不受分辨率限制的胶片扫描

任何胶片影像都可以看成具有４个不同的维数：高度、宽度、厚度以及染料或颗粒密度的变化。这些维数都影响损害了胶片的总分辨率。本文试图量化分辨率的限制，从而建立起实用的手段，以数字的形式从电影胶片中提出所有用的影像信息。     

扫描近场光学显微技术在半导体材料表征领域应用的研究进展

半导体材料及其光电器件如激光器、探测器以及高速微波器件有着广阔的应用前景。半导体材料的结构和缺陷特性对器件性能起着至关重要的影响,然而对材料进行纳米尺度下的检测、表征无论是理论上还是技术和设备上都需要深入研究和发展,因此扫描近场光学显微技术在半导体材料表征领域有着无可替代的地位。扫描近场光学显微技术突破了传统光学显微技术的衍射分辨率极限的限制,具有超高空间分辨率、超高探测灵敏度等特点,并且是一种非接触性探测,具有无损伤性。简要介绍了扫描近场光学显微镜的原理及在半导体材料研究中的应用,包括量子阱结构中的位错及缺陷的表征,半导体器件的表面复合速率及扩散长度的纳米表征,以及半导体薄膜中的缺陷分布的检测。探讨了目前相关研究领域存在的主要问题,并对其发展趋势和前景进行了展望。     

基于近场技术的微纳尺度热物性测量系统空间分辨率增强

传统的脉冲激光时域热反射系统通常基于远场光学设计,对于微纳米材料热物性测量的空间分辨率约在3μm～10μm范围,不足以满足先进微电子器件和芯片的热物性测试要求.基于近场光学原理,本文研究了提升时域热反射系统空间分辨率的新颖技术方法,并建立了相应的实验系统.实验获得的微纳结构样品测量数据表明,基于近场技术的时域热反射系统...     

设置印前扫描分辨率的原理和方法

扫描分辨率是衡量图像细节表现力的重要技术参数.在彩色桌面印前系统中,图像扫描输入、加网线数、灰度等级和照排机输出都与扫描分辨率有关.指出设置用于印刷输出的扫描分辨率要遵循"输入决定分辨率"、"设备决定分辨率"、"印刷适性决定分辨率"、"用整除光学分辨率扫描"等原则,为印前技术人员高质量地进行扫描提供科学依据和理论指导,对生产实际操作具有指导意义.     

金属基复合材料界面导热性能的扫描热探针测试

利用扫描热探针方法,以微米级的空间分辨率,分析测试了三种馆长在复合材料（ＭＭＣ）界面特征和界面导热性能,应用数学统计方法对扫描热显微镜（ＳＴhM)的形貌和热电压数据进行处理和转换,获得 面宽度和界面导热率数据,结果表明,金属基复合材料宏观导热性能与增强相一基体界面的导热性能密切相关。     

基于边界扫描技术的集成电路测试平台设计

支持IEEE1149.1标准的边界扫描芯片的广泛应用和可测性设计(DFT)的研究,使边界扫描测试技术得到广阔的发展.我们以边界扣描测试技术为基础设计集成电路(IC)测试平台,并对许多复杂的IC进行测试.该平台不需要昂贵的仪表、设备,而是通过边界扫描芯片的特点产生并捕获测试信号,并且还具有很高的测试覆盖率.同时也根据在测试开发中遇到的问题,对可测性设计提出一些建议.     

HY-2卫星扫描微波辐射计多通道分辨率匹配技术研究

星载微波辐射计多通道海洋参数反演需要基于同一位置、同一分辨率的多通道观测值,但由于星载微波辐射计设计的局限性,多通道观测地面像元位置和分辨率均不同,因此运用多通道分辨率匹配技术统一观测面元是扫描微波辐射计数据处理中的关键技术,基于海洋二号(HY-2)卫星扫描微波辐射计的成像原理和天线方向图,模拟各通道天线方向图在地面的投影,用Backus-Gilbert(BG)算法将高频观测亮温重采样到最低的低频6.6 GHz通道的观测位置和像元分辨率。结果表明,BG降低分辨率重采样算法能得到很好的拟合效果,并且不另引入噪声。     

以扫描仪扫描照片图像时分辨率的确定方法

本文提出了扫描照片确定分辨率必须遵循的“量入为出”，“量出为入”，“力戒插值扫描”、“力求用整除分辨率扫描”等四项原则，并分析了不同打印机分辨率的区别，为人们高质量地进行扫描提供了科学依据和理论指导。     

CCD和DLP技术光学系统分辨率的现代测试技术研究

提出了一种采用DLP光电图形自动生成技术、CCD摄像技术及计算机图像处理技术等现代技术对光学系统的分辨率进行测试的新方法.该方法可实现客观数字化测量.因此可消除目视检查方法的易疲劳、人为影响等现代技术因素大等诸多缺陷,使得检测准确度高、自动化程度高.     

