微电子专业的通才和专才培养模式

国内微电子产业迅猛发展,支持在低端产品的基础技术人员的储备已经达到相当规模,但自主研发高端产品的专业人才匮乏。目前高等学校微电子专业改革中,在通才和专才培养模式之间很难找到平衡点。本文通过对比中美的微电子人才培养模式,讨论微电子专业通才和专才的培养模式。     

半导体产业及其支撑技术的发展动向

作为当今社会高技术产业之一的微电子工业,以其卓越的成就,影响着人们的生活方式,改变着现代社会的生产方式和经济结构。对代表微电子技术的集成电路工业,世界各国都极为重视,投入了大量的人力和巨额的资金,从而使其发展日渐成熟。本文主要介绍了半导体存储器的生产和研究情况。另外,还介绍了ASIC、逻辑电路、砷化镓器件、半导体材料和设备等方面的发展情况。     

Europe's semiconductor makers are back in the game

European chipmakers have bounced back after being declared nearly dead almost two decades ago - and despite one of the worst downturns in the global semiconductor industry. Three of the world's top 10 chipmakers are now European, compared with just one a decade ago, according to IC Insights Inc., a market research group (Scottsdale, Ariz.). The French-Italian venture STMicroelectronics NV (Geneva) is ranked fourth. Germany's Infineon Technologies AG (Munich), despite its dependence on the ravaged DRAM and telecom markets, claims sixth place. Royal Philips Electronics NV (Amsterdam) is tenth. Europe has shown a remarkable determination to retain control of enabling technology in integrated circuits and become competitive in this market. Its technology leaders have pushed through major restructuring, from consolidation to cooperation. Equally important, they have found not only new ways to manufacture chips but also new uses beyond computers. Introducing 300-mm wafers has been one of several reasons for the renewed success.     

IC业材料切割设备发展状况

通过对国内外半导体切割设备行业的发展与现状分析 ,根据国际IC业最先进的工艺要求 ,提出了切割设备的发展趋势 ;并对切割设备的发展提出了参考性意见。     

智能重构下芜湖微电子产业公共研发服务平台建设研究

微电子技术快速发展,已成为“互联网+智能”时代的技术基石;从制造业视角看,在全球范围内,微电子产业逐渐成为创新价值链的核心,这种趋势带动了全球制造业的智能化重构。文章分析了我国微电子产业发展的现状,指出了制造业智能重构是我国制造业迭代升级、变轨超车的重要机遇。基于安徽芜湖市的区位和产业状况,认为位于长三角区域的芜湖,已初步具备了完整的智能汽车制造基础,形成了一定的产业特色,但距离形成有全球竞争力的智能制造创新价值链基地还有较大差距,建立微电子产业公共研发服务平台是芜湖市实现智能制造重构、微电子产业变轨超车的重要步骤,该平台的建设对于芜湖市成为中国第三代半导体研发和生产基地具有战略意义。     

系统级封装(SiP)技术研究现状与发展趋势

系统级封装(System in Package,SiP)已经成为重要的先进封装和系统集成技术,是未来电子产品小型化和多功能化的重要技术路线,在微电子和电子制造领域具有广阔的应用市场和发展前景,发展也极为迅速。对目前SiP技术的研究现状和发展趋势进行了综述,重点关注了国际上半导体产业和重要的研究机构在SiP技术领域的研究和开发,对我国SiP技术的发展做了简单的回顾和展望。     

Virtual test reduces semiconductor product development time

In the semiconductor industry's evolutionary life cycle, the speed at which products are introduced to the market-place is key to the competitive success of individual companies. The semiconductor industry is classed as a fast-changing industry in which product technology, manufacturing process technology and industry organisation need to be continuously updated in relatively short cycle times. This paper looks at the test engineering aspect of the IC (integrated circuit) product development process and describes how an emerging `virtual test' methodology can be effectively applied to reduce the overall product development time for semiconductor devices     

国际金融危机下封装测试行业面临的挑战

受国际金融危机影响,2008年国内集成电路产业增长率大幅度滑坡,封装测试行业也同样面临巨大挑战。文章分析了2008年国内集成电路产业尤其是江苏省集成电路产业的发展现状,封测业仍保持增长,但也出现明显下滑。原因不仅有国际环境的影响,还与国内集成电路产业特点有关。文章进一步探讨了金融危机的特点和对国内半导体行业的影响,以及国家目前为应对危机出台的各项政策。在此基础上,文章预测2009年半导体业将继续下降,但中国的半导体产业会先于全球半导体产业恢复,并高于全球半导体产业的增长幅度。最后,文章从技术、人才和资金三方面提出了封装测试业应对危机的措施,强调走出这次产业低谷的关键还是要依靠政府的强有力政策措施,即快速拉动国内需求。     

我国台湾地区集成电路工业发展特点分析

集成电路(IC)工业和电脑工业是台湾两个最大的高技术工业。电脑工业的发展大大促进了IC工业的成长,特别是近两年以来,发展尤为迅速,岛内IC(消耗)总市场增长率高达20～37％,比国际高出十多个百分点。1992年IC市场预计可突破千亿元大关,达1128亿新台币(NT),超过韩国、香港、新加坡和马来西亚,位居群龙之首,从而引起国际同行的广泛重视。本研究拟从全球对比角度,分析台湾IC工业规划、技术水平、工业增长和劳动生产率等发展状况,并在此基础上从政府、企业科研、生产和国际合作等几个方面讨论台湾IC工业发展特色及其存在的问题。本文取材来源为ERSO/ITRI,ICE,Dataquest和电子科技情报所等报告。     

