Thermoelectric Properties of Zintl Compound YbZn<Subscript>2</Subscript>Sb<Subscript>2</Subscript> with Mn Substitution in Anionic Framework

The thermoelectric properties of the Zintl compound YbZn₂Sb₂ with isoelectronic substitution of Zn by Mn in the anionic (Zn₂Sb₂)²⁻ framework have been studied. The p-type YbZn_2−x Mn _x Sb₂ (0.0 ≤ x ≤ 0.4) samples were prepared via melting followed by annealing and hot-pressing. Thermoelectric property measurement showed that the Mn substitution effectively lowered the thermal conductivity for all the samples, while it significantly increased the Seebeck coefficient for x < 0.2. As a result, a dimensionless figure of merit ZT of approximately 0.61 to 0.65 was attained at 726 K for x = 0.05 to 0.15, compared with the ZT of ~0.48 in the unsubstituted YbZn₂Sb₂.     

Thermal Stability of Thermoelectric Zn<Subscript>4</Subscript>Sb<Subscript>3</Subscript>

The thermal stability of the thermoelectric Zn₄Sb₃ has been investigated by synchrotron power diffraction measurements in the temperature range of 300 K to 625 K in a capillary sealed under Ar. Data were also collected in air on a 1% Cd-doped sample. Rietveld refinements of the data indicate that a variety of impurity phases are formed. After heat treatment, more than 85% of the Zn₄Sb₃ phase remains in the 1% Cd-doped sample heated in air, and 97% remains in the undoped Zn₄Sb₃ heated in Ar. These stabilities are better than those previously observed in pure samples heated in air. This suggests that doping, as well as oxygen or oxidation impurities, play important roles in the thermal stability of this compound.     

Thermoelectric power of Bi<Subscript>92</Subscript>Sb<Subscript>8</Subscript> and Bi<Subscript>85</Subscript>Sb<Subscript>15</Subscript> thin films

The results of studying the galvanomagnetic and thermoelectric properties of thin block Bi₉₂Sb₈ and Bi₈₅Sb₁₅ films on mica and polyimide substrates are presented. The method used for measuring the thermoelectric power allowed us to study the temperature dependence the thermoelectric power, without introducing additional deformations into the substrate–film system. A significant difference in the temperature dependences of the galvanomagnetic and thermoelectric properties of films on mica and polyimide is found. The free charge-carrier concentrations and mobilities in the films on mica and polyimide and levels of the chemical potential for electrons and holes are calculated within the two-band approximation. The difference in the charge-carrier parameters for films on mica and polyimide is associated with strains in the film–substrate system.     

Thermoelectric Properties of Mo<Subscript>3</Subscript>Sb<Subscript>5.4</Subscript>Te<Subscript>1.6</Subscript> and Ni<Subscript>0.06</Subscript>Mo<Subscript>3</Subscript>Sb<Subscript>5.4</Subscript>Te<Subscript>1.6</Subscript>

Mo₃Sb₇, crystallizing in the Ir₃Ge₇ type structure, has poor thermoelectric (TE) properties due to its metallic behavior. However, by a partial Sb-Te exchange, it becomes semiconducting without noticeable structure changes and so achieves a significant enhancement in the thermopower with the composition of Mo₃Sb₅Te₂. Meanwhile, large cubic voids in the Mo₃Sb₅Te₂ crystal structure provide the possibility of filling the voids with small cations to decrease the thermal conductivity by the so-called rattling effect. As part of the effort to verify this idea, we report herein the growth as well as measurements of the thermal and electrical transport properties of Mo₃Sb_5.4Te_1.6 and Ni_0.06Mo₃Sb_5.4Te_1.6.     

