A 5-GHz programmable frequency divider in 0.18-μm CMOS technology

正A 5-GHz CMOS programmable frequency divider whose modulus can be varied from 2403 to 2480 for 2.4-GHz ZigBee applications is presented.The divider based on a dual-modulus prescaler(DMP) and pulse-swallow counter is designed to reduce power consumption and chip area.Implemented in the 0.18-μm mixed-signal CMOS process,the divider operates over a wide range of 1-7.4 GHz with an input signal of 7.5 dBm;the programmable divider output phase noise is -125.3 dBc/Hz at an offset of 100 kHz.The core circuit without test buffer consumes 4.3 mA current from a 1.8 V power supply and occupies a chip area of approximately 0.015 mm~2.The experimental results indicate that the programmable divider works well for its application in frequency synthesizers.     

A 7-GHz multiloop ring oscillator in 0.18-μm CMOS technology

A novel delay stage for ring oscillator utilizing multiloop technique is presented in this paper. Different conventional delay stages for the multiloop ring oscillators have been reviewed and analyzed in this work. By using push-pull inverter as the secondary input in its delay cell, the proposed oscillator demonstrates a frequency improvement of up to 17% when compared with conventional designs. The fabricated oscillator is measured to cover a frequency range of 6.24–7.04 GHz. Operating in 1.8-V power supply, the oscillator manifests itself a phase noise of ?107.7 dBc/Hz@10 MHz offset from a center frequency of 6.25 GHz. The proposed oscillator consumes a current of 40–51 mA from the 1.8-V supply and occupies an area of 440 μm ×  430 μm.     

A 5.25-GHz low-power down-conversion mixer in 0.18-μm CMOS technology

A 5.25 GHz low voltage, high linear and isolated mixer using TSMC 0.18 μm CMOS process for WLAN receiver was investigated. The paper presents a novel topology mixer that leads to better performance in terms of linearity, isolation and power consumption for low supply voltage. The measuring results of the proposed mixer achieve: 7.6 dB power conversion gain, 11.4 dB double side band noise figure, 3 dBm input third-order intercept point, and the total dc power consumption of this mixer including output buffers is 2.45 mW from a 1 V supply voltage. The current output buffer is about 2 mW, the excellent LO-RF, LO-IF and RF-IF isolation achieved up to 37.8, 54.8 and 38.2 dB, respectively.     

A 3.1-4.8 GHz transmitter with a high frequency divider in 0.18μm CMOS for OFDM-UWB

A fully integrated low power RF transmitter for a WiMedia 3.1-4.8 GHz multiband orthogonal frequency division multiplexing ultra-wideband system is presented. With a separate transconductance stage, the quadrature up-conversion modulator achieves high linearity with low supply voltage. The co-design of different resonant frequencies of the modulator and the differential to single （D2S） converter ensures in-band gain flatness. By means of a series inductor peaking technique, the D2S converter obtains 9 dB more gain without extra power consumption. A divided-by-2 divider is used for carrier signal generation. The measurement results show an output power between -10.7 and -3.1 dBm with 7.6 dB control range, an OIP3 up to 12 dBm, a sideband rejection of 35 dBc and a carrier rejection of 30 dBc. The ESD protected chip is fabricated in the Jazz 0.18μm RF CMOS process with an area of 1.74 mm^2 and only consumes 32 mA current （at 1.8 V） including the test associated parts.     

A 3-5 GHz TH-UWB transmitter in 0.18-μm RF CMOS technology

5 mV at a 50 Ω load from a 1.8-V supply, the return loss (S11) at the output port is less than -10 dB, and the chip size is 0.7 × 0.8 mm2, with a power consumption of 12.3 mW.     

A 3.1-4.8 GHz transmitter with a high frequency divider in 0.18 μm CMOS for OFDM-UWB

A fully integrated low power RF transmitter for a WiMedia 3.1-4.8 GHz multiband orthogonal frequency division multiplexing ultra-wideband system is presented. With a separate transconductance stage, the quadrature up-conversion modulator achieves high linearity with low supply voltage. The co-design of different resonant frequencies of the modulator and the differential to single (D2S) converter ensures in-band gain flatness. By means of a series inductor peaking technique, the D2S converter obtains 9 dB more gain without extra power consumption. A divided-by-2 divider is used for carrier signal generation. The measurement results show an output power between -10.7 and -3.1 dBm with 7.6 dB control range, an OIP3 up to 12 dBm, a sideband rejection of 35 dBc and a carrier rejection of 30 dBc. The ESD protected chip is fabricated in the Jazz 0.18/zm RF CMOS process with an area of 1.74 mm~2 and only consumes 32 mA current (at 1.8 V) including the test associated parts.     

