Writing,Self‐Healing,and Self‐Erasing on Conductive Pressure‐Sensitive Adhesives

A simple strategy for enabling conductive pressure sensitive adhesives (PSAs) to work as light‐responsive materials is reported. Direct laser‐writing of PSA substrates was achieved by means of a continuous‐wave He‐Ne laser focused through the objectives of an optical microscope. This approach takes advantage of cooperative interplay between viscoelastic properties of PSAs and enhanced thermal conductivity provided by an extra overlayer of gold. In particular, the thickness of the gold layer is a crucial parameter for tuning the substrate responsiveness. Self‐healing and self‐degradation processes can be exploited for controlling the lifetime of the written information, whereas additional protective coatings can be introduced to achieve permanent storage.     

Self‐Healing Hydrogels

Over the past few years, there has been a great deal of interest in the development of hydrogel materials with tunable structural, mechanical, and rheological properties, which exhibit rapid and autonomous self‐healing and self‐recovery for utilization in a broad range of applications, from soft robotics to tissue engineering. However, self‐healing hydrogels generally either possess mechanically robust or rapid self‐healing properties but not both. Hence, the development of a mechanically robust hydrogel material with autonomous self‐healing on the time scale of seconds is yet to be fully realized. Here, the current advances in the development of autonomous self‐healing hydrogels are reviewed. Specifically, methods to test self‐healing efficiencies and recoveries, mechanisms of autonomous self‐healing, and mechanically robust hydrogels are presented. The trends indicate that hydrogels that self‐heal better also achieve self‐healing faster, as compared to gels that only partially self‐heal. Recommendations to guide future development of self‐healing hydrogels are offered and the potential relevance of self‐healing hydrogels to the exciting research areas of 3D/4D printing, soft robotics, and assisted health technologies is highlighted.     

石墨烯/纳米银导电油墨导电性能研究

目的制备出具有优异导电性能的石墨烯/纳米银复合材料,并作为导电填料,以提高导电油墨的导电性能。方法采用Hummers法制备氧化石墨烯,以葡萄糖作为还原剂,采用同步还原法制备石墨烯/纳米银,将石墨烯/纳米银复合物和纳米银按不同比例混合作为导电填料来制备导电油墨。通过透射电镜(TEM)、X射线衍射(XRD)、傅里叶变换红外(FTIR)光谱等分析测试方法表征了石墨烯/纳米银复合材料的微观结构和形貌,并通过四探针法对油墨的导电性进行检测。结果纳米银颗粒均匀地负载在石墨烯片层上,纳米银粒径约为35 nm;掺杂石墨烯/纳米银复合物质量分数为12%时,导电油墨的电阻率可达到1.08×10~(-7)?·m,导电性能提高约64%。结论制备的复合材料石墨烯呈片状,结构完好,添加到导电油墨中能明显提高导电性能。     

Self‐healing materials: what can nature teach us?

Natural materials such as bone and insect cuticle are capable of self‐repair, a facility that greatly increases their durability and safe working stress. Some engineering materials have also been designed to be self‐healing, although currently they cannot match the performance of natural materials as regards the efficiency and longevity of the healing process. In this paper, we review the state of the art regarding these two types of materials. We discuss the role of fracture mechanics in the development of theoretical models of self‐healing; we identify certain crucial parameters that make natural materials successful and discuss how these lessons can be applied to improve the performance of self‐healing materials for engineering applications.     

纳米银颗粒-银离子复合型导电墨水导电性研究

目的 为了减少纳米银颗粒墨水所制备图案的孔隙率,提高图案的导电性。方法 将多尺寸纳米银颗粒与银离子溶液混合制备得到纳米银颗粒-银离子复合型墨水,通过扫描电子显微镜（SEM）观察所制备图案的表面形貌,采用X-射线衍射仪（XRD）确定图案表面晶型,并对图案进行电阻率测试。结果 实验结果表明,纳米银颗粒-银离子的配比对该复合型导电墨水的导电性有重要影响。AgNPs与Ag⁺的体积比为2∶1的混合型墨水在干燥之后具有最佳导电性,电阻率为1.33×10^-3Ω·cm,该墨水中银的质量分数约为4.37%。经过热压之后,AgNPs与Ag⁺的体积比为5∶1的墨水所制备的图案导电性最好,电阻率为1.32×10^-4Ω·cm,该墨水中银的质量分数约为3.19%。结论 所制备的纳米银颗粒-银离子复合型墨水干燥后即可导电,经过热压处理之后导电性可进一步提高。该复合型墨水中银含量低,可大大降低其用于柔性器件的成本。     

Tough and Water‐Insensitive Self‐Healing Elastomer for Robust Electronic Skin

An electronic (e‐) skin is expected to experience significant wear and tear over time. Therefore, self‐healing stretchable materials that are simultaneously soft and with high fracture energy, that is high tolerance of damage or small cracks without propagating, are essential requirements for the realization of robust e‐skin. However, previously reported elastomers and especially self‐healing polymers are mostly viscoelastic and lack high mechanical toughness. Here, a new class of polymeric material crosslinked through rationally designed multistrength hydrogen bonding interactions is reported. The resultant supramolecular network in polymer film realizes exceptional mechanical properties such as notch‐insensitive high stretchability (1200%), high toughness of 12 000 J m^?2, and autonomous self‐healing even in artificial sweat. The tough self‐healing materials enable the wafer‐scale fabrication of robust and stretchable self‐healing e‐skin devices, which will provide new directions for future soft robotics and skin prosthetics.     

Self‐Healing Inside APbBr3 Halide Perovskite Crystals

Self‐healing, where a modification in some parameter is reversed with time without any external intervention, is one of the particularly interesting properties of halide perovskites. While there are a number of studies showing such self‐healing in perovskites, they all are carried out on thin films, where the interface between the perovskite and another phase (including the ambient) is often a dominating and interfering factor in the process. Here, self‐healing in perovskite (methylammonium, formamidinium, and cesium lead bromide (MAPbBr₃, FAPbBr₃, and CsPbBr₃)) single crystals is reported, using two‐photon microscopy to create damage (photobleaching) ≈110 µm inside the crystals and to monitor the recovery of photoluminescence after the damage. Self‐healing occurs in all three perovskites with FAPbBr₃ the fastest (≈1 h) and CsPbBr₃ the slowest (tens of hours) to recover. This behavior, different from surface‐dominated stability trends, is typical of the bulk and is strongly dependent on the localization of degradation products not far from the site of the damage. The mechanism of self‐healing is discussed with the possible participation of polybromide species. It provides a closed chemical cycle and does not necessarily involve defect or ion migration phenomena that are often proposed to explain reversible phenomena in halide perovskites.