Formation of dislocation loops in silicon by ion irradiation for silicon light emitting diodes

We have studied the influence of the ion species, ion energy, fluence, irradiation temperature and post-implantation annealing on the formation of shallow dislocation loops in silicon, for fabrication of silicon light emitting diodes. The substrates used were (1 0 0) Si, implanted with 20-80 keV boron at room temperature and 75-175 keV silicon at 100 and 200 °C. The implanted fluences were from 5 × 10¹⁴ to 1 × 10¹⁵ ions/cm². After irradiation the samples were processed for 15 s to 20 min at 950 °C by rapid thermal annealing. Structural analysis of the samples was done by transmission electron microscopy and Rutherford backscattering spectrometry. In all irradiations the silicon substrates were not amorphized, and that resulted in the formation of extrinsic perfect and faulted dislocation loops with Burgers vectors a/2〈1 1 0〉 and a/3〈1 1 1〉, respectively, sitting in {1 1 1} habit planes. It was demonstrated that by varying the ion implantation parameters and post-irradiation annealing, it is possible to form various shapes, concentration and distribution of dislocation loops in silicon.     

Anisotropy of disorder accumulation and recovery in 6H-SiC irradiated with Au ions at 140 K

Single crystal 〈0 0 0 1〉-oriented 6H-SiC was irradiated with Au²⁺ ions to fluences of 0.032, 0.058 and 0.105 ions/nm² at 140 K and was subsequently annealed at various temperatures up to 500 K. The relative disorder on both the Si and C sublattices has been determined simultaneously using in situ D⁺ ion channeling along the 〈0 0 0 1〉 and 〈〉 axes. A higher level of disorder on both the Si and C sublattices is observed along the 〈〉. There is a preferential C disordering and more C interstitials are aligned with 〈0 0 0 1〉. Room-temperature recovery along 〈〉 occurs, which is associated with the 〈0 0 0 1〉-aligned interstitials that annihilate due to close-pair recombination. Disorder recovery between 400 and 500 K is primarily attributed to annihilation of interstitials that are misaligned with 〈0 0 0 1〉 and to epitaxial crystallization. Effects of stacking order in SiC on disorder accumulation are insignificant; however, noticeable differences of low-temperature recovery in Au²⁺-irradiated 6H-SiC and 4H-SiC are observed.     

A systematic study on analysis-induced radiation damage in silicon during channeling Rutherford backscattering spectrometry analysis

Channeling Rutherford backscattering spectrometry (RBS) is an essential analysis technique in materials science. However, the accuracy of RBS can be significantly affected by disorders in materials induced by the analyzing ion beam even under channeling mode. We have studied RBS analysis-induced radiation damage in silicon. A 140-keV H⁺ ion beam was incident along 〈1 0 0〉 Si axis at room temperature to a fluence ranging from 1.6 × 10¹⁶ cm⁻² to 7.0 × 10¹⁶ cm⁻². The evolution of the aligned yields versus fluences has been examined and found to agree well with a model proposed by us.     

Behavior of crystalline silicon under huge electronic excitations: A transient thermal spike description

Recent experimental works devoted to the phenomena of mixing observed at metallic multilayers Ni/Si irradiated by swift heavy ions irradiations make it necessary to revisit the insensibility of crystalline Si under huge electronic excitations. Knowing that Ni is an insensitive material, such observed mixing would exist only if Si is a sensitive material. In order to extend the study of swift heavy ion effects to semiconductor materials, the experimental results obtained in bulk silicon have been analyzed within the framework of the inelastic thermal spike model. Provided the quenching of a boiling (or vapor) phase is taken as the criterion of amorphization, the calculations with an electron-phonon coupling constant g(300 K) = 1.8 × 10¹² W/cm³/K and an electronic diffusivity D_e(300 K) = 80 cm²/s nicely reproduce the size of observed amorphous tracks as well as the electronic energy loss threshold value for their creation, assuming that they result from the quenching of the appearance of a boiling phase along the ion path. Using these parameters for Si in the case of a Ni/Si multilayer, the mixing observed experimentally can be well simulated by the inelastic thermal spike model extended to multilayers, assuming that this occurs in the molten phase created at the Ni interface by energy transfer from Si.     

