Low-temperature atomic layer deposition of ZnO thin films: Control of crystallinity and orientation

Low-temperature atomic layer deposition (ALD) processes are intensely looked for to extend the usability of the technique to applications where sensitive substrates such as polymers or biological materials need to be coated by high-quality thin films. A preferred film orientation, on the other hand, is often required to enhance the desired film properties. Here we demonstrate that smooth, crystalline ZnO thin films can be deposited from diethylzinc and water by ALD even at room temperature. The depositions were carried out on Si(100) substrates in the temperature range from 23 to 140 °C. Highly c-axis-oriented films were realized at temperatures below ~ 80 °C. The film crystallinity could be further enhanced by post-deposition annealing under O₂ or N₂ atmosphere at 400-600 °C while keeping the original film orientation intact.     

Effects of the substrate temperature on the Cu seed layer formed using atomic layer deposition

Cu has replaced Al as the main interconnection material in ultra-large integrated circuits, reducing resistance capacitance delay and yielding higher electro-migration reliability. As feature size decreases, however, it has become more difficult to produce reliable Cu wiring. We studied a Cu seed layer deposited using plasma enhanced atomic layer deposition (PEALD). The electrical properties of the PEALD Cu thin film with sub-10 nm thickness were determined by the continuities and morphologies of the films. At a deposition temperature of 150 °C, the resistivity of Cu thin films was 5.2 μΩ-cm and the impurity content was below 5 atomic %. Based on these results, Cu seed layers were deposited on 32-nm Ta/SiO2 trench substrates, and electrochemical plating was performed under conventional conditions. A continuous seed layer was deposited using PEALD, resulting in a perfectly filling of the 32-nm sized trench.     

Surface poisoning in the nucleation and growth of palladium atomic layer deposition with Pd(hfac)2 and formalin

Palladium (Pd) atomic layer deposition (ALD) can be performed with Pd(hfac)₂ (hfac = hexafluoroacetyl-acetone) and formalin as the reactants. For Pd ALD on oxide surfaces, the nucleation of Pd ALD has been observed to require between 20 and 100 ALD cycles. To understand the long nucleation periods, this study explored the surface reactions occurring during Pd ALD nucleation and growth on hydroxylated Al₂O₃ substrates. In situ Fourier transform infrared (FTIR) spectroscopy on high surface area nanopowders was used to observe the surface species. The adsorption of Pd(hfac)₂ on hydroxylated Al₂O₃ substrates was found to yield both Pd(hfac)* and Al(hfac)* surface species. The identity of the Al(hfac)* species was confirmed by separate FTIR studies of hfacH adsorption on the hydroxylated Al₂O₃ substrates. Isothermal loss of the Al(hfac)* species revealed second-order kinetics at 448-523 K with an activation barrier of E_d = 39.4 kcal/mol. The lack of correlation between Al(hfac)* and AlOH* species during the loss of Al(hfac)* species suggested that the Al(hfac)* species may desorb as Al(hfac)₃. After Pd(hfac)₂ exposure and the subsequent formalin exposure on hydroxylated Al₂O₃ substrates, only hfac ligands from Pd(hfac)* species were removed from the surface. In addition, the formalin exposure added formate species. The Al(hfac)* species was identified as the cause of the long nucleation period because Al(hfac)* behaves as a site blocker. The surface poisoning by Al(hfac)* species was corroborated by adsorbing hfacH prior to the Pd(hfac)₂ exposures. The amount of Pd(hfac)* species after Pd(hfac)₂ exposures decreased progressively versus the previous hfacH exposure. Pd ALD occurred gradually during the subsequent Pd ALD cycles as the Al(hfac)* species were slowly removed from the Al₂O₃ surface. Ex situ transmission electron microscopy analysis revealed Pd nanoclusters that grew in size and dispersion with increasing number of Pd ALD cycles. These nanoclusters eventually coalesced to form a continuous Pd ALD film. Surface poisoning by the hfac ligands may help to explain the nucleation difficulties for metal ALD on oxide substrates using β-diketonate reactants.     