A fractional-N frequency divider for multi-standard wireless transceiver fabricated in 0.18 μm CMOS process

With the rapid evolution of wireless communication technology,integrating various communication modes in a mobile terminal has become the popular trend.Because of this,multi-standard wireless technology is one of the hot spots in current research.This paper presents a wideband fractional-N frequency divider of the multi-standard wireless transceiver for many applications.High-speed divider-by-2 with traditional sourcecoupled-logic is designed for very wide band usage.Phase switching technique and a chain of divider-by-2/3 are applied to the programmable frequency divider with 0.5 step.The phase noise of the whole frequency synthesizer will be decreased by the narrower step of programmable frequency divider.△-Σ modulator is achieved by an improved MASH 1-1-1 structure.This structure has excellent performance in many ways,such as noise,spur and input dynamic range.Fabricated in TSMC 0.18 μm CMOS process,the fractional-N frequency divider occupies a chip area of 1130 × 510μm2 and it can correctly divide within the frequency range of 0.8-9 GHz.With 1.8 V supply voltage,its division ratio ranges from 62.5 to 254 and the total current consumption is 29 mA.     

A low spur,low jitter 10-GHz phase-locked loop in 0.13-μm CMOS technology

This paper presents a 10-GHz low spur and low jitter phase-locked loop(PLL).An improved low phase noise VCO and a dynamic phase frequency detector with a short delay reset time are employed to reduce the noise of the PLL.We also discuss the methodology to optimize the high frequency prescaler's noise and the charge pump's current mismatch.The chip was fabricated in a SMIC 0.13-μm RF CMOS process with a 1.2-V power supply.The measured integrated RMS jitter is 757 fs(1 kHz to 10 MHz);the phase noise is-89 ...     

A low spur, low jitter 10-GHz phase-locked loop in 0.13-μm CMOS technology

This paper presents a 10-GHz low spur and low jitter phase-locked loop (PLL).An improved low phase noise VCO and a dynamic phase frequency detector with a short delay reset time are employed to reduce the noise of the PLL.We also discuss the methodology to optimize the high frequency prescaler's noise and the charge pump's current mismatch.The chip was fabricated in a SMIC 0.13-μm RF CMOS process with a 1.2-V power supply.The measured integrated RMS jitter is 757 fs (1 kHz to 10 MHz); the phase noise is -89 and-118.1 dBc/Hz at 10 kHz and 1 MHz frequency offset,respectively; and the reference frequency spur is below -77 dBc.The chip size is 0.32 mm2 and the power consumption is 30.6 mW.     

A 3-5 GHz BPSK transmitter for IR-UWB in 0.18μm CMOS

This paper presents a transmitter IC with BPSK modulation for an ultra-wide band system.It is based on up-conversion with a high linearity passive mixer.Unlike the traditional BPSK modulation scheme,the local oscillator (LO) is modulated by the baseband data instead of the pulse.The chip is designed and fabricated by standard 0.18μm CMOS technology.The transmitter achieves a high data rate up to 400 Mbps.The amplitude of the pulse can be adjusted by the amplitude of the LO and the bias current of the dri...     

A 900 MHz fractional-N synthesizer for UHF transceiver in 0.18μm CMOS technology

A 900 MHz fractional-N synthesizer is designed for the UHF transceiver. The VCO with a 4 bits capacitor bank covers 823–1061 MHz that implements 16(24)sub-bands. A 7/8 dual-modulus prescaler is implemented with a phase-switching circuit and high-speed flip–flops, which are composed of source coupled logic. The proposed synthesizer phase-locked loop is demonstrated with a 50 k Hz band width by a low 12.95 MHz reference clock, and offers a better phase noise and band width tradeoff. To reduce the out-band phase noise, a 4-levels 3-order single-loop sigma–delta modulator is applied. When its relative frequency resolution is settled to 10-6, the testing results show that the phase noises are –120.6 d Bc/Hz at 1 MHz and –95.0 d Bc/Hz at 100 k Hz. The chip is2.1 mm2 in UMC 0.18μm CMOS. The power is 36 m W at a 1.8 V supply.     

A 1.2-V, 84-dB Σ△ ADM in 0.18-μm digital CMOS technology

A low power and low voltage∑△analog-to-digital modulator is realized with digital CMOS technology, which is due to full compensated depletion mode capacitors.Compared with mixed signal technology,this type of modulator is more compatible for pure digital applications.A pseudo-two-stage class-AB OTA is used in switchedcapacitor integrators for low voltage and low power.The modulator is realized in standard SMIC 0.18μm 1P6M digital CMOS technology.Measured results show that with 1.2 V supply voltage and a 6 MHz sample clock,the dynamic range of the modulator is 84 dB and the total power dissipation is 2460μW.     