Effect of 200 MeV Ag ion irradiation on structural and electrical transport properties of Fe3O4 thin films

Thin films of Fe₃O₄ have been deposited on single crystal MgO(1 0 0) and Si(1 0 0) substrates using pulsed laser deposition. Films grown on MgO substrate are epitaxial with c-axis orientation whereas, films on Si substrate are highly 〈1 1 1〉 oriented. Film thicknesses are 150 nm. These films have been irradiated with 200 MeV Ag ions. We study the effect of the irradiation on structural and electrical transport properties of these films. The fluence value of irradiation has been varied in the range of 5 × 10¹⁰ ions/cm² to 1 × 10¹² ions/cm². We compare the irradiation induced modifications on various physical properties between the c-axis oriented epitaxial film and non epitaxial but 〈1 1 1〉 oriented film. The pristine film on Si substrate shows Verwey transition (T_V) close to 125 K, which is higher than generally observed in single crystals (121 K). After the irradiation with the 5 × 10¹⁰ ions/cm² fluence value, T_V shifts to 122 K, closer to the single crystal value. However, with the higher fluence (1 × 10¹² ions/cm²) irradiation, T_V again shifts to 125 K.     

Structural characterization of buried nitride layers formed by nitrogen ion implantation in silicon

The synthesis of buried silicon nitride insulating layers was carried out by SIMNI (separation by implanted nitrogen) process using implantation of 140 keV nitrogen (¹⁴N⁺) ions at fluence of 1.0 × 10¹⁷, 2.5 × 10¹⁷ and 5.0 × 10¹⁷ cm⁻² into 〈1 1 1〉 single crystal silicon substrates held at elevated temperature (410 °C). The structures of ion-beam synthesized buried silicon nitride layers were studied by X-ray diffraction (XRD) technique. The XRD studies reveal the formation of hexagonal silicon nitride (Si₃N₄) structure at all fluences. The concentration of the silicon nitride phase was found to be dependent on the ion fluence. The intensity and full width at half maximum (FWHM) of XRD peak were found to increase with increase in ion fluence. The Raman spectra for samples implanted with different ion fluences show crystalline silicon (c-Si) substrate peak at wavenumber 520 cm⁻¹. The intensity of the silicon peak was found to decrease with increase in ion fluence.     

Genesis capturing the sun: Solar wind irradiation at Lagrange 1

Genesis, a member of NASAs Discovery Mission program, is the world’s first sample return mission since the Apollo program to bring home solar matter in ultra-pure materials. Outside the protection of Earth’s magnetosphere at the Earth-Sun Lagrange 1 point, the deployed sample collectors were directly exposed to solar wind irradiation. The natural process of solar wind ion implantation into a highly pure silicon (Si) bulk composition array collector has been measured by spectroscopic ellipsometry and scanning transmission electron microscopy (STEM). Ellipsometry results show that bulk solar wind ions composed of approximately 95% H⁺, 4% He⁺ and <1% other elements physically altered the first 59-63 nm of crystalline silicon substrate during 852.8 days of solar exposure. STEM analysis confirms that the solar accelerated ions caused significant strain and visible structural defects to the silicon structure forming a 60-75 nm thick irradiation damage region directly below the surface SiO₂ native oxide layer. Monte Carlo simulations of solar wind H, He, C, O, Ne, Mg, Si and Fe ion collisions in the Si collector with fluences calculated from the Genesis and ACE spacecrafts were used to estimate the energy deposited and Si vacancies produced by nuclear stopping in a flight-like Si bulk array collector. The coupled deposited energy model with the flown Genesis Si in situ measurements provides new insight into the basic principles of solar wind diffusion and space weathering of materials outside Earth’s magnetosphere.     

