冷气动力喷涂涂层结合机理及其工艺研究进展

重点综述了冷气动力喷涂涂层的结合机理及影响涂层质量的因素,对冷喷涂涂层的特点及其应用研究的最新进展进行了简要介绍,指出冷喷涂在高纯金属、非晶、纳米晶及异种复合材料涂层的制备方面具有广阔的应用前景.     

聚合物微流控芯片超声波微熔融键合方法

为了将超声波聚合物焊接技术更好地应用于聚合物微流控芯片的键合,提出基于界面微熔融的聚合物微流控芯片超声波键合方法.设计了适用于该方法的导能筋结构,在合理的键合工艺参数控制下使导能筋结构材料不发生熔融流延,通过键合界面软化润湿来实现对微流控芯片微通道的密封连接.实验结果表明,键合时间仅为0.09 s,键合后微通道的承压能力可达6个大气压,满足微流控芯片的使用要求.面接触导能筋可采用机械加工或注塑方法获得,具有良好的产业化应用前景.     

基于局部溶解性激活的聚合物微流控芯片超声波键合

利用低于临界振幅下的超声波作用在聚合物上仅产生表面热的特点,结合PMMA在异丙醇(IPA)中的温变溶解特性,提出了一种基于局部溶解性激活的超声波聚合物微流控芯片键合方法.理论分析表明当超声振幅小于临界振幅时,只有器件接触表面产生局部表面热,而且在70℃附近IPA对PMMA的溶解性才具有良好的激活作用.在试验研究中,利用精密加工法和热压法制作了带面接触式导能筋结构和80μm×80μm微通道的PMMA微流控芯片基片.在超声振幅为13μm、键合时间8 s、键合压力300 N的条件下进行了键合试验.结果表明,芯片拉伸强度达2.25 MPa,微通道的承压能力超过800 kPa,键合后导能筋无熔融,微沟道变形率小于2%,键合时间仅为8s.该方法的键合强度和键合效率明显高于传统的键合方法,而微结构的变形率却较小,故可作为一种具有产业化前景的聚合物MEMS器件快速封接方法.     

State‐of‐the‐Art Analytical Methods for Assessing Dynamic Bonding Soft Matter Materials

Dynamic bonding materials are of high interest in a variety of fields in material science. The reversible nature of certain reaction classes is frequently employed for introducing key material properties such as the capability to self‐heal. In addition to the synthetic effort required for designing such materials, their analysis is a highly complex—yet important—endeavor. Herein, we critically review the current state of the art analytical methods and their application in the context of reversible bonding on demand soft matter material characterization for an in‐depth performance assessment. The main analytical focus lies on the characterization at the molecular level.     

Enhancement of ceramic-to-metal adhesive bonding by excimer laser surface treatment

A silicon nitride (Si₃N₄) based ceramic cutting material and a structural alloy steel (SAE 4340) were surface-treated using a 800 mJ KrF excimer laser with an aim to improve the ceramic-to-metal bond strength. For these two materials, the effects of laser energy density and the number of pulses upon the surface morphologies of the laser-treated surfaces to be joined were examined. Conical surface microstructures were generally observed on the laser-treated surfaces of the Si₃N₄ material, and the number of conical features was found to be significantly influenced by the laser energy density. Moreover, the results of XPS have shown that the surface chemistry of the ceramic was altered after being laser treated. On the other hand, excimer laser treatment had caused the alloy steel surfaces be melted and resulted in some “beach-mark” features. However, the laser energy density has little effect on the overall surface morphology and the roughness of the treated surfaces. Shear tests were performed on adhesive bonded samples of the laser-treated ceramic and alloy steel. Significant improvement in adhesion shear strength was obtained for the laser-treated samples as compared with those tested in the as-received and mechanically abraded conditions. The required laser operation condition for achieving good shear joint strength was discussed.     

Evaluation of Bonding Quality in the Carbon Fiber--Reinforced Polymer (CFRP) Composite Laminates by Measurements of Local Vibration Nonlinearity

A new approach to monitoring the quality of adhesive bonding in the carbon fiber--reinforced polymer (CFRP) is developed by using a local nonlinear response of the laminate. It is shown that a degraded (contaminated) boundary layer of the adhesive contributes to an overall nonlinear response of the laminate that enables to evaluate and quantify bonding quality caused by various types and levels of single contaminations. In the context of aviation applications, two typical stages during the life of a structural part for which the adhesive properties of a bonding joint could be degraded were considered: the production process and the maintenance/repair scenario. All kinds of single contaminations studied result in enhancement of the nonlinear response of the CFRP laminate, which is an indication of deterioration of the bonding quality. The effect of multiple contaminations confirms a cumulative decline of adhesion caused by increase of the contents of single contamination components.     

