料中的溶解与扩散动力学。结果表明：CnPb共晶钎料在激光加热瞬间与Au/Ni/Cu焊盘中的Au发生反应，生成Au-Sn金属间化合物，其形貌和分布与激光输入能量密切相关；随着激光输入能量的增加，Au-Su化合物由边境连续层状转变为针状，最后以细小颗粒弥散分布在钎料内部。     

Ti/Al/Ni/Au在N-polar GaN上的欧姆接触

N-polar GaN以其特有的材料特性和化学活性日益受到研究者关注,而N-polar GaN上欧姆接触也成为研究的热点。以Ti/Al/Ni/Au作为欧姆接触金属,分析了N-polar GaN上欧姆接触的最优退火条件,并借助剖面透射电子显微镜(TEM)和能量色散X射线能谱仪(EDX)研究了金属和N-polar GaN之间的反应生成物。结果表明,当退火温度升高到860℃时,可得到比接触电阻率ρc为1.7×10~(-5)Ω·cm~2的最优欧姆接触特性。TEM和EDX测试发现,除了生成已报道的AlN,还会在界面处产生多晶AlO_x,两者共同作用会进一步拉高势垒,从而对N-polar GaN上欧姆接触产生不利影响。     

Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu-xPd/immersion Au/electroless Ni solder joints after aging

Sn3.0Ag0.5Cu solder doped with 0, 100, and 500 ppm Pd was reflowed with electroless Ni/immersion Au substrate. As Pd concentration increased in the solder, formation and growth of (Cu,Ni)₆Sn₅ were suppressed. After thermal aging, Cu₄Ni₂Sn₅ and Cu₅NiSn₅ were observed at interface of Sn3.0Ag0.5Cu-xPd/Au/Ni systems. As compared to Cu₄Ni₂Sn₅, more Pd dissolved in Cu₅NiSn₅. In addition, Pd doping enhanced the growth of Cu₄Ni₂Sn₅ and slowed the formation of Cu₅NiSn₅, which would stabilize the intermetallic compound. Based on quantitative analysis by field emission electron probe microanalyzer, the correlation between Pd doping and elemental redistribution in solder joints was probed and discussed. This study described a possible mechanism of the formation of different intermetallic compounds in Pd-doped lead-free solder.     

Effect of thermal annealing on Ni/Au contact to a-InGaZnO films deposited by dc sputtering

We deposited Ni (15 nm)/Au (30 nm) layers on a-InGaZnO in order to produce low-resistance ohmic contacts by using a dc sputtering method. The samples were annealed at various temperatures for 5 min in Ar ambient. The electrical and the structural properties of the Ni/Au contact to a-InGaZnO were investigated. According to the current-voltage measurements, both the as-deposited and low-temperature annealed samples showed an ohmic behavior. The specific contact resistance of the as-deposited sample was 4.1 × 10^− 5 Ω cm², which was the lowest value. Further increasing the temperature above 400 °C led to an increase in the specific contact resistance. This is due to the chemical intermixing and formation of the oxide in the contact interface caused by the post-growth thermal annealing.     

沉积在硅油表面上Au薄膜的电学性能及成膜机理

采用硅油作基底 ,沉积出具有网状特征结构的逾渗Au薄膜 ,用四引线方法原位测量Au薄膜的电学性能 ,测得其电阻随沉积时间以及凝聚时间的变化规律 ,较好地解释了此类薄膜的生长机制。对Au薄膜R I特性的测量结果表明 :生长在液体基底表面Au薄膜的局域隧道电流和跳跃电导效应比一般薄膜更为强烈 ,其功率谱指数w趋于零 ,该值远小于普通逾渗薄膜系统的相应值     

Ni/Zr-Co-Re堆栈层薄膜吸气剂的吸气性能及Ni作用机理研究

采用磁控溅射的方法制备了带有Ni保护层和Zr-Co-Re(Re代表稀土元素)主体层的堆栈层薄膜吸气剂。通过X射线光电子能谱仪(XPS)分析了薄膜吸气剂内部O元素的含量分布,研究了薄膜吸气剂中Ni层的防氧化作用和机理。研究表明:(1)Ni/Zr-CoRe堆栈层薄膜吸气剂在160℃保温3h的条件下可以有效激活,并具有高于Zr-Co-Ni单层薄膜吸气剂的吸气性能;(2)Ni保护层降低了吸气剂的被氧化程度,促进了表面吸附的H2分子的解离和扩散。     

Fracture mechanism and model of 18Ni maraging steel

ABSTRACT

18Ni maraging steel is normally used to make key components by machining processes. It is necessary to understand the fracture mechanism and behaviour of 18Ni maraging steel for the study and further optimisation of machining processes. In this paper, the Split Hopkinson Tensile Bar tests accompanied by quasi-static mechanical tests are carried out to relate the stress triaxiality, deformation temperature and strain rate with the fracture strain. During the building up of the fracture model, it is noticed that the change of fracture mechanism from 600°C to 900°C brings about a non-linear relationship of fracture strain with the deformation temperature. This results in a large error in fitting the Johnson–Cook (J-C) fracture model, so a modified fracture model is put forward.     

Syntheses, characterization and properties of novel nanostructures consisting of Ni/titanate and Ni/titania

Ni/titanate one-dimensional nanostructures and Ni/titania nanocrystal composites were produced by a facile synthetic procedure using protonic titanate nanotubes as the precursor templates. The formation mechanisms for the nanostructures were proposed. The nickel ions first enter into the titanate matrix through three approaches, ion-exchanges reaction with the interlayered hydrogen ions, capillary forces from the microcavities, and electrostatic adsorptions due to the negatively charged outer surface of the titanate nanotubes. The following metallic nickel nucleation and growth may have occurred for these three kinds of the nickel ions reduced under hydrogen gas flow at elevated temperatures. The supports' titanate nanotubes may phase transform into the anatase titania nanocrystals and further into the mixture of anatase and rutile titania along with the increases of temperature. The Ni/titanate nanocomposites demonstrate paramagnetic behaviors and the Ni/titania nanocrystals display typical ferromagnetic behaviors. The Ni/titania sample reduced at 550 °C containing 14.5% rutile has higher photocatalytic activities than the sample reduced at 350 °C containing pure anatase, which is ascribed to a synergistic effect between anatase and rutile. The ferromagnetic characteristics of the Ni/titania products make them available as magnetically separable photocatalysts, which can be separated and recovered quickly by applying an external magnetic field.