微系统与中规模器件的封装技术设计

文章主要论述了微机电系统(MEMS)和微系统诸如微传感器、驱动器和微流体元件的电机封装技术、封装等级和封装技术相关的问题.首先陈述并讨论了典型的MEMS产品诸如微压传感器、加速度计和微泵;微电子封装和微系统封装技术,重点阐述芯片级封装技术和器件级封装技术问题.芯片级封装技术主要涉及芯片钝化、芯片隔离和芯片压焊;器件级封...     

电子封装技术研究与教育机构十年发展

电子封装技术是为基本的电子电路处理和存储信息建立互连和合适操作环境的科学和技术,是构成芯片-器件-组件-产品的桥梁.电子封装是基础制造技术,同时又是-门新兴的交叉学科,涉及到封装材料、电磁设计、结构设计、热管理、微纳制造、电子器件、可靠性等较宽的知识范围.电子制造的特点是技术发展迅速、更新换代极快.电子封装正在从芯片-元件-组件-系统的传统制造模式向系统封装的模式转变,圆片级封装、系统封装、三维封装等先进封装技术已经开始走向市场.封装占电子器件和微系统的制造成本的比重越来越大,在先进封装中达到60％.在高端封装中技术与人才的竞争更为激烈.     

微机电系统关键技术及其研究进展

微机电系统(MEMS)是在微电子技术的基础上兴起的一个多学科交叉的前沿领域,集约了当今科学技术发展的许多尖端成果,在汽车电子、航空航天、信息通讯、生物医学、自动控制、国防军工等领域应用前景广阔.该文介绍了微机电系统发展的背景与基础理论研究,综述了微机电系统所涉及的器件设计、制作材料、3大加工工艺(硅微机械加工、精密微机械加工与光刻、电铸和注塑(LIGA)技术)、微封装与测试等关键技术,总结了微机电系统在微纳传感器、微执行器、微机器人、微飞行器、微动力能源系统、微型生物芯片等方面的典型应用,最后指明了MEMS技术的发展趋势,有望在近几十年将大量先进的MEMS器件从实验室推向实用化和产业化.     

军用MEMS技术研究的最新进展

本文讨论了美国陆军航空兵和导弹部队司令部（AMCOM）正在开发研究的微机电系统（MEMS）技术的最新进展。近年来，工业用低成本、低功率微型器件（从简单的温度计、压力传感器到内胎加速度计）目前技术的成熟水平已为开发研究军民两用MEMS器件奠定了坚实基础。AMCOM早期从事的MEMS技术开发着重于惯性MEMS传感器，但最近启动了一项新的陆军（联合）科学和技术目标（STO）研究项目，目的是研究开发具有中等角频率传感器分辨率且低成本的惯性组件，用于测量导弹姿态的偏航角和旋转滚动速率。这项举措极大地影响了美国国防先进研究计划署（DARPA）和其他政府部门，使其致力于研究开发坚固耐用的实验性惯性MEMS器件。在过去的2年中，AMCOM的MEMS研究范围不断地扩大，包括了用于导弹正常状况监测的环境MEMS传感器、射频MEMS器件、用于光束方向控制的光学MEMS器件以及用于光电子器件微型化的微光学“光具座”等多个项目。此外，MEMS封装和集成也成为人们关注的焦点。本文有选择地描述了这些领域中正在进行的研究项目，并给出某些军用MEMS传感器的技术要求。     

谐振式微型电场传感器芯片级真空封装及测试

为了降低传感器的驱动电压,提高该器件的品质因数和信噪比,该文研究封装材料和工艺对真空封装性能的影响,针对一种微机电系统(MEMS)谐振式微型电场敏感结构芯片,采用独特的共晶键合技术,实现该传感器的芯片级真空封装。实验结果表明,该传感器封装后的品质因数达到了30727.4,是常压封装的500倍;该封装器件具有更低的驱动电压,只需要直流分量100 mV和交流分量60 mVp-p,与常压测试时相比,分别只有原来的1/200和1/16。     

微/纳真空器件封装技术

极度微型化的微/纳真空器件要求专门的封装技术。论文综述了适用于微/纳真空器件封装的真空键合和电极互连技术,同时系统分析了一些相关技术,包括实现真空获得与维持的微型、可集成真空泵技术和非蒸散、薄膜吸气剂技术,监测器件工作环境的真空度测量技术,以及检测器件封装的真空检漏技术等。分析结果对微/纳真空器件的设计与工艺实现提供了有益参考。     