5 GHz 0.18-μm CMOS 可编程分频器

提出了一种2.4GHz ZigBee 应用的可编程分频器,其分频模值在2403-2480之间变化。该分频器基于双模分频器和吞咽计数器架构,功耗和面积得到了有效降低。芯片采用0.18-μm CMOS混合信号工艺实现,当输入信号达到7.5dBm时,分频器可正常工作的频率范围覆盖1-7.4 GHz,在100KHz频偏处的输出相位噪声为-125.3dBc/Hz。分频器核心电路消耗电流4.3mA（1.8V电源电压）,核心面积0.015mm2。测试结果表明该可编程分频器能很好的应用在所需的频率综合器中.     

A 6.25 Gb/s equalizer in 0.18μm CMOS technology for high-speed SerDes

This paper presents a 0.18μm CMOS 6.25 Gb/s equalizer for high speed backplane communication. The proposed equalizer is a combined one consisting of a one-tap feed-forward equalizer （FFE） and a two-tap half-rate decision feedback equalizer （DFE） in order to cancel both pre-cursor and post-cursor ISI. By employing an active-inductive peaking circuit for the delay line, the bandwidth of the FFE is increased and the area cost is minimized. CML-based circuits such as DFFs, summers and multiplexes all help to improve the speed of DFEs. Measurement results illustrate that the equalizer operates well when equalizing 6.25 Gb/s data is passed over a 30-inch channel with a loss of 22 dB and consumes 55.8 mW with the supply voltage of 1.8 V. The overall chip area including pads is 0.3 × 0.5 mm^2.     

A high frequency “divide-by-odd number” CMOS LC injection-locked frequency divider

Numerous circuit topologies have been proposed for divide-by-ρ injection-locked frequency dividers (ILFDs), most of which have been optimized for division by even numbers, especially divide-by-2. It has been more difficult to realize division by odd numbers, such as divide-by-3. In this paper we present simulations of an RF CMOS ILFD that can operate equally well in both divide-by-2 and divide-by-3 modes. The ILFD is based on a cross-coupled CMOS LC oscillator with direct injection and an auxiliary injection path. The paper presents two variants of the circuit architecture and Cadence simulations in the multi-GHz frequency range using a standard TSMC 65 nm CMOS process design kit.     

A 220 GHz dynamic frequency divider in 0.5 μm InP DHBT technology

A high performance 3 inch 0.5 μ m InP DHBT technology with three interconnecting layers has been developed. The epitaxial layer structure and geometry parameters of the device were carefully studied to get the required performances. The 0.5×5 μm² InP DHBTs demonstrated f_t=350 GHz, f_max=532 GHz and BV_CEO=4.8 V, which were modeled using Agilent-HBT large signal model. As a benchmark circuit, a dynamic frequency divider operating from 110 to 220 GHz has been designed, fabricated and measured with this technology. The ultra-high-speed 0.5 μm InP DHBT technology offers a combination of ultra-high-speed and high breakdown voltage, which makes it an ideal candidate for next generation 100 GHz+mixed signal integrated circuits.     

High LO-RF isolation of zero-IF mixer in 0.18 μm CMOS technology

In this study, we introduce a zero-IF sub-harmonic mixer with high isolation in the 5 GHz band using 0.18 μm CMOS technology. Placing an LC-Tank between the class AB stage and the mixer core improves the isolation between the LO to RF at low supply voltage. The measured isolation is 48 dB between the LO and RF ports, and the 9.5 dB conversion gain is achieved with a supply voltage of 7 mA at 2.5 V. In order to alleviate the degradation of linearity due to the high conversion gain, we adopt the class AB stage as RF input stage. The measured IIP₃ is −7.5 dBm. This work was supported by National Science Council of Taiwan, ROC under contract no. NSC94-2220-E-005-002.     

A low power high gain UWB LNA in 0.18-μm CMOS

A low power high gain differential UWB low noise amplifier (LNA) operating at 3-5 GHz is presented.A common gate input stage is used for wideband input matching; capacitor cross coupling (CCC) and current reuse techniques are combined to achieve high gain under low power consumption. The prototypes fabricated in 0.18-μm CMOS achieve a peak power gain of 17.5 dB with a -3 dB bandwidth of 2.8-5 GHz, a measured minimum noise figure (NF) of 3.35 dB and -12.6 dBm input-referred compression point at 5 GHz, while drawing 4.4 mA from a 1.8 V supply. The peak power gain is 14 dB under a 4.5 mW power consumption (3 mA from a 1.5 V supply). The proposed differential LNA occupies an area of 1.01 mm~2 including test pads.     

Evaluation of RF electrostatic discharge (ESD) protection in 0.18-μm CMOS technology

Electrostatic discharge (ESD) protection design is challenging for RF integrated circuits (ICs) because of the trade-off between the ESD robustness and parasitic capacitance. ESD protection devices are fabricated using the 0.18-μm RF CMOS process and their RF ESD characteristics are investigated by the transmission line pulsing (TLP) tester. The results suggest that the silicon controlled rectifier (SCR) is superior to the diode and NMOS from the perspective of ESD robustness and parasitic, but the SCR nevertheless possesses a longer turn-on time.