5W ISM波段InGaP/GaAs HBT功率放大器MMIC

通过分析InGaP/GsAsHBT器件的热学和电学特点,结合HBT大功率放大器芯片在技术性能、稳定性、可靠性及尺寸等方面的要求,通过优化设计HBT功率器件单元和匹配电路,开发了一个大功率、高效率、小尺寸的ISM波段功率放大器单片集成电路。该三级放大器的各级器件单元的发射极面积分别为320μm2,1280μm2,5760μm2,芯片内部包括了输入、输出50Ω匹配电路,面积仅为1.9mm×2.1mm。放大器采用5V单电源供电,在2.4～2.5GHz频率范围内线性增益为27dB,2dB增益压缩点输出饱和功率达到37dBm,功率附加效率为46%。     

一种适用于功率放大器的InGaP/GaAs HBT预失真电路

提出了一种具有串、并联负反馈网络的有源预失真电路,对其工作原理进行了分析.基于AWR MicrowaveOffice软件的仿真结果表明:该预失真电路能够产生增益扩展与负相位偏差,可将其用于补偿功率放大器后级电路产生的增益压缩和正相位偏差,提高功放的线性度.将该预失真电路作为输入级设计了一款功率放大器,并基于截止频率为29.5GHz的2 μm InGaP/GaAs HBT工艺成功流片,测试结果表明:在3.5 V偏置电压下、1.5～1.8 GHz频段范围内,功放的功率增益可达27dB,P1dB为28 dBm,最大功率附加效率为36%.     

应用于WLAN InGaP/GaAs HBT线性功率放大器

设计了一款基于2μm InGaP/GaAs HBT工艺的移动通信用高线性功率放大器,应用于移动终端WLAN 802.11b/g/n 2.4~2.5GHz。整个放大器芯片由三级放大电路构成,芯片面积为1.9mm×1.7mm。在VCC=Vbias=+5V、VReg=VPdown=+2.85V双电源供电条件下,测试频点为2.45GHz时,线性增益为35dB,1dB压缩点处输出功率为34.5dBm,此时效率为37.5%。输出功率为27dBm时,EVM(误差矢量幅度)值小于3%(输入信号为WLAN 802.11g 64QAM 54 Mb/s),可以满足WLAN应用对线性度的需求。     

InGaP/GaAs HBT微波功率放大器的设计

采用模拟退火算法提取出异质结双极晶体管器件的大信号Gum mel- Poon模型参数,利用所提取出的模型参数设计出具有很低静态功耗的190 0 MHz两级AB类功率放大器.该功放的功率增益为2 6 d B,1d B压缩点输出功率为2 8d Bm,对应的功率附加效率和邻近信道功率比分别为38.8%、- 30 .5 d Bc,1d B压缩点处的各阶谐波功率均小于- 4 0 d Bc.     

InGaP/GaAs HBT微波功率放大器的设计

采用模拟退火算法提取出异质结双极晶体管器件的大信号Gummel-Poon模型参数,利用所提取出的模型参数设计出具有很低静态功耗的1900MHz两级AB类功率放大器.该功放的功率增益为26dB,1dB压缩点输出功率为28dBm,对应的功率附加效率和邻近信道功率比分别为38.8%、-30.5dBc,1dB压缩点处的各阶谐波功率均小于-40dBc.     

InGaP/GaAs HBT X波段混合集成功率合成放大器的研制

研制了面向X波段应用的InGaP/GaAs HBT混合集成功率合成放大器模块. 电路采用一种新颖的具有片上RC稳定网络的InGaP/GaAs HBT功率管作为功率合成单元以提高电路的稳定性,并采用紧凑的微带线并联匹配网络进行功率分配和合成. 在8.1GHz,偏置为Vcc=7V, Ic=230mA的AB类工作条件下,连续波最大输出功率为28.9dBm,功率合成效率达到80%.     

Design of Broad-Band Power GaAs FET Amplifiers

A model is presented for the drain-gate breakdown phenomenon of GaAs FET's, based on experimental results. this breakdown model is added to a previously published large-signal model and incorporated in a powerful computer-aided design program called LSFET. The program is capable of searching for the optimum power load for an FET and simulating the power performance of multistage amplifiers. The design of power amplifiers is discussed in detail, using the knowledge gained from LSFET. Data is presented from a fabricated monolithic broad-band power amplifier chip showing good agreement between measured results and simulated curves.     

