对数正态分布下基于MLE的红外LED的寿命预测

为了获得红外LED的寿命信息,采用对数正态分布函数描述了红外LED的寿命分布,利用极大似然法(MLE)估计了对数均值和对数标准差,完成了恒定及步进应力实验数据的统计和分析,并自行开发了寿命预测软件。数值结果表明,红外LED的寿命服从对数正态分布,其加速模型符合逆幂定律。精确计算的加速参数使得快速估算红外LED寿命成为可能。     

摄像头LED阵列的电路连接模式优化研究

针对摄像头补光LED(Light Emitting Diode,LED)阵列的布阵优化及电路连接问题,研究了LED的串联阵列、并联阵列以及混联阵列的电路模型,分析了各自的构成特征及可靠性。理论分析与实验结果表明:先并后串的混联网状式LED阵列具有较高的可靠性,能延长阵列寿命,易于与驱动电源匹配,可广泛应用于摄像头补光。     

大功率LED寿命的理想因子表征

提出了用理想因子n评价大功率LED可靠性的新方法.通过对大功率LED I-V曲线的拟合计算出理想因子n的数值,对大功率LED进行电流加速老化试验,用最小二乘法算法将lnφ-t关系拟合成一条直线从而测得大功率LED的寿命,并据此讨论了大功率LED的理想因子与其寿命的关系.实验结果证明,理想因子n可以用于评价大功率LED的可靠性.     

LED阵列模式的优化研究

作为新一代照明光源LED照明技术已经有了长足的发展,但单颗LED并不能满足正常的照明需求,想达到所要的照明效果通常采用多个LED组合。LED组合有各种形式,利用tracepro对4种LED平面阵列形式,即：3×3方形阵列、3-6同心圆阵列、阿基米德螺线阵列以及1-8圆形阵列进行了详细的光学分析。在满足照明要求的条件下,通过对比找到一种最优化的设计,发现1-8圆形阵列效果最好,所占面积最小,从而可以减少材料的浪费,进一步提高LED照明的性价比,为LED照明的普及提供设计上的借鉴。     

圆形LED阵列的光斑发散特性研究

为了获得圆形发光二极管(LED)阵列的光斑发散特性,利用单个LED芯片的照度公式推导出圆形LED阵列的照度公式、光斑半径和发散角公式.采用数值计算方法对圆形LED阵列光斑的发散角随m值、随阵列半径以及随目标距离的变化规律进行了理论分析,取得了这3种情况下光斑发散角的变化数据.结果表明,光斑发散角随m值的增加而减小,随阵列半径增加而减小,随目标距离的增加而增大.这一结果对利用圆形LED阵列来实现照明设计是有帮助的.     

基于LSM的红外LED加速寿命试验数据的统计分析

利用最小二乘法(LSM)完成了红外发光二极管(LED)恒定与步进应力加速寿命试验数据的统计分析,并自行开发了可视界面和通用性强的寿命预测软件.数值结果证实了红外LED的寿命服从对数正态分布以及加速寿命方程完全符合逆幂定律,并精确地计算出预测该器件寿命所用到的关键性参数,从而使其在很短的时间(1000h)内估算寿命成为可能.     

基于大面积拼接优化的大功率LED照明阵列分布研究

为了实现在(4 m×6 m)目标面积内模拟适合座舱人机训练的光照均匀环境,提出一种面积拼接的大功率LED阵列设计方法。针对传统矩形和圆形阵列的照度分布不均匀问题,采用一种改进型的阵列分布,结合改进的粒子群算法进行优化排布。经仿真分析,改进型单模块阵列的照度均匀性为91.17%。由于安装误差的影响,实际测试光照均匀性为89%。单模块阵列拼接优化多模块LED阵列,仿真结果为照度均匀性85.83%,光能量利用率87.40%。研究结果显示,使用面积拼接方法设计的改进型多模块阵列更适合模拟大面积光照环境,具有高照度均匀性和高光能量利用率的特点,对实际应用具有重要的参考价值。     

用于TFT-LCD的大功率LED侧式背光系统

用蓝光激发黄色荧光粉发出的1W大功率白光LED作为TFT-LCD背光光源,LED左右两侧各12个以13.2mm等间距排列;采用由反射率为95%的反射镜构成的光学腔代替传统复杂的导光系统进行导光,仅仅用反射镜将LED发出的光导入液晶面板底部,减少了背光结构的复杂程度;利用光学模拟软件Tracepro对设计的侧式背光系统的LED阵列位置及反射镜位置等参数进行模拟优化,设计了可应用于26.4cm(10.4in)TFT-LCD的大功率白光LED侧式背光源系统。经过优化的背光系统,其亮度均匀性和光利用率分别达到87%和74%,背光系统的几何尺寸为292mm×164mm×20mm。     

