吐温和十二烷基硫酸钠作修饰剂对水热合成法制备纳米铜的影响

在一定温度下的水溶液中,以硫酸铜为前驱体,抗坏血酸(Vc)为还原剂,加入适量修饰剂,进行了粒径、形貌可控的纯铜纳米粒子的合成。通过X射线衍射分析(XRD)、透射电子显微镜观察(TEM)、选区电子衍射分析(SAED)和傅立叶红外光谱分析(FTIR)等手段对纳米铜进行了表征。制备过程中添加的修饰剂对铜粉颗粒的粒径大小、粒径分布、形貌和晶型结构的影响很大。分别探讨了单一修饰剂(吐温系列(Tween-20、Tween-40和Tween-80)和十二烷基硫酸钠(SDS))和复配修饰剂(SDS Tween-20、SDS Tween-40和SDS Tween-80)的影响作用,并初步解释了修饰剂的作用机理,将其归纳为静电效应和位阻效应。     

化学镀法制备铜包覆SiC颗粒的研究

采用化学镀法制备了镀铜SiC粉体,研究了预处理、镀液成分、pH值和装载量对SiC化学镀铜的影响,并比较了主盐含量和装载量对复合粉体中铜含量变化的影响。利用XRD,SEM和EDS对粉体的物相、形貌、成分进行了分析,得到了最佳施镀工艺。结果表明:用于预处理的活化敏化液要放置一段时间后使用,才能成功地实施化学镀铜;随着pH值和主盐含量的升高,镀速呈上升趋势,但粉体的包覆完整性和均一性下降;通过改变装载量来控制复合粉体中的铜含量可行。     

Niehoff M5拉丝机国产化设计

针对Niehoff M5拉丝机结构特点及用户对铜丝产品质量的要求,对Niehoff M5拉丝机进行国产化设计,即加入退火装置。介绍了退火装置的工作原理,设计要点和结构示意图。加入退火装置的Niehoff M5拉丝机生产出的产品的韧性、耐磨性等性能都得到了较大的是高。     

基于选冶联合的废印刷线路板铜粉源头除杂的技术路线

废印刷线路板是重要的城市矿产资源,因其成分复杂导致其处理难度大。在详细总结废印刷线路板回收利用方法的基础上,针对主流的废印刷线路板火法冶金处理工艺存在的锡铅锌等杂质金属分散和有机物燃烧释放有害气体的问题,提出一种基于选冶联合的废印刷线路板铜粉源头除杂的技术路线:废印刷线路板铜粉通过碱性加压氧化浸出,使锡铅锌等杂质金属溶解进入浸出液,锡浸出率>98.2%,浸出液经硫化净化脱除杂质,铅和锌的沉淀率>99.5%,净化液经电积产出98.0%的粗锡;浸出渣中废印刷线路板基体和阻焊油等有机物从铜箔表面剥离,采用摇床使之分离,有机物脱除率>50.0%。采用选冶联合的方法脱除了废印刷线路板铜粉中的大部分锡杂质金属和有机物,为后续火法炼铜提供了优质原料,为废印刷线路板铜粉在火法炼铜系统的高效处理提供了新的技术路线。     

化学镀镍作为钢酸性镀铜前处理工艺的应用研究

为了防止钢表面酸性电镀铜出现置换铜,采取在电镀铜前增加化学镀镍工序,研究了化学镀镍工艺对酸性电镀铜的影响。结果表明,化学镀镍时间超过6 min时(镍层厚度>2.5～3μm),工件在酸性镀铜液中浸泡10 min,无置换铜出现。化学镀镍层对后续的酸性镀铜层的表面形貌和附着力均无明显影响,表明化学镀镍可作为钢酸性镀铜的底层。     

