锗/石墨/硅薄膜结构的制备及其性质分析

利用磁控溅射技术在单晶硅衬底上制备出具有Ge/石墨/Si结构的薄膜样品,然后把其放入快速热退火(RTA)炉中退火。扫描电子显微镜(SEM)测试表明,石墨过渡层的引入缓解了Si、Ge之间的晶格失配和热失配。X射线衍射(XRD)分析表明450℃是Ge薄膜晶化的临界衬底温度,750℃是使Ge薄膜RTA晶化程度明显提高的临界退火温度,30s是最佳退火时间。     

Ge/Si量子点生长的研究进展

回顾了近年来在Ge/Si量子点生长方面的研究进展.主要讨论了为了提高量子点空间分布有序性、增大量子点的密度、减小量子点的尺寸及改善其分布均匀性而采取的各种方法,如图形衬底辅助生长、表面原子掺杂及利用超薄SiO2层辅助生长等,以及Ge量子点的演变及组分变化.     

镶嵌在介质层中纳米晶的单电子能级的精确求解

假设镶嵌在介质层(如SiO2、SiC)中的纳米晶(如Si、Ge、Sn)为球形量子点,考虑到电子在纳米晶和介质层中的有效质量差异,对镶嵌在介质层中单电子的所有束缚态的能量和波函数进行精确求解,分析了量子点半径、势垒高度、电子有效质量等对能级的影响。计算结果表明,量子限制效应随着量子点半径的减小而急剧增强,不同材料电子的有效质量对电子能级也有重要影响。Sn纳米晶的半径为22nm左右,Ge的半径和Si的半径分别约为10nm和7nm时,能观察到较为明显的量子限制效应。本模型提出的计算方法快速而准确,并适用于任意尺寸、任意势垒和任意材料的球方势阱量子点系统。     

Ge基GaAs薄膜和InAs量子点MBE生长研究

采用分子束外延(MBE)法,在优化Ge衬底退火工艺的基础上,通过对比在(001)面偏<111>方向分别为0°、2°、4°和6°的Ge衬底上生长的GaAs薄膜,发现当Ge衬底的偏角为6°时有利于高质量GaAs薄膜的生长;通过改变迁移增强外延(MEE)的生长温度,发现在GaAs成核温度为375℃时,可在6°偏角的Ge衬底上获得质量最好的GaAs薄膜。通过摸索GaAs/Ge衬底上InAs量子点的生长工艺,实现了高效的InAs量子点光致发光,其性能接近GaAs衬底上直接生长的InAs量子点的水平。     

Si基富Ge含量Si1-x-yGexCy异质结构的热退火行为研究

研究了Si基富Ge含量的Si1-x-yGexCy异质结构的热退火地为,采用等离子体增强化学气相淀积（PECVD）法在Si(100）衬底上淀积一层厚度为170nm的Si1-x-yGexCy薄膜（x-0.7,y-0.15),并在其上覆盖－Ge层,将样品分别在650度和800度下进行N2氛围下热退火20min。用拉曼谱（Raman),俄歇电子能谱（AES）以及X射线光电子能谱XPS等方法对样品进行研究。研究结果表明,低温PECVD法生长的Si1-x-yGexCy薄膜是一种亚稳结构,Ge/Si1-x-yGexCy/Si异质结构在650度下呈现不稳定性,薄膜中的Ge,C相对含量下降,且在界面处出现Ge,C原子的堆积,经过800度下退火20min的样品中C 含量基本为0,Ge相对含量下降至约20％左右,且薄膜的组分比较均匀。     

硅中高剂量锗离子注入的快速热退火研究

报道了利用高剂量Ge 注入制备SiGe/Si异质结的工作.100keV、5.3×1016/cm2/cm2 Ge 注入(001)SIMOX膜中,峰值Ge 浓度接近20%.样品在不同温度下进行不同时间的快速热退火,X射线衍射分析和背散射沟道谱研究表明:1000°C退火0.5h,退火效果较好;退火时间过短或过长,退火温度过高或过低,都将影响退火效果.     

埋层应变对溅射生长Ge量子点的影响

利用离子束溅射制备双层Ge/Si量子点,通过变化Si隔离层厚度和Ge沉积量研究了埋层应变场对量子点生长的影响。实验中观察到隔离层厚度较薄时,双层结构中第2层量子点形成的临界厚度减小,生长过程提前;此外,随着Ge沉积量的增加,第2层量子点密度维持在一定范围,分布被调制的同时岛均匀长大呈现单模分布。增大隔离层厚度,埋层岛的生长模式在第2层岛生长时得到复制。通过隔离层传递的不均匀应变场解释了量子点生长模式的变化。     

超高真空化学气相淀积自组织生长锗量子点

采用超高真空化学气相淀积系统制备了小尺寸、高密度、纵向自对准的Ge量子点．通过TEM和AFM对埋层和上层量子点的形貌和尺寸分布进行了研究，对生长的温度和时间进行了优化．采用硼预淀积的方法得到了尺寸分布小于3％的均匀的圆顶形Ge量子点．采用低温光荧光测量了多层量子点的光学特性．在10K的PL谱可以观察到明显的蓝移现象，表明量子点中较强的量子限制效应．量子点非声子峰的半高宽约为46meV，表明采用UHV／CVD工艺生长的多层量子点具有较窄的尺寸分布．     