医用MEMS传感器特殊封装技术研究

简要介绍了医用MEMS传感器在物联网应用领域的需求和市场发展趋势。指出MEMS传感器是一种采用微电子和微机械加工技术制造出来的新型传感器。与传统的传感器相比,它具有体积小、重量轻、成本低、功耗低、可靠性高、适于批量化生产、易于集成和实现智能化的特点。这些特点必须通过新型封装技术的开发才能实现,因而提出开发MEMS传感器特殊封装的必要性。介绍了电子血压计传感器特殊封装产品的研发流程,论述了在开发电子血压计传感器特殊封装过程中必须解决的关键工艺技术。同时还系统介绍了特殊封装产品的结构、电路原理、工艺流程和技术开发过程中影响产品质量的各种因素。最后特别提到,电子血压计的MEMS传感器特殊封装技术虽然有别于传统IC封装工艺技术,但部分流程仍然可以和传统IC塑料封装工艺很好地兼容,这对降低MEMS传感器制造成本具有现实意义。     

一种新型给药微结构的封装技术研究

介绍了MEMS器件封装技术发展的历史、作用及现状;概要阐述了本课题组研究的可体内降解的高分子材料新型给药微结构;最后,针对这种高分子材料给药微器件自身的特点,提出了一种新型微器件的真空热融封装技术。     

射频MEMS封装技术

MEMS在射频(RF)应用领域表现出的低功耗、低损耗和高数据率的优越特性为RF无线通信系统及其微小型化提供新的技术手段。在产品设计的初期阶段,RF MEMS封装的设计考虑是降低成本、提高产品合格率的有效途径。我们主要针对当前RF MEMS器件与电路设计制造中突出的问题——封装技术进行研究,指出封装在产品设计中的重要地位和技术实现方法,特别介绍了计算机仿真在RF MEMS器件与电路封装中的作用。     

系统级封装及其研发领域

系统级封装(System-on-Package,SOP或System-in-Package,SIP)是与传统电子封装完全不同的封装概念。它强调的是将一个尽可能完整的电子系统或子系统高密度地集成在一个大小只有封装尺寸的体积内。其中包含各种有源器件,如数字集成电路、射频集成电路、光电器件、甚至于传感器等,还包含各种无源器件,如电阻、电容、电感、无源滤波器、耦合器,天线等。它的出现不仅对传统的封装技术提出全面挑战,推进封装技术进步,同时也将直接推动整个电子制造业的技术进步。介绍系统级封装的概念,讨论它的意义和所涉及的研发方面,以及它对电子制造技术的影响。     

Physical limits and lifetime limitations of semiconductor devices at high temperatures

In many applications of electronics, a growing demand for devices being capable of operating at increased temperatures is developing. In automotive and aerospace industry, the replacement of mechanical or hydraulic systems by electronics requires harsh environmental conditions. Furthermore, the oil-well business, military, industrial, chemical, and consumer electronics show increasing interest in higher operating temperatures.In this paper, the influence of temperature on semiconductor device characteristics is discussed with regard to physical limits for device operation. Different semiconductor materials are compared with respect to high temperature electronics, and an overview of the state-of-the-art of high-temperature devices is given. With standard silicon technology, high operation temperatures (200°C) can be reached with reduced performance, the use of SiC enables electronic devices for much higher temperatures (600°C). For practical use, device lifetime becomes the limiting factor at increased temperatures, especially chip metallisation systems and packaging technologies are critical factors for device lifetime in most cases.     

High Temperature Embedded SiC Chip Module (ECM) for Power Electronics Applications

Technology for a 3-D high temperature integrated power electronics module for applications involving high density, and high temperature (e.g., those over 200degC) is described. The high temperature embedded chip module (ECM) technology is proposed to realize a lower stress distribution in a mechanically balanced structure with double-sided metallization layers and material coefficient of thermal expansion match in the structure. This technology for packaging the active component is also proposed for universal use with a flip-over structure and pressure connections. The fabrication process of this high temperature ECM is presented. The forward and reverse characteristics of the high temperature ECM have been measured up to 279degC. Thermally induced mechanical stress is reduced to an acceptable level by applying a symmetrical structure with buffering layers     

Chip-scale packaging of power devices and its application inintegrated power electronics modules

A power electronics packaging technology utilizing chip-scale packaged (CSP) power devices to build three-dimensional (3-D) integrated power electronics modules (IPEMs) is presented in this paper. The chip-scale packaging structure, termed die dimensional ball grid array (D²BGA), eliminates wire bonds by using stacked solder joints to interconnect power chips. D²BGA package consists of a power chip, inner solder caps, high-lead solder balls, and molding resin. It has the same lateral dimensions as the starting power chip, which makes high-density packaging and module miniaturization possible. This package enables the power chip to combine excellent thermal transfer, high current handling capability, improved electrical characteristics, and ultralow profile packaging. Electrical tests show that the V_CE(sat) and on-resistance of the D²BGA high speed insulated-gate-bipolar transistors (IGBTs) are improved by 20% and 30% respectively by eliminating the device wirebonds and other external interconnections, such as the leadframe. In this paper, we present the design, reliability, and processing issues of D²BGA package, and the implementation of these chip-scale packaged power devices in building 30 kW half-bridge power converter modules. The electrical and reliability test results of the packaged devices and the power modules are reported     