化学镀 Cu-Co-P 非晶合金及其催化性能表征

目的优化Cu-Co-P非晶合金的化学镀工艺,研究其对硼氢化钠水解制氢的催化性能。方法以铁片为基体,研究化学镀Cu-Co-P非晶合金的制备工艺,探讨镀液成分对沉积速率、镀液稳定性及镀层质量的影响,并根据研究结果筛选出化学镀Cu-Co-P的优化配方。采用该配方对氧化铝(γ-Al2O3)基体施镀,制备出负载型Cu-Co-P/γ-Al2O3非晶合金催化剂,对其组成、形貌和结构等进行表征。利用硼氢化钠水解制氢实验,评价制备的负载型Cu-Co-P多元合金催化剂的催化性能。结果根据优化配方制备出的负载型非晶合金Cu-Co-P/γ-Al2O3催化剂的比表面积为233 m2/g,相对组成为57.85%Cu+39.69%Co钴+2.46%P(均为质量分数)。45℃条件下,在20 m L含1 g硼氢化钠和1 g氢氧化钠的溶液中,硼氢化钠水解制氢的速率为1295 m L/(g·min)。结论化学镀Cu-Co-P的优化配方组成为:硫酸钴20 g/L,硫酸铜0.7 g/L,次亚磷酸钠40 g/L,柠檬酸钠20 g/L,EDTA-2Na 10 g/L,氟化铵25 g/L。工艺参数为:温度(85±1)℃,p H=9。     

The features of mass transfer in the electroreduction of copper from aqueous ethanol solutions of copper sulfate

The process of electroreduction of copper from aqueous ethanol solutions of copper sulfate on a copper electrode is studied using the polarization and impedance techniques. It is shown that, at the working electrode potentials in a range of −0.6 to −0.8 V, the rate-limiting step of the process is the diffusion of copper ions to the electrode’s surface. The diffusion coefficient of copper ions at an ethanol concentration of about 0.08 m. f. takes the minimum value due to the restructuring of the near-electrode layer at the given concentration of alcohol.     

形变Cu-20vol%Fe原位复合材料研究

研究了形变Cu-20vol％Fe原位复合材料的组织结构，结果发现，合金经室温变形后，Fe相由铸造态的树枝状变成纤维状组织，在纵截面上呈现片状，其厚度随变形量增加而减小，在横断面上呈弯曲的薄片状。随变形量增加，Cu-20vol％Fe合金的强度提高。适当的中间热处理可以大大降低其电阻率，经过室温形变和中间热处理的合理配合，可获得良好强度和电导率的结合。     

二段脱铜液还原结晶法脱砷新工艺

对铜电解液脱砷方法进行研究,提出以二段脱铜液为原料,采用SO2还原结晶法脱砷新工艺。在二段脱铜液中通入SO2,将其中的As(Ⅴ)还原成As(Ⅲ),还原后的溶液通过蒸发结晶析出As2O3,达到二段脱铜液脱砷的目的。结果表明:当As(Ⅴ)浓度为12.41 g/L、H2SO4浓度为253.00 g/L、反应温度为60℃时,向二段脱铜液中通入SO290 min后静置90 min,二段脱铜液中As(Ⅴ)的还原率达到94.54%。还原后的溶液进行蒸发结晶,当蒸发前与结晶后的体积比(V0:V1)为3.5时,砷的脱除率达到91.33%,结晶产物为As2O3。与传统脱砷工艺相比,新工艺具有操作简单、成本低廉及砷的脱除效果明显等优势。     

从铝灰中回收铝制备超细氧化铝粉体过程研究

电解生产铝的过程中产生大量铝灰、铝渣,作废渣弃去,既污染环境又造成铝资源浪费.本文介绍了一条回收铝灰中的铝制备氧化铝粉体的新工艺.用硫酸浸取铝灰,使之转化为硫酸铝溶液,铝浸出率达95%以上;硫酸铝与碳酸氢铵反应生成前驱体碳酸铝铵沉淀和硫酸铵溶液,过滤、洗涤、煅烧碳酸铝铵得氧化铝扮体.所得产品经过XRD和SEM等方法检测为60mm的α-Al_2O_3.过程无废气、污水、新的废洼排放.     

Research on Copper Removal from Composite Wires of Copper-Stainless Steel Fibers

ＲｅｓｅａｒｃｈｏｎＣｏｐｐｅｒＲｅｍｏｖａｌｆｒｏｍＣｏｍｐｏｓｉｔｅＷｉｒｅｓｏｆＣｏｐｐｅｒＳｔａｉｎｌｅｓＳｔｅｌＦｉｂｅｒｓＨｅＷａｎｎｉａｎ，ＦｅｎｇＪｉｎｇｓｕａｎｄＨｅＳｉｊｉａ（何万年）（冯景苏）（何思郏）ＧｅｎｅｒａｌＲｅｓｅａ...     