硅衬底结构LED芯片阵列封装热可靠性分析

LED阵列封装是高密度电子封装的解决方案之一,LED的光集成度得到提高,总体输入功率提高,但同时其发热量大,封装结构如果不合理,那么在温度载荷下各层材料热膨胀系数的差异将会导致显著的热失配现象,从而将会大大缩短LED的寿命。为此,兼顾散热和封装的可靠性设计与表面贴装式将芯片直接焊接在铝基板上不同的是采用硅衬底过渡,同时在硅衬底上布置电路这一结构。这种结构的优点是可以通过硅衬底的过渡来降低热失配对封装结构的影响,同时硅衬底作为电路层则省去了器件引脚。通过对4×4的LED芯片阵列结构进行有限元模拟,分析了温度对带有硅衬底的LED芯片阵列封装可靠性影响,同时对硅衬底进行分析和总结。     

Weibull分布下基于MLE的红外发光二极管寿命预测

为了对红外发光二极管(LED)恒定及步进应力加速寿命试验的数据进行统计分析,应用Weibull分布函数描述了其寿命分布,利用极大似然法(MLE)及其迭代流程图估计出形状参数和尺度参数,通过最小二乘法确定了红外LED加速寿命方程,对红外LED寿命是否符合威布尔分布进行了Kolmogorov-Smirnov检验,并利用自行开发的寿命预测软件计算出平均寿命和中位寿命。数值结果表明,红外LED的寿命服从Weibull分布,加速寿命方程符合逆幂定律,所估计出的红外LED的寿命对生产厂商和用户有很强的指导意义。     

Optimization and integration of LED array for uniform illumination distribution

A design method for light-emitting diode （LED） array is proposed to achieve a good uniform illumination distribution on target plane. By using random walk algorithm, the basic LED array modules are optimized ftrstly. The optimized basic arrays can generate uniform illumination distribution on their target plane. The optimized basic LED array mod- ules can be integrated into a large LED array module with more than tens of LEDs. In the large array, we can select a sub-array with K LEDs （K〉7）, which can produce the good uniform illumination distribution. By this way, we design two LED arrays which consist of 21 and 25 LEDs, respectively. The 21-LED array and 25-LED array can generate uniform illumination distributions with the uniformities of 95% and 90%, respectively.     

Methodology of reliability enhancement for high power LED driver

The degradation of a linear-mode high power LED driver is studied. This driver is to provide constant current to LED regardless of its output voltage, but there is a minimum output voltage whereby the output current cannot be maintained as constant. Prolonged operation of the driver through relevant reliability test revealed that this minimum voltage will increase due to degradation of the output transistor in the driver, and when this minimum voltage exceeds the operating voltage of the driver, it no longer provides a constant current to the LEDs. Our investigation clearly reveals that the degradation mechanism is hot carrier injection as will be shown in this work, and hence it is inevitable. As high power LEDs have long life time, their drivers must also have equivalent lifetime so that the long life of LEDs can be leveraged in the entire luminary. One method to enhance its lifetime is to increase the hot carrier injection lifetime of the output transistor which may requires some fundamental change in the transistor structure and/or processing, and it is beyond the control of the driver designer and can be expensive also. A circuit approach is to use redundant circuit for enhancement which is common in the circuit world. Effective switch over to redundant circuit requires continuous health monitor of the primary circuit. In this work, the method to identify the health monitoring index, based on the degradation mechanism is shown, and the control circuit to detect and switch over to the redundant circuit is also designed and presented here.     

实现白光LED阵列色温分布均匀化技术研究

本文通过优化白光LED阵列的结构,实现在目标面上产生均匀的色温分布。通过收集系统中每颗LED的色温坐标矩阵与照度矩阵,根据色温叠加公式,计算LED阵列在目标面上叠加后的色温分布,构建目标面上色温均匀度评价函数,评价函数反应目标面上色温分布的均匀性。通过优化阵列中LED的位置,使得评价函数的值最小,即目标面上色温均匀度最高。运用这种方法我们优化设计了两个实例:(1)相同规格的9颗白光LED方形阵列;(2)不同规格16颗圆形白光LED阵列,优化后色温均匀度均达到了95%以上。利用这种方法同样可以在目标面上同时实现均匀的色温分布与照度分布,设计9颗相同规格的白光LED以3×3方形阵列方式排布,优化后色温均匀度从78%提升到88.7%,照度的均匀度从42%提升到87.6%。分析实际加工制造过程产生的误差对色温均匀度的影响,随着制造误差的增大优化后色温均匀度下降,但均优于优化前色温分布均匀性。     

Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component

The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the impact of various components, including blue die, phosphor layer, and substrate, on the lumen depreciation of CSP LEDs after aging test. The electro-optical measurement results show that the overdriving current can lead to both massive light output degradation and significant color shift of CSP LEDs. The quantitative analysis results show that the phosphor layer is the major contributor to the failure in early period aging test. For the long-term reliability, the degradations of phosphor and reflectivity of substrate contribute significantly on lumen depreciation. The proposed reliability assessment method with overdriving loadings can be usefully implemented for LED manufacturers to make a cost- and effective-decision before mass production.     