Annular gas ionization detector for low energy heavy ion backscattering spectrometry

A gas ionization chamber for use in backscattering spectrometry has been built. It has the shape of a hollow cylinder and can be placed in-line with the incident ion beam. The entrance window for detected particles is composed of a circular array of silicon nitride membranes. A low noise preamplifier with cooled FET is used for charge amplification. The detector resolution has been measured for a variety of ions in the mass range from He to Si and for energies between 0.5 and 8 MeV. The energy resolution of the ionization chamber surpasses the one of a state-of-the-art silicon charged particle detector for all ions heavier than Li. For Si ions the improvement in resolution is more than a factor of 2. The device does not suffer from any radiation damage. For He particles around 1 MeV the resolution is between 13 and 16 keV (FWHM). Therefore the new detector is not only well suited for heavy ion backscattering spectrometry but can also be applied for standard He RBS, allowing the use of a single detector for all types of projectiles in a wide energy range.     

Atomistic properties of helium in hcp titanium: A first-principles study

First-principles calculations based on density functional theory have been performed to investigate the behaviors of He in hcp-type Ti. The most favorable interstitial site for He is not an ordinary octahedral or tetrahedral site, but a novel interstitial site (called FC) with a formation energy as low as 2.67 eV, locating the center of the face shared by two adjacent octahedrons. The origin was further analyzed by composition of formation energy of interstitial He defects and charge density of defect-free hcp Ti. It has also been found that an interstitial He atom can easily migrate along 〈0 0 1〉 direction with an activation energy of 0.34 eV and be trapped by another interstitial He atom with a high binding energy of 0.66 eV. In addition, the small He clusters with/without Ti vacancy have been compared in details and the formation energies of He_nV clusters with a pre-existing Ti vacancy are even higher than those of He_n clusters until n ? 3.     

Surface exfoliation and defect structures in Si induced by 160 keV He and 110 keV H ion implantation

Cz n-type Si(100) wafers were implanted at room temperature with 160 keV He ions at a fluence of 5 × 10¹⁶/cm² and 110 keV H ions at a fluence of 1 × 10¹⁶/cm², singly or in combination. Surface phenomena and defect microstructures have been studied by various techniques, including scanning electron microscopy (SEM), atomic force microscopy (AFM) and cross-sectional transmission electron microscopy (XTEM). Surface exfoliation and flaking phenomena were only observed on silicon by successive implantation of He and H ions after subsequent annealing at temperatures above 400 °C. The surface phenomena show strong dependence on the thermal budget. At annealing temperatures ranging from 500 to 700 °C, craters with size of about 10 μm were produced throughout the silicon surface. As increasing temperature to 800 °C, most of the implanted layer was sheared, leaving structures like islands on the surface. AFM observations have demonstrated that the implanted layer is mainly transfered at the depth around 960 nm, which is quite consistent with the range of the ions. XTEM observations have revealed that the additional low fluence H ion implantation could significantly influence thermal growth of He-cavities, which gives rise to a monolayer of cavities surrounded by a large amount of dislocations and strain. The surface exfoliation effects have been tentatively interpreted in combination of AFM and XTEM results.     

Study on preventing segregation of erbium atoms to a silicon surface by annealing in oxygen atmosphere at high temperature

The damage produced by implantation of Er ions of 400 keV at a fluence of 5 × 10¹⁵ ions/cm² in silicon was investigated by Rutherford backscattering spectrometry with 2.1 MeV He²⁺ ions with multiple scattering models. It was found that the damage around the Si surface was almost removed after annealing in oxygen and nitrogen atmospheres successively at 1000 °C, and only a small portion of the Er atoms segregated to the silicon surface. Most of the Er atoms diffused to deeper depths because of the affinity of Er for oxygen.     