氨-硫酸铵体系过硫酸盐氧化含钙镁碳酸盐低品位铜矿的浸出动力学(英文)

研究在氨?硫酸铵体系中用过硫酸盐氧化低品位铜矿浸出动力学,确定搅拌速度、浸出温度、矿物粒度及氨、硫酸铵和过硫酸钠的浓度对浸出的影响。结果表明,搅拌速度在300r/min以上时对浸出速度无影响,浸出速度随反应温度及氨、硫酸铵和过硫酸钠浓度的增大而增加。对浸出渣的EDS和物相定量分析表明斑铜矿被过硫酸盐氧化而溶解于氨?硫酸铵溶液。用产物层的界面传质和扩散控制的收缩核模型分析铜矿的溶解动力学,其表观活化能为22.91kJ/mol,同时获得了描述浸出过程的半经验动力学方程,其对氨、硫酸铵和过硫酸钠的浓度的表观反应级数分别为0.5、1.2和0.5。     

Synthesis of ultrafine copper particles by complex-reduction-extraction method

A novel chemical process for producing well-defined copper particles with satisfied anti-oxidation property was described. The resultant particles were characterized by X-ray diffractometry and scanning electron microscopy. The results show that well-dispersed nano-copper particles with 70 nm in diameter are obtained from the water/organic solution containing 0.2 mol/L Cu2. ion, with ammonia as ligand and ascorbic acid as reductant. In this process, the formation of copper-ligands in aqueous solution causes initial copper ions concentration very low, which is not only good to obtain homogeneous initial reaction solution, but also slower the initially drastic nucleation reaction rate. This makes the process more convenient for delaying the nuclei processes and for controlling the ultimate copper particles size. In addition, oleic acid acts as both a phase-transfer agent and a particle protector coordinating their carboxyl end groups on the new generated copper particles surface, the carbon tails of the oleic acids are pointed outwards from the surface of the synthesized particles. This organic film also seems to play an important role to prevent the new generated copper particles from oxidation.     

铟的还原浸出动力学及分步沉淀选择性分离（英文）

开展硫化锌精矿还原浸出高铁锌浸出渣高效浸铟及浸出液中铟选择性分离的研究。结果表明：在固体物料粒度74～105μm、反应温度90℃、浸出时间300 min、硫酸浓度1.4 mol/L的条件下,铟的浸出率达95%以上。采用收缩核模型对还原浸出动力学进行分析,不同条件下的浸出实验结果表明反应受穿过固体产物层的扩散控制,活化能为17.96 k J/mol,相对于硫酸浓度的反应级数为2.41。铁粉置换沉铜过程铜和砷的沉淀率均达99%以上。98%以上的铟从含高亚铁离子浓度的硫酸锌溶液中选择性分离,获得铟含量约为2.4%的富铟渣,经酸浸-萃取-电积工艺流程进一步处理后可得到纯铟。     

Preparation of ultrafine nickel powder by wet chemical process

1 Introduction Driven towards smaller size, higher capacitance and lower cost, the manufacturing techniques of multilayer ceramic capacitors(MLCCs) are now undergoing a revolution characterized by the development of MLCCs with base metal internal electrod…     

石墨表面无敏化及活化的化学镀铜法

由于石墨表面具有特殊性,具备自动催化的功能,因此无需敏化、活化等工艺,可直接在石墨表面进行化学镀铜,获得的铜镀层光滑致密,镀液的稳定性好,同时对石墨表面化学镀铜的机理进行了探讨,分析了镀液能稳定进行镀覆反应的原因,并利用SEM对反应初期以及后期的复合粉末进行了观察,证明反应时石墨表面能直接生成大量均匀分布的铜微晶,生长至彼此侧面相连时就得到完整镀层,并且石墨颗粒越小,化学镀铜的活性越高,因而非常适合用于制备高性能的金属石墨复合材料.     

