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1.
端羟基聚环氧氯丙烷醚的合成及表征   总被引:8,自引:2,他引:6  
介绍了端羟基聚环氧氯丙烷醚的合成方法。讨论了催化剂、引发剂、聚合反应温度对产物的影响。用FTIR、13CNMR对产物进行了结构分析表征。  相似文献   

2.
研究了以苯酚和硫酸为原料,在催化剂的存在下合成双酚S,讨论了加料方式,原料配比,反应温度等条件对反应的影响。  相似文献   

3.
通过芳香二胺化合物在聚亚胺砜分子链中嵌入醚键,从而得到了新型结构可溶性耐热高分子材料——聚亚胺醚砜(PIES)。通过红外、核磁和元素分析对所制备的聚合物的结构进行了表征。由差示扫描量热和热重方法对PIES进行了热性能分析,结果表明,该聚合物具有良好的耐热性能。还对PIES良好的溶解性能进行了实验和理论分析。  相似文献   

4.
研究了酚酞(PP),4,4'-二羟基二苯硫醚(Bis—T),4,4'-二氯二苯砜(DCDPS)三元共聚物(PP/Bis-T)PES的聚合反应过程,热性能及部分力学性能。适宜的聚合温度为185~195℃。(PP/Bis—T)PES属于均相无规共聚物。共聚物具有良好的热稳定性、良好的机械性能。  相似文献   

5.
聚环氧丙烷醚/端羟基聚环氧氯丙烷醚聚氨酯的阻尼性能   总被引:4,自引:0,他引:4  
以聚环氧丙烷醚(PPG)和端羟基聚环氧氯丙烷醚(PECH)为聚醚多元醇,合成了多嵌段聚醚型聚氨酯弹性体(PU)。用动态力学分析法研究了不同扩链剂[乙二醇、1,2-丙二醇(PG)和1,4-丁二醇]、二异氰酸酯[甲苯二异氰酸酯(TDI)和二苯基甲烷二异氰酸酯(MDI)]、PPG/PECH(质量比,下同)以及端羟基丁腈橡胶(HTBN)对PU阻尼性能的影响。结果表明,以TDI为二异氰酸酯,PG为扩链剂。当PPG/PECH为60/40,TDI/聚醚多元醇(摩尔比)为5/1时,试样的最大阻尼损耗因子为0.41。弹性模量为18.35MPa,阻尼温域为-18~15℃,阻尼性能较其他试样好。在此条件下加入摩尔分数为20%的HTBN,可提高PU的适用阻尼温域(18~38℃),改善阻尼性能。  相似文献   

6.
范广宇  刘克静 《塑料工业》1992,(1):50-51,58
酚酞型聚芳醚砜(PES-C)是一种新型工程塑料,用它制作超滤膜材料引起人们的重视,因此测定PES-C的溶解度参数对研究其溶液性质和制膜工艺有较大意义。本文以氯仿为溶剂,甲醇和正己烷为沉淀剂,用浊度法测定了PES-C的溶解度参数。结果表明,该法是测定PES-C溶解度参数的一种简便有效的方法。测得PES-C在20℃时的溶解度参数δ为20.19(J/mL)~(1/2)。  相似文献   

7.
氰酸酯树脂是一种黏接强度高、介电性能优异的耐高温树脂,但因韧性较差严重限制了氰酸酯树脂的应用,采用双酚E型氰酸酯(BEDCy)树脂作为基体树脂,酚酞型聚芳醚砜(PES-C)作为增韧剂,通过加热共混得到了BEDCy/PES-C树脂。通过拉力机、动态力学热分析、热重(TG)分析、X射线光电子能谱、阻抗分析和扫描电子显微镜(SEM)测试了BEDCy/PES-C树脂对铝材的黏接强度、模量、耐热性、介电性能、微观结构和形貌的影响。结果表明,PES-C对BEDCy树脂的增韧效果显著,以剪切性能为例,BEDCy树脂在常温下剪切强度由最初的19.9 MPa提升至30.4 MPa,相比纯BEDCy树脂提高了52.8%,230℃下剪切强度提高了36.7%,此时,SEM下也能观察到明显的沟壑状增韧条纹。TG分析测试表明,少量PES-C (<40%)的加入对耐热性能影响并不明显,失重率5%时温度基本保持在418℃。BEDCy/PES-C的介电性能也明显提高,当PES-C质量分数为20%时,10.1 GHz下的介电常数为2.41,介电损耗为0.010 6。  相似文献   