Characterizations of NbAlO thin films grown by atomic layer deposition

Niobium-aluminate (NbAlO) thin films have been prepared on silicon (100) with different Nb₂O₅:Al₂O₃ growth cycle ratio by atomic layer deposition (ALD) technology. The structural, chemical and optical properties of NbAlO thin films are investigated using X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and spectroscopic ellipsometry (SE). The results show that all the obtained NbAlO films are amorphous and fully oxidized. It is also found that the proportion of components in the NbAlO film can be well-controlled by varying the ALD growth cycles of the independent oxides. Furthermore, the refraction index of the prepared films is observed to increase with an increase of the concentration of Nb in the mixtures.     

Predictive modeling of atomic layer deposition on the feature scale

A feature scale simulator for atomic layer deposition (ALD) is presented that combines a Boltzmann equation transport model with chemistry models. A simple but instructive chemistry is considered; one reactant species adsorbs onto the surface, and a second reactant reacts with it from the gas phase (Eley–Rideal). This work includes potential desorption of the adsorbed species during purge steps, which may or may not play a role in any given ALD system. Three sets (cases) of rate parameters are chosen to compare chemical rates with transport rates. The duration of the ALD pulses and the geometry of the representative feature are the same for each case. Simulation results are presented for all four steps in one ALD cycle, adsorption, post-adsorption purge, reaction, and post-reaction purge. The results are extended to multiple ALD cycles, and the monolayers per cycle are estimated. We highlight the potential trade-off between pulse durations and deposition rate (wafer throughput); e.g. the time penalty required to increase the amount adsorbed during the adsorption step. The simulation methodology we present can be used to determine the pulse durations that maximize throughput for a given chemistry and chemical rate parameters. One overall observation is that transport is fast relative to chemical reactions, for reasonable kinetic parameters.     

Initial reaction mechanism of nitrogen-doped zinc oxide with atomic layer deposition

Atomistic mechanism for the nitrogen-doped ZnO Atomic Layer Deposition (ALD) on Si(100)-2 × 1 surface is investigated within the framework of density functional theory. We have examined three possible reaction pathways involving the metal precursors diethyl Zinc and ammonia hydride (NH₄OH), which serves as oxidizer and nitrogen doping source. The dissociation of NH₄OH leads to NH₃ and H₂O for latter parallel half reactions occurring simultaneously following the diethyl Zinc half reaction. Our results show overall three reactions are exothermic and energetically favorable, however, the adsorption energy in diethyl Zinc half reaction is only − 6.53 kJ/mol, which is much lower compared to NH₃ and H₂O half reactions, indicating longer zinc precursor pulsing time is indeed needed in order to attain better -ZnCH₂CH₃? group coverage. The energy barrier in NH₃ and H₂O half reactions are 142.00 and 94.16 kJ/mol respectively, combining with the calculation results that the exothermic energy of the H₂O half reaction is 39.04 kJ/mol higher than the NH₃ half reaction, we concluded that in the initial ALD zinc oxide procedure the ZnO deposition rate is much faster than the incorporation of nitrogen, which is in accordance with the function of nitrogen as p-type impurities in ZnO semiconductor.     

Monocrystalline zinc oxide films grown by atomic layer deposition

In the present work we report on the monocrystalline growth of (00.1) ZnO films on GaN template by the Atomic Layer Deposition technique. The ZnO films were obtained at temperature of 300 °C using dietylzinc (DEZn) as a zinc precursor and deionized water as an oxygen precursor. High resolution X-ray diffraction analysis proves that ZnO layers are monocrystalline with rocking curve FWHM of the 00.2 peak equals to 0.07°. Low temperature photoluminescence shows a sharp and bright excitonic line with FWHM of 13 meV.     