应用于IEEE 802.11 ac的高线性InGaP/GaAs HBT功率放大器

针对应用于无线局域网IEEE 802.11ac标准的终端,通过采用自适应线性化偏置和宽带匹配技术,设计一种高线性度的InGaP/GaAs HBT功率放大器。芯片测试结果表明,在4.9~5.9GHz的工作频段内,该功率放大器小信号增益超过26.2dB,1dB压缩点输出功率超过29.1dBm,实现了在64正交振幅调制-正交频分复用输入信号下,误差矢量幅度在3%时超过19dBm的线性输出功率。     

Design of Broad-Band GaAs FET Power Amplifiers

A direct systematic approach to designing broad-band GaAS FET power amplifiers for optimum large-signal gain performance is described. Assets of this approach include its accuracy in predicting large-signal amplifier performance and its basic simplicity. The implementation of the technique is facilitated by having to measure large-signal device bebavior at only one single frequency. The practicability of the method is demonstrated through comparisons between measured and predicted results.     

InGaP/GaAs HBT X波段混合集成功率合成放大器的研制

研制了面向X波段应用的InGaP/GaAs HBT混合集成功率合成放大器模块.电路采用一种新颖的具有片上RC稳定网络的InGaP/GaAs HBT功率管作为功率合成单元以提高电路的稳定性,并采用紧凑的微带线并联匹配网络进行功率分配和合成.在8.1GHz,偏置为Vcc=7V,Ic=230mA的AB类工作条件下,连续波最大输出功率为28.9dBm,功率合成效率达到80%.     

用于W-LAN的5.8GHz InGaP/GaAs HBT MMIC线性功率放大器

介绍了一种应用于W-LAN系统的5.8 GHz InGaP/GaAs HBT MMIC功率放大器。该功率放大器采用了自适应线性化偏置电路来改善线性度和效率,同时偏置电路中的温度补偿电路可以抑制直流工作点随温度的变化,采用RC稳定网络使放大器在较宽频带内具有绝对稳定性。在单独供电3.6 V电压情况下,功率放大器的增益为26 dB,1 dB压缩点处输出功率为26.4 dBm,功率附加效率(PAE)为25%。三阶交调系数(IMD3)在输出功率为26.4 dBm时为-19 dBc,输出功率为20 dBm时低于-38 dBc,在1 dB压缩点处偏移频率为20 MHz时邻道功率比(ACPR)值为-31 dBc。     

Analysis and Design of a Dynamic Predistorter for WCDMA Handset Power Amplifiers

This paper presents a dynamic predistorter (PD), which linearizes the dynamic AM-AM and AM-PM of a wideband code division multiple access handset power amplifier (PA). The dynamic PD allows an adjacent channel leakage power ratio (ACPR) improvement of 15.7 dB, which is superior to conventional PDs that linearize static AM-AM and AM-PM. The dynamic PD was designed using an HBT generating nonlinearity, a short circuit at the baseband (les4 MHz), and a load circuit for the HBT at the RF fundamental band (ap1.95 GHz). Volterra-series analysis was performed to understand the mechanism of the dynamic PD. The analysis revealed that the short circuit at the baseband enabled the dynamic PD generating third-order intermodulation distortion (IMD3) with opposite phase to the fundamental tone (i.e., antiphase IMD3). The antiphase IMD3 allows dynamic gain compression, which linearizes the dynamic gain expansion of a PA with low quiescent current. The analysis also revealed that the IMD3 amplitude of the dynamic PD can be adjusted by load impedance at the RF fundamental band, which enables the gradient of dynamic AM-AM and AM-PM to be optimized to linearize the PA. The fabricated two-stage InGaP/GaAs HBT PA module with the dynamic PD exhibited an ACPR of -40 dBc and a power-added efficiency of 50% at an average output power of 26.8 dBm with a quiescent current of 20 mA     

宽带GaAs FET功率放大器的计算机辅助设计

本文叙述了采用静态法模拟GaAs FET大信号模型和以该大信号模型设计宽带GaAsFRT功率放大器的方法.在分析电路时,提出了一种对非线性电路进行交流大信号稳态分析的有效方法:时一频转换循环迭代法.编写了一个优化设GaAs FET功率放大器的计算机程序GFPA.采用该程序设计制作了一个单级宽带GaAs FET功率放大器.在未作任何调整的情况下,该放大器的实测性能与其理论计算符合较好.     

改善增益平坦度的新型InGaP/GaAs HBT功率放大器单片设计

介绍了一款应用于3GHz通信的基于改进增益平坦度的功率放大器设计,其由商用InGaP/GaAs异质结双极性晶体管(HBT)工艺制作.为了以简单方式改善增益平坦度,除了耦合旁路电容以及射频扼流圈外,在实际电路中没有加入额外部件.其测量线性增益为23dB,大信号增益平坦度为±0.25dB,非常贴近仿真和日标值.此两级功放400MHz带宽下的输出线性功率为31dBm,增益附加效率为44%.本电路通过良好的失真补偿电路和扼流圈模型的使用,成功地改善了增益平坦度.     