世界集成电路市场发展趋势

自50年代发明集成电路（IC）后,世界集成电路产业结构经过了三次变革。80年代以来,IC设计业、制造业、封装业和制版业的市场发展迅速。在PC市场增长逐渐趋缓之后,通信类芯片成为IC市场新的增长点,将带动IC产业的持续发展。     

The future of microelectronics

The future of microelectronics will be determined largely by the success of the semiconductor industry in continuing to exploit the “productivity engine”. The cycle of this engine is: 1) exponential trends in technology and productivity improvement, which enable 2) expanding markets and revenues, which enable 3) larger research and development (R&D) and manufacturing investments, which, in turn, enable 1). This paradigm has served us well for almost four decades, and the semiconductor industry is probably unique in maintaining such a steep performance/price improvement trend for its products over such a relatively long period. Agriculture has shown improvement over a longer period (thousands of years) but at a much slower pace. Other industries have enjoyed occasional step-function advances, but not on a regular basis spanning several decades. Of course, there is a diversity of opinion about how much longer the fundamental trends (e.g., “Moore's law”) can persist. In this paper, we will discuss some of the challenges and opportunities associated with the extension of these trends and indulge in some speculation about potential future scenarios in microelectronics business and technology     

The development strategies for Taiwan's semiconductor industry

Taiwan's integrated circuit (IC) industry development process can be separated into three stages: the initiation stage, consisting of obtaining technology and facilitating setup of domestic companies; the burgeoning stage, consisting of the formation of manufacturer's R&D abilities; and the growth stage, consisting of further raising an industry's international competitive levels. In each stage this article examines the development strategy from the perspective of interactions among the government, research institute, and the domestic industry in terms of technology selection, R&D activities, technology transfer, and industry development results. Finally, factors underlying success, issues arising from the case, and suggestions for newly industrialized countries are discussed     

微电子技术发展的新领域

介绍"微电子"及其微电子技术的主要内容,对微电子技术和其它学科结合而衍生出一系列新的交叉学科,如微机电系统,生物芯片等进行论证,展望微电子技术的发展方向。     

Reliability challenges in the nanoelectronics era

Microelectronics has pervaded our lives for the past fifty years. The shift from the era of microelectronics, where semiconductor devices were measured in microns to the new era of nanoelectronics where they shrink to dimensions measured in nanometers, will make the semiconductors even more pervasive than it is today. Starting from the vision and background of ENIAC, the European Technology Platform for nanoelectronics, this paper will shortly summarise the Strategic Research Agenda (SRA) of nanoelectronics. Based on this SRA, the challenges for reliability will be discussed, and possible solutions will be suggested.     

电子封装技术发展现状及趋势

现今集成电路晶圆的特征线宽进入微纳电子时代,而电子产品和电子系统的微小型化依赖先进电子封装技术的进步,封装技术已成为半导体行业关注的焦点之一。主要介绍了近年来国内外出现的有市场价值的封装技术,详细描述了一些典型封装的基本结构和组装工艺,并指出了其发展现状及趋势。各种封装方法近年来层出不穷,实现了更高层次的封装集成,因而封装具有更高的密度、更强的功能、更优的性能、更小的体积、更低的功耗、更快的速度、更小的延迟、成本不断降低等优势,其技术研究和生产工艺不可忽视,在今后的一段时间内将拥有巨大的市场潜力与发展空间,推动半导体行业进入后摩尔时代。     

21世纪初微电子技术发展展望

综述了微电子领域中纳米技术、ＭＥＭＳ、Ｓｉ和ＧａＡｓ集成电路、微波／毫米波器件及宽禁带半导体技术目前的发展状况。在此基础上,对其在２１世纪初期的发展做了展望。     

Emission Spectroscopy as a Method for Studying the Interaction of the Plasma–Solid Body System

Russian Microelectronics - Gallium arsenide semiconductor wafers placed in a plasma medium of halogen-containing gases are used as a solid-plasma system. In the semiconductor industry, engineering,...     

丝网印刷与厚膜IC技术

丝网印刷与厚膜IC技术是微电子技术的核心技术之一,IC技术是指以半导体晶体材料为基础,采用专门工艺技术组成的微小型电路或系统,分别叙述了厚膜IC与网版和厚膜IC与印墨及厚膜IC等印刷技术,简单介绍了厚膜电阻的制作工艺。     

BIS forecasts for GaAs ICs

Strong growth is forecast for the GaAs IC industry in a recently published report by BIS Strategic Decisions. From $142M worldwide in 1990, the merchant (i.e. excluding captive revenues) GaAs IC market is forecast to reach %740M by 1995, a compound annual average growth rate of 39%, one of the fastest in the semiconductor industry.     

How China is closing the semiconductor technology gap

China has been obtaining and advancing technology in a manner and at a pace that has surprised most people. The high-tech semiconductor industry exemplifies this growth. In less than 10 years China went from being five generations behind in integrated circuit (IC) semiconductor processing, to being current with the state-of-the-art. With the help of Chinese engineers, often educated by U.S. companies including Motorola and Intel, Chinese companies will soon be producing the leading IC technologies for the world. With the already existing infrastructure to incorporate semiconductors into advanced systems, and a large internal (and external) market, China's future truly looks bright.