Low-Temperature Thermoelectric Properties of Co<Subscript>0.9</Subscript>Fe<Subscript>0.1</Subscript>Sb<Subscript>3</Subscript>-Based Skutterudite Nanocomposites with FeSb<Subscript>2</Subscript> Nanoinclusions

Bulk thermoelectric nanocomposite materials have great potential to exhibit higher ZT due to effects arising from their nanostructure. Herein, we report low-temperature thermoelectric properties of Co_0.9Fe_0.1Sb₃-based skutterudite nanocomposites containing FeSb₂ nanoinclusions. These nanocomposites can be easily synthesized by melting and rapid water quenching. The nanoscale FeSb₂ precipitates are well dispersed in the skutterudite matrix and reduce the lattice thermal conductivity due to additional phonon scattering from nanoscopic interfaces. Moreover, the nanocomposite samples also exhibit enhanced Seebeck coefficients relative to regular iron-substituted skutterudite samples. As a result, our best nanocomposite sample boasts a ZT = 0.041 at 300 K, which is nearly three times as large as that for Co_0.9Fe_0.1Sb₃ previously reported.     

Thermoelectric Properties of Cu-doped Bi<Subscript>0.4</Subscript>Sb<Subscript>1.6</Subscript>Te<Subscript>3</Subscript> Prepared by Hot Extrusion

Cu_0.003Bi_0.4Sb_1.6Te₃ alloys were prepared by using encapsulated melting and hot extrusion (HE). The hot-extruded specimens had the relative average density of 98%. The (00l) planes were preferentially oriented parallel to the extrusion direction, but the specimens showed low crystallographic anisotropy with low orientation factors. The specimens were hot-extruded at 698 K, and they showed excellent mechanical properties with a Vickers hardness of 76 Hv and a bending strength of 59 MPa. However, as the HE temperature increased, the mechanical properties degraded due to grain growth. The hot-extruded specimens showed positive Seebeck coefficients, indicating that the specimens have p-type conduction. These specimens exhibited negative temperature dependences of electrical conductivity, and thus behaved as degenerate semiconductors. The Seebeck coefficient reached the maximum value at 373 K and then decreased with increasing temperature due to intrinsic conduction. Cu-doped specimens exhibited high power factors due to relatively higher electrical conductivities and Seebeck coefficients than those of undoped specimens. A thermal conductivity of 1.00 Wm^?1 K^?1 was obtained at 373 K for Cu_0.003Bi_0.4Sb_1.6Te₃ hot-extruded at 723 K. A maximum dimensionless figure of merit, ZT _max = 1.05, and an average dimensionless figure of merit, ZT _ave = 0.98, were achieved at 373 K.     

Thermoelectric Characterization of Zone-Melted and Quenched Zn<Subscript>4</Subscript>Sb<Subscript>3</Subscript>

Because of its complex structure, Zn₄Sb₃ exhibits relatively low thermal conductivity. This, in combination with large values of the Seebeck coefficient and moderate to high electrical conductivity, makes the material especially interesting for thermoelectric application in temperatures up to 400°C. The phase purity and thermal stability of Zn₄Sb₃ are major issues for its thermoelectric performance and are strongly dependent on the synthesis method, atmosphere, density, and grain size. Therefore, Zn₄Sb₃ was prepared by both zone melting and quenching in this study, and pressed samples from crushed powders of three different grain sizes were compared. The effect of thermal cycling was studied, along with repeated structural analysis and Seebeck mapping. It was found that zone melting leads to improved thermal stability regarding decomposition via Zn loss, which finally may result in the formation of ZnSb. Larger grain size seems to reduce the degradation, because of lower concentration of grain boundaries, thus hindering diffusion inside the material.     

Thermoelectric Properties of Co-Doped TiS<Subscript>2</Subscript>

The thermoelectric properties of cobalt-doped compounds Co _x Ti_1−x S₂ (0 ≤ x ≤ 0.3) prepared by solid-state reaction were investigated from 5 K to 310 K. It was found that the electric resistivity ρ and absolute thermopower |S| for all the doped compounds decreased significantly with increasing Co content over the whole temperature range investigated. The increased lattice thermal conductivity of the doped compounds would imply enhancement of the acoustic velocity. Moreover, the ZT value of the doped compounds was improved over the whole temperature range investigated, and specifically reached 0.03 at 310 K for Co_0.3Ti_0.7S₂, being about 66% larger than that of TiS₂.     