快速光热退火制备硅基锗薄膜的机理研究

采用磁控溅射技术首先在单晶硅衬底上溅射石墨缓冲层,然后在石墨层上溅射沉积Ge薄膜。采用快速光热退火和常规热退火对Ge薄膜后续处理。通过X射线衍射及Raman光谱测试,研究不同退火条件下薄膜的晶化情况,揭示了光子在薄膜晶化中的作用。研究表明,光量子效应对锗薄膜晶化既有晶化作用,也有退晶化作用。     

SiO2/Si(111)表面Ge量子点的生长研究

Si衬底用化学方法清洗后,表面大约残余1.0 nm厚SiO2薄膜.利用原子力显微镜(AFM)和反射高能电子衍射(RHEED)来研究温度和Ge蒸发厚度对在SiO2薄膜表面生长的Ge量子点的影响.实验结果表明,当衬底温度超过500 ℃时,SiO2开始与Ge原子发生化学反应,并形成与Si(111)表面直接外延的Ge量子点.在650 ℃时,只有Ge的厚度达到0.5nm时,Ge量子点才开始形成.     

Emission wavelength trimming of self-assembled InGaAs/GaAs quantum dots with GaAs/AlGaAs superlattices by rapid thermal annealing

The effects of rapid thermal annealing on InGaAs quantum dots grown by atomic layer molecular beam epitaxy to the structural transformation and optical properties are investigated. No misfit dislocation was observed from either the as-grown or annealed dots. The size and composition of the quantum dots become more uniform upon annealing mainly from the height fluctuation as predicted by the theoretical model. Large bandgap blue shifts, resulted from the In and Ga interdiffusion, were observed with the preservation of three-dimensional carrier confinement. The GaAs/AlGaAs superlattice was found to minimize the defect diffusion and dot interdiffusion during the high-temperature epitaxial overgrowth.     

Effects of pulsed laser radiation on epitaxial self-assembled Ge quantum dots grown on Si substrates

Laser irradiation of Ge quantum dots (QDs) grown on Si(100) substrates by solid-source molecular beam epitaxy has been performed using a Nd:YAG laser (532 nm wavelength, 5 ns pulse duration) in a vacuum. The evolution of the Ge QD morphology, strain and composition with the number of laser pulses incident on the same part of the surface, have been studied using atomic force microscopy, scanning electron microscopy and Raman spectroscopy. The observed changes in the topographical and structural properties of the QDs are discussed in terms of Ge-Si diffusion processes. Numerical simulations have been developed for the investigation of the temperature evolution of the QDs during laser irradiation. The obtained results indicate that the thermal behaviour and structural variation of the nanostructures differ from conventional thermal annealing treatments and can be controlled by the laser parameters. Moreover, an unusual island motion has been observed under the action of subsequent laser pulses.     

Study of various strain energy distribution in InGaN/GaN multiple quantum wells

The formation of In-rich quantum dot structures will induce strain energy in the quantum well layer, forming the clusters and stacking faults influencing the optical properties. Our results showed different QW widths with the formation of various In-rich quantum dot structures and different levels of strain energy. Upon thermal annealing, energy relaxation resulted in the reshaping of quantum dots and hence the changes of optical properties. The results of temperature variations of PL spectral peak, integrated PL intensity and PL decay time showed consistent trends in varying strain energy distribution.     

Effect of post-growth rapid thermal annealing on bilayer InAs/GaAs quantum dot heterostructure grown with very thin spacer thickness

We have investigated the effect of post-growth rapid thermal annealing on self-assembled InAs/GaAs bilayer quantum dot samples having very thin barrier thickness (7.5-8.5 nm). In/Ga interdiffusion in the samples due to annealing is presumed to be controlled by the vertical strain coupling from the seed dots in bilayer heterostructure. Strain coupling from embedded seed QD layer maintains a strain relaxed state in active top islands of the bilayer quantum dot sample grown with comparatively thick spacer layer (8.5 nm). This results in minimum In/Ga interdiffusion. However controlled interdiffusion across the interface between dots and GaAs barrier, noticeably enhances the emission efficiency in such bilayer quantum dot heterostructure on annealing up to 700 °C.     

The Urbach–Martienssen absorption tails in the optical spectra of semiconducting variable-sized zinc selenide and cadmium selenide quantum dots in thin film form

The sub-bandgap exponential absorption tails of Urbach–Martienssen type in chemically deposited variable-sized ZnSe and CdSe quantum dots in thin film form were studied. The Urbach energy, characterizing the steepness of the exponential absorption tails, was found to decrease upon particle size enlargement due to thermal annealing of the as-deposited ZnSe and CdSe quantum dots in thin film form. Such decrease of the Urbach energy was attributed to the decrease of the degree of structural disorder upon annealing of the semiconducting quantum dot thin films, manifested through lattice strain relaxation, average crystal size and lattice constant increase and dislocation density decrease. This behavior is in line with the predictions of the Cody model, relating the Urbach energy to the degree of structural disorder for a given material. In this way, it is shown that semiconducting quantum dots deposited in thin film form have a certain non-thermal component to the exponential absorption tails of the Urbach–Martienssen type. This non-thermal component is due to the inherent nanocrystalline character of the semiconducting quantum dots, characterized with a rather pronounced structural disorder, manifested through a certain degree of lattice strain and the rather large values for the dislocation densities.     