碳纤维-铝多层结构胶接质量的超声检测

采用宽带窄脉冲超声换能器对树脂基碳纤维与铝板胶接质量进行检测,通过对采集的回波信号幅值、声时以及相位等因素的分析,找出回波信号与胶接缺陷形态的对应关系,提出针对树脂基碳纤维与铝多层结构胶接结构的超声检测方法。本文还通过对试块上预埋缺陷的检测确定了该检测方法的准确性,并运用红外热成像检测技术对检测结果的可靠性予以验证。     

铺层方式对CFRP-Al单搭接接头胶接性能的影响

使用热压罐制备[45/-45]_4s、[0/90]_4s和[0/45/-45/90]_2s三种铺层方式的CFRP层合板,然后在室温下与Al胶接制备出单搭接试样。使用电子万能试验机、数字图像相关法(DIC)和扫描电子显微镜(SEM)等手段测量胶接接头的拉伸载荷-位移曲线和应变分布并观察断口形貌。基于试验数据分析不同铺层方式下CFRP-Al单搭接接头的拉伸性能,研究了铺层方式对CFRP-Al单搭接接头胶接性能的影响和铺层方式胶接接头的破坏机制。结果表明,在拉伸过程中[45/-45]_4s试样出现塑性变形阶段其拉伸位移最大,而[0/45/-45/90]_2s和[0/90]_4s试样的拉伸位移较小且发生了脆性断裂。铺层方式从[45/-45]_4s到[0/45/-45/90]_2s再到[0/90]_4s,试样的极限载荷和纤维束断裂数量增加、层间剪切力减小、应变集中程度和分层破坏程度降低。     

高性能树脂基复合材料典型空天环境下动态力学行为研究现状

随着飞行器结构中碳纤维增强树脂基复合材料用量的迅速增加,其应用范围从非主承力构件逐渐扩展到主承力构件,复合材料结构中的疲劳、低速冲击和高速撞击等动态力学问题已经引起了国内外研究者的广泛关注.本文综述了典型空天环境因素与碳纤维增强树脂基复合材料的交互作用,重点探讨了其在疲劳、低速冲击和高速撞击载荷作用下的行为,简述了环境损伤与动态载荷耦合对碳纤维增强树脂基复合材料动态力学性能的影响,以期为聚合物基复合材料在空天飞行器上的应用提供有益的参考.     

超高性能混凝土与普通混凝土的黏结抗冻性能

对147个超高性能混凝土与普通混凝土的100mm×100mm×100mm立方体黏结试件进行了冻融循环后的黏结性能研究,测量了冻融后试件的相对动弹性模量、质量损失率以及劈裂抗拉强度,研究了超高性能混凝土中的钢纤维掺量、普通混凝土的强度等级、黏结面形式、试件的浇筑方向等因素对黏结试件抗冻性能的影响。结果表明,冻融循环结束后,所有黏结试件中的超高性能混凝土部分都没有出现损伤,超高性能混凝土可以作为普通混凝土结构的理想外围护材料;随着冻融循环次数的增加,黏结试件的相对动弹性模量逐渐减小,质量损失率先降低后增加,黏结试件的劈裂抗拉强度线性下降;影响黏结试件冻融后劈裂抗拉强度下降速度的关键因素是超高性能混凝土中的钢纤维掺量和黏结面的形式。     

间苯二酚甲醛／丁苯吡共混胶膜的动态粘弹性与疲劳性能

制备了间苯二酚甲醛/丁苯吡共混胶膜(RFL)。研究了RFL胶膜的动态粘弹性、拉伸性能以及拉伸疲劳性能,发现间苯二酚(R)/甲醛(F)=1/0.8~1/2.0之间时,F的增加,对RFL胶膜的E′和Tg影响不大,但在RFL熟化一定时间后,补充F可使RFL胶膜的E′提高,而Tg略有降低。此外,F用量以及加入时机对RFL胶膜拉伸强度、杨氏模量、拉伸疲劳次数以及粘合性有较大的影响。提出了适于芳香聚酰胺纤维和玻璃纤维表面处理的配方。     

The New Method of Semiconductor Devices Production by Wafers Direct Bonding

Problems of a new technological process of multilayer silicon structure formation by direct bonding of silicon wafers (SDB) are reviewed. The main accent is made on the consideration of possible mechanisms of semiadhesive bonding of silicon surfaces at low-temperature and high-temperature steps of the bonding process. Issues regarding the quality of multilayer structures such as absence of voids, crystal structure peculiarities of the bonding interface, and electrical properties of the device layers are presented. Examples of applications of the SDB multilayer structures in device fabrication are shown. The review includes both the consideration of principal reports on the subject and the author's experimental results.     

聚合物中小分子扩散的分子动力学模拟

采用分子动力学(MD)方法,以研究低聚体在聚甲基丙烯酸甲酯中的扩散为例,通过分析高分子链长、低聚体含量、聚合度和温度对扩散系数的影响,揭示小分子在聚合物中扩散过程.通过比较扩散系数的模拟值与实验值,发现两者比值在4左右.为获得小分子在聚合物中的扩散系数提供了一种较好的方法.     

液相连接氮化硅陶瓷的结合强度研究

本文用玻璃焊料研究了氮化硅陶瓷的液相连接,探讨了组份（0～10wt％α－Si₃N₄）、温度（1450～1650℃）和保温时间（10～120min）对结合强度的影响规律．结果表明,α－Si₃N₄的加入提高了液态焊料的粘度,降低了焊料的流动性,导致结合强度下降．采用组份为不含α－Si₃N₄的纯氧化物玻璃焊料在1600℃、保温30min可以得到较为理想的结合强度．