Cu(In,Ga)3Se5薄膜结构的Raman研究

讨论了Ga含量对四元有序缺陷化合物Cu(In,Ga)3Se5薄膜的晶格振动模式的影响,室温下CuIn3Se5与CuGa3Se5 A1模式峰位分别位于153cm-1和164cm-1,Ga含量的增加引起晶格扭曲系数以及阴离子Se位移参数的增加,相应改变了Cu-Se以及In/Ga-Se的键长及其键拉伸力学常数,从而影响了A1模式峰位的移动.     

周期顺序蒸发工艺生长的Cu(In,Ga)Se_2薄膜结构

采用新颖的周期顺序蒸发和真空硒化退火工艺生长出p型CuIn0 7Ga0 3 Se2 薄膜.通过XPS谱、Raman谱、XRD谱分析了预生长层以及硒化后的CuIn0 7Ga0 3 Se2 薄膜,对四元化合物Cu(In ,Ga)Se2 的Raman谱进行了讨论,并观察到Ga对A1模式峰位的移动影响,同时发现薄膜倾向于沿(112 )晶面生长,薄膜贫Cu会加剧(2 2 0 ) / (2 0 4)表面自发分解成{ 112 }小晶面.研究表明,薄膜具有良好的电学特性和结构特性.     

周期顺序蒸发工艺生长的Cu(In,Ga)Se2薄膜结构

采用新颖的周期顺序蒸发和真空硒化退火工艺生长出p型CuIn0.7Ga0.3Se2薄膜.通过XPS谱、Raman谱、XRD谱分析了预生长层以及硒化后的CuIn0.7Ga0.3Se2薄膜,对四元化合物Cu(In,Ga)Se2的Raman谱进行了讨论,并观察到Ga对A1模式峰位的移动影响,同时发现薄膜倾向于沿(112)晶面生长,薄膜贫Cu会加剧(220)/(204)表面自发分解成{112}小晶面.研究表明,薄膜具有良好的电学特性和结构特性.     

CIGS薄膜(InGa)2Se3-富Cu-富In(Ga)的演变

采用三步共蒸发工艺顺序沉积铜铟镓硒(CuInGaSe2,CIGS)薄膜.薄膜的厚度、组份、晶相结构分别由台阶仪、X射线荧光光谱仪(XRF)和X射线衍射仪(XRD)来表征.在(In,Ga)2Se3预制层-富Cu相的演变过程中,依次发生以下相变:Cu(In,Ga)5Se8、Cu(In,Ga)3Se5、Cu2(In,Ga)4Se7(或Cu(In,Ga)2Se3.5)、Cu(In,Ga)Se2(液相CuxSe).在富Cu相-富In(Ga)相的演变过程中,依次发生以下相变:Cu(In,Ga)Se2(液相CuxSe)、Cu2(In,Ga)4Se7(或Cu(In,Ga)2Se3.5)、Cu(In,Ga)3Se5、Cu(In,Ga)5Se8.对这两个演变过程中薄膜的生长机理和结构特性进行了讨论.     

全固源分子束外延生长InP和InGaAsP

在国产分子束外延设备的基础上 ,利用新型三温区阀控裂解源炉 ,对 In P及 In Ga As P材料的全固源分子束外延 (SSMBE)生长进行了研究。生长了高质量的 In P外延层 ,表面缺陷密度为 65cm- 2 ,非故意掺杂电子浓度约为 1× 1 0 16cm- 3.In P外延层的表面形貌、生长速率及 p型掺杂特性与生长温度密切相关 .研究了 In Ga As P外延材料的组分特性 ,发现在一定温度范围内生长温度对 族原子的吸附系数有较大影响 .最后得到了晶格匹配的 In0 .56Ga0 .4 4 As0 .94 P0 .0 6材料 ,低温光致发光谱峰位于 1 50 7nm,FWHM为 9.8me V.     