The influence of post-growth annealing on the optical properties of InAs quantum dot chains grown on pre-patterned GaAs(100)

We report on the effect of post-growth thermal annealing of [011]- ,[011(-)]-, and [010]-oriented quantum dot chains grown by molecular beam epitaxy on GaAs(100) substrates patterned by UV-nanoimprint lithography. We show that the quantum dot chains experience a blueshift of the photoluminescence energy, spectral narrowing, and a reduction of the intersubband energy separation during annealing. The photoluminescence blueshift is more rapid for the quantum dot chains than for self-assembled quantum dots that were used as a reference. Furthermore, we studied polarization resolved photoluminescence and observed that annealing reduces the intrinsic optical anisotropy of the quantum dot chains and the self-assembled quantum dots.     

Tensile strained Ge quantum wells on Si substrate: Post-growth annealing versus low temperature re-growth

We investigate tensile strained Ge/Si_1 − xGe_x (x = 0.87) multiple quantum wells (MQW) on a Ge virtual substrate abruptly grown on Si for integration in CMOS technology. Two schemes are discussed – Scheme A in situ growth of the MQW stack combined with post-growth rapid thermal annealing (RTA) and Scheme B re-growth of the MQW stack on an RTA strain optimized Ge-VS. Samples are characterized by Raman spectroscopy, X-ray diffraction (XRD), scanning transmission electron microscopy, Brewster transmission and photo-reflectance spectroscopy. The strain in the as-grown virtual substrate of Scheme A, measured with Raman spectroscopy and XRD, increases from 0.17% to 0.24% after RTA to 850 °C. XRD reveals an activated inter-diffusion of the MQWs and, at the highest temperatures (T_RTA > 750 °C), a structural relaxation. The MQWs of Scheme B appear to be of inferior quality. The inter-band transitions in this material are comparatively blue shifted and broad, which is attributed to relaxation induced dislocations at the interface between the virtual substrate and the multiple quantum wells.     

Ge–Si intermixing in Ge quantum dots on Si

We have provided direct evidence for the presence of considerable Si–Ge intermixing in strained and unstrained Ge quantum dots deposited on Si(001) and Si(111). The local structure around Ge was probed by using Ge K-edge X-ray absorption spectroscopy; complementary evidence for intermixing was provided by AFM and STM studies. These results implied that the strain energy in the dots was reduced by Si atoms diffusing into the dots, resulting in a modified form of Stranski–Krastanov growth.     

Ge quantum dot memory structure with laterally ordered highly dense arrays of Ge dots

This work was devoted to the development of a Ge quantum dot memory structure of a MOSFET type with laterally ordered Ge quantum dots within the gate dielectric stack. Lateral ordering of the Ge dots was achieved by the combination of the following technological steps: (a) use of a focused ion beam (FIB) to create ordered two-dimensional arrays of regular holes on a field oxide on the silicon substrate, (b) chemical cleaning and restoring of the Si surface in the holes, (c) further oxidation to transfer the pattern from the field oxide to the silicon substrate, (d) removal of the field oxide and thermal re-oxidation of the sample in order to create a tunneling oxide of homogeneous thickness on the patterned silicon surface, and (e) self-assembly of the two-dimensional arrays of Ge dots on the patterned tunneling oxide. The charging properties of the obtained memory structure were characterized by electrical measurements. Charging of the Ge quantum dot layer by electrons injected from the substrate resulted in a large shift in the capacitance-voltage curves of the MOS structure. Charges were stored in deep traps in the charging layer, and consequently the erasing process was difficult, resulting in a limited memory window. The advantages of controlled positioning of the quantum dots in the charging layer will be discussed.     

Fabrication and characterization of silicon quantum dots in Si-rich silicon carbide films

Amorphous Si-rich silicon carbide films were prepared by magnetron co-sputtering and subsequently annealed at 900-1100 degrees C. After annealing at 1100 degrees C, this configuration of silicon quantum dots embedded in amorphous silicon carbide formed. X-ray photoelectron spectroscopy was used to study the chemical modulation of the films. The formation and orientation of silicon quantum dots were characterized by glancing angle X-ray diffraction, which shows that the ratio of silicon and carbon significantly influences the species of quantum dots. High-resolution transmission electron microscopy investigations directly demonstrated that the formation of silicon quantum dots is heavily dependent on the annealing temperatures and the ratio of silicon and carbide. Only the temperature of about 1100 degrees C is enough for the formation of high-density and small-size silicon quantum dots due to phase separation and thermal crystallization. Deconvolution of the first order Raman spectra shows the existence of a lower frequency peak in the range 500-505 cm(-1) corresponding to silicon quantum dots with different atom ratio of silicon and carbon.