An area-efficient 55 nm 10-bit 1-MS/s SAR ADC for battery voltage measurement

An area-efficient CMOS 1-MS/s 10-bit charge-redistribution SAR ADC for battery voltage measurement in a SoC chip is proposed. A new DAC architecture presents the benefits of a low power approach without applying the common mode voltage. The threshold inverter quantizer(TIQ)-based CMOS Inverter is used as a comparator in the ADC to avoid static power consumption which is attractive in battery-supply application. Sixteen level-up shifters aim at converting the ultra low core voltage control signals to the higher voltage level analog circuit in a 55 nm CMOS process. The whole ADC power consumption is 2.5 mW with a maximum input capacitance of 12 pF in the sampling mode. The active area of the proposed ADC is 0.0462 mm2 and it achieves the SFDR and ENOB of 65.6917 dB and 9.8726 bits respectively with an input frequency of 200 kHz at 1 MS/s sampling rate.     

A 14-bit wide temperature range differential SAR ADC with an on-chip multi-segment BGR

A 14-bit low power self-timed differential successive approximation(SAR) ADC with an on-chip multisegment bandgap reference(BGR) is described.An on-chip multi-segment BGR,which has a temperature coefficient of 1.3 ppm/℃and a thermal drift of about 100μV over the temperature range of -40 to 120℃is implemented to provide a high precision reference voltage for the SAR ADC.The Gray code form is utilized instead of binary form mode control to reduce substrate noise and enhance the linearity of the whole system.Self-timed bit-cycling is adopted to enhance the time efficiency.The 14-bit ADC was fabricated in a TSMC 0.13μm CMOS process. With the on-chip BGR,the SAR ADC achieves an SNDR of 81.2 dB(13.2 ENOB) and an SFDR of 85.2 dB with a conversion rate of 2 MS/s at room temperature and can keep an ENOB of more than 12 bits at a conversion rate of 2 MS/s over the temperature range from -40 to 120℃.     

一种带12位3.2 MS/s 逐次逼近型模数转换器的电源线通信模拟前端电路

This paper presents an analog front end for a power line communication system,including a 12-bit3.2-MS/s energy-efficient successive approximation register analog-to-digital converter,a positive feedback programmable gain amplifier,a 9.8 ppm/°C bandgap reference and on-chip low-output voltage regulators.A two segment capacitive array structure(6 MSB 5 LSB) composed by split capacitors is designed for the SAR core to save area cost and release reference voltage accuracy requirements.Implemented in the GSMC 0.13 m 1.5 V/12 V dual-gate 4P6 M e-flash process,the analog front end occupies an area of 0.457 mm2 and consumes power of18.8 m W,in which 1.1 m W cost by the SAR ADC.Measured at 500 k Hz input,the spurious-free dynamic range and signal-to-noise plus distortion ratio of the ADC are 71.57 d B and 60.60 d B respectively,achieving a figure of merit of 350 f J/conversion-step.     

一种有效位为11.3比特的14位100兆CMOS流水线型模数转换器

This paper demonstrates a 14-bit 100-MS/s pipelined analog-to-digital converter(ADC) in 0.18μm CMOS process with a 1.8 V supply voltage.A fast foreground digital calibration mechanism is employed to correct capacitor mismatches.The ADC implements an SHA-less 3-bit front-end to reduce the size of the sampled capacitor. The presented ADC achieves a 70.02 dB signal-to-noise distortion ratio(SNDR) and an 87.5 dB spurious-free dynamic range(SFDR) with a 30.7 MHz input signal,while maintaining over 66 dB SNDR and 76 dB SFDR up to 200 MHz input.The power consumption is 543 mW and a total die area of 3 x 4 mm2 is occupied.     

An ll-bit 22-MS/s 0.6 mW SAR ADC with parasitic capacitance compensation

Abstract： This paper presents an l 1-bit 22-MS/s 0.6-mW successive approximation register （SAR） analog-to- digital converter （ADC） using SMIC 65-nm low leakage （LL） CMOS technology with a 1.2 V supply voltage. To reduce the total capacitance and core area the split capacitor architecture is adopted. But in high resolution ADCs the parasitic capacitance in the LSB-side would decrease the linearity of the ADC and it is hard to calibrate. This paper proposes a parasitic capacitance compensation technique to cancel the effect with no calibration circuits. Moreover, dynamic circuits are used to minimize the switching power of the digital logic and also can reduce the latency time. The prototype chip realized an 11-bit SAR ADC fabricated in SMIC 65-nm CMOS technology with a core area of 300 × 200 μm2. It shows a sampling rate of 22 MS/s and low power dissipation of 0.6 mW at a 1.2 V supply voltage. At low input frequency the signal-to-noise-and-distortion ratio （SNDR） is 59.3 dB and the spurious-free dynamic range is 72.2 dB. The peak figure-of-merit is 36.4 fJ/conversion-step.     

