Defects in electronics and their significance for structural integrity

With Electronics likely to become a major area of interest to structural integrity practitioners, the paper aims to introduce the field from a structural integrity perspective. The Industry is presently facing two major challenges: continued miniaturisation and the implementation of lead‐free technology associated with interconnections. Following a consideration of the background of both aspects, a brief outline of typical components and production processes is presented. Attention is then focussed upon possible defects that may arise during manufacture, and under the, often, complex conditions of service. Comparisons are drawn with more traditional applications of structural integrity, and the fresh challenges associated with the utilisation of a new generation of solder alloys, and with micro and near‐nano dimensions, are introduced.     

Impact of the ROHS Directive on high-performance electronic systems

The European Union enacted legislation, the ROHS Directive, that bans the use of lead (Pb) and several other substances in electronic products commencing July 1, 2006. The legislation recognized that in some situations no viable alternative Pb-free substitute materials are known at this time, and so provided exemptions for those cases. It was also recognized that certain electronic products, specifically servers, storage and storage array systems, network infrastructure equipment and network management for telecommunication equipment referred to as high-performance electronic products, perform tasks so important to modern society that their operational integrity had to be maintained. The introduction of new and unproven materials posed a significant potential reliability risk. Accordingly, the European Commission (EC) granted an exemption permitting the continued use of Pb in solders, independent of concentration, for high-performance (H-P) equipment applications. This exemption was primarily aimed at assuring that the reliability of solder joints, particularly flip-chip solder joints is preserved. Flip-chip solder joints experience the most severe operating conditions in comparison to other applications that utilize Pb in electronic equipment. This paper briefly describes the solder-exempted H-P electronic products, their capabilities, and some typical tasks they perform. Also discussed are the major attributes that differentiate H-P electronic equipment from consumer electronics, particularly in relation to their operational and reliability requirements. Interestingly, other than the special solder exemption accorded to H-P electronic equipment, these products must meet all the other requirements for ROHS compliancy. The EC was aware that issues would surface after the legislation was enacted, so it created the Technical Advisory Committee (TAC) to review industry-generated requests for exemptions. The paper discusses three exemption requests granted by the EC that are particularly relevant to H-P electronic products. The exemptions allow the continued use of lead-bearing solder materials.     

Design,Performance, and Application of Thermoelectric Nanogenerators

Thermal energy harvesting from the ambient environment through thermoelectric nanogenerators (TEGs) is an ideal way to realize self‐powered operation of electronics, and even relieve the energy crisis and environmental degradation. As one of the most significant energy‐related technologies, TEGs have exhibited excellent thermoelectric performance and played an increasingly important role in harvesting and converting heat into electric energy, gradually becoming one of the hot research fields. Here, the development of TEGs including materials optimization, structural designs, and potential applications, even the opportunities, challenges, and the future development direction, is analyzed and summarized. Materials optimization and structural designs of flexibility for potential applications in wearable electronics are systematically discussed. With the development of flexible and wearable electronic equipment, flexible TEGs show increasingly great application prospects in artificial intelligence, self‐powered sensing systems, and other fields in the future.     

Structural integrity and damage type in military aircraft

This paper discusses the nature of the damage which can cause unanticipated, early fleet failures in legacy military aircraft. This damage often takes a form quite unlike the notional cracking which is used in structural integrity design, but can lead to high costs, or reduced fleet availability, by requiring additional costly inspections and recovery programs in response to discovery of the damage. Using examples from Australian fleets the paper demonstrates that a lack of diagnostic and prognostic tools contributed to the impact of the damage on the fleet. Development of even simple prognostic and diagnostic tools could reduce the fleet impact and cost of discovered damage, and would ultimately allow the non‐crack damage to be incorporated into design to achieve a much more global level of damage tolerance. The paper discusses the key differences between these non‐crack damage forms and the more traditional crack‐like defect which is used in current damage tolerance based structural integrity management approaches for these aircraft. These differences are associated principally with damage variability and damage location, and they challenge some aspects of our existing structural integrity design methods such as reliance on testing and analysis of supposedly ‘representative’ example of aircraft structure. The larger challenge is to fully exploit the principles of damage tolerant structural design and management, and the paper argues that to achieve this we need to maintain a move towards a broader, risk‐based approach to structural integrity management. This longer‐term goal will also involve a reappraisal of the nature and distribution of damage, and a fundamental shift in our crack‐centric view of structural integrity, additional diagnostic and prognostic tools for such damage would be essential for developing this transition to a more global risk‐based damage management approach.     

Engineering Gyroid‐Structured Functional Materials via Templates Discovered in Nature and in the Lab

In search of optimal structures for functional materials fabrication, the gyroid (G) structure has emerged as a promising subject of widespread research due to its distinct symmetry, 3D interconnected networks, and inherent chiral helices. In the past two decades, researchers have made great progress fabricating G‐structured functional materials (GSFMs) based on G templates discovered both in nature and in the lab. The GSFMs demonstrate extraordinary resonance when interacting with light and matter. The superior properties of GSFMs can be divided into two categories based on the dominant structural properties, namely, dramatic optical performances dominated by short‐range symmetry and well‐defined texture, and effective matter transport due to long‐range 3D interconnections and high integrity. In this review, G templates suitable for fabrication of GSFMs are summarized and classified. State‐of‐the‐art optical applications of GSFMs, including photonic bandgap materials, chiral devices, plasmonic materials, and matamaterials, are systematically discussed. Applications of GSFMs involved in effective electron transport and mass transport, including electronic devices, ultrafiltration, and catalysis, are highlighted. Existing challenges that may hinder the final application of GSFMS together with possible solutions are also presented.     

Recent Progress of Textile‐Based Wearable Electronics: A Comprehensive Review of Materials,Devices, and Applications

Wearable electronics are emerging as a platform for next‐generation, human‐friendly, electronic devices. A new class of devices with various functionality and amenability for the human body is essential. These new conceptual devices are likely to be a set of various functional devices such as displays, sensors, batteries, etc., which have quite different working conditions, on or in the human body. In these aspects, electronic textiles seem to be a highly suitable possibility, due to the unique characteristics of textiles such as being light weight and flexible and their inherent warmth and the property to conform. Therefore, e‐textiles have evolved into fiber‐based electronic apparel or body attachable types in order to foster significant industrialization of the key components with adaptable formats. Although the advances are noteworthy, their electrical performance and device features are still unsatisfactory for consumer level e‐textile systems. To solve these issues, innovative structural and material designs, and novel processing technologies have been introduced into e‐textile systems. Recently reported and significantly developed functional materials and devices are summarized, including their enhanced optoelectrical and mechanical properties. Furthermore, the remaining challenges are discussed, and effective strategies to facilitate the full realization of e‐textile systems are suggested.     

Solders as high temperature engineering materials

Abstract

Although they operate at temperatures around ambient, it is argued that tin-based solders may be regarded as conventional high temperature engineering alloys, such as steels, titanium and nickel-base alloys, which normally experience much higher temperatures. This proposition is based upon a comparison at similar homologous temperatures, rather than their absolute values.

The demand for structural integrity of soldered joints in modern electronic devices is growing. Design challenges, quite similar to those in power generation and aerospace, require reliable life prediction under complex operating conditions. The paper compares monotonic and cyclic properties of solders with those of the more conventional high temperature alloys. Particular attention is focussed on the emerging lead-free solders which are being introduced for environmental reasons. It is concluded that solders are amongst the most vulnerable of high temperature alloys particularly with respect to their strain rate sensitivity and time dependent behaviour.     

Airbus Airframe – New Technologies and Management Aspects

Airframe innovations in all relevant technological fields are important for the development of high performance airframes best to satisfy the market needs. The Airbus “intelligent” airframe is optimized in terms of new materials and advanced design, and implements smart structures technologies step by step. Hence, the competition between technologies (metal vs. composite) is leading to a hybrid airframe solution in the latest Airbus aircraft. This ensures that the best mature innovative technology is used for each specific application. Airbus is in the leading position for application of advanced technologies and has accumulated broad experience in all airframe technologies with all types of structural materials. In order to meet the current and future challenges and to incorporate worldwide best state‐of the‐art technological solutions, cooperation with external suppliers and strategic partners is essential. Increasingly decentralized engineering and manufacturing co‐operations – at an international level – lead to challenging aircraft program and technology management. Therefore, Airbus is intensifying its cooperation with research facilities, equipment, material and structure suppliers based on new Airbus ‐ Supplier cooperation philosophies.     

Recent Progress on Stretchable Electronic Devices with Intrinsically Stretchable Components

Stretchable electronic devices with intrinsically stretchable components have significant inherent advantages, including simple fabrication processes, a high integrity of the stacked layers, and low cost in comparison with stretchable electronic devices based on non‐stretchable components. The research in this field has focused on developing new intrinsically stretchable components for conductors, semiconductors, and insulators. New methodologies and fabrication processes have been developed to fabricate stretchable devices with intrinsically stretchable components. The latest successful examples of stretchable conductors for applications in interconnections, electrodes, and piezoresistive devices are reviewed here. Stretchable conductors can be used for electrode or sensor applications depending on the electrical properties of the stretchable conductors under mechanical strain. A detailed overview of the recent progress in stretchable semiconductors, stretchable insulators, and other novel stretchable materials is also given, along with a discussion of the associated technological innovations and challenges. Stretchable electronic devices with intrinsically stretchable components such as field‐effect transistors (FETs), photodetectors, light‐emitting diodes (LEDs), electronic skins, and energy harvesters are also described and a new strategy for development of stretchable electronic devices is discussed. Conclusions and future prospects for the development of stretchable electronic devices with intrinsically stretchable components are discussed.     

Laser‐Assisted Lattice Recovery of Graphene by Carbon Nanodot Incorporation

Producing highly oriented graphene is a major challenge that constrains graphene from fulfilling its full potential in technological applications. The exciting properties of graphene are impeded in practical bulk materials due to lattice imperfections that hinder charge mobility. A simple method to improve the structural integrity of graphene by utilizing laser irradiation on a composite of carbon nanodots (CNDs) and 3D graphene is presented. The CNDs attach themselves to defect sites in the graphene sheets and, upon laser‐assisted reduction, patch defects in the carbon lattice. Spectroscopic experiments reveal graphitic structural recovery of up to 43% and electrical conductivity four times larger than the original graphene. The composites are tested as electrodes in electrochemical capacitors and demonstrate extremely fast RC time constant as low as 0.57 ms. Due to their low defect concentrations, the reduced graphene oxide‐carbon nanodot (rGO‐CND) composites frequency response is sufficiently fast to operate as AC line filters, potentially replacing today's electrolytic capacitors. Using this methodology, demonstrated is a novel line filter with one of the fastest capacitive responses ever reported, and an aerial capacitance of 68.8 mF cm^?2. This result emphasizes the decisive role of structural integrity for optimizing graphene in electronic applications.     

Tracking Structural Phase Transitions in Lead‐Halide Perovskites by Means of Thermal Expansion

The extraordinary properties of lead‐halide perovskite materials have spurred intense research, as they have a realistic perspective to play an important role in future photovoltaic devices. It is known that these materials undergo a number of structural phase transitions as a function of temperature that markedly alter their optical and electronic properties. The precise phase transition temperature and exact crystal structure in each phase, however, are controversially discussed in the literature. The linear thermal expansion of single crystals of APbX₃ (A = methylammonium (MA), formamidinium (FA); X = I, Br) below room temperature is measured using a high‐resolution capacitive dilatometer to determine the phase transition temperatures. For δ‐FAPbI₃, two wide regions of negative thermal expansion below 173 and 54 K, and a cascade of sharp transitions for FAPbBr₃ that have not previously been reported are uncovered. Their respective crystal phases are identified via powder X‐ray diffraction. Moreover, it is demonstrated that transport under steady‐state illumination is considerably altered at the structural phase transition in the MA compounds. The results provide advanced insights into the evolution of the crystal structure with decreasing temperature that are essential to interpret the growing interest in investigating the electronic, optical, and photonic properties of lead‐halide perovskite materials.     

Preintercalation Strategy in Manganese Oxides for Electrochemical Energy Storage: Review and Prospects

Manganese oxides (MnO₂) are promising cathode materials for various kinds of battery applications, including Li-ion, Na-ion, Mg-ion, and Zn-ion batteries, etc., due to their low-cost and high-capacity. However, the practical application of MnO₂ cathodes has been restricted by some critical issues including low electronic conductivity, low utilization of discharge depth, sluggish diffusion kinetics, and structural instability upon cycling. Preintercalation of ions/molecules into the crystal structure with/without structural reconstruction provides essential optimizations to alleviate these issues. Here, the intrinsic advantages and mechanisms of the preintercalation strategy in enhancing electronic conductivity, activating more active sites, promoting diffusion kinetics, and stabilizing the structural integrity of MnO₂ cathode materials are summarized. The current challenges related to the preintercalation strategy, along with prospects for the future research and development regarding its implementation in the design of high-performance MnO₂ cathodes for the next-generation batteries are also discussed.     