Thermoelectric Properties of Layer-Antiferromagnet CuCrS<Subscript>2</Subscript>

We have performed a detailed study of the electrical and thermal conductivities and thermoelectric power behavior of an antiferromagnetic-layer compound of chromium, CuCrS₂, from 15 K to 300 K. Unlike previous studies, we find noninsulating properties and sensitive dependence on the preparation method, the microstructure, and the flaky texture formed in polycrystalline samples after extended sintering at high temperatures. Flakes are found to be metallic, with strong localization effects in the conductivity on cooling to low temperatures. The antiferromagnetic transition temperature T _N (=40 K) remains essentially unaffected. The Seebeck coefficient is found to be in the range of 150 μV/K to 450 μV/K, which is exceptionally large, and becomes temperature independent at high temperatures, even for specimens with low resistivity values of 5 mΩ cm to 200 mΩ cm. We find the thermal conductivity κ to be low, viz. 5 mW/K cm to 30 mW/K cm. This can be attributed mostly to the dominance of lattice conduction over electronic conduction. The value of κ is further reduced by disorder in Cu occupancy in the quenched phase. We also observe an unusually strong dip in κ at T _N, which is probably due to strong magnetocrystalline coupling in these compounds. Finally we discuss the properties of CuCrS₂ as a heavily doped Kondo-like insulator in its paramagnetic phase. The combination of the electronic properties observed in CuCrS₂ makes it a potential candidate for various thermoelectric applications.     

Thermoelectric Properties of Co<Subscript>4</Subscript>Sn<Subscript>6</Subscript>Se<Subscript>6</Subscript> Ternary Skutterudites

A ternary ordered variant of the skutterudite structure, the Co₄Sn₆Se₆ compound, was prepared. Polycrystalline samples were prepared by a modified ceramic method. The electrical conductivity, the Seebeck coefficient and the thermal conductivity were measured over a temperature range of 300–800 K. The undoped Co₄Sn₆Se₆ compound was of p-type electrical conductivity and had a band gap E _g of approximately 0.6 eV. The influence of transition metal (Ni and Ru) doping on the thermoelectric properties was studied. While the thermal conductivity was significantly lowered both for the undoped Co₄Sn₆Se₆ compound and for the doped compounds, as compared with the Co₄Sb₁₂ binary skutterudite, the calculated ZT values were improved only slightly.     

Nitrogen-doped Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript> films for nonvolatile memory

Nitrogen-doped Ge₂Sb₂Te₅ (GST) films for nonvolatile memories were prepared by reactive sputtering with a GST alloy target. Doped nitrogen content was determined by using x-ray photoelectron spectroscopy (XPS). The crystallization behavior of the films was investigated by analyzing x-ray diffraction (XRD) and differential scanning calorimetry (DSC). Results show that nitrogen doping increases crystallization temperature, crystallization-activation energy, and phase transformation temperature from fcc to hexagonal (hex) structure. Doped nitrogen probably exists in the grain vacancies or grain boundaries and suppresses grain growth. The electrical properties of the films were studied by analyzing the optical band gap and the dependence of the resistivity on the annealing temperature. The optical band gap of the nitrogen-doped GST film is slightly larger than that of the pure GST film. Energy band theory is used to analyze the effect of doped nitrogen on electrical properties of GST films. Studies reveal that nitrogen doping increases resistivity and produces three relatively stable resistivity states in the plot of resistivity versus annealing temperature, which makes GST-based multilevel storage possible. Current-voltage (I-V) characteristics of the devices show that nitrogen doping increases the memory’s dynamic resistance, which reduces writing current from milliampere to microampere.     

Thermoelectric Properties of Zr<Subscript>3</Subscript>Mn<Subscript>4</Subscript>Si<Subscript>6</Subscript> and TiMnSi<Subscript>2</Subscript>

The Seebeck coefficient, electrical resistivity, and thermal conductivity of Zr₃Mn₄Si₆ and TiMnSi₂ were studied. The crystal lattices of these compounds contain relatively large open spaces, and, therefore, they have fairly low thermal conductivities (8.26 Wm⁻¹ K⁻¹ and 6.63 Wm⁻¹ K⁻¹, respectively) at room temperature. Their dimensionless figures of merit ZT were found to be 1.92 × 10⁻³ (at 1200 K) and 2.76 × 10⁻³ (at 900 K), respectively. The good electrical conductivities and low Seebeck coefficients might possibly be due to the fact that the distance between silicon atoms in these compounds is shorter than that in pure semiconductive silicon.     

