Carbon incorporation process in GaAsN films grown by chemical beam epitaxy using MMHy or DMHy as the N source

Crystal quality of GaAsN films can be improved by using CBE for low-temperature growth. However, low-temperature growth increases C incorporation in the films, which degrades their electrical properties. Consequently, C incorporation was investigated in view of the surface reaction of N sources on a substrate surface, and MMHy and DMHy were compared. When MMHy was used as an N source, C concentration in GaAsN drastically increases below 380 °C than that in GaAs due to insufficient CH_x desorption. In the case of DMHy, N(CH₃)₂ is desorbed more readily than CH_x, therefore, the C concentration can then be reduced using DMHy.     

Epitaxial growth and electrical measurement of single crystalline Pb(Zr0.52Ti0.48)O3 thin film on Si(001) for micro-electromechanical systems

We report in this work the epitaxial growth and the electrical characteristics of single crystalline Pb(Zr_0.52Ti_0.48)O₃ (PZT) thin film on SrTiO₃(STO)-buffered Si(001) substrate. The STO buffer layer deposited by molecular beam epitaxy allows a coherent oxide/Si interface leading enhanced PZT crystalline quality. 70 nm-thick PZT (52:48) layer was then grown on STO/Si(001) by sol-gel method. X-ray diffraction demonstrates the single crystalline PZT film on Si substrate in the following epitaxial relationship: [110] PZT (001)//[110] STO (001)//[100] Si (001). The macroscopic electrical measurements show a hysteresis loop with memory window of 2.5 V at ± 7 V sweeping range and current density less than 1 μA/cm² at 750 kV/cm. The artificial domains created by piezoresponse force microscopy with high contrast and non-volatile properties provide further evidence for the excellent piezoelectric properties of the single crystalline PZT thin film.     

Temperature effects on the growth and electrical properties of Er2O3 films on Ge substrates

Er₂O₃ films were grown on Ge (001) substrates at different temperatures by molecular beam epitaxy using metallic Er and molecular oxygen sources with otherwise identical conditions. High-resolution transmission electron microscopy and X-ray photoelectron spectroscopy were used to characterize the microstructures and compositions of the films. The film deposited at room temperature is found to be composed of an Er₂O₃ layer and an ErGe_xO_y interface layer with a thickness of 5.5 nm; the film grown at 300 °C has a mixed structure of Er₂O₃ and ErGe_xO_y and the thickness was found to be reduced to 2.2 nm; the film grown at 450 °C becomes much rougher with voids formed underneath the film, having a mixed structure of three compounds of Er₂O₃, GeO and ErGe_xO_y. The growth mechanisms of the films at different temperatures are suggested. Current images obtained by tunneling atomic force microscopy show that the film grown at 450 °C has much more leaky spots than those grown at RT and 300 °C, which may arise from the formation of volatile GeO in the film.     

CVD金刚石薄膜(111)与(100)取向生长的热力学分析

用非平衡热力学耦合模型计算了CVD金刚石薄膜生长过程中C2H2与CH3浓度之比[C2H2]/[CH3]随衬底温度和CH4浓度的变化关系,从理论上探讨了金刚石薄膜（111）面和（100）面取向生长与淀积条件的关系。在衬底温度和CH4浓度由低到高的变化过程中,[C2H2]/[CH3]逐渐升高,导致金刚石薄膜的形貌从（111）晶面转为（100）晶面。添加氧后C2H2与CH3浓度都将下降,但C2H2下降得更多,因而添加氧也使[C2H2]/[CH3]下降,从而有利于生长（111）晶面的金刚石薄膜。     

Morphology of TiN thin films grown on SiO2 by reactive high power impulse magnetron sputtering

Thin TiN films were grown on SiO₂ by reactive high power impulse magnetron sputtering (HiPIMS) at a range of temperatures from 45 to 600 °C. The film properties were compared to films grown by conventional dc magnetron sputtering (dcMS) at similar conditions. Structural characterization was carried out using X-ray diffraction and reflection methods. The HiPIMS process produces denser films at lower growth temperature than does dcMS. Furthermore, the surface is much smoother for films grown by the HiPIMS process. The [200] grain size increases monotonically with increased growth temperature, whereas the size of the [111] oriented grains decreases to a minimum for a growth temperature of 400 °C after which it starts to increase with growth temperature. The [200] crystallites are smaller than the [111] crystallites for all growth temperatures. The grain sizes of both orientations are smaller in HiPIMS grown films than in dcMS grown films.     

Raman scattering and Rutherford backscattering studies on InN films grown by plasma-assisted molecular beam epitaxy

A series of InN thin films was grown on sapphire substrates via plasma-assisted molecular beam epitaxy (PA-MBE) with different nitrogen plasma power. Various characterization techniques, including Hall, photoluminescence, Raman scattering and Rutherford backscattering, have been employed to study these InN films. Good crystalline wurtzite structures have been identified for all PA-MBE grown InN films on sapphire substrate, which have narrower XRD wurtzite (0002) peaks, showed c-axis Raman scattering allowed longitudinal optical (LO) modes of A₁ and E₁ plus E₂ symmetry, and very weak backscattering forbidden transverse optical (TO) modes. The lower plasma power can lead to the lower carrier concentration, to have the InN film close to intrinsic material with the PL emission below 0.70 eV. With increasing the plasma power, high carrier concentration beyond 1 × 10²⁰ cm^− 3 can be obtained, keeping good crystalline perfection. Rutherford backscattering confirmed most of InN films keeping stoichiometrical In/N ratios and only with higher plasma power of 400 W leaded to obvious surface effect and interdiffusion between the substrate and InN film.     

Effect of nitridation on crystallinity of GaN grown on GaAs by MBE

GaN films are grown on [0 0 1] GaAs substrates by plasma-assisted molecular beam epitaxy using a three-step process that consists of a substrate nitridation, deposition of a low-temperature buffer layer, and a high-temperature overgrowth. Films are evaluated by X-ray diffraction and the dependence of crystalline quality on the nitridation temperature is studied. It is demonstrated that nitridation has to be performed at low-temperature to achieve c-oriented α-GaN. Higher nitridation temperature promotes formation of mis-oriented domains and β-GaN inclusions     

Carbon segregation in silicon

Carbon doping strongly suppresses the diffusion of boron. This is very important for later high temperature processing steps, e.g. for the fabrication of a high doped SiGe-base in a heterojunction bipolar transistor. We investigated (with a novel method) the segregation of C in Si (100) at growth temperatures between 500 and 700°C. A C-doped Si layer was grown by MBE under constant C and Si fluxes. The growth temperature was switched between 300°C and the investigated growth temperature. As the temperature was switched, the surface-accumulated C concentration was perturbed, causing a spike or depression in the SIMS depth profile. The surface segregation at a given temperature was measured by the amount of adlayer density in the spike. Clear evidence of the surface segregation of carbon in Si is found by these experiments.     

Removal of stacking faults in Ge grown on Si through nanoscale openings in chemical SiO2

Nucleation and eventual coalescence of Ge islands, grown out of 5 to 7 nm diameter openings in chemical SiO₂ template and epitaxially registered to the underlying Si substrate, have been shown to generate a low density of threading dislocations (?10⁶ cm^− 2). This result compares favorably to a threading dislocation density exceeding 10⁸ cm^− 2 in Ge films grown directly on Si. However, the coalesced Ge film contains a relatively high density of stacking faults (5 × 10⁷ cm^− 2), and subsequent growth of GaAs leads to an adverse root-mean-square roughness of 36 nm and a reduced photoluminescence intensity at 20% compared to GaAs grown on Ge or GaAs substrates. Herein, we find that annealing the Ge islands at 1073 K for 30 min before their coalescence into a contiguous film completely removes the stacking faults. However, the anneal step undesirably desorbs any SiO₂ not covered by existing Ge islands. Further Ge growth results in a threading dislocation density of 5 × 10⁷ cm^− 2, but without any stacking faults. Threading dislocations are believed to result from the later Ge growth on the newly exposed Si where the SiO₂ has desorbed from areas uncovered by Ge islands. The morphology and photoluminescence intensity of GaAs grown on the annealed Ge is comparable to films grown on GaAs or Ge substrates. Despite this improvement, the GaAs films grown on the annealed Ge/Si exhibit a threading dislocation density of 2 × 10⁷ cm^− 2 and a minority carrier lifetime of 67 ps compared to 4 to 5 ns for GaAs on Ge or GaAs substrates. A second oxidation step after the high temperature anneal of the Ge islands is proposed to reconstitute the SiO₂ template and subsequently improve the quality of Ge film.     

Microstructure and secondary phases in epitaxial LaBaCo_2O_(5.5 + δ) thin films

Aberration-corrected scanning transmission electron microscopy was employed to investigate the microstructures and secondary phases in LaBaCo_2O_(5.5 + δ)(LBCO) thin films grown on SrTiO_3(STO) substrates. The as-grown films showed an epitaxial growth on the substrates with atomically sharp interfaces and orientation relationships of [100]_(LBCO)//[100]_(STO)and(001)_(LBCO)//(001)_(STO). Secondary phases were observed in the films, which strongly depended on the sample fabrication conditions. In the film prepared at a temperature of 90℃, nano-scale CoO pillars nucleated on the substrate, and grew along the [001]direction of the film. In the film grown at a temperature of 1000℃, isolated nano-scale Co_3O_4 particles appeared, which promoted the growth of {111} twinning structures in the film. The orientation relationships and the interfaces between the secondary phases and the films were illustrated, and the growth mechanism of the film was discussed.     

Structural and optical properties of GaN films grown on GaAs substrates by molecular beam epitaxy

GaN films are grown on [0 0 1] GaAs substrates by plasma-assisted molecular beam epitaxy using a three-step process that consists of a substrate nitridation, deposition of a low-temperature buffer layer, and a high-temperature overgrowth. X-ray diffraction and transmission electron microscopy indicate that this method promotes prismatic growth of c-oriented α-GaN. Photoluminescence studies show that the emission from cubic β-GaN inclusions dominates the spectrum.     

Dislocation reduction in GaN film using Ga-lean GaN buffer layer and migration enhanced epitaxy

A GaN buffer layer grown under Ga-lean conditions by plasma-assisted molecular beam epitaxy (PAMBE) was used to reduce the dislocation density in a GaN film grown on a sapphire substrate. The Ga-lean buffer, with inclined trench walls on its surface, provided an effective way to bend the propagation direction of dislocations, and it reduced the dislocation density through recombination and annihilation processes. As a result, the edge dislocation density in the GaN film was reduced by approximately two orders of magnitude to 2 × 10⁸ cm^− 2. The rough surface of the Ga-lean buffer was recovered using migration enhanced epitaxy (MEE), a process of alternating deposition cycle of Ga atoms and N₂ radicals, during the PAMBE growth. By combining these two methods, a GaN film with high-crystalline-quality and atomically-flat surface can be achieved by PAMBE on a lattice mismatch substrate.     

Growth-induced atomic step ordering on patterned and non-patterned Si(111)

Atomic step configurations on the vicinal surfaces of patterned and non-patterned Si(111) during homoepitaxial step-flow growth were studied as a function of film thickness, deposition temperature, deposition rate, and substrate miscut. We found, for the first time, that step-flow growth on the vicinal surfaces of Si(111) miscut toward the [11 ] direction results in the formation of collective, in-phase zigzag arrays of [2 ]- and [1̄21̄]-type steps. We also found that step-flow growth on the lower-level region around the edge of Si(111) mesa ridges significantly improves period uniformity. We explained the shape of atomic steps on the basis of the stability of surface reconstruction on Si(111), and the atomic step ordering on the assumption of the anisotropic barrier for diffusion at the growing steps.     

Ag-assisted CBE growth of ordered InSb nanowire arrays

We present growth studies of InSb nanowires grown directly on [Formula: see text] and [Formula: see text] substrates. The nanowires were synthesized in a chemical beam epitaxy (CBE) system and are of cubic zinc blende structure. To initiate nanowire nucleation we used lithographically positioned silver (Ag) seed particles. Up to 87% of the nanowires nucleate at the lithographically pre-defined positions. Transmission electron microscopy (TEM) investigations furthermore showed that, typically, a parasitic InSb thin film forms on the substrates. This thin film is more pronounced for InSb((111)B) substrates than for InAs((111)B) substrates, where it is completely absent at low growth temperatures. Thus, using InAs((111)B) substrates and growth temperatures below 360?°C free-standing InSb nanowires can be synthesized.     

Plasma-assisted molecular beam epitaxy of ZnO on in-situ grown GaN/4H-SiC buffer layers

Plasma-assisted molecular beam epitaxy (MBE) was used to grow ZnO(0001) layers on GaN(0001)/4H-SiC buffer layers deposited in the same growth chamber equipped with both N- and O-plasma sources. The GaN buffer layers were grown immediately before initiating the growth of ZnO. Using a substrate temperature of 440°C–445°C and an O₂ flow rate of 2.0–2.5 sccm, we obtained ZnO layers with smooth surfaces having a root-mean-square roughness of 0.3 nm and a peak-to-valley distance of 3 nm shown by AFM. The FWHM for X-ray rocking curves recorded across the ZnO(0002) and ZnO(101ˉ5) reflections were 200 and 950 arcsec, respectively. These values showed that the mosaicity (tilt and twist) of the ZnO film was comparable to corresponding values of the underlying GaN buffer. It was found that a substrate temperature >450°C and a high Zn-flux always resulted in a rough ZnO surface morphology. Reciprocal space maps showed that the in-plane relaxation of the GaN and ZnO layers was 82.3% and 73.0%, respectively and the relaxation occurred abruptly during the growth. Room-temperature Hall-effect measurements showed that the layers were intrinsically n-type with an electron concentration of 10¹⁹ cm^–3 and a Hall mobility of 50 cm²·V^–1·s^–1.     

Laterally‐selective doping by molecular beam epitaxy growth

Abstract

For GaAs grown by molecular beam epitaxy (MBE), predeposition of a sufficient amount of Sn on the substrate surface, which tends to segregate to the film surface during growth, can uniformly dope the subsequently grown overlayer. For example, GaAs grown on a substrate predeposited with ～one monolayer of Sn, results in uniformly n‐type doped overlayer with ～200 nm thickness. Similar segregation effects also have been observed in GaAs doped with n‐type dopant Te and p‐type dopants, Mn, Fe and Cr. Based on this so‐called “predeposition doping” method, a laterally‐selectively doped GaAs layer can be grown on a surface which is repeatedly prepared by depositing each kind of the aforementioned dopant on an InAs passivated surface, followed by the selective etching to define its covered region, followed by the removal of InAs by thermal desorption. The latter requires the dopants to have low vapor pressures at the InAs desorption temperature. Finally, a GaAs layer with a lateral p‐n junction exhibiting excellent diode characteristics was grown to demonstrate this laterally‐selective doping MBE technique.     

Effect of substrate conductivity on the thickness and composition of GaAlSb epitaxial layers grown by liquid phase epitaxy

It is shown experimentally that the thickness and composition of Ga_1 − xAl_xSb layers grown by liquid phase epitaxy on Gasb substrates depend on the conductivity type of the substrates. To avoid experimental uncertainties that naturally happen from an experiment to another one, such as changes in the exact liquid composition, growth temperature, temperature gradients, etc., the Ga_1 − xAl_xSb layers have been grown simultaneously from the same liquid solution on N and P type GaSb substrates. The X-ray rocking curves show that for every couple of layers, grown on N and P type substrates, there is a consistent difference between their thickness and composition. The thickness difference has also been verified by optical microscopy. A likely explanation of this effect is a change in surface energy of the substrate induced by the surface electric field normally present in semiconductors.     