One‐Dimensional Hybrid Nanostructures for Heterogeneous Photocatalysis and Photoelectrocatalysis

Semiconductor‐based photocatalysis and photoelectrocatalysis have received considerable attention as alternative approaches for solar energy harvesting and storage. The photocatalytic or photoelectrocatalytic performance of a semiconductor is closely related to the design of the semiconductor at the nanoscale. Among various nanostructures, one‐dimensional (1D) nanostructured photocatalysts and photoelectrodes have attracted increasing interest owing to their unique optical, structural, and electronic advantages. In this article, a comprehensive review of the current research efforts towards the development of 1D semiconductor nanomaterials for heterogeneous photocatalysis and photoelectrocatalysis is provided and, in particular, a discussion of how to overcome the challenges for achieving full potential of 1D nanostructures is presented. It is anticipated that this review will afford enriched information on the rational exploration of the structural and electronic properties of 1D semiconductor nanostructures for achieving more efficient 1D nanostructure‐based photocatalysts and photoelectrodes for high‐efficiency solar energy conversion.     

Experimental Analysis of Thermo‐mechanical Behaviour of Electronic Components with Speckle Interferometry

Experimental investigations of thermo‐mechanical behaviour of electronic components may help to prevent catastrophic in‐service failures. Non‐contact optical techniques such as speckle and moiré interferometry are naturally suited for carrying out measurements on electronic equipment as they are non‐invasive techniques and provide high‐resolution full‐field information on displacements. In spite of its inherent ability to measure deformations at the nanometer level, there are few examples of application of speckle interferometry to true monitoring of thermo‐mechanical behaviour of electronic components in real time. For this reason, the paper presents a phase shifting electronic speckle pattern interferometry (PSESPI) experimental set‐up developed in order to monitor the time evolution of thermal deformations in electronic components for aerospace applications submitted to normal or anomalous working conditions. Cyclic loads are also analysed to assess fatigue behaviour. Experimental results obtained for whole electronic boards and single components mounted on board fully demonstrate the capability of PSESPI to detect even small differences in thermo‐mechanical response between normal and anomalous functioning.     

Scaffold‐Free Liver‐On‐A‐Chip with Multiscale Organotypic Cultures

The considerable advances that have been made in the development of organotypic cultures have failed to overcome the challenges of expressing tissue‐specific functions and complexities, especially for organs that require multitasking and complex biological processes, such as the liver. Primary liver cells are ideal biological building blocks for functional organotypic reconstruction, but are limited by their rapid loss of physiological integrity in vitro. Here the concept of lattice growth used in material science is applied to develop a tissue incubator, which provides physiological cues and controls the 3D assembly of primary cells. The cues include a biological growing template, spatial coculture, biomimetic radial flow, and circulation in a scaffold‐free condition. The feasibility of recapitulating a multiscale physiological structural hierarchy, complex drug clearance, and zonal physiology from the cell to tissue level in long‐term cultured liver‐on‐a‐chip is demonstrated. These methods are promising for future applications in pharmacodynamics and personal medicine.     

Probing molecules in integrated silicon-molecule-metal junctions by inelastic tunneling spectroscopy

Molecular electronics has drawn significant attention for nanoelectronic and sensing applications. A hybrid technology where molecular devices are integrated with traditional semiconductor microelectronics is a particularly promising approach for these applications. Key challenges in this area include developing devices in which the molecular integrity is preserved, developing in situ characterization techniques to probe the molecules within the completed devices, and determining the physical processes that influence carrier transport. In this study, we present the first experimental report of inelastic electron tunneling spectroscopy of integrated metal-molecule-silicon devices with molecules assembled directly to silicon contacts. The results provide direct experimental confirmation that the chemical integrity of the monolayer is preserved and that the molecules play a direct role in electronic conduction through the devices. Spectra obtained under varying measurement conditions show differences related to the silicon electrode, which can provide valuable information about the physics influencing carrier transport in these molecule/Si hybrid devices.     