Influence of substrate temperature and Zn-precursors on atomic layer deposition of polycrystalline ZnO films on glass

Influence of substrate temperature and Zn-precursors on growth rate, crystal structure, and electrical property of undoped ZnO thin films grown by atomic layer deposition (ALD) have been studied. Differences between dimethylzinc (DMeZn) and diethylzinc (DEtZn) used as Zn-precursors were examined. The ZnO films grown using DMeZn showed higher electrical resistivity compared to that grown using DEtZn. However, the higher resistivity in the case of DMeZn was owing to much amount of residual impurities incorporated during the ALD growth.     

Simulation of growth dynamics in atomic layer deposition. Part I. Amorphous films

This first article in a series on simulation of growth of thin films by the ALD (= atomic layer deposition) technique deals with the theoretical background for growth and preparation of amorphous films. The growth dynamics of amorphous thin films have been simulated on the basis of growth on randomly positioned hemisphere-shaped seed objects. The objects were positioned in the simulation space according to rules which intend to create entirely random or guided random patterns. The simulations are able to reproduce the non-linear growth in the initial stages of ALD growth according to type-2 substrate-inhibited growth, and provide a mechanism for this based on purely geometrical concepts; also a self-driving mechanism toward flat surfaces is demonstrated. An initial stage of roughening of the films occurs before smoothening takes over.     

Electrical properties of quaternary HfAlTiO thin films grown by atomic layer deposition

Quaternary alloyed HfAlTiO thin (~ 4-5 nm) films in the wide range of Ti content have been grown on Si substrates by Atomic Layer Deposition technique, and the effect of both the film composition and the interfacial reactions on the electrical properties of HfAlTiO films is investigated. It is shown that depending on the Ti content, the permittivity and the leakage current density I_leak in HfAlTiO films vary in the range k = 18 ÷ 28 and 0.01-2.4 A cm^− 2, respectively. The incorporation of ultra thin SiN interlayer in Al/HfAlTiO/SiN/Si stack gives rise to the sharp (× 10³) decrease of the I_leak ~ 6 · 10^− 5 A/cm² at the expense of the rather low capacitance equivalent thickness ~ 0.9 nm.     

Applications of atomic layer deposition to nanofabrication and emerging nanodevices

Recently, with scaling down of semiconductor devices, need for nanotechnology has increased enormously. For nanoscale devices especially, each of the layers should be as thin and as perfect as possible. Thus, the application of atomic layer deposition (ALD) to nanofabrication strategies and emerging nanodevices has sparked a good deal of interest due to its inherent benefits compared to other thin film deposition techniques. Since the ALD process is intrinsically atomic in nature and results in the controlled deposition of films at the atomic scale, ALD produces layers with nanometer scale thickness control and excellent conformality. In this report, we review current research trends in ALD processes, focusing on the application of ALD to emerging nanodevices utilizing fabrication through nanotechnology.     

Surface chemistry and film growth during TiN atomic layer deposition using TDMAT and NH3

Surface chemistry and film growth were examined during titanium nitride (TiN) atomic layer deposition (ALD) using sequential exposures of tetrakis-dimethylamino titanium (TDMAT) and NH₃. This ALD system is shown to be far from ideal and illustrates many potential problems that may affect ALD processing. These studies were performed using in situ Fourier transform infrared (FTIR) techniques and quartz crystal microbalance (QCM) measurements. Ex situ measurements also analyzed the properties of the TiN ALD films. The FTIR studies revealed that TDMAT reacts with NH_x* species on the TiN surface following NH₃ exposures to deposit new Ti(N(CH₃)₂)_x* species. Subsequent NH₃ exposure consumes the dimethylamino species and regenerates the NH_x* species. These observations are consistent with transamination exchange reactions during the TDMAT and NH₃ exposures. QCM studies determined that the TDMAT and NH₃ reactions are nearly self-limiting. However, slow continual growth occurs with long TDMAT exposures. In addition, the TiN ALD growth rate increases progressively with growth temperature. The resistivities of the TiN ALD films were ?10⁴ μΩ cm and the densities were ?3 g/cm³ corresponding to a porosity of ∼40%. The high porosity allows facile oxidation of the TiN films and lowers the film resistivities. These high film porosities will seriously impair the use of these TiN ALD films as diffusion barriers.     

Goniocolorimetric study of aluminum oxide films deposited by atomic layer deposition

The interference colors resulting from thin films of Al₂O₃ deposited by atomic layer deposition (ALD) on silicon have been rigorously analyzed using a recently developed robotic gonioreflectometer. A series of eleven increasingly thick films was deposited, up to 1613 Å, and their reflectance values obtained for the visible spectrum. A comparison of these values with the predictions of computer simulations employing Fresnel equations has revealed that while there was generally good agreement between predicted and measured spectra, there are some spectral regions that exhibit large deviations from predicted reflectances, typically at near-normal measurement angles and shorter wavelengths. The effect of these discrepancies on color appearance was investigated in the CIE L*a*b* color space for the daylight illuminant D65. Large iridescence is both predicted and measured for most film thicknesses. Chroma and hue differences as large as 20 CIELAB units between the predicted and the measured color centers were obtained. Simulation also predicts larger iridescence than what is actually measured. A likely cause for the observed discrepancies is that the dielectric constants of the ALD films deviate from the literature values for the bulk material.     

Growth of aluminum nitride thin films prepared by plasma-enhanced atomic layer deposition

Aluminum nitride (AlN) thin films were deposited by atomic layer deposition from aluminum chloride (AlCl₃) and an ammonia/hydrogen plasma. The most important role of the ammonia/hydrogen plasma was to act as a reducing agent to extract Cl from AlCl₃, and to form AlN subsequently. The growth rate was saturated at ∼0.042 nm/cycle, and the thickness was proportional to the number of reaction cycles. Repeating this reaction cycle led to precisely controlled growth. The film properties were analyzed using Auger electron spectroscopy, X-ray photoelectron spectroscopy, Rutherford backscattering spectroscopy and time-of-flight elastic recoil detection analysis. The concentration of chlorine and hydrogen impurities was 0.23 and 2.01 at.%, respectively. AlN films showed good anti-oxidation properties when O₂ was annealed at 650 °C for 30 min.     

Influence of Si(1 0 0) surface pretreatment on the morphology of TiO2 films grown by atomic layer deposition

The effect of water plasma treatment of both hydrophobic and hydrophilic Si(1 0 0) surfaces has been studied using infrared spectroscopy to monitor the various surface species present. Exposure to a water plasma results in a significant increase in the concentration of H-bonded hydroxyls and hydrides. Both atomic force microscopy (AFM) and cross-sectional transmission electron microscopy (XTEM) of TiO₂ films deposited by atomic layer deposition at 300 °C, show that the morphology of the films is dependent on the nature of the initial surface. XTEM of the early stages of growth showed that coatings on hydrophilic substrates deposited as initially amorphous and continuous films, which crystallised with further growth. However, the hydrophobic substrate produced island growth of small, crystalline grains. AFM images of 23-nm thick films showed that films deposited on hydrophobic and hydrophilic Si consisted of 35–100 and 150–350 nm crystallites, respectively. A film on water plasma treated Si, closely resembled that on the hydrophilic surface, indicating that hydroxyl groups are responsible for directing the film growth.     

ZnO thin films prepared by atomic layer deposition and rf sputtering as an active layer for thin film transistor

Recently, the application of ZnO thin films as an active channel layer of transparent thin film transistor (TFT) has become of great interest. In this study, we deposited ZnO thin films by atomic layer deposition (ALD) from diethyl Zn (DEZ) as a metal precursor and water as a reactant at growth temperatures between 100 and 250 °C. At typical growth conditions, pure ZnO thin films were obtained without any detectable carbon contamination. For comparison of key film properties including microstructure and chemical and electrical properties, ZnO films were also prepared by rf sputtering at room temperature. The microstructure analyses by X-ray diffraction have shown that both of the ALD and sputtered ZnO thin films have (002) preferred orientation. At low growth temperature T_s ≤ 125 °C, ALD ZnO films have high resistivity (> 10 Ω cm) with small mobility (< 3 cm²/V s), while the ones prepared at higher temperature have lower resistivity (< 0.02 Ω cm) with higher mobility (> 15 cm²/V s). Meanwhile, sputtered ZnO films have much higher resistivity than ALD ZnO at most of the growth conditions studied. Based upon the experimental results, the electrical properties of ZnO thin films depending on the growth conditions for application as an active channel layer of TFT were discussed focusing on the comparisons between ALD and sputtering.     

X-ray mirrors on flexible polymer substrates fabricated by atomic layer deposition

Atomic layer deposition (ALD) techniques were used to fabricate W/Al₂O₃ superlattices with high X-ray reflectivity on flexible Kapton® polyimide and polyethylene naphthalate (PEN) polymer substrates. Reflectivities of 78% and 74% at λ = 1.54 Å were measured for 6-bilayer W/Al₂O₃ superlattices on Kapton® polyimide and PEN, respectively. These excellent X-ray reflectivities are attributed to precise bilayer thicknesses and ultrasmooth interfaces obtained by ALD and smoothing of the initial polymer surface by an Al₂O₃ ALD layer. The conformal ALD film growth also produces correlated roughness that enhances the reflectivity. These W/Al₂O₃ superlattices on flexible polymers should be useful for ultralight and adjustable radius of curvature X-ray mirrors.     

The uniformity of Al distribution in aluminum-doped zinc oxide films grown by atomic layer deposition

We investigated the aluminum distribution in aluminum-doped zinc oxide films grown by atomic layer deposition. Surface morphology, structure, composition and electrical properties of obtained films were studied. For the aluminum content less than 2 at.%, a periodicity of Al distribution along the layer depth was observed. This periodicity diminished significantly after annealing the samples in nitrogen atmosphere at 300 °C. For the Al content higher than 2 at.%, its distribution in ZnO:Al films was uniform within the depth measurement accuracy of ∼5-10 nm.     

Characterization of titanium dioxide atomic layer growth from titanium ethoxide and water

Atomic layer growth of titanium dioxide from titanium ethoxide and water was studied. Real-time quartz crystal microbalance measurements revealed that adsorption of titanium ethoxide is a self-limited process at substrate temperatures 100–250°C. A relatively small amount of precursor ligands was released during titanium ethoxide adsorption while most of them was exchanged during the following water pulse. At temperatures 100–150°C, incomplete reaction between surface intermediates and water hindered the film growth. Nevertheless, the deposition rate reached 0.06 nm per cycle at optimized precursor doses. At substrate temperatures above 250°C, the thermal decomposition of titanium ethoxide markedly influenced the growth process. The growth rate increased with the reactor temperature and titanium ethoxide pulse time but it insignificantly depended on the titanium ethoxide pressure. Therefore reproducible deposition of thin films with uniform thickness was still possible at substrate temperatures up to 350°C. The films grown at 100–150°C were amorphous while those grown at 180°C and higher substrate temperature, contained polycrystalline anatase. The refractive index of polycrystalline films reached 2.5 at the wavelength 580 nm.     

Temperature dependence of SiO2 film growth with plasma-enhanced atomic layer deposition

The growth per cycle (GPC) temperature dependence was investigated for SiO₂ films prepared by plasma-enhanced atomic layer deposition (PEALD). During preparation of PEALD-SiO₂ using bis-diethyl-amino-silane, the GPC was saturated via increasing the precursor dose time and flow rate. The saturated GPC decreased with increasing deposition temperature. GPC saturation curves as a function of precursor dose time were analyzed by a two-step adsorption model, where the amino-silane reversibly adsorbed (physisorption) during the first step, and then irreversibly adsorbed (chemisorption) on the SiO₂ surface upon reaction with surface OH absorbents. This model is in good quantitative agreement with the saturation curve. The GPC value was determined by the surface reaction of amino-silane with OH sites, whose surface density was decreased by increasing the deposition temperature. The GPC saturation became slower with increasing deposition temperature, because the desorption rate of the physisorbed precursor increased with increasing temperature.