Electrodeposition and Thermoelectric Characteristics of Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript> and Sb<Subscript>2</Subscript>Te<Subscript>3</Subscript> Films for Thermopile Sensor Applications

A thermopile sensor was processed on a glass substrate by electrodeposition of n-type bismuth telluride (Bi-Te) and p-type antimony telluride (Sb-Te) films. The n-type Bi-Te film electrodeposited at −50 mV in a 50 mM electrolyte with a Bi/(Bi + Te) mole ratio of 0.5 exhibited a Seebeck coefficient of −51.6 μV/K and a power factor of 7.1 × 10⁻⁴ W/K² · m. The p-type Sb-Te film electroplated at 20 mV in a 70 mM solution with an Sb/(Sb + Te) mole ratio of 0.9 exhibited a Seebeck coefficient of 52.1 μV/K and a power factor of 1.7 × 10⁻⁴ W/K² · m. A thermopile sensor composed of 196 pairs of the p-type Sb-Te and the n-type Bi-Te thin-film legs exhibited sensitivity of 7.3 mV/K.     

Thermoelectric Properties of Co<Subscript>4</Subscript>Sb<Subscript>12</Subscript> Skutterudite Materials with Partial In Filling and Excess In Additions

The properties of Co₄Sb₁₂ with various In additions were studied. X-ray diffraction revealed the presence of the pure δ-phase of In_0.16Co₄Sb₁₂, whereas impurity phases (γ-CoSb₂ and InSb) appeared for x = 0.25, 0.40, 0.80, and 1.20. The homogeneity and morphology of the samples were observed by Seebeck microprobe and scanning electron microscopy, respectively. All the quenched ingots from which the studied samples were cut were inhomogeneous in the axial direction. The temperature dependence of the Seebeck coefficient (S), electrical conductivity (σ), and thermal conductivity (κ) was measured from room temperature up to 673 K. The Seebeck coefficient of all In-added Co₄Sb₁₂ materials was negative. When the filler concentration increases, the Seebeck coefficient decreases. The samples with In additions above the filling limit (x = 0.22) show an even lower Seebeck coefficient due to the formation of secondary phases: InSb and CoSb₂. The temperature variation of the electrical conductivity is semiconductor-like. The thermal conductivity of all the samples decreases with temperature. The central region of the In_0.4Co₄Sb₁₂ ingot shows the lowest thermal conductivity, probably due to the combined effect of (a) rattling due to maximum filling and (b) the presence of a small amount of fine-dispersed secondary phases at the grain boundaries. Thus, regardless of the non-single-phase morphology, a promising ZT (S ² σT/κ) value of 0.96 at 673 K has been obtained with an In addition above the filling limit.     

Switching effects in the films based on Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript>

Experimental results on the switching effects related to the phase transitions in Ge₂Sb₂Te₅ in the presence of external voltage or laser irradiation are presented. An electron model of the reversible switching is discussed.     

Special features of Sb<Subscript>2</Subscript> and Sb<Subscript>4</Subscript> incorporation in MBE-grown AlGaAsSb alloys

AlGaAsSb and GaAsSb alloys of different composition were grown by molecular-beam epitaxy (MBE) on GaSb, InAs, and GaAs substrates, using both conventional and cracker antimony effusion cells. The incorporation coefficients of dimer and tetramer antimony molecules, which totally describe the kinetic processes on the growth surface, were calculated. The differences in the incorporation of Sb₂ and Sb₄ molecules in MBE-grown GaAsSb alloys are shown. The effect of the MBE-growth parameters (substrate temperature and incident fluxes of group-V and group-III elements) on the composition of (Al,Ga)AsSb alloys and the incorporation coefficient of Sb was studied in detail. The incorporation coefficients of tetramer and dimer antimony molecules were found to vary over a wide range, depending on the substrate temperature and the ratio between the arrival rates of the group-III and the group-V elements.     

