A fast 16 bit NMOS parallel multiplier

An architecture for a fast parallel array multiplier is described. Using a 3 /spl mu/m E/D NMOS process, a 16/spl times/16 bit trial circuit has been designed. A multiplication time of 120 ns has been achieved with a power dissipation of 200 mW and a silicon area of 5 mm/SUP 2/. This architecture concept greatly reduces the logical depth of the array by rearranging internal delays. It is applicable in principle to any MOS, CMOS, GaAs, or bipolar technology.     

25-ns 256K/spl times/1/64K/spl times/4 CMOS SRAM's

Through a metal option, a 256K word/spl times/1-bit and a 64K word/spl times/4-bit CMOS SRAM organization has been obtained. A fast access time has been achieved with a short bit-line structure and a data-bus precharging technique which minimize the bit-line and data-bus delay. A feedback-controlled address-transition-detector circuit has been adopted to assure the fast access time in the presence of address skew. A 1.0-/spl mu/m double-polysilicon and single-metal process technology with a polycide gate offers a memory cell size of 90 /spl mu/m/SUP Z/ and a chip size of 47.4 mm/SUP 2/.     

A 6 K-gate GaAs gate array with a new large-noise-margin SLCF circuit

A 6 K-gate GaAs gate array has been successfully designed and fabricated using a novel large-noise-margin Schottky-diode level-shifter capacitor-coupled FET logic (SLCF) circuitry and a WN/SUB x/ gate selfaligned lightly doped drain (LDD) structure GaAs MESFET process. Chip size was 8.0/spl times/8.0 mm/SUP 2/. A basic cell can be programmed as an SLCF inverter, a two-input NOR, or a two-input NAND gate. The unloaded propagation delay time was 76 ps/gate a 1.2-mW/gate power dissipation. The increases in delay time due to various loading capacitances were 10 ps/fan-in, 45 ps/fan-out, and 0.64 ps/IF. A 16-b serial-to-parallel-to-serial (S/P/S) data-conversion circuit was constructed on the gate array as an application example. A maximum operation frequency of 852 MHz was achieved at a 952-mW power dissipation, including I/O buffers.     

An 8-MHz CMOS subranging 8-bit A/D converter

A 8-bit subranging converter (ADC) has been realized in a 3-/spl mu/m silicon gate, double-polysilicon capacitor CMOS process. The ADC uses 31 comparators and is capable of conversion rates to 8 MHz at V/SUB DD/=5 V. Die size is 3.2/spl times/2.2 mm/SUP 2/.     

An experimental 4-Mbit CMOS DRAM

A 4-Mb dynamic RAM has been designed and fabricated using 1.0-/spl mu/m twin-tub CMOS technology. The memory array consists of trenched n-channel depletion-type capacitor cells in a p-well. Very high /spl alpha/-particle immunity was achieved with this structure. One cell measures 3.0/spl times/5.8 /spl mu/m/SUP 2/ yielding a chip size of 7.84/spl times/17.48 mm/SUP 2/. An on-chip voltage converter circuit was implemented as a mask option to investigate a possible solution to the MOSFET reliability problem caused by hot carriers. An 8-bit parallel test mode was introduced to reduce the RAM test time. Metal mask options provide static-column-mode and fast-age-mode operation. The chip is usable as /spl times/1 or /spl times/4 organizations with a bonding option. Using an external 5-V power supply, the row-address-strobe access time is 80 ns at room temperature. The typical active current is 60 mA at a 220-ns cycle time with a standby current of 0.5 mA.     

A 4-Mbit CMOS EPROM

A high-density (512K-word/spl times/8-b) erasable programmable read-only memory (EPROM) has been designed and fabricated by using 0.8-/spl mu/m n-well CMOS technology. A novel chip layout and a sense-amplifier circuit produce a 120-ns access time and a 4-mA operational supply current. The interpoly dielectric, composed of a triple-layer structure, realizes a 10-/spl mu/s/byte fast programming time, in spite of scaling the programming voltage V/SUB PP/ from 12.5 V for a 1-Mb EPROM to 10.5 V for this 4-Mb EPROM. To meet the increasing demand for a one-time programmable (OTP) ROM, a circuit is implemented to monitor the access time after the assembly. A novel redundancy scheme is incorporated to reduce additional tests after the laser fuse programming. Cell size and chip size are 3.1/spl times/2.9 /spl mu/m/SUP 2/ and 5.86/spl times/14.92 mm/SUP 2/, respectively.     

An 80 ns 1 Mbit MASK ROM with a new memory cell

A high-speed 1-Mb MASK ROM incorporating a new through-hole programmed memory cell, named THOLE CELL, and a full CMOS static sense amplifier is described. The ROM has been fabricated using a double-polysilicon p-well CMOS technology. As a result of achieving a compact ROM cell that is as small as 5.2-/spl times/6.4 /spl mu/m/SUP 2/, even with relatively conservative 2.0 /spl mu/m design rules, a small die size of 7.08/spl times/7.7 mm/SUP 2/ is realized. The ROM organization is 128K/spl times/8 bit and has a typical access time of 80 ns. A typical active current of 8 mA is achieved, in spite of the fully static system. This ROM offers high speed and low power characteristics, while achieving small die size and short turnaround time.     

A 25-ns 1-Mbit CMOS SRAM with loading-free bit lines

A 128 K/spl times/8-b CMOS SRAM is described which achieves a 25-ns access time, less than 40-mA active current at 10 MHz, and 2-/spl mu/A standby current. The novel bit-line circuitry (loading-free bit line), using two kinds of NMOSFETs with different threshold voltages, improves bit-line signal speed and integrity. The two-stage local amplification technique minimizes the data-line delay. The dynamic double-word-line scheme (DDWL) allows the cell array to be divided into 32 sections along the word-line direction without a huge increase in chip area. This allows the DDWL scheme to reduce the core-area delay time and operating power to about half that of other conventional structures. A double-metal 0.8-/spl mu/m twin-tub CMOS technology has been developed to realize the 5.6/spl times/9.5-/spl mu//SUP 2/ cell size and the 6.86/spl times/15.37-mm/SUP 2/ chip size.     

A 10-/spl mu/W standby power 256K CMOS SRAM

A 32K/spl times/8-bit CMOS static RAM using titanium polycide technology has been developed. The RAM has a standby power of 10 /spl mu/W, an active power of 175 mW, and an access time of 55 ns. The standby power has been achieved by an optimization of polysilicon resistors in a memory cell. A digit line circuit controlled by three internal clocks contributes to reduction of active power. The cell size has been reduced to 89.5 /spl mu/m/SUP 2/ by using both a buried isolation and a polycide GND line. Furthermore a simplified address-transition detection circuit and a single data bus configuration result in a small layout area, thus offering a 40.7 mm/SUP 2/ die size.     

A 288K CMOS pseudostatic RAM

A 288-kb pseudostatic RAM with high density and ease of use has been fabricated using polycide-gate n-well CMOS technology. For high speed and low power dissipation, a half-V/SUB cc/ precharging scheme, with CMOS back biased to V/SUB BB/, was used. For easier use, an address transition detector, plus auto-refresh and self-refresh, were adopted. Organized as 32K/spl times/9 bits, the RAM occupies an area of 55 mm/SUP 2/ and has a cell size of 6.8/spl times/13.6 /spl mu/m/SUP 2/, which was achieved using the 2-/spl mu/m design rule. A typical address access time is 125 ns, and the operating current is 60 mA at a 125-ns cycle time. Standby power is 2 mA.     

A 256 kbit ROM with serial ROM cell structure

The realization of a 256 kbit ROM using a 500 /spl Aring/ E/D NMOS technology is described. A high packaging density has been achieved by using a NAND structure in the memory array and in the decoders. Some characteristics of this serial ROM structure are discussed and compared with the conventional parallel configurations. The 32K/spl times/8 bit ROM with a bit size of 5.25/spl times/5.5 /spl mu/m/SUP 2/ has a total chip area of 18.6 mm/SUP 2/. Operating from a single 5 V supply, the device has a typical access time of 850 ns with a minimum cycle time of 1500 ns and dissipates 70 mW. In the power-down mode this power is reduced to 5 mW.     

A subnanosecond 8K-gate CMOS/SOS gate array

An 8370-gate CMOS/SOS gate array has been developed using a Si-gate CMOS/SOS process with two-level metallization. The gate lengths of the transistors are 1.8 and 1.9 /spl mu/m for the n-channel and p-channel, respectively. Subnanosecond typical gate delay times have been obtained. Typical delay times of inverter, two-input NAND, and two-input NOR gates are 0.67, 0.87, and 0.99 ns, respectively, under a typical loading condition (three fan outs and 2 mm first metal). It is shown that ECL speed with CMOS power can be achieved in a system by using the CMOS/SOS gate array. Advantages of the SOS device on speed performance are also discussed.     

An EEPROM for microprocessors and custom logic

An EEPROM extension to a 2.5-/spl mu/ n-well CMOS technology has been developed. In this technology an EEPROM has been designed that is suitable for integration with (existing) microprocessors in a baseline 5 V technology. A 2K EEPROM memory module, usable as a building block in a cell library for custom logic, measures 3.2 mm/SUP 2/ with a memory cell area of 440 /spl mu/m/SUP 2/.     

A 16 DIP, 64 kbit, static MOS-RAM

A 64K/spl times/1 bit fully static MOS-RAM has been fabricated. For the purpose of replacement of 64 kbit dynamic RAM, this static RAM has been designed to be assembled in a standard 300 mil 16 pin DIP. It is the first time address multiplexing has been in static RAMs. The device with multiple addressing and improved row decoder employs a double poly Si layer and a 1.5 /spl mu/m design rule which is achieved by advanced process technology. As a result, the RAM has a 11.0 /spl mu/m/spl times/26.5 /spl mu/m (291.5 /spl mu/m/SUP 2/) cell size and a 3.84 mm/spl times/7.40 mm (28.40 mm/SUP 2/) chip size. The address access time is less than 150 ns with an active power dissipation of 400 mW.     