Growth and characterization of group-III impurity-doped semiconducting BaSi2 films grown by molecular beam epitaxy

Ga- or In-doped BaSi₂ films were grown on Si(111) by molecular beam epitaxy (MBE). The Ga-doped BaSi₂ showed n-type conductivity. The electron concentration and resistivity of the Ga-doped BaSi₂ depended on the Ga temperature; however, the electron concentration and resistivity could not be controlled properly. In contrast, the In-doped BaSi₂ showed p-type conductivity and its hole concentration was controlled in the range between 10¹⁶ and 10¹⁷ cm^− 3 at RT.     

Molecular Beam Epitaxy Scalable Growth of Wafer‐Scale Continuous Semiconducting Monolayer MoTe2 on Inert Amorphous Dielectrics

Monolayer MoTe₂, with the narrowest direct bandgap of ≈1.1 eV among Mo‐ and W‐based transition metal dichalcogenides, has attracted increasing attention as a promising candidate for applications in novel near‐infrared electronics and optoelectronics. Realizing 2D lateral growth is an essential prerequisite for uniform thickness and property control over the large scale, while it is not successful yet. Here, layer‐by‐layer growth of 2 in. wafer‐scale continuous monolayer 2H‐MoTe₂ films on inert SiO₂ dielectrics by molecular beam epitaxy is reported. A single‐step Mo‐flux controlled nucleation and growth process is developed to suppress island growth. Atomically flat 2H‐MoTe₂ with 100% monolayer coverage is successfully grown on inert 2 in. SiO₂/Si wafer, which exhibits highly uniform in‐plane structural continuity and excellent phonon‐limited carrier transport behavior. The dynamics‐controlled growth recipe is also extended to fabricate continuous monolayer 2H‐MoTe₂ on atomic‐layer‐deposited Al₂O₃ dielectric. With the breakthrough in growth of wafer‐scale continuous 2H‐MoTe₂ monolayers on device compatible dielectrics, batch fabrication of high‐mobility monolayer 2H‐MoTe₂ field‐effect transistors and the three‐level integration of vertically stacked monolayer 2H‐MoTe₂ transistor arrays for 3D circuitry are successfully demonstrated. This work provides novel insights into the scalable synthesis of monolayer 2H‐MoTe₂ films on universal substrates and paves the way for the ultimate miniaturization of electronics.     

XPS study of the a-C:H/Ti and a-C:H/a-Si interfaces

In this study ultrathin hydrogenated amorphous carbon (a-C:H) films have been grown onto the titanium and amorphous silicon (a-Si) overlayers by direct ion beam deposition using acetylene gas as a hydrocarbon source. X-ray photoelectron spectroscopy (XPS) was used for study of the DLC-Ti and DLC-Si interfaces. It was revealed that a-Si is a good interlayer for improvement of adhesion in the case of diamond-like carbon film deposition onto the steel substrate at room temperature. a-C:H film growth without substantial intermixing occurred on the a-Si. On the other hand, adhesion between the Ti interlayer and the diamond like carbon film was very sensitive to the deposition conditions (presence of the pump oil) as well as structure and stress level of the Ti film. It was explained by strong intermixing between the growing carbon film and Ti. Bad adhesion between the growing DLC film and Ti interlayer was observed despite formation of the TiC. At the same time, formation of the TiO_x was not an obstacle for good adhesion. It is shown that composition of the used hydrocarbon gas, structure of the Ti thin film and mechanical stress in it had greater influence on adhesion with a-C:H film than elemental composition of the Ti interlayer surface.