功率模块封装结构及其技术

本文从封装角度评估功率电子系统集成的重要性。文中概述了多种功率模块的封装结构形式及其主要研发內容。另外还讨论了模块封装技术的一些新进展以及在功率电子电路系统集成中的地位和作用。     

一种新型的封装发展趋势——圆片级封装

在军用电子元器件和民用消费类电路中,电子封装均起着举足轻重的地位。当今社会,电子技术日新月异,集成电路正向着超大规模、超高速、高密度、大功率、高精度、多功能的方向迅速发展,对集成电路的封装技术提出了愈来愈高的要求,使得新的封装形式不断涌现,新的封装技术层出不穷。文中介绍了一种新型的封装发展趋势——圆片级封装技术,主要详述了圆片级封装的概念、技术驱动力,列举了主要厂家圆片级封装技术的应用情况。     

厚膜化电源模块老炼筛选过程的壳温控制

在现代电源模块技术中用厚膜化工艺和SMT(表面贴装工艺)生产的电源模块,由于其效率高、质量轻、可靠性高、密封性能好等优点,被广泛用于可靠性要求高的电子设备与军用装备中.文章简要介绍了单个功率器件的热模型以及根据模块的输出功率、效率与封装的热阻计算温升的办法.提出如何根据厚膜化电源模块老练时的最高壳温确定烘箱温度.通过对...     

LTCC package for high temperature applications

There is a growing demand for sensors and electronics that can work in harsh environments and at high temperature. Applications include sensors and actuators for control in petroleum and geothermal industry, process monitoring and distributed control systems in the automotive and aerospace fields. Process development and packaging materials for electronic devices are closely connected to such packaging issues. In many cases the package is as important as the device itself in meeting the applications needs.Low temperature co-fired ceramics (LTCC) and thick-film technologies have the potential to incorporate multilayer structures, enabling fabrication of specialized packaging systems. LTCC technology enables easy electrical or optical connections within and between layers in addition to enabling use of integrated passive components, heaters, sensors, converters etc.This paper presents attempts to develop a reliable packaging technology for silicon carbide (SiC) based hydrogen sensors operating at temperatures up to 300 °C. Some simulations of thermal properties were carried out and package structures were made and investigated. The package protects the sensor against mechanical damage and makes possible easy electrical connections. Moreover, the heater and temperature sensors allow for proper temperature regulation of the element. The manufacturing process, basic electrical parameters of the integrated heater as well as real temperature distribution are presented.     

中国电子学会生产技术学分会（电子封装专业）第八届电子封装技术国际会议ICEPT 2007

自1994年以来，电子封装技术国际会议（ICEPT）分别存中国北京、上海利深圳等地成功召开过七届。由于电子封装产业的快速发展，电子封装技术国际会议自2005年开始改为每年召开一次。作为唯一由中国政府，权威机构，业内主导所组织和支持的电子封装技术会议，每届都吸引了大批的国内外高校、研究机构、封装组装制造厂商、封装测试组装设备厂商、封装组装材料厂商踊跃参加，人数每次都超过400位，包括来自近20个国家和地区的国外专家、学者和企业家等。会议议题主要集中在半导体封装设计、半导体封装制造、半导体封装测试、以及LED封装、MEMS封装、系统封装及组装等领域。这是唯一由中国政府和相关业界发起的国内最高水平、最大规模的关于电子封装组装利测试技术的学术会议，已经成为先进封装技术交流的大平台。第八届电子封装技术国际学术会议将于2007年8月14日至8月17日在微电了产业基地上海举行，敬邀您的参与。会议相关内容说明如下：     

Meniscus coating: a low-cost polymer deposition method for system-on-package (SOP) substrates

Meniscus coating is a low-cost deposition method that can be used to apply polymers in solution as thin films to the surface of electronics packaging substrates or flat panel displays. Most Roadmaps in electronics packaging project 6 to 8 /spl mu/m lines and spaces for next generation high density printed wiring board (PWB) substrates in the year 2006, which would require coating thickness of similar magnitudes for manufacturing fine lines with higher yield. Meniscus coating can be an enabling deposition method that can provide finer yet uniform coating on large area substrates which would translate to patterning finer copper traces, thereby increasing the wiring density. This paper reports preliminary results on coating thickness that can be achieved with photoresists, dielectrics, and solder masks which are the integral parts of the sequential build up multi-layer process for the system-on-package substrates.