大功率LED用封装基板研究进展

LED被称为第四代照明光源及绿色光源,近几年来该产业发展迅猛.由于LED结温的高低直接影响到LED的出光效率、器件寿命和可靠性等,因此散热问题已经成为大功率LED产业发展的瓶颈.文章阐述了大功率LED基板的封装结构和散热封装技术的发展状况,从基板的结构特点、导热性能及封装应用等方面分别介绍了金属芯印刷电路基板、覆铜陶瓷...     

10W COB集成LED光源的性能分析

随着发光二极管(LED)的发光效率、寿命、可靠性等性能的逐步提高,特别是大功率LED的发展备受人们关注,已经开始作为光源应用于普通照明领域中。但是大功率LED的散热问题是阻碍其迅速发展和推广普及的难题之一。从光色电热等性能方面,详细介绍了10W COB集成LED光源的研究进展,通过封装材料的选择和封装工艺的改善,可以有效改善LED的热阻性能,实测器件热阻值Rth=4.6K/W。     

Linear Cascade Arrays of GaN-Based Green Light-Emitting Diodes for High-Speed and High-Power Performance

In the following study, we demonstrated linear cascade GaN-based light-emitting-diode (LED) arrays at a wavelength of approximately 520 nm. Experimental LEDs were analyzed with the goal to improve the output power and differential efficiency of a single LED. The study shows that using arrays with up to four LEDs connected in series, we can achieve four times the improvement in output power (differential quantum efficiency) under the same bias current as compared to a single LED apparatus. We have also measured the modulation-speed performance of experimental LEDs, and both devices exhibit similar 3-dB bandwidth (90 MHz) under the same bias currents. Experimental results indicate that the cascade connection offers the advantages of significantly enhanced external differential efficiency and provision of a method to use a constant-voltage power supply. The current crowding problem and resistance-capacitance-limited bandwidth degradation issues in a large active area LED can also be minimized using the connection demonstrated in our experiment.     

GaAs衬底厚度对发光二极管稳定性的影响

在n+-GaAs(n=1×1018cm-3)衬底上,用MOCVD方法制备了610 nm的AlGaInP发光二极管的外延片,用X射线双晶衍射和PL谱表征了ALGaInP外延片样品的性质,通过对减薄到不同厚度的LED外延片的管芯在相同条件下的退化实验,发现了亮度的退化随厚度的减小而减小的结果。由理论计算结果可以得到,衬底厚度的降低对于LED样品稳定性产生作用的主要因素是由于产生的耗散热的减小而使缺陷增殖速度减小和非辐射复合中心浓度的相应降低,同时衬底厚度的降低也有助于提高AlGaInP LED的器件的稳定性。     

大功率LED照明电路高效驱动技术研究

大功率发光二极管因其良好的性能在照明中得到广泛应用。介绍了发光二极管的电特性,并根据并联、串联的特点,对具有较好稳定性与可靠性的LED串并联组合电路加以分析。研究了用恒定输出电流驱动大功率LED组的反激式电路．并给出电路参数设计。根据驱动方法,构建了10．0V／1．10A的输出电路原型,并在额定负荷与过载负荷下进行测试,以检验电流的稳定性。试验结果表明,这个LED驱动电路精度高、性能稳定、效率高,说明所提出的方法对于驱动大功率发光二极管是切实可行的。     

基才Smoke仿真分析在器件降额设计中的应用

器件降额设计是电路可靠性设计中的一种常用方法。通过降额设计可以达到降低器件基本失效率、提高产品使用可靠性的目的。传统的降额设计存在计算量大、耗时长、是一种静态分析方法、无法估计器件瞬态应力的缺点,基于Smoke仿真分析的降额设计可以准确分析电路中各个器件的瞬态电应力和器件结温。并直接输出所有器件的应力分析和降额情况,从而大大提高了降额设计的准确性和效率。本文采用OrCAD公司PSpice软件中的Smoke高级分析模块,对飞机刹车控制电路的V/I转换模块进行了降额设计仿真,验证了该方案的可行性,从而为电路的降额设计提供了一种新的手段,说明在Smoke分析基础上进行降额设计的研究具有重要的实用意义。