Electro magnetic interference shielding characteristic of silver coated copper powder

The present investigation deals with the synthesis of silver coated copper powder for potential application as filler material in conductive polymers for electro magnetic interference (EMI) shielding. Copper powders were obtained by the reaction of cuprous oxide and, hydrazine in a mixed solvent (H₂O:ethanol) at various reaction conditions. The cuprous oxide powder was produced by the reaction of CuSO₄, NaOH and D-glucose. The synthesized copper powder was silver coated by its reaction with (NH₄)₂SO₄, C₄H₄O₆KNa and AgNO₃. The prepared powders were characterized by XRD, SEM, TGA and XPS. The coaxial transmission line method was used to measure the EMI shielding effectiveness of the powders. The silver coated copper powders exhibited an improved oxidation resistance and higher EMI shielding effectiveness as compared to the uncoated copper powders.     

CuSn预合金粉芯复合银钎料的润湿铺展机理

研究了添加质量分数为30%～70%CuSn预合金粉复合银钎料在T2紫铜基体上的润湿铺展过程,并讨论了CuSn预合金粉复合银钎料在紫铜基体上的润湿铺展机理.结果表明,在与紫铜基体的润湿铺展过程中,初始接触角由30%CuSn的119°降低到70%CuSn的94°.最终接触角由30%CuSn的15°下降到70%CuSn的7°.当粉芯中CuSn合金粉含量为60%时,钎料在铜板上的润湿面积达到530.04 mm²,相比于未添加CuSn合金粉时提高了约66%.由于低熔点CuSn预合金粉的前驱润湿作用使复合银钎料表面张力降低,初始接触角和最终接触角随着CuSn预合金粉含量的增加而减小. CuSn预合金粉在钎焊过程中先于BAg30CuZnSn钎料外皮熔化,形成熔融的铜锡液态合金薄层,降低了固液界面张力.随后,熔化的BAg30CuZnSn箔带在先期熔化的铜锡液态薄层上铺展,并与其发生溶质原子的扩散反应,最终形成液态复合钎料.低熔点CuSn预合金粉的加入,使复合银钎料在铜上的润湿性能显著改善.添加40%CuSn预合金粉复合银钎料与铜基体的反应润湿界面均匀致密,其中白色富Ag相互连接,...     

Liquid infiltrated powder interlayer bonding: a process for large gap joining

Abstract

The liquid infiltrated powder interlayer bonding (LIPIB) process is proposed to make large gap, transient liquid phase joints. Some basic aspects of the LIPIB process are discussed. In the LIPIB process, a joint with high mechanical properties requires a low volume fraction of porosity in the powder interlayer and low concentrations of melting point depressants in the joint. To achieve the fully infiltrated large gap joint, it is essential to maintain an open pore structure at the initial stage of infiltration, while allowing complete elimination of pores behind the infiltration front. Approximate analytical solutions are applied to describe dissolution of capillaries and isothermal diffusional solidification during infiltration. Calculations based on the Cu–Ag binary system show that infiltration kinetics are strongly affected by the geometry of the capillaries. When the effective capillary size is smaller than the critical effective capillary radius at a certain infiltration temperature, the isothermal solidification time will be less than the time required for full infiltration, leading to an incompletely infiltrated powder interlayer. Full infiltration of powder compacts requires tight control of the rearrangement rate of the particles such that a relatively large capillary radius can be maintained to prevent diffusional solidification before full infiltration. Meanwhile, the rearrangement should be able to close the pores behind the infiltration front. Small amounts of chromium or nickel powder addition into spherical copper powders were found to affect the rearrangement significantly, whereas little effect was observed for irregular copper powders. Copper–copper square joints with clearance up to 22 mm have been successfully made.     

超声场辅助增强化学还原法制备纳米铜粉及影响因素

对超声场辅助增强作用下的液相化学还原法制备纳米级铜粉的工艺过程和条件进行了研究. 研究表明: 在包覆剂存在的条件下, 硫酸铜溶液与不同还原剂相配合, 在超声场作用下可制得粒径小于100.nm的铜粉. 探讨了超声波场功率、冷却方式、反应时间、 pH值、反应温度等对粒径和反应转化率的影响. 通过参数调整可获得最佳的制备工艺.