Thickness and MeV Si ions bombardment effects on the thermoelectric properties of Ce3Sb10 thin films

The three single layer Ce₃Sb₁₀ thin films were grown on silicon dioxide and quartz (suprasil) substrates with thicknesses of 297, 269 and 70 nm using ion beam assisted deposition (IBAD) technique. The high-energy cross plane Si ion bombardments with constant energy of 5 MeV have been performed with varying fluence from 1 × 10¹², 1 × 10¹³, 1 × 10¹⁴, 1 × 10¹⁵ ions/cm². The Si ions bombardment modified the thermoelectric properties of films as expected. The fluence and temperature dependence of cross plane thermoelectric parameters that are Seebeck coefficient, electrical and thermal conductivities were determined to evaluate the dimensionless figure of merit, ZT. Rutherford backscattering spectrometry (RBS) enabled us to determine the elemental composition of the deposited materials and layer thickness of each film.     

The interdiffusion and solid-state reaction of low-energy copper ions implanted in silicon

At room temperature, single-crystal silicon was implanted with Cu⁺ ions at an energy of 80 keV using two doses of 5 × 10¹⁵ and 1 × 10¹⁷ Cu⁺ cm⁻². The samples were heat treated by conventional thermal annealing at different temperatures: 200 °C, 230 °C, 350 °C, 450 °C and 500 °C. The interdiffusion and solid-state reactions between the as-implanted samples and the as-annealed samples were investigated by means of Rutherford backscattering spectrometry (RBS) and X-ray diffraction (XRD). After annealing at 230 °C, the XRD results of the samples (subject to two different doses) showed formation of Cu₃Si. According to RBS, the interdiffusion between Cu and Si atoms after annealing was very insignificant. The reason may be that the formation of Cu₃Si after annealing at 230 °C suppressed further interdiffusion between Si and Cu atoms.     

Evaluation of theoretical critical angle including mass effects for channeling by computer simulation

The calculated critical angles using the theory included mass effects of Zheng et al. for the axial channeling of ion have been investigated by the computer simulations, making comparisons with the theory of Lindhard and the precise formula of Barrett’s numerical simulations. The computer simulations employing the ACOCT program code, which treats the atomic collisions three-dimensionally and is based on the binary collision approximation (BCA), were carried out for the channeling of He, Ne, Ar, Kr, Xe and Rn ions incident along the 〈1 0 0〉 axis in Al, Cu, Ag and Pt crystals. A slight dependence of the channeling critical angle on the atomic number of incident ion in the ACOCT results is in agreement with that in the calculated ones using the theory of mass effects. The average critical angles in the ACOCT results for the channeling of six rare gas ions are approximately 5.0/Z₂ times the magnitude of the theoretical critical angles with mass effects, where Z₂ is the atomic number of crystal atom. Besides, the results show that the calculated critical angles using the theory with mass effects are substantially larger than those using the theory of Lindhard, the Barrett’s formula and the formula by the ACOCT simulations for He ions impinging on Al, Cu, Ag and Pt crystals, and that the channeling critical angles in the ACOCT results agree well with those in the calculated ones using Barrett’s formula for 0.6-50 MeV He ions incident on Cu and Ag crystals and 5-50 MeV He ions impinging on Al and Pt crystals.     

On a peculiarity of low-energy ion scattering from a well-ordered bcc W(2 1 1) surface

A peculiarity in the backscattering of keV He⁺ ions by a well-ordered high-purity W(2 1 1) surface is reported. Besides the normal elastic binary collision peak and the low-energy tail due to backscattering in deeper layers, an extra peak is observed for an inelastic loss of about 95 eV. This unusually large loss has a constant value over a wide range of primary energies (1.5-4.5 keV). An extra peculiarity is that the peak is only observed for the scattering in normal incidence towards the (2 1 1) plane. It is also not seen for polycrystalline W. The energy loss may be due to a quasi-double or -triple collisions of He particles with the row-trough structure of W(2 1 1) involving electronic excitation of both He and W atoms. Alternatively it may be due to a special channeling/dechanneling process for the incident ions.     