Structural and electrical properties of co-evaporated In, Ga-rich CIGS thin films

The CIGS thin films are prepared by co-evaporation of elemental In, Ga and Se on the substrates of Mo-coated glasses at400℃ followed by co-evaporation of elemental Cu and Se at 550℃. We study the structural and electrical properties usingXRD, XRF and Hall effect measurements. In general, Cu(In,Cra)5Se8 phase exists when Cu/(In Ga) ratio is from 0.17 to0.27, Cu(In,Ga)3Se5 phase exists for Cu/(In Ga) ratio between 0.27 and 0.41, Cu2(In,Ga)4Se7 and Cu(In,Ga)2Se3.5 phasesexist for Cu/(In Ga) ratio between 0.41 and 0.61, and OVC(or ODC) and CuIn0.7Ga0.3 Se2 phases exist when Cu/(In Ga)ratio is from 0.61 to 0.88. With the increase of Cu/(In Ga) ratio, the carrier concentrations of the films gradually increase,but the electrical resistivity gradually decreases.     

分子束外延ZnSe/ZnS_xSe_(1-x)超晶格光学特性

用分子束外延方法在 Ga As(10 0 )衬底上生长了高质量的 Zn Se/ Zn Sx Se1 - x(x=0 .12 )超晶格结构 ,通过 X射线衍射谱和光致发光谱 ,对其结构特性和光学特性进行了研究 .结果表明 :在 4 .4 K温度下 ,超晶格样品显示较强的蓝光发射 ,主发光峰对应于阱层 Zn Se的基态电子到重空穴基态的自由激子跃迁 ,而且其峰位相对于 Zn Se薄膜的自由激子峰有明显蓝移 .从理论上分析计算了由应变和量子限制效应引起的自由激子峰位移动 ,理论和实验结果相吻合     

Structural and electrical properties of co-evaporated In,Garich CIGS thin films

The CIGS thin trims are prepared by co-evaporation of elemental In, Ga and Se on the substrates of Mo-coated glasses at 400℃ followed by co-evaporation of elemental Cu and Se at 550℃. We study the structural and electrical properties using XRD, XRF and Hall effect measurements. In general, Cu（In,Ga）sSes phase exists when Cu/（In＋Ga） ratio is from 0.17 to 0.27, Cu（In,Ga）3Se5 phase exists for Cu/（In＋Ga） ratio between 0.27 and 0.41, Cu2（in,Ga）4Se7 and Cu（In,Ga）2Se3.5 phases exist for Cu/0n＋Ga） ratio between 0.41 and 0.61, and OVC（or ODC） and CuIn0.7Ga0.3Se2 phases exist when Cu/（In＋Ga） ratio is from 0.61 to 0.88. With the increase of Cu/（In＋Ga） ratio, the carrier concentrations of the films gradually increase, but the electrical resistivity gradually decreases.     

InP基功率HEMT结构材料分子束外延生长研究

从 3个层面研究了分子束外延 Al0 .48In0 .52 As/ Ga0 .47In0 .53As/ In P功率 HEMT结构材料生长技术。首先 ,通过观察生长过程的高能电子衍射 (RHEED)图谱 ,确立了 Ga0 .47In0 .53As/ In P结构表面层的 MBE RHEED衍射工艺相图 ,据此生长的单层 Si-doped Ga0 .47In0 .53As(40 0 nm) / In P室温迁移率可达 6960 cm2 / V· s及电子浓度 1 .3 3 E1 7cm- 3。其次 ,经过优化结构参数 ,低噪声 Al0 .48In0 .52 As/ Ga0 .47In0 .53As/ In P HEMT结构材料的 Hall参数达到μ30 0 K≥ 1 0 0 0 0 cm2 / V· s、2 DEG≥ 2 .5 E1 2 cm- 2 。最后 ,在此基础之上 ,降低 spacer的厚度、在 Ga0 .47In0 .53As沟道内插入 Si平面掺杂层并增加势垒层的掺杂浓度获得了功率 Al0 .48In0 .52 As/ Ga0 .47In0 .53As/ In PHEMT结构材料 ,其 Hall参数达到μ30 0 K≥ 80 0 0 cm2 / V· s、2 DEG≥ 4 .0 E1 2 cm- 2 。     

MOCVD生长InGaAs／Alj0.2Ga0.8As应变多量子阱

用MOCVD方法生长了3种InGaAs/Al0.2Ga0.8As应变多量子阱（MQWs）样品，用于研究在气相中TMIn的含量对MQWs的发光波长和半峰宽（FWHM）以及在X射线中零级峰位的影响。研究表明，随着In组分在MQW中的增加，MQWs中应变也随之增加，这是造成FWHM增大的原因。同时也研究了应变MQWs中In组分与气相中TMIn含量的关系，为准确设计和控制MQWs的组分提供了依据。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.