基于SVM的电涡流传感器动态建模方法

传感器的动态特性反映了系统动态测试的能力,而时传感器动态特性描述的有效方法是建立传感器的动态模型.本文简单介绍了回归型支持向量机的基本原理,研究了利用支持向量机建立传感器动态模型的方法.利用支持向量机良好的回归拟合能力,建立了电涡流传感器的动态模型.实验结果表明该方法所建模型具有较高的准确性,为改善电涡流传感器的动态特性,实现动态补偿提供了一种较为有效的方法.     

基于模型参考和神经网络的传感器动态补偿器的设计

为了改善传感器的动态响应特性,提出了一种动态补偿器的设计方法.该方法在传感器后接一基于模型参考自适应方法的动态补偿器,并利用BP神经网络算法不断在线辨识补偿器参数,使其始终工作在最佳参数下,实现动态性能的在线补偿.试验表明,对动态品质较差的双孔悬臂梁式压力传感器进行在线补偿,其到达稳态值的调节时间由0.1 s缩短为0.015 s,动态性能得以较好的改善.该方法为提高传感器性能开辟了新途径.     

基于改进QR-PSO算法的压力传感器的动态补偿方法

针对压力传感器在实际使用中动态特性难以满足测试需求这一问题,利用激波管对压力传感器进行动态标定,获取实验样本,依赖样本估计逆模型,提出了基于QR分解和改进粒子群算法构建补偿系统的设计方法.采用QR分解确定模型阶次,降低了简化传感器模型带来的动态补偿运算误差,并结合改进粒子群算法,高效、智能的确定补偿系数.通过实测样本对补偿系统进行重复性验证,结果表明压力传感器的动态响应性能显著地提高了,补偿效果令人满意.     

用多项式预测滤波消噪的传感器动态特性辨识

在利用传感器进行动态测量时,为了得到精确的测量结果,需要建立传感器动态特性的数学模型,传感器动态特性可以通过系统辨识得到.但是,测量噪声的存在,使得辨识得到的传感器动态特性与实际动态特性存在一定误差,影响到测量系统的精度.为了解决该问题,本文讨论了多项式预测滤波和中值滤波相结合的方法对传感器输出信号进行滤波消噪.然后,利用消噪后的信号,通过系统辨识方法建立传感器动态特性的数学模型.研究表明,采用本文研究的方法可以克服测量噪声对传感器动态特性辨识的影响,并将该方法用于薄膜热电偶的动态特性辨识.     

压力传感器动态误差修正方法的FPGA实现

为了实时修正由于压力传感器动态特性引起的动态误差,提出了一种基于IIR数字补偿滤波器的FPGA实现方案.该方案首先依据压力传感器动态标定时的输入和输出数据利用改进的最小二乘算法建立全面描述传感器系统的数学模型,继而运用零极点配置方法重新配置模型零极点得到最优IIR补偿器模型及参数,其次在保证补偿器性能无失真或失真很小的基础上使用MATLAB工具量化补偿器模型参数,最后在以FPGA为控制核心的数据采集及存储系统的基础上应用量化的IIR补偿器模型参数设计了IIR补偿器软核,从而实现传感器动态误差的实时修正.实验结果表明:该方案能够实时有效地修正传感器动态误差.     

压阻式压力传感器的动态特性

综合分析了敏感元件构形与尺寸及传感器的封装结构对动态压力测量的影响。给出了几种ＣＹＧ压阻式压力传感器在动态压力测量时的频响特性的理论计算值与实验值。     

基于AlN绝缘的多晶硅高温压力传感器设计

探讨了一种多晶硅高温压力传感器的设计方法,采用AlN作硅衬底和多晶硅力敏电阻条之间的电绝缘层,由于无p-n结,力敏电阻无反向漏电,使制作的压力传感器特性好.利用多晶硅材料在高温条件下能够表现出良好的压阻特性,考虑其纵横向压阻效应的不同,作了理论分析,在此基础上制作力敏电阻条.利用有限元分析方法,借助MARC软件,模拟了传感器承压弹性膜的应力场分布.确定了多晶硅力敏电阻条的位置和排列方式.并且施加10kPa压力时,模拟了不同膜厚t与对应的最大应力o11的曲线;模拟了11方向主应力COMP11边缘中点应力为一特定值时所需压力尸N与膜厚t的关系曲线.     

正弦压力发生器在传感器动态校准中的应用

在介绍正弦压力发生器工作原理的基础上 ,讨论了在应用正弦压力发生器校准传感器动态性能时应用系统的组成和功能。同时 ,给出了采用正弦压力发生器校准传感器动态特性的两个实例。校准结果表明 :这两个传感器分别属于一阶和二阶模型 ,所得的参数模型在幅频和相频特性两方面都与实验结果一致     

运算型电容传感器在动态厚度测量中的应用研究

以运算型电容传感器在薄钢板厚度动态检测中的应用为例,分析了探头及变换电路各环节对动态特性的影响,建立了动态测量时的关系模型,提出了改善传感器动态响应的有效方法。     

压力传感器动态测量方法的研究

介绍一种获得压力传感器动态特性指标的方法,可以利用周期压力波激励压力传感器,测得压力传感器的频率响应,然后,利用计算机采集输出电压,通过软件处理滤波的方法,就可以获得压力传感器的频谱特性。测量结果证明:这种测量方法可以很方便地获得传感器全频程的动态特性,为进一步设计改善压力传感器的动态性能提供实验数据。     

数字气压传感器的一种高效标定和补偿方法

硅压阻式压力传感器受制造工艺和测量环境的影响,其输出大都具有一定的非线性,其中以温度的影响最为明显。鉴于此,传感器需要准确地标定测试和温度补偿,首先制作一种带有高精度AD和微处理器的数字气压传感器,用它采集数据;然后分析测试设备,确定采用恒压变温的标定方案,它不仅效率高,而且能准确反映传感器的温度和输出特性;最后用最小二乘算法在微处理器上实现温度补偿,补偿后传感器的输出精度满足了应用需求。     

基于LS-SVR的压力传感器温度自补偿策略

硅压阻式压力传感器在实际使用过程中受环境温度影响易发生温度漂移,同时传感器本身又存在一定的非线性,这使得传感器测量精度大幅度降低.针对传统的温度补偿方法中需引入温度传感器的情况,提出一种基于最小二乘支持向量回归(LS-SVR)的压力传感器温度自补偿策略,通过定义并测量传感器桥路自身参数获取温度信息实现温度补偿,而无需配置额外的温度传感器.通过粒子群算法和交叉验证对LS-SVR的参数进行了优化.实验结果表明:这种利用传感器自身桥路进行温度补偿的方法能够有效地消除压力传感器的温度漂移.补偿后测量精度达到0.1%FS.     

一种温压内爆炸准静态压力测量方法研究

针对有限空间温压爆炸准静态压力准确测量问题,依据传压管道滤波效应特性,设计了一种准静态压力测量组件,建立了温压内爆炸准静态压力测量方法。采用圆柱杆上的螺旋形凹槽结构,与内管壁组成了微型传压管道,与压阻型压力传感器配合,形成一种准静态压力测量组件,抑制了爆炸压力波中高频冲击波分量的传播,减小了爆炸光、热对压力传感器性能的影响。在激波管和准静态压力校准装置上,分别测量了压力组件的输出信号,得到测量组件的升压时间小于0.24 ms,测量误差小于0.6%,满足内爆炸场准静态压力的测试需求。目前,该测量方法已用于温压炸药内爆炸效应试实验中,为温压炸药爆炸释能评估提供了测试基础。     

High-Speed Flow Sensing as A Diagnostic Tool in the Development of Microfluidic Systems

Seyonic is developing a family of high-speed micro flow sensors with full-scale sensitivities between 0.25 and 10 microliter per second. The flow rate is determined by the measurement of a pressure difference across a fluidic restriction, using two integrated piezo-resistive pressure sensors. Main applications are in sub-microliter dispensing systems, where both sensor accuracy and speed provide real-time validation of the requested liquid volumes. The very fast response of the sensor, less than 2 ms, allows for measurement of liquid volumes down to the nL range. The sensor is able to measure not only the flow, but also the instantaneous pressure in the systems under evaluation. It is therefore possible to obtain valuable information on the system's operation for the characterization of fluidic components such as micromachined pumps, solenoid valves and jet dispensers     

基于QPSO稀疏化LSSVM的压力传感器温度补偿研究

针对硅压阻式压力传感器的温度补偿问题,提出一种量子粒子群(Quantum Particle Swarm Optimization,QPSO)稀疏化最小二乘支持向量机(Least Squares Support Vector Machine,LSSVM)策略,目的在于能够保证温度补偿性能的同时获得较为精简的补偿模型。结合10 MPa绝压压力传感器标定实验数据进行仿真试验,研究结果表明,该方法的补偿效果优于QPSO优化的LSSVM、经典稀疏化LSSVM和QPSO优化的稀疏化LSSVM,补偿后测试样本集的最大相对误差,平均误差和误差方差分别为1.104×10^-3、4.819×10^-4和1.197×10^-7。在满足高精度测试要求的前提下,达到提升补偿效率的目的。     