8.
液体端羟基聚环氧氯丙烷的合成   总被引:4,自引:0,他引:4  
  相似文献   

9.
以酚酞,双酚A,4,4’-二氯二苯砜为原料,采用碱性条件下亲核取代、逐步缩聚的方法合成了一系列新型的主链上含Cardo基的三元共聚芳醚砜。采用傅里叶变换红外光谱仪、核磁共振氢谱仪、差示扫描量热仪、热重分析仪、凝胶渗透色谱仪等表征了含Cardo基三元共聚芳醚砜的结构并研究了其热性能。结果表明:含Cardo基三元共聚芳醚砜为非晶态,其玻璃化转变温度为171~258℃,在氮气中质量损失5%时的温度均高于395℃;在强极性非质子溶剂及普通有机溶剂中均具有较好的溶解性;相对分子质量为(1.0~2.1)×104,相对分子质量分布为2.23~3.49。  相似文献   

10.
基于利用壳聚糖中氨基和磺化聚芳醚砜中的磺酸基团之间的静电力制备复合膜材料。综述了该类复合材料的材质选择、成膜方式以及在超微滤、纳滤、反渗透以及质子交换膜领域的应用状况,并展望了未来的发展方向。  相似文献   

11.
测定环氧值方法的改进   总被引:8,自引:0,他引:8  
研究了环氧值的表征,优化了时间、温度和盐酸-丙酮溶液的过量百分数等因素,并确定了乙醇-水-氢氧化钠溶液的配制比例,将环氧值的滴定步骤具体化,从而更加精确地测定环氧值。  相似文献   

12.
研究了以苯酚和硫酸为原料,在催化剂的存在下合成双酚S,讨论了加料方式、原料配比、反应温度等条件对反应的影响。  相似文献   

13.
在微乳化和非微乳化条件下研究了环氧氯丙烷(ECH)和三甲胺盐酸盐(TMAC)的反应。采用液相色谱和气相色谱分析相结合的方法,分别测定两种条件下随反应时间变化的各物质的量。实验结果表明,反应温度在20~40℃时,微乳条件下10 min时ECH的转化率接近60%,是非微乳条件时转化率的3倍以上;微乳条件下1,3-二氯-2-丙醇(DCP)的生成量比非微乳条件下的高出1个数量级。由此证明微乳条件下生成DCP反应的速率远高于非微乳体系。并根据实验结果建立了微乳化条件下ECH和TMAC反应的动力学方程。  相似文献   

14.
The curing kinetics for a system of Sulfonyl bis(4,1-phenylene)bis[4-(2,3-epoxypro pyloxy)benzoate] (p-SBPEPB) with 4,4′-diaminodiphenyl ether (DDE) were investigated by nonisothermal differential scanning calorimetry (DSC). The dependencies of the apparent activation energy Ea and the conversion α during overall curing reaction were revealed by Ozawa's method. The results shown the Ea decreased drastially from 107 to 75 KJ/mol with α in the initial stages (α = 0–20%), the average apparent activation energy Ea of p-SBPEPB/DDE is 82.81 KJ/mol and was relatively constant in the 0.5 to 0.9 conversion interval. Some parameters were evaluated using the two kinetic models of ?esták–Berggren (S-B) equation and JMA model. The liquid crystalline (LC) phase had formed and was fixed in the system during the curing process.  相似文献   