Microstructures and Thermoelectric Properties of an Annealed Ti<Subscript>0.5</Subscript>(Hf<Subscript>0.5</Subscript>Zr<Subscript>0.5</Subscript>)<Subscript>0.5</Subscript>NiSn<Subscript>0.998</Subscript>Sb<Subscript>0.002</Subscript> Ribbon

The thermoelectric half-Heusler compound Ti_0.5(Hf_0.5Zr_0.5)_0.5NiSn_0.998Sb_0.002 was fabricated by spin-casting and subsequent annealing. ZT at room temperature increased with annealing time through an increase in absolute Seebeck coefficients despite a decrease in electrical conductivity. ZT reached 0.10 after annealing at 1050 K for 48 h. In powder x-ray diffraction analysis, each half-Heusler peak was accompanied by a bump at the high-angle side, corresponding to a minor Ti-rich half-Heusler phase. The quantity and Ti composition of the minor phase increased with annealing time, although those of the major half-Heusler phase were almost constant. In transmission electron microscopic analysis, granular domains, several nanometers in size, with atomic ordering or disordering were observed. Thermoelectric properties were␣improved by annealing through the growth of heterogeneous microstructures of the Ti-rich and Ti-poor half-Heusler grains and of the granular domains.     

Effect of Deformation Temperature on Texture and Thermoelectric Properties of Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> Prepared by Hot-Press Deformation

The effects of deformation temperature on texture and thermoelectric properties of p-type Bi_0.5Sb_1.5Te₃ sintered materials were investigated. The sintered materials were prepared by mechanical alloying and hot-press sintering. The hot-press deformation was performed at 723 K and 823 K by applying mechanical pressure in a graphite die. Then, the materials were extruded in the direction opposite to the direction of applied pressure. X-ray diffraction and electron backscattered diffraction patterns showed that the hexagonal c-plane tended to align along the extruded direction when the samples were deformed at high temperatures. The thermoelectric power factor was increased by high-temperature hot-press deformation because of the low electrical resistivity that originated from the c-plane orientation.     

Thermal Stability of Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript> in Contact with Ti and TiN

The thermal stability of a Ge₂Sb₂Te₅ chalcogenide layer in contact with titanium and titanium nitride metallic thin films has been investigated mainly using x-ray diffraction and elastic nuclear backscattering techniques. Without breaking vacuum, Ti and TiN have been deposited on Ge₂Sb₂Te₅ material using magnetron sputtering. Thermal treatments have been performed in a 10⁻⁷ mbar vacuum furnace. On annealing up to 450°C, the TiN metallic film does not interact with the chalcogenide film, but at the same time adhesion problems and instabilities in contact resistance arise. To improve the adhesion and eventually stabilize the contact resistance, an interfacial Ti layer has been considered. At 300°C, a TiTe₂ compound is formed by interacting with Te segregated from the Ge₂Sb₂Te₅ layer. At higher temperatures, the Ti layer decomposes the chalcogenide film, forming several compounds tentatively identified as GeTe, Ge₃Ti₅, Ge₅Ti₆, TiTe_2,, and Sb₂Te₃. It has been found that the properties of the Ge₂Sb₂Te₅ film can be retained by controlling the decomposition rate of the chalcogenide layer, which is achieved by providing a limited supply of Ti and/or by depositing a Te-rich Ge₂Sb₂Te₅ film.     

Electrical and Thermal Conductivity and Conduction Mechanism of Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript> Alloy

Ge₂Sb₂Te₅ alloy has drawn much attention due to its application in phase-change random-access memory and potential as a thermoelectric material. Electrical and thermal conductivity are important material properties in both applications. The aim of this work is to investigate the temperature dependence of the electrical and thermal conductivity of Ge₂Sb₂Te₅ alloy and discuss the thermal conduction mechanism. The electrical resistivity and thermal conductivity of Ge₂Sb₂Te₅ alloy were measured from room temperature to 823 K by four-terminal and hot-strip method, respectively. With increasing temperature, the electrical resistivity increased while the thermal conductivity first decreased up to about 600 K then increased. The electronic component of the thermal conductivity was calculated from the Wiedemann–Franz law using the resistivity results. At room temperature, Ge₂Sb₂Te₅ alloy has large electronic thermal conductivity and low lattice thermal conductivity. Bipolar diffusion contributes more to the thermal conductivity with increasing temperature. The special crystallographic structure of Ge₂Sb₂Te₅ alloy accounts for the thermal conduction mechanism.