A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging

In the process of piezo-resistive pressure sensor packaging, a simple thermo-compression bonding setup has been fabricated to achieve the wire bonding interconnection of a silicon chip with printed circuit board. An annealed gold wire is joined onto a pad surface with a needle-like chisel under a force of 0.5–1.5 N/point. The temperature of the substrate was maintained in the range of 150–200°C and the temperature of the chisel was fixed at around 150°C during wire bonding operation. The tensile strength of the wire bonding was measured with a bonding tester by the destructive-pulling experiment and was found to be at the average of 132 mN/mm². The microstructure of the bonding point was examined by scanning electron microscopy. The interface of the thermo-compression boning was shown to possess an acceptable level of reliability for a micro-electromechanical system (MEMS)-based device. The results showed that this setup can be easily operated for fabrication and is suitable for fabricating not only low-cost pressure sensors, but also other MEMS devices.

     

基于MEMS实现SOI压力传感器工艺研究

应用压组效应原理制作硅氧化物绝缘体（SOI）压力传感器,具有耐高温、抗辐射、稳定性好等优点,本文说明了SOI在微电子机械系统（MEMS）技术上的实现优势,并对压力传感器SOI结构的实现工艺进行了探索性试验,完成了SOI压力传感器的设计和封装,在强调了压力传感器的测试方法的同时,对所设计的样品进行了测试。     

A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging

In the process of piezo-resistive pressure sensor packaging, a simple thermo-compression bonding setup has been fabricated to achieve the wire bonding interconnection of a silicon chip with printed circuit board. An annealed gold wire is joined onto a pad surface with a needle-like chisel under a force of 0.5?C1.5?N/point. The temperature of the substrate was maintained in the range of 150?C200°C and the temperature of the chisel was fixed at around 150°C during wire bonding operation. The tensile strength of the wire bonding was measured with a bonding tester by the destructive-pulling experiment and was found to be at the average of 132?mN/mm². The microstructure of the bonding point was examined by scanning electron microscopy. The interface of the thermo-compression boning was shown to possess an acceptable level of reliability for a micro-electromechanical system (MEMS)-based device. The results showed that this setup can be easily operated for fabrication and is suitable for fabricating not only low-cost pressure sensors, but also other MEMS devices.     

宽温度压阻式传感器的热灵敏度漂移补偿

介绍了压阻式传感器的灵敏度温度补偿原理 ,给出了一种在宽温度范围内采用了分段补偿方式进行灵敏度温度补偿的方法 ,实现了宽温度范围内较高的补偿准确度。这里介绍的方案是通过数 -模组合硬件电路实现分段补偿 ,具体方案是基于目前国内外OEM硅压力传感器厂商采用的固定电阻器并联补偿法。技术途径是设计一组温控开关电路来控制并联电阻器是否接入 ,温度信号来源于恒流源供电下的传感器桥压信号。此方法硬件电路及补偿计算均较简单 ,适用于较宽的温度环境 ,性能价格比合理。同时便于扩展为多段补偿以实现高补偿准确度 ,并且传感器在快速温变环境下工作时温度跟踪误差小。     

Biomimetic flexible/compliant sensors for a soft-body lamprey-like robot

This paper focuses on the development of biomimetic sensory abilities for an undulatory soft-body lamprey-like robot, which has been designed to replicate the locomotion mechanisms of living lamprey in order to address useful applications wherever locomotion in unstructured environments is required. The compliant sensory elements are piezo-resistive and made from compliant material called a quantum tunneling composite by mixing micro/nano carbon black particles into a highly soft silicone rubber matrix. The relationship of the composite strip between piezo-resistivity and mechanical strain is investigated by a universal strain–stress tensiometer through resistivity monitoring. Increasing and decreasing resitivity both appears during elongation and retraction, suggesting that piezo-resistivity in the composite material is governed by both percolation theory and quantum tunneling effects. Dynamic tests on the bench shows that the compliant stretch receptor is able to follow the stimulations under fairly wide frequency ranges, exceeding initial estimations. In addition, the compliant artificial stretch receptor has enough sensitivity to detect the local actuations and the actions generated by neighboring actuators in the segmented robotic structure. Finally, the experiments on biomimetic cilia-based cupula receptor show that a low cost flexible/compliant biomimetic sensor is able to detect medium fluidic speeds ranging from 0.05 m/s to 0.6 m/s.