改善增益平坦度的新型InGaP/GaAs HBT功率放大器单片设计

介绍了一款应用于3GHz通信的基于改进增益平坦度的功率放大器设计,其由商用InGaP/GaAs异质结双极性晶体管(HBT)工艺制作.为了以简单方式改善增益平坦度,除了耦合旁路电容以及射频扼流圈外,在实际电路中没有加入额外部件.其测量线性增益为23dB,大信号增益平坦度为±0.25dB,非常贴近仿真和日标值.此两级功放400MHz带宽下的输出线性功率为31dBm,增益附加效率为44%.本电路通过良好的失真补偿电路和扼流圈模型的使用,成功地改善了增益平坦度.     

InGaP/GaAs superlattice-emitter resonant tunneling bipolartransistor (SE-RTBT)

In this letter, a new InGaP/GaAs superlattice-emitter resonant tunneling bipolar transistor (SE-RTBT) is fabricated and demonstrated. A 5-period InGaP/GaAs superlattice is used to serve the RT route and the confinement barrier for minority carriers. Due to the large valence band discontinuity (ΔE_v) at the InGaP/GaAs heterointerface, a high current gain (β_max≃220) is obtained. Furthermore, the interesting N-shaped negative-differential-resistance (NDR) phenomena resulting from RT effect are found both in the saturation and forward-active region of current-voltage (I-V) characteristics at room temperature     

InGaP/GaAs HBT功率放大器的键合线匹配技术

射频集成电路的性能很大程度受到封装的影响,与集成电路设计和制造工艺相比,封装技术并没有受到相应的关注.用一种新的键合线匹配功率放大器(PAM)的方法,利用封装寄生参数进行电路匹配设计,消除了封装的负面影响,并进行了试制验证;电路芯片采用InGaWGaAs HBT工艺制作并使用了16引脚微小引线框架(MLP)封装.无需芯片外表面贴装电容和电感,实现了功率放大器的低损耗输出阻抗匹配,节省了宝贵的线路板空间.电路测试指标很好地达到了设计要求,证明了该技术的可行性,为高性能、低成本射频功率放大器的开发提供了新的思路.     

Power Generation and Efficiency in GaAs Traveling-Wave Amplifiers (Short Papers)

The effect of the dielectric loading in a bidimensional analysis that follows. GaAs traveling-wave amplifier (TWA) is investigated, with respect to the EM power generated by the structure and the efficiency of the dc to RF conversion. The validity of some usual approximations and assumptions is studied and a parameter, i.e., the power gain X efficiency product, is proposed as a useful tool for comparing the possible performances of TWA's.     

新结构InGaP/GaAs/InGaP DHBT生长及特性研究

设计并生长了一种新的InGaP/GaAs/InGaP DHBT结构材料,采用在基区和集电区之间插入n+-InGaP插入层结构,以解决InGaP/GaAs/InGaP DHBT集电结导带尖峰的电子阻挡效应问题。采用气态源分子束外延(GSMBE)技术,通过优化生长条件,获得了高质量外延材料,成功地生长出带有n+-InGaP插入层结构的GaAs基InGaP/GaAs/InGaP DHBT结构材料。采用常规的湿法腐蚀工艺,研制出发射极面积为100μm×100μm的新型结构InGaP/GaAs/InGaP DHBT器件。直流特性测试的结果表明,所设计的集电结带有n+-InGaP插入层的InGaP/GaAs/InGaP DHBT器件开启电压约为0.15V,反向击穿电压达到16V,与传统的单异质结InGaP/GaAs HBT相比,反向击穿电压提高了一倍,能够满足低损耗、较高功率器件与电路制作的要求。     

A new InGaP/GaAs tunneling heterostructure-emitter bipolar transistor (T-HEBT)

Excellent characteristics of an InGaP/GaAs tunneling heterostructure-emitter bipolar transistor (T-HEBT) are first demonstrated. The insertion of a thin n-GaAs emitter layer between tynneling confinement and base layers effectivelty eliminates the potential spike at base-emitter junction and reduces the collector-emitter offset voltage, while the thin InGaP tunneling confinement layer is employed to reduce the transporting time across emitter region for electrons and maintain the good confinement effect for holes. Experimentally, the studied T-HEBN exhibits a maximum current gain of 285, a relatively low offset voltage of 40 mW, and a current-gain cutoff frequency of 26.4 GHz.