Ionization in symmetric and nearly symmetric low energy ion-surface collisions

Multiply charged ions are emitted following bombardment of Al(1 0 0) and Si(1 1 1) by low energy Si⁺ and P⁺ ions. The ion formation is attributed to inner-shell electron promotion during a hard collision between symmetric or nearly symmetric atomic species, followed by Auger decay outside the surface. The relative yield of triply charged Si ions for Si⁺ → Si(1 1 1) is much smaller than that of triply charged Al ions in direct recoil Si⁺ → Al(1 0 0) experiments. This difference can be explained by assuming that only one 2p hole is produced in a Si atom during the symmetric collision, whereas a double 2p hole is also produced in the Al atom following the nearly symmetric Si-Al collision. Further evidence is provided by the complimentary experiment P⁺ → Si(1 1 1), where Si³⁺ regains its intensity and Si⁴⁺ emerges as a result of a double 2p hole decay with shake-off.     

Ion bombardment induced changes in the optical and electrical properties of polycarbonate

The changes in the optical and electrical properties of polycarbonate (PC) films, bombarded with He and Ar ion beams, have been studied. The PC films were divided into two groups where the first group was bombarded with 130 keV He ions of fluences ranged from 1 × 10¹⁴ cm⁻² to 2 × 10¹⁶ cm⁻², while the second one was bombarded with 320 keV Ar of fluences (1 × 10¹³ cm⁻² and 1 × 10¹⁵ cm⁻²). The surface morphology of the unirradiated and irradiated PC films was studied using scanning electron microscopy (SEM) technique. The optical properties of the two groups have been carried out using UV-Vis spectrophotometer and the direct current (DC) electrical conductivity was also performed. The obtained results showed a decrease in the optical energy gap, the optical activation energy and the electrical activation energy with increasing the fluence of both He and Ar ions. Meanwhile, an increase in the DC conductivity was obtained with increasing the fluence of the ions. The bombardment of the PC films with He and Ar ion beams induced formation of carbon clusters near the polymer surface and, also, resulted in scission in the polymer chains.     

Computer simulation of CAICISS spectra of clean Cu(1 0 0) surface and Cu(1 0 0) surface by Pt deposition

The clean Cu(1 0 0) surface and Pt/Cu(1 0 0) surface by Pt deposition at room temperature have been investigated using the computer simulation of coaxial impact-collision ion scattering spectroscopy (CAICISS). The computer simulations employing the ACOCT program code, which treats the atomic collisions three-dimensionally and is based on the binary collision approximation (BCA), were carried out for the case of 3 keV He⁺ ions incident along the 〈1 0 0〉 and 〈1 1 0〉 azimuths of the clean Cu(1 0 0) and Pt/Cu(1 0 0) surfaces. The comparisons between ACOCT results and experimental CAICISS data show that the experimental results on the clean Cu(1 0 0) surface are relatively well reproduced by the ACOCT simulations including the inward relaxation of 1.2% in the first interlayer spacing and the outward relaxation of 1.6% in the second interlayer spacing, and that the ACOCT simulations for the Pt deposition with coverages of 2.35 ML and 2.75 ML on the Cu(1 0 0) surface appear the concentrations of 0.24 ML of Pt sitting 2.3 Å and 0.25 ML of Pt sitting 2.5 Å above the outermost atomic layer, respectively.     

Growth of silicon nitride films by bombarding amorphous silicon with N ions: MD simulation

In this study, the molecular dynamics simulation method was employed to investigate the growth of silicon nitride films by using N⁺ ions, with energies of 50, 100, 150 and 200 eV, to bombard an amorphous silicon surface at 300 K. After an initial period of N⁺ bombardment, saturation of the number of N atoms deposited on the surface is observed, which is in agreement with experiments. During subsequent steady state deposition, a balance between uptake of N by the surface and sputtering of previously deposited N is established. The Si(N_x) (x = 1-4) and N(Si_y) (y = 1-3) bond configurations in the grown films are analyzed.