Structural and Functional Diversity in Lead‐Free Halide Perovskite Materials

Lead halide perovskites have emerged as promising semiconducting materials for different applications owing to their superior optoelectronic properties. Although the community holds different views toward the toxic lead in these high‐performance perovskites, it is certainly preferred to replace lead with nontoxic, or at least less‐toxic, elements while maintaining the superior properties. Here, the design rules for lead‐free perovskite materials with structural dimensions from 3D to 0D are presented. Recent progress in lead‐free halide perovskites is reviewed, and the relationships between the structures and fundamental properties are summarized, including optical, electric, and magnetic‐related properties. 3D perovskites, especially A₂B⁺B³⁺X₆‐type double perovskites, demonstrate very promising optoelectronic prospects, while low‐dimensional perovskites show rich structural diversity, resulting in abundant properties for optical, electric, magnetic, and multifunctional applications. Furthermore, based on these structure–property relationships, strategies for multifunctional perovskite design are proposed. The challenges and future directions of lead‐free perovskite applications are also highlighted, with emphasis on materials development and device fabrication. The research on lead‐free halide perovskites at Linköping University has benefited from inspirational discussions with Prof. Olle Inganäs.     

2D Binary Plasmonic Nanoassemblies with Semiconductor n/p‐Doping‐Like Properties

The electronic, optical, thermal, and magnetic properties of an extrinsic bulk semiconductor can be finely tuned by adjusting its dopant concentration. Here, it is demonstrated that such a doping concept can be extended to plasmonic nanomaterials. Using two‐dimensional (2D) assemblies of Au@Ag and Au nanocubes (NCs) as a model system, detailed experimental and theoretical studies are carried out, which reveal collective semiconductor n/p‐doping‐like plasmonic properties. A threshold doping concentration of Au@Ag NCs is observed, below which p‐doping dominates and above which n‐doping prevails. Furthermore, Au@Ag NC dopants can be converted into corresponding Au seed “voids” dopants by selectively removing Ag without changing the overall structural integrity. The results show that the plasmonic doping concept may serve as a general design principle guiding synthesis and assembly of plasmonic metamaterials for programmable optoelectronic devices.     

Determining the Progression of Damage in Materials Subjected to Sustained Random Loads Using an Adaptive Finite Impulse Response Approach

It is often important to establish the ability of materials to withstand dynamic loads. This ability is best determined by subjecting the elements to sustained random loads under controlled conditions. It is during these fatigue endurance tests that the loss of structural integrity of a material or an element needs to be quantified. The research presented herein uses a recently developed continuous structural integrity assessment technique to evaluate variations in the mechanical properties (namely stiffness) of materials. The effectiveness of the technique was evaluated by undertaking controlled experiments, during which damage was simulated by varying the stiffness (in this case the length of a cantilever beam) of a physical single degree‐of‐freedom vibratory system subjected to random base excitation. Additional experiments where materials were allowed to naturally decay (structurally) under sustained random loads were also performed. Overall, the results presented in this study indicate that the technique can be a practical and effective tool for detecting small variations in the structural integrity of materials subjected to sustained random loads.     

Robust Catalysis on 2D Materials Encapsulating Metals: Concept,Application, and Perspective

Great endeavors are undertaken to search for low‐cost, rich‐reserve, and highly efficient alternatives to replace precious‐metal catalysts, in order to cut costs and improve the efficiency of catalysts in industry. However, one major problem in metal catalysts, especially nonprecious‐metal catalysts, is their poor stability in real catalytic processes. Recently, a novel and promising strategy to construct 2D materials encapsulating nonprecious‐metal catalysts has exhibited inimitable advantages toward catalysis, especially under harsh conditions (e.g., strong acidity or alkalinity, high temperature, and high overpotential). The concept, which originates from unique electron penetration through the 2D crystal layer from the encapsulated metals to promote a catalytic reaction on the outermost surface of the 2D crystal, has been widely applied in a variety of reactions under harsh conditions. It has been vividly described as “chainmail for catalyst.” Herein, recent progress concerning this chainmail catalyst is reviewed, particularly focusing on the structural design and control with the associated electronic properties of such heterostructure catalysts, and also on their extensive applications in fuel cells, water splitting, CO₂ conversion, solar cells, metal–air batteries, and heterogeneous catalysis. In addition, the current challenges that are faced in fundamental research and industrial application, and future opportunities for these fantastic catalytic materials are discussed.