15.
The kinetics of the cure reaction for a system of bisphenol-S epoxy resin (BPSER), with 4,4′-diaminodiphenylmethane (DDM) as a curing agent, were studied by means of differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure, with the model proposed by Kamal, which includes two rate constants, k1 and k2, and two reaction orders, m and n. Rate constants k1 and k2 were observed to be greater when curing temperature increased. The over-all reaction order, m + n, is in the range of 2.5 ∼ 3. The activation energies for k1 and k2 were 55 kJ/mol and 57 kJ/mol, respectively. Diffusion control is incorporated to describe the cure in the latter stages. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1799–1803, 1999  相似文献   

16.
赵明  杨明山 《广州化工》2009,37(4):69-71
研究了邻甲酚醛环氧树脂/苯代三聚氰胺酚醛树脂的固化反应机理,邻甲酚醛环氧树脂(o—CFER)被固化剂苯代三聚氰胺酚醛树脂(BPR)固化,采用非等温扫描方法研究环氧树脂固化反应,用来确定其固化反应动力学参数以及最佳固化工艺条件。用差示扫描量热仪(DSC)对邻甲酚醛环氧树脂固化体系的固化反应过程进行了分析。采用不同升温速率,用Kissinger方法求得体系固化反应的表观活化能△E=63.6kJ/mol,根据Crane理论计算得到该体系的固化反应级数n=0.899。固化反应起始温度、峰值温度、终止温度分别为Tio=102.95℃、Tpo=132.16℃、Tpf=166.6℃,为确定苯代三聚氰胺酚醛树脂作为固化剂的固化反应条件提供了一定的理论依据。  相似文献   

17.
The curing behavior of the epoxy resin N,N,N′,N′‐tetraglycidyldiaminodiphenyl methane (TGDDM) with triglycidyl p‐aminophenol as a reactive diluent was investigated using 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane (DCDDM) as the curing agent. The effect of the curing agent on the kinetics of curing, shelf‐life, and thermal stability in comparison with a TGDDM‐diaminodiphenylsulfone (DDS) system was studied. The results showed a lesser activation energy at the lower level of conversion with a broader cure exotherm for the epoxy‐DCDDM system in comparison with the epoxy‐DDS system, although the overall activation energy for the two systems was comparable. TGA studies showed more stability in the epoxy‐DCDDM system than in the epoxy‐DDS system. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2097–2103, 2000  相似文献   

18.
以2,2-双[4-(4-氨基苯氧基)苯基1丙烷(BAPOPP)和2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BPADA)为原料在室温下于DMAe溶剂中合成了一种新型聚酰亚胺,并用其改性环氧树脂体系获得聚酰亚胺-环氧体系胶黏剂.利用差示扫描量热计(DSC),以不同的升温速率对聚酰亚胺-环氧树脂胶黏剂进行DSC...  相似文献   

19.
陈平 《中国胶粘剂》1993,2(6):27-29
用DSC和IR研究了含有噁硼杂环的硼胺络合物与环氧树脂体系的固化反应机理和固化反应动力学。  相似文献   

20.
A comprehensive thermal and rheological characterisation of a commercially important aerospace resin system modified with a thermoplastic toughener is presented here. The primary focus has been the understanding of how the cure kinetics and mechanism relate to other processes such as phase separation during cure. Differential scanning calorimetry has shown that thermoplastic modification does not affect the cure mechanism significantly and that the process was dominated by an autocatalytic process up to vitrification after which diffusion‐controlled processes dominate regardless of thermoplastic concentration. Thermoplastic addition at 10 wt.‐% PEI was found to increase the final cure conversion compared with the neat resin and inhibit the onset of diffusion control below a cure temperature of 160 °C. At 20 wt.‐% PEI concentration the final conversion and the onset of diffusion control were similar until 150 °C, after which they displayed lower values than the neat resin. Rheological analysis showed that the phase separation process could be followed conveniently through the changes in viscosity and exhibited effects consistent with expected variations in morphology. The 10 wt.‐% PEI system displayed abrupt increases in viscosities which were indicative of a dispersed particulate morphology, while the 20 wt.‐% PEI system displayed more complex behaviour consistent with a phase‐inverted or co‐continuous structure. The gelation process was shown to obey a power law model although the local environment or morphology of the reactive epoxide group at higher PEI concentrations was shown to affect the fit to the model.

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