A 50-/spl mu/A standby 1M/spl times/1/256K/spl times/4 CMOS DRAM with high-speed sense amplifier

A 1M word/spl times/1-bit/256K word/spl times/4-bit CMOS DRAM with a test mode is described. The use of an improved sense amplifier for the half-V/SUB CC/ sensing scheme and a novel half-V/SUB CC/ voltage generator have yielded a 56-ns row access time and a 50-/spl mu/A standby current at typical conditions. High /spl alpha/-particle immunity has been achieved by optimizing the impurity profile under the bit line, based on a triple-layer polysilicon n-well CMOS technology. The RAM, measuring 4.4/spl times/12.32 mm/SUP 2/, is fit to standard 300-mil plastic packages.     

An LSI adaptive array processor

Describes an LSI adaptive array processor (AAP) for two-dimensional data processings. The AAP contains a large number of one-bit processing elements (PEs) arranged in a square array. The large degree of parallelism and control registers in each PE allow for high speed and flexible operations. High transfer capability is also obtained by a simple inter-PE connection network with hierarchical bypasses. The high applicability to various data processings is indicated by a matrix multiplication example, utilizing an algorithm similar to a systolic one. An AAP LSI composed of 8/spl times/8 PEs with powerful functions has been implemented in a 96.0 mm/SUP 2/ chip by using 2 /spl mu/m Si-gate p-well CMOS technology. A high-speed cycle time of 55 ns, low power dissipation of 1.1 W, and high packing density of 1170 transistors/mm/SUP 2/ has been achieved by a skilful manual design. Though the LSI contains as many as 111900 transistors, the design effort has only required one man-year due to cellular array regularity. This LSI is expected to realize a high-performance AAP compactly.     

A 200-mW GaAs 1 K SRAM with 2-ns cycle time

A very high-speed and low-power 1024/spl times/1 SRAM has been designed and fabricated using a normally-off recessed-gate FET technology. Minimum gate length is 0.7 /spl mu/m. A minimum access time of 1.4 ns has been obtained with a power dissipation of 210 mW. The memory cell area is 1197 /spl mu/m/SUP 2/ and the chip size is 1.91/spl times/2.21 mm/SUP 2/. The output voltage swing across a 50-/spl Omega/ load is 700 mV. The maximum simulated yield for 1 K SRAMs is discussed theoretically. A mean standard deviation in threshold voltage less than 15 mV is required to obtain 100% design yield. The SRAM has been shown to be fully operational using the march and checkerboard tests and exhibits read and write cycle times of 2 ns.     

Isoplanar integrated injection logic: a high-performance bipolar technology

A newly developed technology is discussed. The emphasis of this approach is on achieving high packing density and high performance by use of various process innovations combined with topological design variations. Factors affecting packing density, DC as well as power delay product in I/SUP 2/L are analyzed and design considerations for the new structure are given. The results of computer simulations and measured device parameters and power delay are given. The following gate performance has been obtained at 100-/spl mu/A injector current, /spl beta/u/spl sime/2-4 for all four collectors, speed <10 ns for fan-out of four, speed <5 ns for a fan-out of one. At low currents a speed power product is 0.15 pJ. A packing density of more than 300 gates/mm/SUP 2/ including interconnect and power bussing has been achieved.     

A 256-kbit flash E/SUP 2/PROM using triple-polysilicon technology

A high-density 256-kb flash electrically erasable PROM (E/SUP 2/PROM) with a single transistor per bit has been developed by utilizing triple-polysilicon technology. As a result of achieving a novel compact cell that is as small as 8/spl times/8 /spl mu/m/SUP 2/, even with relatively conservative 2.0-/spl mu/m design rules, a small die size of 5.69/spl times/5.78 mm/SUP 2/ is realized. This flash E/SUP 2/PROM is fully pin-compatible with a 256-kb UV-EPROM without increasing the number of input pins for erasing by introducing a novel programming and erasing scheme. Programming time is as fast as 200 /spl mu/s/byte and erasing time is less than 100 ms per chip. A typical access time of 90 ns is achieved by using sense-amplifier circuitry.     

A high speed bulk CMOS C/SUP 2/L microprocessor

The CDP 1802, single-chip, 8-bit microprocessor is fabricated in C/SUP 2/L, or closed COS/MOS logic, a new structural approach to high-speed bulk silicon COS/MOS logic. In this self-aligned silicon-gate CMOS technology, the gate completely surrounds the drain providing transistor aspect ratios which maximize the transconductance to capacitance ratio and thus allow high on-chip speed. Generally, standard 6-/spl mu/m channel length C/SUP 2/L devices show an improvement in packing density by a factor of 3 over standard CMOS and operate at frequencies approximately four times faster than standard CMOS. High density 5-/spl mu/m channel length devices further improve area and speed by factors up to 1.5. The fabrication sequence for C/SUP 2/L devices requires six photomasks (one less than standard CMOS).