Imaging of Thermal Conductivity with Sub-Micrometer Resolution Using Scanning Thermal Microscopy

With the development of new emerging technologies, many objects in scientific research and engineering are of sub-micrometer and nanometer size, such as microelectronics, micro-electro-mechanical systems (MEMS), biomedicines, etc. Therefore, thermal conductivity measurements with sub-micrometer resolution are indispensable. This paper reports on the imaging of various micrometer and sub-micrometer size surface variations using a scanning thermal microscope (SThM). The thermal images show the contrasts indicating the differences of the local thermal conductivity in the sample. Thermal resistance circuits for the thermal tip temperature are developed to explain the heat transfer mechanism between the thermal tip and the sample and to explain the coupling between the local thermal conductivity and the topography in the test results.     

Realizing the Accurate Measurements of Thermal Conductivity over a Wide Range by Scanning Thermal Microscopy Combined with Quantitative Prediction of Thermal Contact Resistance

Quantitative thermal performance measurements and thermal management at the micro-/nano scale are becoming increasingly important as the size of electronic components shrinks. Scanning thermal microscopy (SThM) is an emerging method with high spatial resolution that accurately reflects changes in local thermal signals based on a thermally sensitive probe. However, because of the unclear thermal resistance at the probe-sample interface, quantitative characterization of thermal conductivity for different kinds of materials still remains limited. In this paper, the heat transfer process considering the thermal contact resistance between the probe and sample surface is analyzed using finite element simulation and thermal resistance network model. On this basis, a mathematical empirical function is developed applicable to a variety of material systems, which depicts the relationship between the thermal conductivity of the sample and the probe temperature. The proposed model is verified by measuring ten materials with a wide thermal conductivity range, and then further validated by two materials with unknown thermal conductivity. In conclusion, this work provides the prospect of achieving quantitative characterization of thermal conductivity over a wide range and further enables the mapping of local thermal conductivity to microstructures or phases of materials.     

The Art of SPM: Scanning Probe Microscopy in Materials Science

In this Progress Report, outstanding scientific applications of scanning probe microscopy (SPM) in the field of materials science and the latest technique developments are introduced and discussed. Besides being able to image the organization of matter with sub‐nanometer resolution, SPM, owing to its basic operating principle, provides the power to measure, analyze, and even quantify properties of matter on the nanometer length scale. Moreover, because of its unique potential to manipulate the organization of atoms, molecules, assemblies, or particles and to structure surfaces in a controlled fashion, in the fields of nanoscience and nanotechnology SPM has become one of the most powerful tools for preparation and analysis of nanostructures and their functionality. Because of the tremendous variety of its applications, only selected—but subjectively exceptional—topics are considered in this Progress Report, showing the full potential of SPM.     

Thermal Conductivity Measurements of Thin Amorphous Silicon Films by Scanning Thermal Microscopy

Thermal conductivity measurements of thin amorphous silicon films performed with a micro-thermistance mounted on an atomic force microscope are presented. A specific thermal model is implemented, and an identification procedure is proposed to extract the film contribution from the apparent thermal conductivity. Results show agreement with the literature regarding interface resistance data, but lower thermal conductivity values are obtained.     

The Effects of Thermal Cycles on the Impact Fatigue Properties of Thermoplastic Matrix Composites

The effects of thermal cycles on the impact fatigue properties of unidirectional carbon fibre reinforced polyetherimide (PEI) matrix composites were investigated. During the thermal cycles, samples were immersed into boiling water (100 °C) and subsequently to ice water (0 °C), 50, 200 and 500 times. The changes in viscoelastic properties of the composites were investigated by means of dynamic mechanical thermal analyzer (DMTA). At the second step, thermal cycled composites were subjected to repeated impact loadings, with different impact energies. Instrumented impact test results were presented as a function of force, energy, deformation during the experiments. The scanning electron microscope (SEM) studies were done in order to understand the morphology of fractured samples after impact fatigue loading. The number of thermal cycles and applied impact energy of the hammer are found to have a great importance on the fracture morphology of repeatedly impacted material, as expected.     

(YCa)F3助烧AIN陶瓷的显微结构和热导率

采用（ＣａＹ）Ｆ３为助烧结剂,低温烧结（１６５０℃,６ｈ）制备出热导率为２０８Ｗ／ｍＫ的ＡＩＮ陶瓷,在烧结过程中,热导率随保温时间的变化服从方程,λ（ｔ）＝λ∞－△λ（．３＾－６／ｒ,用ＳＥＭ、ＳＴｈＭ、ＴＥＭ和ＨＲＥＭ对ＡＩＮ陶瓷的显微结构及其对热导率的影响进行了研究。结果表明,晶粒尺２对ＡＩＮ陶瓷热导率的影响可以忽略,而分隔在ＡＮＩ晶粒之间的昌界相会降低热导率。