一种用于射频识别的超低功耗温度传感器

An ultra-low-power CMOS temperature sensor with analog-to-digital readout circuitry for RFID applications was implemented in a 0.18-μm CMOS process. To achieve ultra-low power consumption, an error model is proposed and the corresponding novel temperature sensor front-end with a new double-measure method is presented. Analog-to-digital conversion is accomplished by a sigma-delta converter. The complete system consumes only 26 μA @ 1.8 V for continuous operation and achieves an accuracy of ±0.65 °C from –20 to 120 °C after calibration at one temperature.     

An 8 bit 1 MS/s SAR ADC with 7.72-ENOB

This paper presents a low power 8-bit 1 MS/s SAR ADC with 7.72-bit ENOB. Without an op-amp, an improved segmented capacitor DAC is proposed to reduce the capacitance and the chip area. A dynamic latch comparator with output offset voltage storage technology is used to improve the precision. Adding an extra positive feedback in the latch is to increase the speed. What is more, two pairs of CMOS switches are utilized to eliminate the kickback noise introduced by the latch. The proposed SAR ADC was fabricated in SMIC 0.18 μm CMOS technology. The measured results show that this design achieves an SFDR of 61.8 dB and an ENOB of 7.72 bits, and it consumes 67.5 μ W with the FOM of 312 fJ/conversion-step at 1 MS/s sample under 1.8 V power supply.     

A 1 V 186-μW 50-MS/s 10-bit subrange SAR ADC in 130-nm CMOS process

This paper presents a 10-bit 50-MS/s subrange successive-approximation register (SAR) analog-to-digital converter (ADC) composed of a 4-bit SAR coarse ADC and a 6-bit SAR fine ADC. In the coarse ADC, multi-comparator SAR architecture is used to reduce the digital logic propagation delay, and a traditional asynchronous SAR ADC with monotonic switching method is used as the fine ADC. With that combination, power dissipation also can be much reduced. Meanwhile, a modified SAR control logic is adopted in the fine ADC to speed up the conversion and other techniques, such as splitting capacitors array, are borrowed to reduce the power consumption. Fabricated with 1P8M 130-nm CMOS technology, the proposed SAR ADC achieves 51.6-dB signal to noise and distortion ratio (SNDR) and consumes 186 μ W at 50 MS/s with a 1-V supply, resulting in a figure of merit (FOM) of 12 fJ/conversion-step. The core area is only 0.045 mm².     

A 10-bit 50-MS/s reference-free low power SAR ADC in 0.18-μm SOI CMOS technology

正A 10-bit 50-MS/s reference-free low power successive approximation register(SAR) analog-to-digital converter(ADC) is presented.An energy efficient switching scheme is utilized in this design to obtain low power and high frequency operation performance without an additional analog power supply or on-chip/off-chip reference. An on-chip calibration DAC(CDAC) is implemented to cancel the offset of the latch-type sense amplifier(SA) to ensure precision whilst getting rid of the dependence on the pre-amplifier,so that the power consumption can be reduced further.The design was fabricated in IBM 0.18-μm 1P4M SOI CMOS process technology.At a 1.5-V supply and 50-MS/s with 5-MHz input,the ADC achieves an SNDR of 56.76 dB and consumes 1.72 mW,resulting in a figure of merit(FOM) of 61.1 fJ/conversion-step.     

A 1.2-V 19.2-mW 10-bit 30-MS/s pipelined ADC in 0.13-μm CMOS

A 10-bit 30-MS/s pipelined analog-to-digital converter(ADC) is presented.For the sake of lower power and area,the pipelined stages are scaled in current and area,and op amps are shared between the successive stages. The ADC is realized in the 0.13-μm 1-poly 8-copper mixed signal CMOS process operating at 1.2-V supply voltage. Design approaches are discussed to overcome the challenges associated with this choice of process and supply voltage, such as limited dynamic range,poor analog characteristic device...     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks